JP2702169B2 - Semiconductor device manufacturing equipment - Google Patents
Semiconductor device manufacturing equipmentInfo
- Publication number
- JP2702169B2 JP2702169B2 JP63201270A JP20127088A JP2702169B2 JP 2702169 B2 JP2702169 B2 JP 2702169B2 JP 63201270 A JP63201270 A JP 63201270A JP 20127088 A JP20127088 A JP 20127088A JP 2702169 B2 JP2702169 B2 JP 2702169B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- printing
- device manufacturing
- manufacturing equipment
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造装置に関し、とくに半導体
装置用印刷前処理工程を含む半導体装置の製造装置に関
する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly to an apparatus for manufacturing a semiconductor device including a pre-printing process for a semiconductor device.
従来の半導体装置用印刷前処理装置は、第２図に示す
ように、レール１にて搬送された半導体装置２の表面と
平行な回転軸を持つ横型ブラシ13を回転させることによ
り、半導体装置２の印刷面に付着しているごみの除去を
行い、しかる後にマーク等の印刷を行っていた。なお、
ブラシ３の軸はモータ４の軸に直結されている。As shown in FIG. 2, a conventional printing pretreatment apparatus for a semiconductor device rotates a horizontal brush 13 having a rotation axis parallel to the surface of the semiconductor device 2 conveyed by the rail 1 to thereby reduce the semiconductor device 2. The dust attached to the printing surface of the above was removed, and thereafter printing of marks and the like was performed. In addition,
The shaft of the brush 3 is directly connected to the shaft of the motor 4.
上述した従来のブラッシング機構は、印刷面とブラシ
軸が平行なため、回転振れ、接触量が少ないなどの問題
があり、印刷面のごみをうまく除去できず、印刷不良が
慢性化しているという欠点があった。The conventional brushing mechanism described above has a problem that the printing surface and the brush axis are parallel, so that there is a problem such as a rotational runout and a small amount of contact. was there.
本発明の目的は、半導体装置の印刷不良を起すことの
ない、印刷性の良い半導体装置の製造装置を提供するこ
とにある。An object of the present invention is to provide an apparatus for manufacturing a semiconductor device having good printability without causing printing failure of the semiconductor device.
本発明は、半導体装置の表面に印刷を行う前の前処理
工程を含む半導体装置の製造装置において、前記半導体
装置の表面を清浄する手段と、しかる後に該半導体装置
の表面を熱する手段とを有している。The present invention relates to a semiconductor device manufacturing apparatus including a pretreatment step before printing on a surface of a semiconductor device, wherein a means for cleaning the surface of the semiconductor device, and a means for heating the surface of the semiconductor device thereafter. Have.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。 FIG. 1 is a perspective view showing one embodiment of the present invention.
第１図において、印刷前の半導体装置２が送り込まれ
るレール１の上部に、印刷面のごみを除去する、ブラシ
3,エアーブロー５及び浮遊しているごみをファン８によ
って吸い込む吸引ダクト７、さらに印刷面を温めるため
のホットエア６を設ける。In FIG. 1, a brush for removing dust on a printing surface is provided on an upper portion of a rail 1 to which a semiconductor device 2 before printing is fed.
3. An air blow 5 and a suction duct 7 for sucking floating dust by a fan 8 and a hot air 6 for warming a printing surface are provided.
印刷前の半導体装置２がレール１に送り込まれるとモ
ータ４に直結した竪型ブラシ３の面接触回転により、印
刷面に付着したごみは除去され、同時に、エアーブロー
５によりごみを吹き飛ばし、ファン８を回転させ、吸引
ダクト７で吸引する。しかる後にホットエア６によって
印刷面を温め、次工程で印刷を行う。When the semiconductor device 2 before printing is sent to the rail 1, dust attached to the printing surface is removed by the surface contact rotation of the vertical brush 3 directly connected to the motor 4, and at the same time, the dust is blown off by the air blow 5 and the fan 8 Is rotated, and suction is performed by the suction duct 7. Thereafter, the printing surface is warmed by the hot air 6, and printing is performed in the next step.
以上説明したように本発明は、竪型ブラシを使用する
ことにより、印刷面とブラシの接触量が大きくなり、さ
らに、エアーブローと吸引ダクトによって印刷面に付着
したごみを多く除去できる。従って、従来装置に比べ、
印刷面のごみ付着による印刷不良が少なくなるという効
果がある。また、ホットエアを吹きつけ、印刷面を温め
ることにより、印刷性も良好となる効果もある。As described above, in the present invention, by using the vertical brush, the contact amount between the printing surface and the brush is increased, and moreover, the dust attached to the printing surface can be removed by the air blow and the suction duct. Therefore, compared to the conventional device,
This has the effect of reducing printing defects due to the adhesion of dust on the printing surface. Further, by blowing hot air to warm the printing surface, there is also an effect that the printability is improved.
第１図は本発明の一実施例を示す斜視図、第２図は従来
の半導体装置の製造装置の一例を示す斜視図である。 １……レール、２……半導体装置、３……竪型ブラシ、
４……モータ、５……エアーブロー、６……ホットエ
ア、７……吸引ダクト、８……ファン、13……横型ブラ
シ。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing an example of a conventional semiconductor device manufacturing apparatus. 1 ... rail, 2 ... semiconductor device, 3 ... vertical brush,
4 ... motor, 5 ... air blow, 6 ... hot air, 7 ... suction duct, 8 ... fan, 13 ... horizontal brush.
Claims (1)
工程を含む半導体装置の製造装置において、前記半導体
装置の表面を清浄する手段と、しかる後に該半導体装置
の表面を熱する手段とを有することを特徴とする半導体
装置の製造装置。An apparatus for manufacturing a semiconductor device including a pretreatment step before printing on the surface of the semiconductor device, means for cleaning the surface of the semiconductor device, and means for subsequently heating the surface of the semiconductor device. An apparatus for manufacturing a semiconductor device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63201270A JP2702169B2 (en) | 1988-08-12 | 1988-08-12 | Semiconductor device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63201270A JP2702169B2 (en) | 1988-08-12 | 1988-08-12 | Semiconductor device manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0250412A JPH0250412A (en) | 1990-02-20 |
| JP2702169B2 true JP2702169B2 (en) | 1998-01-21 |
Family
ID=16438172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63201270A Expired - Fee Related JP2702169B2 (en) | 1988-08-12 | 1988-08-12 | Semiconductor device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2702169B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109595575B (en) * | 2018-12-08 | 2020-04-10 | 温州宏量机械科技有限公司 | Full-automatic soot blower for biomass boiler soot blowing system |
| JP7280960B2 (en) | 2019-09-12 | 2023-05-24 | 株式会社フジクラ | Optical fiber measuring device and method for applying bending to optical fiber |
-
1988
- 1988-08-12 JP JP63201270A patent/JP2702169B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0250412A (en) | 1990-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |