JP2700082B2 - Wire saw cutting tip processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for processing parts used in a wire saw.

[0002]

2. Description of the Related Art A wire saw used for cutting stone and reinforced concrete is configured as shown in FIG. An annular wire saw 2 is stretched between the pulley 1a and the pulley 1b. As shown in FIG. 5, the wire saw 2 has cutting tips 4 attached to the wire 3 at predetermined intervals.

As shown in FIG. 6, a cutting tip 4 is composed of a tip body 4a in which superabrasive grains 7 such as diamond or CBN (cubic boron nitride) are mixed in a matrix metal, and a steel cylinder 4b. And the chip body 4a
And the cylindrical body 4b are integrally processed by sintering or brazing. The internal passage of the cylindrical body 4b is the wire insertion hole 5.

Immediately after the cutting tip 4 is completed by passing the cutting tip 4 through the wire 3, the surface A of the cutting tip 4 of the wire saw 2 is smooth without super abrasive grains 7 being exposed on the surface as shown in FIG. It is.

Although not shown in FIGS. 5 and 7, the wire 3 is protected by a coating layer such as rubber or resin. When the wire saw 2 is used as shown in FIG. 4, the surface of the cutting tip 4 is rubbed against the work 6, and the matrix metal is scraped off. After several tens of minutes to several hours, as shown in FIG. As shown, the superabrasive grains 7 represented by black circles are exposed on the surface, and the workpiece 6 is cut by the exposed superabrasive grains 7. FIG. 8 shows the cutting tip 4 in which the superabrasive grains 7 are exposed on the surface.

[0006]

As described above, when a new wire saw 2 is used for the first time, the super-abrasive grains 7 are exposed on the surface of the cutting tip 4 for several tens of minutes to several hours after starting the operation. Therefore, there is a problem that the biting of the wire saw 2 into the work 6 is poor and the working efficiency is poor.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wire saw cutting tip processing apparatus capable of improving the biting of a workpiece from the beginning even when a new wire saw is used for the first time.

[0008]

According to a first aspect of the present invention, there is provided an apparatus for processing a cutting tip, comprising: a work rotating means for holding the cutting tip and rotating the cutting tip around the length direction of the wire insertion hole; Work vertical movement means for vertically moving the cutting tip, which is rotationally driven by the cutting tool, in the length direction of the wire insertion hole, a grindstone capable of contacting the cutting tip, and the length direction of the wire insertion hole with respect to the cutting tip. And a whetstone moving means for changing the contact position of the cutting tip on the whetstone by moving in a direction intersecting with the whetstone.

[0009] The processing apparatus for a cutting tip according to claim 2 is
A work rotating means for holding the cutting tip and rotating the cutting tip around the length direction of the wire insertion hole, and a work for moving the cutting tip rotationally driven by the work rotating means up and down in the length direction of the wire insertion hole. Vertical movement means, a grindstone capable of contacting the cutting tip, and a workpiece movement for moving the cutting tip relative to the grindstone in a direction intersecting the length direction of the wire insertion hole to change the contact position of the cutting tip on the grindstone. Means is provided.

[0010] According to a third aspect of the present invention, there is provided a machining apparatus for a cutting tip.
A work rotating means for holding the cutting tip and rotating the cutting tip around the length direction of the wire insertion hole, a grindstone capable of contacting the cutting tip, and a cutting tip rotated by the work rotating means. A grindstone vertical moving means for moving the grindstone up and down in the length direction of the wire insertion hole, and moving the grindstone in a direction intersecting with the length direction of the wire insertion hole with respect to the cutting tip so that the contact position of the cutting tip in the grindstone is adjusted. And a changing whetstone moving means.

According to a fourth aspect of the present invention, there is provided a cutting tip processing apparatus, comprising:
A work rotating means for holding the cutting tip and rotating the cutting tip around the length direction of the wire insertion hole, a grindstone capable of contacting the cutting tip, and a cutting tip rotated by the work rotating means. A grindstone vertical movement means for moving the grindstone up and down in the length direction of the wire insertion hole, and moving the cutting tip in a direction intersecting the length direction of the wire insertion hole with respect to the grindstone so that the contact position of the cutting tip in the grindstone is adjusted. A work moving means for changing is provided.

[0012]

According to the first aspect of the present invention, the grinding wheel is pressed against the cutting chip and polished while moving the cutting chip vertically by the work vertical moving means while rotating the cutting chip by the work rotating means. The contact position of the cutting tip on the grindstone is changed by the grindstone moving means.

According to the second aspect of the present invention, the grinding wheel is pressed against the cutting tip and polished while the cutting tip is moved up and down by the work vertical moving means while rotating the cutting tip by the work rotating means. The contact position of the cutting tip on the grindstone is changed by the work moving means.

According to the third aspect of the present invention, the grinding wheel is pressed against the cutting chip and polished while the grinding wheel is moved up and down by the grinding wheel vertical moving means while rotating the cutting chip by the work rotating means. The contact position of the cutting tip on the grindstone is changed by the grindstone moving means.

According to the fourth aspect of the present invention, the grinding wheel is pressed against the cutting chip and polished while the grinding wheel is moved up and down by the grinding wheel vertical moving means while rotating the cutting chip by the work rotating means. The contact position of the cutting tip on the grindstone is changed by the work moving means.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS. As shown in FIG. 1A, an eccentric press 8 as a work rotating means and a work vertical moving means.
Rotates vertically and vertically while holding the cylindrical body 4b of the cutting tip 4 as a workpiece from above and below by the first and second shafts 8a and 8b.

The grindstone 9 capable of contacting the cutting tip 4 can be moved toward and away from the first and second shafts 8a and 8b and is supported so as to be able to move horizontally. In this cutting configuration, a control circuit is configured to operate according to the procedure shown in FIG.

As shown in FIG. 1 (b) and FIG. 2 (a), when the cutting tip 4 is pinched by the first and second shafts 8a and 8b to start the operation, the cutting tip 4 While rotating about the axis (in the direction of arrow B), it moves up and down (in the direction of arrow C), and the grindstone 9 approaches the cutting tip 4 in the direction of the arrow D.

As shown in FIGS. 2B and 2C, the arrow E
When the grindstone 9 rotating in the direction abuts on the cutting tip 4, the grindstone 9 horizontally moves in the direction of arrow F1, and when the grindstone 9 moves to the end, the direction of arrow F2 as shown in FIG. Then, the chip body 4a is polished by the grindstone 9.

By this polishing, the matrix metal on the surface of the cutting tip 4 was removed, and the cutting tip 4 in which the superabrasive grains 7 were well exposed was obtained. The processing conditions are such that the rotation speeds of the first and second shafts 8a and 8b of the eccentric press device 8 are different.
300 rpm, vertical movement speed is 5 m / sec. The grindstone 9 had a diameter of 25 cm and a rotation speed of 1200 rpm.
The speed of the horizontal movement of the grindstone 9 was 4 m / sec.

The cutting tip 4 having the super-abrasive grains 7 exposed on the surface in this manner is passed through the wire 3 at a predetermined interval, and a rubber or resin coating layer for protecting the wire 3 is provided on the cylindrical body of the adjacent cutting tip 4. The cutting tip 4 is formed over the end of the wire 4b and the cutting tip 4 is fixed to the wire 3 to obtain a wire saw 2 product.

Therefore, in the wire saw 2 obtained as a product in this way, since the superabrasive grains 7 are well exposed on the surface of the cutting tip 4, the wire saw 2 can be favorably applied to the work 6 immediately after the start of the cutting operation. A biting state can be obtained, and an improvement in cutting efficiency can be realized.

In the processing of the cutting tip 4, the grinding stone 9 is moved by the grinding wheel moving means in a direction intersecting the length direction of the wire insertion hole 5 with respect to the cutting tip 4, and Since the polishing is performed while changing the contact position, a part of the grindstone 9 is not worn away, and good processing can be expected for a long period of time.

In the above-described embodiment, # 1 of the explanatory diagram shown in FIG.
Although the case of the processing contents of # 2 to # 3 has been described, instead of the processing contents of # 3, the eccentric press device 8 is turned to the arrow F without rotating the grindstone 9 and moving it in the directions of the arrows F1 and F2.
Similar results can be obtained with the processing contents of # 1- # 2- # 4 by moving left and right in the directions of F1 and F2.

In step # 2 following step # 1, the grinding wheel 9 is moved up and down without moving the cutting tip 4 up and down.
6, the same result is obtained with the processing contents of # 1- # 5- # 7.

In the above processing contents # 2 or # 5, the lateral movement of the eccentric press device 8 and the grindstone 9 in the directions of the arrows F1 and F2 is only the single lateral movement of the eccentric press device 8 or the grindstone 9. However, both can be moved, and good results can be obtained by the relative movement of the eccentric press device 8 and the grindstone 9.

[0027]

According to the construction of each claim, since the work rotating means, the work vertical moving means or the grindstone vertical moving means, the grindstone and the grindstone moving means or the work moving means are provided, the cutting before attaching to the wire is performed. The chip can be processed so that the abrasive is appropriately exposed on the surface.

Therefore, by using the wire saw using the cutting tip machined by this machining apparatus, even if a new wire saw is used for the first time, the bite to the work is good and the cutting efficiency is improved. Can be expected.

Further, the provision of the whetstone moving means or the work moving means enables the processing to proceed while changing the contact position of the cutting tip on the whetstone, thereby obtaining stable processing performance over a long period of time. .

[Brief description of the drawings]

FIG. 1 is a perspective view showing a processing step of a processing device for a wire saw cutting tip according to the present invention.

FIG. 2 is a plan view of a processing step of the embodiment.

FIG. 3 is an explanatory diagram showing a combination of processing contents according to the embodiment.

FIG. 4 is an explanatory view of a cutting device using a wire saw.

FIG. 5 is an explanatory diagram of a wire saw.

FIG. 6 is an exploded perspective view of a cutting tip.

FIG. 7 is a front view of a wire saw after use and a wire saw before use.

FIG. 8 is a perspective view of a cutting tip of a wire saw with good bite after use.

[Explanation of symbols]

 Reference Signs List 2 wire saw 3 wire 4 cutting tip 5 wire insertion hole 7 superabrasive grain 8 eccentric press device 9 grindstone

Claims (4)

(57) [Claims] 1. A processing device for processing a cutting tip having a cutting portion mixed with an abrasive material around a wire insertion hole, the cutting device holding the cutting tip and cutting around the length direction of the wire insertion hole. Work rotating means for rotating the tip,
Work vertical movement means for vertically moving the cutting tip, which is rotationally driven by the work rotating means, in the length direction of the wire insertion hole, and moving the grindstone in a direction intersecting the length direction of the wire insertion hole with respect to the cutting tip. And a grinding wheel moving means for changing a contact position of the cutting tip on the grinding wheel. 2. A processing device for processing a cutting tip having a cutting portion mixed with an abrasive material around a wire insertion hole, the cutting device holding the cutting tip and cutting around the length direction of the wire insertion hole. Work rotating means for rotating the tip,
Work vertical movement means for vertically moving the cutting tip, which is rotationally driven by the work rotating means, in the length direction of the wire insertion hole, a grindstone capable of abutting the cutting tip, and the cutting tip of the wire insertion hole with respect to the grindstone. A wire saw cutting tip processing apparatus provided with a work moving means for changing a contact position of a cutting tip on a grindstone by moving the cutting tip in a direction intersecting a length direction. 3. A processing device for processing a cutting tip having a cutting portion mixed with an abrasive material around a wire insertion hole, the cutting device holding the cutting tip and cutting around the length direction of the wire insertion hole. Work rotating means for rotating the tip,
A grindstone capable of contacting the cutting tip, a grindstone vertical moving means for moving the grindstone up and down in the length direction of the wire insertion hole with respect to the cutting tip being rotationally driven by the work rotating means, and An apparatus for processing a wire saw cutting tip, comprising: a grindstone moving means for moving the cutting tip in the grindstone by moving the cutting tip in a direction intersecting the length direction of the wire insertion hole. 4. A processing device for processing a cutting tip having a cutting portion mixed with an abrasive material around a wire insertion hole, the cutting device holding the cutting tip and cutting around the length direction of the wire insertion hole. Work rotating means for rotating the tip,
A grindstone capable of contacting the cutting tip, a grindstone vertical moving means for moving the grindstone up and down in the length direction of the wire insertion hole with respect to the cutting tip being rotationally driven by the work rotating means, and An apparatus for processing a wire saw cutting tip, comprising: a work moving means for changing a contact position of a cutting tip on a grindstone by moving the cutting tip in a direction intersecting a length direction of a wire insertion hole.