JP2704321B2 - Method for manufacturing optical semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a leadless type resin-sealed optical semiconductor device.

[0002]

2. Description of the Related Art The structure and manufacturing method of a surface mount device (hereinafter referred to as SMD) in a conventional leadless type optical semiconductor device will be described with reference to FIGS.

First, as shown in FIG. 10, the structure of a substrate X used includes a through hole 1 for through-hole plating for forming an electrode and a header portion 5 for mounting an optical semiconductor element (light receiving / emitting element). And a connection portion 6 for electrically connecting the optical semiconductor element 8 and the electrode with the gold wire 9. As a material of the substrate X, glass epoxy resin or the like is used.

An optical semiconductor device 8 shown in FIG. 10 is die-bonded to a header 5 of a three-dimensional plating pattern 7 laminated on a substrate X. Further, this device 8 is connected to a connection portion 6 of the plating pattern 7 by a gold wire 9. Is done. Then, as shown in FIG. 11, the optical semiconductor element 8 is molded (packaged) using a translucent resin by transfer molding so as to have the lens 11. In this case, the package 10 itself has a structure that also serves as a runner portion. Thereafter, dicing is performed on a dicing line 12, as shown in FIG.
A single SMD optical semiconductor device is manufactured.

As a transfer molding method, as shown in FIG. 12, a runner portion 2 is provided in a portion other than a portion to be a package 10, and a resin is injected from the runner portion 2 through a gate 4 to perform packaging and molding. Is completed.
Thereafter, the runner section 2 and the gate 4 are removed, and dicing is performed on the dicing line 12 to complete a single SMD optical semiconductor device.

[0006]

The conventional method for manufacturing an optical semiconductor device has the following problems.

(1) In the optical semiconductor device formed by molding the package 10 by the transfer molding method shown in FIG. 11, since the package 10 is directly cut in the dicing step of cutting into a single optical semiconductor device, the periphery of the optical element is removed. In this case, there is a possibility that peeling, cracks, etc. may occur at the interface between the light-transmitting resin and the substrate, which may adversely affect the reliability of the product.

(2) In the optical semiconductor device in which the package 10 is formed by the transfer molding method shown in FIG. 12, although there is little adverse effect at the time of cutting as shown in (1), the runner 2 is connected to the package 10. Since the optical semiconductor device is provided in a portion other than the above portion, a loss occurs in the number of single optical semiconductor devices per substrate, and the production efficiency is rather poor.

SUMMARY OF THE INVENTION In view of the above, the present invention prevents the occurrence of separation between a light-transmitting resin and an insulating resin substrate when cutting a substrate, and eliminates a loss in the number of optical semiconductor devices per substrate. An object of the present invention is to provide a method for manufacturing an optical semiconductor device that improves production efficiency.

[0010]

Means for Solving the Problems (1) According to the first aspect of the present invention, as shown in FIGS. 1 to 9, a three-dimensional plating pattern 7 is provided on an insulating resin substrate X from the front surface to the back surface. A plurality of optical semiconductor elements 8 are mounted on the plating pattern 7, and the plurality of optical semiconductor elements 8 are molded with a translucent resin to form a plurality of packages 10,
In a method of manufacturing a surface-mount type optical semiconductor device, in which the insulating resin substrate X is cut into multiple parts along a dicing line 12 so as to separate and separate the package 10, the insulating resin substrate X has an optical semiconductor A plurality of header portions 5 on which the elements 8 are mounted are provided, and a concave surface 2 serving as a runner portion of the translucent resin is provided on the back surface immediately below each of the header portions 5. holes 4 for resin introduction that leads to 5 side, so as to form to avoid the bobbin 10 from the dicing line 12, it is provided in communication with the concave 2, the stereoscopic plated pattern 7, before
From the header part 5 to the through hole 1 for through hole plating
The light-transmitting resin is formed so as to reach the rear surface through the through hole 4 for introducing the resin from the concave surface 2 through the header portion 5.
And the concave surface 2 so as to be flush with the back surface of the substrate X.
Each optical semiconductor element 8 is molded by filling .

(2) According to a second aspect of the present invention, as shown in FIGS. 1 to 4, the resin introduction through hole 4 according to the first aspect is penetrated from the concave surface 2 according to the first aspect to the vicinity of the package portion. The transparent resin is passed through the concave surface 2 through the through hole 4 for introducing the resin.
To mold each optical semiconductor element 8.

(3) According to a third aspect of the present invention, as shown in FIGS. 5 to 9, the resin introduction through hole 4 according to the first aspect is directly penetrated from the concave surface 2 according to the first aspect to the package portion. The transparent resin is passed through the concave surface 2 through the through hole 4 for introducing the resin.
To mold each optical semiconductor element 8.

[0013]

In the means for solving the problems according to the first to third aspects, the through hole 4 for resin injection is formed with the runner portion of the light-transmitting resin so that the light-transmitting resin flows toward the header portion 5 from the dicing line 12. By communicating with the concave surface 2
When the optical semiconductor element 8 is molded, the dicing line 12
Therefore, when the package 10 is diced, the package 1 can be formed.
It is possible to adopt a structure in which 0 is not directly cut. For this reason, at the time of cutting the insulating resin substrate X, occurrence of peeling or the like at the interface between the translucent resin and the insulating resin substrate X can be prevented.

Further, since the concave surface 2 serving as the runner portion is provided on the back surface immediately below the header portion 5 without providing the runner portion other than the portion serving as the package as shown in FIG. Loss in the number of single optical semiconductor devices can be eliminated.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

<First Embodiment> FIGS. 1A and 1B show an insulating resin substrate according to an optical semiconductor device of a first embodiment of the present invention. FIG. 1A is a plan view, and FIG. 2A is a cross-sectional view taken along the line AA, FIG. 2C is a cross-sectional view taken along the line BB of FIG. 2A, FIG. FIG. 4 also shows a completed optical semiconductor device, FIG. 4 (a) is a plan view, FIG. 4 (b) is a cross-sectional view taken along line CC of FIG. 4 (a), and FIG. (C) is a DD sectional view of the same figure (a).

As shown in the figure, in the leadless type resin-sealed optical semiconductor device of this embodiment, a three-dimensional plating pattern 7 is provided on an insulating resin substrate X, and a plurality of optical semiconductor elements 8 are provided on the three-dimensional plating pattern 7. Are mounted, and a plurality of packages 10 are formed by molding the plurality of optical semiconductor elements 8 with a translucent resin. In order to separate and independent the packages 10, the insulating resin substrate X is mounted along a dicing line 12. It consists of cutting into parts.

As shown in FIG. 1, the insulating resin substrate X has, on its surface, a plurality of concave header portions 5 on which the optical semiconductor element 8 is die-bonded, and the optical semiconductor element 8 die-bonded on the header section 5 and a gold wire. 9, the connection portion 6 for electrically connecting the optical semiconductor element 8 and the back surface electrode 7a is provided. After cutting the insulating resin substrate X , a through hole for forming the electrode 7a is provided. A through hole 1 for plating is provided, and a concave surface 2 serving as a runner portion of a light-transmitting resin is provided on the back surface immediately below each of the header portions 5. A through hole 4 serving as a sub-runner portion leading to the substrate X surface side is provided in communication with the concave surface 2, and a concave portion 4 a serving as a gate portion for guiding the injected resin to the header portion 5 on the surface side of the through hole 4. Is provided. The through hole 4 to be the Sabra emissions toner unit, the bobbin 10 so as to form to avoid the dicing line 12, disposed through from the concave surface 2 near Pas tree cage portion.

The method for manufacturing the optical semiconductor device will be described in detail.

First, as shown in FIG. 2, a plurality of optical semiconductor elements 8 are die-bonded to the header section 5 of the three-dimensional pattern 7 of the insulating resin substrate X, and the optical semiconductor elements 8 and the connection section 6 are connected by gold wires 9. Then, the optical semiconductor element 8 and the electrode 7a are electrically connected. Next, the insulating resin substrate X is set in a mold, and a translucent resin is injected by a transfer mold. Then, the translucent resin becomes the concave surface 2 which becomes the runner part.
Then, the optical semiconductor element 8 is injected into the periphery of the die-bonded header portion 5 through the through hole 4 serving as the sub-runner portion and the concave portion 4a serving as the gate portion (see FIG. 4).

At this time, the through hole 4 serving as a sub-runner portion
Is arranged so as to allow the translucent resin to flow toward the header portion 5 side from the dicing line 12 so as to penetrate near the package portion from the concave surface 2, so that the package 10 is formed inside the dicing line 12 avoiding the dicing line 12. Will be done. Note that a lens 11 for obtaining high output favorable sensitivity is formed on the upper part of the package 10.

Finally, dicing is performed on the dicing line 12 (see FIG. 3) to divide the insulating resin substrate X into many parts, thereby completing a single SMD optical semiconductor device. In this dicing, the package 10 is formed inside the dicing line 12 while avoiding the dicing line 12, so that the insulating resin substrate X is cut outside the package 10 so that the optical semiconductor element 8 is cut.
Peeling over the interface between the surrounding translucent resin and the insulating resin substrate X ,
There is no cracking effect.

Further, as shown in FIG. 12, the concave surface 2 which becomes the runner portion at the time of molding is provided on the back surface immediately below the header portion 5 without providing the runner portion other than the portion which becomes the package. No loss occurs in the number of optical semiconductor devices per substrate as in the related art.

<Second Embodiment> FIGS. 5A and 5B show an insulating resin substrate according to an optical semiconductor device of a second embodiment of the present invention. FIG. 5A is a plan view, and FIG. 7A is a cross-sectional view taken along the line EE, FIG. 7C is a cross-sectional view taken along the line FF of FIG. 7A, FIG. FIG. 8 also shows a completed optical semiconductor device, FIG. 8 (a) is a plan view, FIG. 8 (b) is a sectional view taken along line GG of FIG. 8 (a), and FIG. (C) is an HH sectional view of the same figure (a).

In the insulating resin substrate X of this embodiment, as shown in FIG. 5, a through hole 4 is formed in a gate portion for directly injecting a translucent resin into each header portion 5 from a concave surface 2 serving as a runner portion during transfer molding. And is arranged so as to penetrate the package portion directly from the concave surface 2, and the other configuration is the same as that of the first embodiment.

Then, the dicing line 1 is formed in the final step through the same steps described in the first embodiment, ie, the die bonding and wire bonding steps shown in FIG. 6 and the molding step shown in FIG.
8 is performed to divide the insulating resin substrate X into many parts.
Is completed. Therefore, in this embodiment, the same effect as in the first embodiment can be obtained.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.

For example, by making the shape of the lens of the package 10 into the shape of the inner lens 11a as shown in FIG. 9, the handling of an automatic mounting machine or the like can be improved.

[0029]

As is clear from the above description, according to the first to third aspects of the present invention, the package can be formed avoiding the dicing line. There is no need to cut the packaging directly. For this reason, the occurrence of peeling or the like at the interface between the translucent resin and the insulating resin substrate is eliminated, and the adverse effect on the reliability as a product can be solved.

Further, since the concave surface serving as the runner portion is provided on the back surface immediately below the header portion without providing the runner portion other than the portion serving as the package, the number of optical semiconductor devices per insulating resin substrate can be reduced. Loss is eliminated and production efficiency is improved. In addition, the transparent back surface of the insulating resin substrate
By providing a concave surface that becomes the resin runner,
The surface can be formed flat, and the three-dimensional
Since it is formed from the front surface to the back surface of the resin substrate, another mounting
Easier surface mounting on the board and dividing the board into multiple parts
Attachment to a dicing device when cutting is facilitated. Sa
In addition, since a concave surface is provided on the back surface of the substrate, the mold
There is no need to provide a runner for injecting resin,
Therefore, the structure of the mold can be simplified and the manufacturing cost can be reduced.
Can be achieved.

[Brief description of the drawings]

FIGS. 1A and 1B show an insulating resin substrate according to an optical semiconductor device of a first embodiment of the present invention, wherein FIG. 1A is a plan view, and FIG. A sectional view and FIG. 3C are BB sectional views of FIG.

FIG. 2 is a diagram showing a state at the time of completion of mounting the optical semiconductor element.

FIG. 3 is a diagram showing a state at the time of completion of package formation.

FIGS. 4A and 4B show a completed optical semiconductor device, in which FIG. 4A is a plan view, and FIG.
FIG. 3C is a cross-sectional view, and FIG. 3C is a cross-sectional view taken along the line DD in FIG.

FIGS. 5A and 5B show an insulating resin substrate according to the optical semiconductor device of the second embodiment of the present invention, wherein FIG. 5A is a plan view, and FIG. FIG. 7C is a sectional view taken along line E-F of FIG.

FIG. 6 is a diagram showing a state at the time of completion of mounting the optical semiconductor element.

FIG. 7 is a diagram showing a state at the time of completion of package formation.

8A and 8B show a completed optical semiconductor device. FIG. 8A is a plan view, and FIG. 8B is a plan view of G in FIG. 8A.
FIG. 2C is a sectional view taken along line H-H of FIG.

9 shows a completed optical semiconductor device according to another embodiment, FIG. 9B is a sectional view taken along line II of FIG. 9A, and FIG.
Is a JJ sectional view of FIG.

FIG. 10 is a view showing a state at the time of completion of mounting of an optical semiconductor element in a manufacturing process of a conventional optical semiconductor device.

Figure 11 is a diagram likewise illustrating the condition of the path Tsukeji formation completion.

FIG. 12 is a view showing a state at the time of completion of package formation when a runner portion is provided other than the package.

FIG. 13 shows a completed product of a conventional optical semiconductor device. FIG. 13 (a) is a plan view, and FIG. 13 (b) is a view of FIG.
(C) is a sectional view taken along line LL in (a) of FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 through hole for through hole plating 2 concave surface 4 through hole for resin introduction 5 header portion 7 three-dimensional plating pattern 8 optical semiconductor element 10 package 12 dicing line X insulating resin substrate

Claims (3)

(57) [Claims] An insulated resin substrate is provided with a vertical plating pattern from a front surface to a rear surface , and a plurality of optical semiconductor elements are mounted on the three-dimensional plating pattern. A plurality of packages are formed by molding with a resin, and the insulating resin substrate is cut into multiple parts along a dicing line in order to separate and separate the packages. The resin substrate is provided with a plurality of header portions on which the optical semiconductor element is mounted on the front surface side, and a concave surface serving as a runner portion of the light-transmitting resin is provided on the back surface immediately below each of the header portions, and the light-transmitting resin is provided. through hole for resin introduction leading from concave to Hetsuda portion side, so as to form by avoiding the bobbin from the dicing lines, it becomes provided to communicate with the concave surface, the three-dimensional
The plating pattern is formed through the through hole
It is formed to reach the back surface through the through hole for wood,
The translucent resin is guided from the concave surface through the through hole for resin introduction toward the header portion so that it is flush with the back surface of the substrate.
A method for manufacturing an optical semiconductor device, wherein each optical semiconductor element is molded by filling a concave surface . 2. The through hole for introducing a resin according to claim 1 is penetrated from the concave surface according to claim 1 to the vicinity of the package portion, and a transparent resin is injected from the concave surface through the through hole for introducing the resin. A method for manufacturing an optical semiconductor device, wherein each optical semiconductor element is molded. 3. The through hole for introducing resin according to claim 1 is directly penetrated into the package portion from the concave surface according to claim 1, and a light-transmitting resin is injected from the concave surface through the through hole for introducing resin. A method for manufacturing an optical semiconductor device, wherein each optical semiconductor element is molded.