JP2707082B2 - Method and apparatus for manufacturing metal sieve - Google Patents

Abstract

In a method for forming a sieve material a base sieve material is connected as a cathode in an electroplating bath; said bath contains an amount of a compound having properties of a second class brightener and during electrodeposition a flow of liquid is maintained through the perforations of the base sieve material. A thin deposit is allowed to form; said deposit is removed from the base sieve and thickened under essentially the same conditions in a further electroplating step. The thickened deposit has perforations of essentially the same size as the perforations in the base sieve material. The method may be carried out continuously. The invention concerns also a device for carrying out the method according to the invention.

Description

Description: TECHNICAL FIELD The present invention relates to a metal sieve, and a method and an apparatus for producing the same. In particular, the present invention forms the first metal layer 2 by electric plating on a separately formed sieve substrate having a release layer, wherein during at least a portion of the electric plating process, A method of manufacturing a metal sieve by removing a first metal layer from a sieve substrate while maintaining a flow of liquid through a hole having the same, under substantially the same conditions as forming the first metal layer. Then, the first metal layer removed from the sieve substrate is further subjected to an electric plating process, and a brightening agent is present in the electric plating bath to precipitate metal until a required thickness is obtained. , A second metal layer 3 is obtained. PRIOR ART Such a method is already described in Dutch patent application no.
Known by No. 7. That is, in this prior document,
A liquid is allowed to flow through the pores of the sieve substrate during the deposition of the metal while the metal deposit layer is formed on the sieve substrate by electric plating, so that the metal is orthogonal to the outer surface of the sieve substrate. A method is described for producing a metal sieve which is oriented in the direction and thus the pores of the finally obtained metal sieve have essentially the same size as the pores of the sieve substrate. Advantageously, during the metal deposition described above, the solution contains an organic compound having the properties of a secondary brightener. Specific examples include butynediol and ethylene cyanohydrin. Generally, such compounds are Has at least one unsaturated bond that does not belong to According to this previously known method, if the metal layer to be removed has to be thick, the sieve substrate also has the disadvantage that it has to be hard. Otherwise, the sieve substrate will be damaged while removing the second metallization. Further, according to conventional methods, the sieve substrate is in use during electrical plating to repeatedly use the sieve substrate to obtain a metal layer of sufficient thickness to be removed from the sieve substrate. Therefore, there is a disadvantage in that the amount of the sieve substrate used repeatedly becomes very large. Means for solving the problems The present invention aims to solve the above problems,
Such an object is achieved, according to the invention, by subjecting the first metallization to a treatment for forming a second metallization under substantially the same conditions as the formation of the removed first metallization, whereby the metal is removed. This can be achieved by depositing the metal and forming a second metal layer until the desired thickness is obtained. That is, in the method for producing a metal sieve according to the present invention, a first metal layer is formed by electric plating on a separately formed sieve substrate having a release layer, and at least a part of the electric plating process is performed. A method of manufacturing a metal sieve that retains a flow of a liquid passing through a hole of a sieve substrate and removes the first metal layer from the sieve substrate, wherein the first metal layer is substantially formed. Under the same conditions, the first metal layer removed from the sieve substrate is further subjected to an electric plating treatment to deposit a metal until a required thickness is obtained, thereby obtaining a second metal layer. And Therefore, according to the method of the present invention, the metal layer deposited on the sieving substrate is removed while it is still thin, and the removed metal layer having pores substantially equal in size to the pores of the sieving substrate. Get
This can be further electroplated to deposit metal thereon until the desired thickness is obtained. During the final metal deposition step, the removed first metal layer is connected as a cathode (cathode) in an electric plating bath and the pores of the sieve retain substantially the same cross section as the cross section in the sieve substrate As such, the flow of liquid is maintained through the holes in the removed metal layer. In particular, a pulsed current may be used during the deposition of the first metal on the sieve substrate and during the deposition of the second metal on the first metal layer removed from the sieve substrate. By using such a pulse current, when the composition of the electric plating bath is kept constant, the so-called growth rate of metal deposition can be controlled. Also, by selecting appropriate pulse parameters, it is possible to deposit in a desired geometric shape. As mentioned above, the use of a pulsed current during metal deposition is described in Dutch Patent Application No. 8105150. According to the invention, after the formed sieve has obtained the required thickness, it is advantageous to apply a wear-resistant and / or rust-proof coating or coating thereon. Such coatings may be, for example, an electrophoretic plastic layer, an inorganic layer such as silica or titanium nitride deposited by cathodic (cathode) sputtering, or a chromium formed by electroplating. And a tin / nickel layer. If necessary, the mechanical properties of the formed sieve should be
It can be further improved by subjecting it to heat treatment at temperatures up to 300 ° C. for up to 5 hours. Such treatment removes the stress inherent in the sieve and prevents damage due to brittleness. If necessary, a protective gas such as nitrogen is used during the process. Most preferably, the method of the present invention is performed continuously. That is, a thin metal layer formed on a suitable sieve substrate is continuously removed to obtain a web, which is passed through a subsequent electric plating bath. Such a bath is, for example, a bath having the same composition as the bath in which the first metal layer is formed on the sieve substrate,
It is a bath that forms a rust-proof and / or abrasion-resistant layer. In the present invention, for example, various metals and alloys such as nickel, copper, and iron can be deposited on the sieve substrate. However, among these, nickel is particularly preferable from various points. When carrying out the process of the invention continuously, it is particularly advantageous for the sieve substrate to have the shape of a cylinder. In such an implementation, the cylindrical sieve substrate is partially immersed in an electric plating bath so that there is a gap in the bath between the surface of the sieve substrate and the anode (anode) surface. , An anode (anode) is provided. In such a preferred continuous method, the liquid is circulated from the inside of the cylindrical sieve substrate, through the holes of the sieve substrate, and toward the anode (anode). The sieve substrate may be formed according to a conventionally known method. That is, after depositing a metal on a mandrel consisting of a net-like pattern consisting of conductive bars and an electrically insulating region included between these bars, the metal is peeled off from the mandrel and provided to a sieve substrate. . The sieve substrate is formed by a continuous method using a pattern of holes arranged in the desired shape and size by another method, i.e., mechanical means, radiation or etching.
It can also be manufactured. The starting material can be a material consisting of metal, plastic or glass. When a material made of plastic or glass is used, it is necessary to form a required hole pattern and then form a conductive region so that it can be connected as a cathode (cathode) in an electric plating bath. The method of depositing a conductive layer on an insulating material is already well known, and can be, for example, by vapor deposition, electroless plating, or the like. However, in the present invention, as the starting material, a cylinder made of a thin and seamless nickel, which is provided with holes in a required shape, size and distribution by the method described above, is preferably used. Such a cylindrical sieve substrate, when held and connected as a cathode (cathode), is very advantageous for carrying out the process of the invention continuously. In order to remove the metal deposition layer formed on the sieve substrate,
It is also very important to apply a release layer on the sieve substrate in advance. Such release layers themselves are already known, and agents such as, for example, beeswax are often used to form release layers for temporary use. However, when performing the method of the present invention on a large scale, the use of a temporary release layer as described above is not appropriate. The method of the present invention can obtain advantageous results by forming a release layer having a permanent release property on a sieve substrate. Such a permanent release layer can be formed, for example, of chromium. According to the present invention, after forming the sieve base, it is subjected to an oxidizing treatment, the current distribution is not substantially affected, and strong adhesion between the deposited metal and the sieve base is prevented. By forming such an oxidized surface layer, an excellent release layer can be obtained. Such oxidation can be performed, for example, by using a potassium dichromate or potassium permanganate solution. The resulting oxide film is sufficiently stable that a metal layer can be deposited and stripped a number of times thereon without replacement or replenishment. Furthermore, according to the invention, there is provided an apparatus for performing the method according to the invention as described above. Such an apparatus comprises a bath required for performing various electroplating treatments, means for connecting a sieve substrate as a cathode (cathode), and a metal layer removed from a sieve metal as a cathode (cathode). Means for controlling the liquid flow and / or pulsing the current, and means for removing the metal formed on the sieve metal and guide means for guiding the metal to various baths. It is characterized by being. Finally, the present invention relates to a metal prepared by the method as described above and having pores having a size and shape substantially equal to the size and shape of the pores of the sieve substrate. Regarding sieve. Hereinafter, the present invention will be described in detail with reference to the drawings. In FIG. 1, a to d schematically show the steps required to carry out the method of the invention. FIG. 2 shows a cross section of an example of the final shape of one bar of a metal sieve according to the present invention. In FIG. 3, a to i show several examples of the final shape of the metal sieve according to the present invention. FIG. 4 is a sectional view showing an apparatus for continuously performing the method of the present invention. In FIG. 1, reference numeral 1 denotes a sieve substrate, which is, for example, a perforated material made of nickel having a thickness of about 50 μm and having holes 4 drilled by laser beam technology. is there. FIG. 1b shows the metallization 2 formed on the sieve substrate 1, wherein the flow of the liquid through the holes 4 in the direction indicated by the arrows in the figure during at least partial growth of the metallization is shown. Will be retained. The metal coating 2 has substantially the same thickness as the sieve substrate 1. FIG. 1c shows the metallization 2 removed from the sieve substrate,
FIG. 1 d shows a newly formed metal coating 3 on the metal sieve 2, as before, while at least a portion of the metal coating grows on the metal coating 2 by arrows in the figure. Liquid flow through the holes in the indicated direction is maintained. In the example shown, the metal coating 3 is substantially equal in thickness to the metal coating 2.
However, the ratio of the thickness of the metal coatings 2 and 3 can be arbitrarily selected. In the above growth process, a pulse current can be used in combination with the liquid flow instead of using the liquid flow. But in any case, the bath
It is preferable to contain an organic compound that promotes the growth of the metal in the orthogonal direction on the outer surface of the sieve substrate. Examples of such organic compounds include, for example, ethylene cyanohydrin and butynediol. In FIG. 2, reference numeral 2 indicates the first metal coating removed from the sieve substrate 1 as described above. FIG. 1d
A new second metallization 3 is formed on the first metallization 2 as in the above, depending on the bath composition and the growth conditions, the growth of the bar on the sieve substrate rather than the first cross section. Be careful not to make the cross section of the metal to be large. Finally, a rustproof and / or wear-resistant layer 4 is formed on the assembly of the metal layers 2 and 3. Such a layer
For example, consisting of chrome or tin / nickel, but
It may be made of other conventionally known rust-proof and / or wear-resistant materials. 3a to i show examples of the final shape of the metal sieve obtained using the method of the present invention. However, the present invention is not limited to these examples. FIG. 4 shows the configuration of an apparatus for continuously performing the method of the present invention. Reference numeral 5 indicates, for example, a first electric plating bath consisting of a nickel bath containing an appropriate amount of butynediol. In the first electric plating bath, a cylinder 7-shaped sieve substrate is rotatably partially immersed and disposed as a cathode (cathode), and a stationary anode (anode)
6 is provided and during at least a portion of the metal growth,
The liquid flow in the direction from the cathode (cathode) to the anode (anode) indicated by the arrow is maintained. By appropriately setting the current density of the cathode (cathode) and the rotation speed of the cathode (cathode), a sufficient thickness can be removed on the sieve substrate while it is immersed in the electric plating bath. A metal coating (web) made of a first metal layer having a thickness can be formed. After the process of growing and removing the first metal layer (web) on the sieving substrate is started, the first metal layer (web) 8 is so-called thickened by a guide roller 13. Into a subsequent second electric bath 9 such as a chemical bath. In the second electric plating bath, the first metal layer (web) is connected as a cathode (cathode), and an anode (anode) 10 is provided. A liquid flows through the first metal layer (web) 8 connected as a (cathode) in the direction of an anode (anode). In the second electric plating bath, the electric plating treatment is further performed on the first metal layer (web) removed from the sieve base under substantially the same conditions as those for forming the first metal layer. And depositing the metal until the required thickness is obtained, resulting in a second metal layer. After a metal layer (web) of sufficient thickness is obtained in this way, the metal layer (web) is led to a bath 11 for final treatment, where:
For example, a wear-resistant and / or rust-proof layer is formed by electric plating. In this way, a finished metal sieve can be obtained continuously, and this metal sieve is ultimately
It is wound up. If it is desirable from the point of view of the electric plating process to carry out the growth step in the bath over several baths, of course, following bath 9 and before bath 11, one or the same bath 9 may be used. Two or more may be provided. Instead of the bath 11, a station for forming a wear-resistant and / or rust-proof layer by another method can be provided. Examples of such methods include coating of a substance by electrophoresis, formation of a metal coating by electrostatic coating, and formation of a metal coating by vacuum technology such as vapor deposition or cathode sputtering.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows the steps required to carry out the method of the invention, and FIG. 2 shows an example of the final shape of one bar of a metal sieve according to the invention. FIG. 3 is a cross-sectional view showing several examples of other final shapes of the metal sieve according to the present invention, and FIG. 4 is an apparatus configuration diagram for continuously performing the method of the present invention. is there. 1 ... sieve substrate, 2 ... first metal coating formed on sieve substrate, 3 ... second metal coating formed on first metal coating, 4 ... rust prevention and 5) Nickel bath (first electric plating bath), 6 anode (anode), 7 cylinder, 8 first metal coating removed from sieve substrate , 9 ... thickening bath (second electric plating bath),
10… Anode (anode), 11… Final treatment bath.

Claims (1)

(57) [Claims] In a first electric plating bath, a first metal layer having a thickness sufficient to be removed from the sieve substrate is formed on the sieve substrate having a release layer by electric plating. During at least a portion of the plating process, the first metal layer is continuously removed from the sieve substrate while maintaining the flow of liquid through the holes of the sieve substrate to form a second electrical device. The first metal layer is further subjected to an electric plating process under substantially the same conditions as those used for forming the first metal layer, and the metal is removed until the required thickness is obtained. A method for continuously producing a metal sieve, wherein the method comprises depositing to obtain a second metal layer. 2. A first metal layer 2 is deposited on a sieve substrate, and a second metal layer 3 is deposited on the first metal layer 2 removed from the sieve substrate.
The method for continuously producing a metal sieve according to claim 1, wherein a pulse current is used to precipitate the metal sieve. 3. The abrasion-resistant and / or rust-preventive layer 4 is formed after a required thickness is obtained for the formed metal sieve. A continuous production method for metal sieves. 4. The method for continuously producing a metal sieve according to claim 3, wherein the layer 4 is formed from chromium or tin / nickel by electric plating. 5. 5. The method according to claim 1, wherein the finally obtained metal sieve is heat-treated at a temperature of 300 DEG C. for 0.5 to 5 hours in an inert gas if necessary. Continuous production method of metal sieve. 6. 6. The metal sieve according to claim 1, further comprising an electric plating in a subsequent bath having the same composition as the bath in which the first metal layer 2 is formed. Continuous manufacturing method. 7. In the first electric plating bath, a cylindrical sieve base having a peeling layer is rotatably partially immersed, disposed as a cathode, and an anode is disposed, while rotating the sieve base, A first metal layer having a thickness enough to be removed from the sieve substrate is formed thereon by electric plating, wherein at least a part of the electric plating process has holes formed in the sieve substrate. Maintaining a flow of liquid therethrough, then removing the first metal layer continuously from the sieve substrate and directing it into a subsequent second electrical plating bath to remove the first metal layer Under substantially the same conditions as those formed, the first metal layer removed from the sieve substrate is further subjected to an electric plating treatment to deposit a metal until a required thickness is obtained, thereby forming a second metal layer. The metal sieve according to any one of claims 1 to 6, wherein a layer is obtained. Continued manufacturing method. 8. The sieve substrate 1 is manufactured by providing the starting material with holes of a required size and a required pattern by mechanical means, radiation beam means or etching means, and the material thus drilled is required. The method for continuously producing a metal sieve according to any one of claims 1 to 7, wherein a conductive coating is formed according to the method. 9. 9. The method according to claim 8, wherein the starting material is selected from the group consisting of metal, plastic and glass. 10. 10. The method for continuously producing a metal sieve according to claim 7, wherein the starting material is formed from a cylinder made of thin and seamless nickel. 11. 11. The method for continuously producing a metal sieve according to claim 1, wherein the release layer on the sieve substrate is formed from a material having permanent peelability. 12. 12. A release layer is formed on a sieve substrate by oxidizing the sieve substrate with an aqueous solution of acidic potassium bichromate or potassium permanganate. The continuous production method of a metal sieve according to the above item. 13. Claim 1 characterized in that a metal sieve is obtained in which the sieve pore shape and size dimension is substantially equal to the sieve substrate pore shape and size dimension.
Item 13. The method for continuously producing a metal sieve according to any one of Items 12 to 12. 14． In the first electric plating bath, a cylindrical sieve base having a peeling layer is rotatably partially immersed, disposed as a cathode, and an anode is disposed, while rotating the sieve base, A first metal layer having a thickness enough to be removed from the sieve substrate is formed thereon by electric plating, wherein at least a part of the electric plating process has holes formed in the sieve substrate. Maintaining a flow of liquid therethrough, then removing the first metal layer continuously from the sieve substrate and directing it into a subsequent second electrical plating bath to remove the first metal layer Under substantially the same conditions as those formed, the first metal layer removed from the sieve substrate is further subjected to an electric plating treatment to deposit a metal until a required thickness is obtained, thereby forming a second metal layer. In a continuous apparatus for manufacturing a metal sieve for obtaining a layer, a first electric plating bath and the first electric plating bath are provided. In the bath, a cylindrical sieve substrate having a release layer rotatably disposed by being partially immersed as a cathode, an anode, and controlling the flow of liquid in the first and second electric plating baths, And / or means for pulsing a current, wherein a first metal layer formed on the sieve substrate is continuously removed from the sieve substrate in a first electric plating bath, 2. A continuous apparatus for producing a metal sieve, comprising: means for guiding a cathode in an electric plating bath; and an anode in a second electric plating bath.