JP2699129B2 - Manufacturing method of connecting tab terminal - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a connecting tab terminal in which a plurality of tab terminals connected to a semiconductor device as external leads are connected to a band.

[0002]

2. Description of the Related Art Conventionally, a tab terminal is sometimes used in a semiconductor device as shown in FIG. In this semiconductor device, a semiconductor element 4, a resistor 6, a capacitor 8, an IC 10, and the like are mounted on a substrate 2 provided on a base 1 to form a predetermined circuit, and the circuit is connected to an external circuit or the like. After soldering the tab terminals 12 to predetermined positions on the substrate 2,
The circuit portion is sealed with a resin molding material 14.

When the tab terminals 12 are soldered as described above, instead of connecting each of the tab terminals 12 to each circuit, for example, as shown in FIG. Forming a connecting tab terminal 18 formed with the tab terminal 12;
After soldering the tab terminals 12 of the connection tab terminals 18 to predetermined positions of the substrate 2 of each semiconductor device at a time,
Has been performed to separate the tab terminals 12 from each other.

Such a connecting tab terminal 18 is formed, for example, by punching a metal strip 20 as shown in FIG. 5A at a time using a progressive die, as shown in FIG. Is done. After that, the tip of each tab terminal 12 is bent to form a portion to be soldered to the substrate 2 in FIG. Further, the entire surface of the connection tab terminal 18 is subjected to solder plating. This is because if the solder plating is not performed, the punched portion, for example, the portion shown in satin in FIG. 6 remains the cloth of the band-shaped body 20, and in particular, the portion 12a exposed from the molding material 14 Because it corrodes.

[0005]

However, when solder plating is performed on the entire surface of the connecting tab terminal 18 as described above, the tab terminal 12 is thin and the tab terminal 12 is easily deformed by barrel plating. , The possibility of processing failure was high. Further, if each of the tab terminals 12 is suspended and plated one by one, the above-described problem does not occur, but a new problem occurs in that the cost increases.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is provided at predetermined intervals along the longitudinal direction of the metal strip in the width direction of the metal strip. An opening is formed respectively. Following this, plating is applied to the entire surface of the strip. Furthermore, a portion of the strip between each opening and one longitudinal edge is formed so as to form a tab terminal between the portion between each opening of the strip and one longitudinal edge of the strip. Remove each. Note that the strip portions between each opening and one of the long edges of the strip are respectively formed so as to form an enlarged portion at a position deviated from the opening of each tab terminal to one of the long edges. It can also be removed.

[0007]

According to the present invention, after the opening is formed, the entire surface of the strip is plated. Therefore, the edges of each opening are also plated. Plating at the stage when the openings are formed in this way can be performed relatively easily compared to the case where plating is performed after forming each tab terminal. And
When a portion of the strip between each opening and one longitudinal edge is removed, a tab terminal is formed between the portion between each opening of the strip and one longitudinal edge of the strip. . And, of these tab terminals, the portions formed by the edges of the openings are plated as described above. Therefore, when these connecting tab terminals are used in a semiconductor device as shown in FIG. 6, if the plated portions are exposed from the mold, corrosion can be prevented.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A connecting tab terminal 30 manufactured according to this embodiment has a band portion 32 as shown in FIG. 1 (d), and tab terminals 34, 34 are provided at regular intervals from one longitudinal edge thereof.
.. Are projected sideways. These tab terminals 3
4, 34... Are soldered to predetermined positions on the substrate 36 of the semiconductor device and then removed from the band 32 and used as external leads as shown in FIG.
Are bent to form the soldered portion 38 at the predetermined position.

Further, an enlarged portion 40 is formed in the middle of these tab terminals 34. These enlarged parts 40 are shown in FIG.
As shown in FIG. 7, when the semiconductor device is molded with the molding material 42, the tab terminal 34 is firmly connected to the molding material 42.
4, even when a pulling force upward in FIG. 4 is applied, the soldering of the soldering portion 38 to the substrate 36 can be prevented from coming off.

In addition, the band 32 and the tab terminals 34,
34 are plated over the entire upper and lower surfaces as shown by hatching in FIG. 3, and in particular, the side surfaces from the enlarged portion 40 to the band portion 32, that is, as shown in FIG. When soldered to the substrate 36, plating is also applied to the side surface of the portion protruding from the mold material 42.

The connecting tab terminal 30 is manufactured by each process as shown in FIG. 1, for example. That is, FIG.
As shown in (a), a copper band-shaped cloth 44 wound in a loop is fed out, and using a progressive die, one halfway in the width direction of the cloth 44 as shown in FIG. The square holes 46, 46... Are punched out at regular intervals in a state of being biased to the longitudinal edges. By forming the square holes 46, 46,... In this manner, the band portion 32 is formed on the one longitudinal edge side.
Each tab terminal 3 is located at the boundary between the square holes 46, 46.
The bases 48, 48,. Further, an unprocessed strip 50 is formed on the opposite side of the strip 32 with the bases 48, 48. The fabric 44 punched out of the square holes 46, 46 is wound up as shown on the left side of FIG.

Thereafter, the cloth 44 is plated over the entire surface as shown by hatching in FIG. At this time, as shown in an enlarged view in FIG. 2, the side surface of each base portion 48 is also plated. Thus, the square holes 46, 46,.
It is relatively easy to apply plating to the cloth 44 in the state where the... Are formed.

[0013] With respect to the thus-plated fabric,
Punching is performed using a progressive die, and holes 52, 52,... For processing are formed in the band portion 32, and further, as shown in FIG. , And a linear head portion 54 are formed in the unprocessed portion 50. Then, as shown in FIG. 1D, the tip of the head 54 is bent to form the soldered portion 38, the band 32 is cut to an appropriate length, and the connection tab terminal 30 is cut.
Is completed.

.. And the heads 54, 54... Are formed by the punching process. However, as shown in FIG. 4, the enlarged portion 40 and the head 54 are molded in the molding material 42, so that even if plating is not performed, there is no problem of corrosion. Also, the base 48
Are protruded from the molding material 42, but since both the upper and lower surfaces of the base 48 are plated, as well as the both surfaces, no corrosion occurs.

The connecting tab terminal 3 manufactured as described above
Each of the 0 tab terminals 32 is soldered to a predetermined position on the substrate 36 shown in FIG. 4 and then separated from the band 32 after or after molding. In FIG. 4,
Reference numerals 56, 58, 60, and 62 denote semiconductor elements, resistors, capacitors, and ICs provided on the substrate 36, respectively, and 64 denotes a base on which the substrate 36 is mounted.

In the above embodiment, each tab terminal 34
Each formed a huge part 40, but in some cases,
These enlarged portions 40 can be omitted. In addition, although the distal end of each tab terminal 34 is bent to form the soldering portion 38, it may not be necessary to bend according to the place to be soldered.

[0017]

As described above, according to the present invention, it is possible to manufacture a connecting tab terminal in which, for example, all of the unmolded portion of the partially molded tab terminal is plated. After the opening is formed in the part, it is manufactured by plating the entire surface of the band-shaped part, so that the plating is easier than the conventional method of plating after forming each tab terminal, and the processing is easy. Without failure
Further, the manufacturing cost can be reduced as compared with the conventional method of plating each of the tab terminals. In addition, since each tab terminal has an enlarged portion, when this tab terminal is used as a tab terminal of a semiconductor device to be molded, the enlarged portion is firmly connected to the molding material,
It is possible to prevent the soldered portion from peeling off.

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of a method for manufacturing a connection tab terminal according to the present invention.

FIG. 2 is an enlarged perspective view showing a plated state in the embodiment.

FIG. 3 is an enlarged perspective view showing a state where an unprocessed portion is punched after plating is performed in the embodiment.

FIG. 4 is a vertical sectional view of a semiconductor device using the tab terminal manufactured according to the embodiment.

FIG. 5 is a view showing a conventional method for manufacturing a connection tab terminal.

FIG. 6 is a longitudinal sectional view of a semiconductor device using a conventional connection tab terminal.

[Explanation of symbols]

 REFERENCE SIGNS LIST 30 connection tab terminal 32 band part 34 tab terminal 44 fabric (band-like band) 46 square hole

Claims (2)

(57) [Claims] A step of forming openings at predetermined intervals along a longitudinal direction of the band in the width direction of the metal band; a step of plating the entire surface of the band; To form a tab terminal between the portion between each opening and one longitudinal edge of the band, respectively, the portion of the band between each of the openings and the one longitudinal edge is respectively Removing the connecting tab terminal. 2. The method for manufacturing a connecting tab terminal according to claim 1, wherein the opening and the opening are formed at a position deviated from the opening of the tab terminal toward the one longitudinal edge. A method for manufacturing a connecting tab terminal, wherein a portion of the strip that is located between the strip and one of the long edges is removed.