JP2702118B2 - Dispenser application method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for applying cream solder or the like by a general-purpose automatic machine using a dispenser. (Prior Art) In an automatic machine for soldering a target component (hereinafter referred to as FPIC) 1 such as a flat plate integrated circuit as shown in FIG. 1 to a printed wiring board, first, cream solder is applied by a dispenser, and then FPIC1 is applied. Put. In the subsequent process, soldering is performed by passing each substrate through a reflow furnace, applying a heated iron directly to the pins 2 of the FPIC 1, or irradiating the pins 2 with light. In FIG. 1, reference numeral 3 denotes cream solder. The movement of the dispenser and the application of the cream solder are controlled by an automatic machine such as a programmable robot in order to support various types of FPIC1. (Problems to be Solved by the Invention) In the FPIC1, since the pins are on four sides, the dispenser is moved in the order of point U → point V → point W → point X while maintaining a constant height from the substrate as shown in FIG. A cream solder is applied to a portion where the pin 2 is to be soldered. As shown in FIG. 2, conventionally, the lengths of the movement start point a to the application start point b, the point b to the application stop point c, and the point c to the movement stop point d are time.
Control was performed with three time parameters T ₁ , T ₂ , and T ₃ . As a practical matter, point a becomes point b, point d
Is matched with the point c, the cream solder is applied more at the points b and c than between the points b and c. Therefore, the idle running sections at the points ab and cd are necessary. Also, the time from when the application command signal is sent to when the cream solder is discharged, and the time from when the application stop signal is sent to when the cream solder is cut off, is usually T, because a delay occurs due to an intermediate air circuit, the viscosity of the cream solder, and the like. the ₁ <T _3. When the moving speed of the dispenser is the same, T ₁ + T ₂ + T ₃ is constant. However, when the time T ₁ , T ₂ , or T ₃ is changed, the other two patterns are changed to correspond to the time delay element of the dispenser. Must also be changed. Usually, several types of FPIC1 are mounted on one board, and there is a problem that much time is required until all parameters are determined. Further, when the moving speed of the dispenser is changed thereafter, there is a problem that all the above-mentioned parameters must be determined again from the beginning. An object of the present invention is to provide a dispenser coating method that solves the above problems. (Means for Solving the Problems) The present invention has solved the above-mentioned problems by giving a length parameter such as an external dimension of the FPIC to the automatic machine instead of the time parameter. (Examples) Hereinafter, the present invention will be described with reference to examples. FIG. 4 shows an example of a configuration for realizing the method of the present invention, and FIG. 5 is a flowchart for explaining the operation of the configuration shown in FIG. The moving distance and direction (± A) set by the moving length and direction setting unit 11 are stored in the register 12, and the idle distance a is stored in the register.
13, the solder application distance b is temporarily stored in the register 14, and the movement axis X or Y is temporarily stored in the register 15. The contents stored in the registers 12 to 15 are read by the CPU 16 as necessary, subjected to arithmetic processing, and based on the result of the processing, a solder application device 19 including a solder sending device 17 and a driving device 18.
Is controlled. First, when the instruction for solder application is started, the moving distance and direction (±
A), the free running distance (a), the solder application distance (b), and the movement axis designation (X or Y) are specified, and the free running distance C [= A
-Ab] is calculated. These relationships are shown in FIG.
As shown in FIG. Above [± A], [a], [b], [X or Y]
As shown in FIG. 5 (b), each point data
P _{0 to} P ₃ are calculated and stored. Here, P ₀ is a movement start point, P ₁ is a solder application start point, P ₂ is a solder application stop point, P ₃ is a movement stop point, and given a point P ₀ , P ₁ = P _{0 + a, P 2 = P} 0 + a
+ B, P ₃ = A-ab. Subsequently, the total movement amount [A] is set, and the driving device 18 starts the constant speed movement of the solder delivery device 17. This movement until it reaches the P ₁ point not is made solder coating, coating the solder by the solder delivery device 17 from the time when it reaches the P ₁ point is performed to reach the P ₂ point, the solder delivery device 17 in P ₂ points the solder delivery is stopped, the movement of the solder delivery device 17 to P ₃ points is continued. Travel section from P ₀ point to P ₁ points, the travel-run interval in the P ₂ point to P ₃ points is not performed solder coating, from P ₁ point
Travel section of up to P ₂ points the solder coating is made. The same applies to the case where the X axis direction is specified by the movement axis specification and the case where the Y axis direction is specified. (Effects of the Invention) As described above, according to the present invention, various types of
When FPIC is placed also it may be the length P ₁ to P ₃ corresponding to the component dimensions of each FPIC and parameters may short time parameter determination. In addition, since this parameter is not affected by the moving speed, it is possible to change the application speed to the optimum even after setting the parameter. In addition, the parameters P ₁ and P ₂ can be set according to the air circuit of the dispenser and the delay time of the discharge and stoppage of cream solder due to the viscosity of the cream solder, greatly reducing the time required for parameter setting. it can.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic plan view showing a state where cream solder is applied to a pin portion of an FPIC. FIG. 2 is a schematic side view showing a conventional method of applying cream solder. FIG. 3 is a block diagram showing an example for carrying out the method of the present invention, FIG. 4 is a flowchart for explaining the operation according to the example shown in FIG. 3, and FIGS. 5 (a) and (b) are the present invention. It is a schematic diagram with which the operation of one embodiment is provided. 1 ... FPIC, 2 ... pin, 3 ... cream solder, 11 ...
Movement length, direction setting device, 12 to 15 ... register, 16 ... CP
U, 17: Solder delivery device, 18: Drive device, 19: Solder application device.

Continuation of front page    (56) References JP-A-60-148669 (JP, A)                 JP-A-61-502734 (JP, A)                 Tokiko Hei 2-43354 (JP, B2)                 Tokiko Hei 7-97700 (JP, B2)

Claims (1)

(57) [Claims] In an automatic machine that applies cream solder to a target component by using a dispenser, the outer length of the target component and the application length and position in the outer length are given to the automatic machine as parameters for solder application by the dispenser, A dispenser coating method, wherein a non-coated portion and a coated portion are calculated from the outer shape length, the coated length, and the position of the coated length portion, and the cream solder is delivered only in the coated portion.