JP2711266B2 - Method of manufacturing wiring in structure - Google Patents
Method of manufacturing wiring in structureInfo
- Publication number
- JP2711266B2 JP2711266B2 JP26134088A JP26134088A JP2711266B2 JP 2711266 B2 JP2711266 B2 JP 2711266B2 JP 26134088 A JP26134088 A JP 26134088A JP 26134088 A JP26134088 A JP 26134088A JP 2711266 B2 JP2711266 B2 JP 2711266B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- groove
- palladium
- bracket
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 229920006351 engineering plastic Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、電動機のブラケット等の構造体における配
線の製造方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing wiring in a structure such as a bracket of an electric motor.
［従来の技術］ 電動機の内部等における配線は、プリント基板にプリ
ント配線を施して行われているが、この場合プリント基
板の性質上プリント配線が平面で行われることになり、
平面以外の部分等に対してはリード線で接続しなければ
ならなかった。[Prior Art] Wiring inside an electric motor or the like is performed by applying printed wiring to a printed circuit board. In this case, printed wiring is performed in a plane due to the nature of the printed circuit board.
Parts other than the plane had to be connected by lead wires.
また、電動機のようにプリント配線にある程度大きな
電流が流れる場合、断面積を大きくするために幅の広い
配線を形成しなければならなかった。In addition, when a relatively large current flows through a printed wiring as in an electric motor, a wide wiring must be formed in order to increase the sectional area.
さらに、プリント配線では、機械的強度が少なく、大
きな外力が加わるとプリント基板からプリント配線が剥
がれ易いといった問題を有していた。Further, the printed wiring has a problem that the mechanical strength is low and the printed wiring is easily peeled off from the printed board when a large external force is applied.
「発明が解決しようとする問題点」 本発明は、この様な事情に鑑みてなされたものであ
り、電動機等の外形が複雑な構造で機械的強度が要求さ
れる構造における配線の製造方法を提供することを目的
としている。"Problems to be Solved by the Invention" The present invention has been made in view of such circumstances, and a method of manufacturing a wiring in a structure in which the external shape of a motor or the like is complicated and mechanical strength is required is described. It is intended to provide.
［問題点を解決するための手段］ 本発明は、エンジニアリングプラスチックの表面を多
孔質にすると共に構造体を構成し、この構造体の表面を
パラジューム処理し、この構造体の表面の一部を残しモ
ールドして表面に溝を形成し、この溝にパラジュームの
触媒作用で無電解メッキを施し、さらに無電解メッキさ
れた溝に電極を接続して電気メッキによる銅メッキを施
すことによって問題点を解決している。[Means for Solving the Problems] According to the present invention, a surface of an engineering plastic is made porous and a structure is formed, and the surface of the structure is subjected to a palladium treatment to leave a part of the surface of the structure. Solving the problem by forming a groove on the surface by molding, applying electroless plating to this groove by the catalytic action of palladium, connecting the electrode to the electroless plated groove, and applying copper plating by electroplating doing.
［作用］ 多孔質の表面に形成される小孔にパラジュームが入
り、このパラジュームの触媒作用によって無電解メッキ
が行える。[Operation] Palladium enters into the small holes formed on the porous surface, and electroless plating can be performed by the catalytic action of the palladium.
そして、無電解メッキされた部分に電極を接続して電
気メッキを行うことにより銅メッキによる断面積の大き
い配線を形成することができる。Then, by connecting electrodes to the electrolessly plated portions and performing electroplating, it is possible to form a wiring having a large cross-sectional area by copper plating.
［実施例］ 本発明を図面に示された一実施例に基づいて説明する
と、第１図は、本発明の構造体における配線の製造方法
の一実施例を示す要部斜視図であり、第２図及び第３図
は、それぞれ工程を説明するための要部拡大縦断面図で
ある。Embodiments The present invention will be described with reference to an embodiment shown in the drawings. FIG. 1 is a perspective view of an essential part showing one embodiment of a method for manufacturing a wiring in a structure of the present invention. FIG. 2 and FIG. 3 are enlarged vertical cross-sectional views of a main part for describing respective steps.
第１図、第２図及び第３図において、構造体における
配線の製造方法は、構造体としてエンジニアリングプラ
スチックを成形して形成された電動機のブラケット１に
配線２が複数形成されている。In FIGS. 1, 2 and 3, in the method of manufacturing wiring in a structure, a plurality of wirings 2 are formed on a bracket 1 of an electric motor formed by molding engineering plastic as a structure.
そして、ブラケット１は、一実施例として示されてい
るものであり、配線が施されるケースの内側などプラス
チックによって成形製作されるものであれば、他のもの
でも同じであり、特に外形が平面のものにかかわらず凹
凸のものでもよい。The bracket 1 is shown as an embodiment, and the other brackets are the same as long as they are formed and formed of plastic, such as the inside of a case to which wiring is applied. Irregular thing may be used regardless of thing.
さらに、配線２には、電極３が接続されており、この
電極３は、配線２に対して取付け及び取り外しが任意に
構成されているものである。Further, an electrode 3 is connected to the wiring 2, and the electrode 3 is configured to be arbitrarily attached to and removed from the wiring 2.
ブラケット１は、エンジニアリングプラスチックから
なるものであり、第２図に示される通り表面が多孔質で
小孔４を有しており、第１図に示される通り成形型で任
意の形状が得られるものである。The bracket 1 is made of engineering plastic, has a porous surface as shown in FIG. 2 and has small holes 4, and can have an arbitrary shape with a molding die as shown in FIG. It is.
そして、成形製作されたブラケット１をパラジューム
の液層に入れるなどして表面の小孔４にパラジューム５
を残留させる。Then, the formed bracket 1 is put into the liquid layer of palladium, for example, so that the palladium 5
Is left.
そこで、ブラケット１を成形型に入れて配線２が必要
な部分を残して表面にモールド６を施し、モールド６に
施されない部分によって配線２が形成される溝７を形成
する。Then, the bracket 1 is put into a molding die, and a mold 6 is applied to the surface except for a portion where the wiring 2 is required, and a groove 7 in which the wiring 2 is formed by a portion not applied to the mold 6 is formed.
そして、この溝７の面には、パラジューム５が残留し
た小孔４が露出する。Then, on the surface of the groove 7, the small hole 4 in which the palladium 5 remains is exposed.
さらに、溝７の小孔４にパラジューム５が残留した状
態でブラケット１を無電解メッキすると、パラジューム
５の触媒作用によって溝７に薄い無電解メッキの層８が
形成される。Further, when the bracket 1 is electrolessly plated while the palladium 5 remains in the small holes 4 of the groove 7, a thin electroless plating layer 8 is formed in the groove 7 by the catalytic action of the palladium 5.
この様な方法による無電解メッキの層８は、およそ２
μ／時間程度の速度で行えるが、比較的短時間の工程で
よい。The layer 8 of the electroless plating by such a method is approximately 2
Although it can be performed at a speed of about μ / hour, a relatively short process is sufficient.
すなわち、電解３が接続されて電気メッキが行えれば
よい。That is, it is only necessary that the electrolysis 3 is connected to perform the electroplating.
次の工程は、無電解メッキの層８に第１図に示される
通り、電極３を接続し、電気メッキ法により銅メッキを
行うと銅９による配線２が形成される。In the next step, as shown in FIG. 1, the electrode 3 is connected to the electroless plating layer 8 and copper plating is performed by an electroplating method, whereby the wiring 2 of copper 9 is formed.
また、電気メッキのため銅９によって計された配線２
は、30μ／時間程度の速度でメッキが行えるため短時間
で断面積を大きくすることができ、しかも、溝７の内側
に形成されるため、外力を受けることが少なく、機械的
強度が大きな配線２を形成できる。Also, wiring 2 measured by copper 9 for electroplating
Since the plating can be performed at a speed of about 30 μ / hour, the cross-sectional area can be increased in a short time, and since it is formed inside the groove 7, it is less subject to external force and has high mechanical strength. 2 can be formed.
このように形成される配線２は、電動機の巻線や制御
回路が接続されるなど、電気配線に使用できる。The wiring 2 formed in this way can be used for electric wiring, such as connection of a winding of a motor or a control circuit.
また、電気メッキが施された後に銅９を含めて外表面
を再びモールドすることもでき、この場合、モールドさ
れた内側に銅９による配線２を埋設することができ、絶
縁が行え機械的及び電気的に丈夫な電動機を構成するこ
とができる。Further, after the electroplating is performed, the outer surface including the copper 9 can be molded again. In this case, the wiring 2 made of the copper 9 can be buried inside the molded inside, and insulation can be performed and mechanical and An electrically strong electric motor can be configured.
［発明の効果］ 本発明によれば、平面に限らず成形製作できる複雑な
形状の構造体に配線を施すことができ、しかも、機械的
強度及び電気的特性が良好な配線を得ることができ、電
動機などに応用されることによって著しい効果を得るこ
とができるものである。[Effects of the Invention] According to the present invention, wiring can be formed not only on a flat surface but also on a complicated-shaped structure that can be formed and manufactured, and furthermore, wiring having excellent mechanical strength and electrical characteristics can be obtained. A remarkable effect can be obtained by being applied to a motor or the like.
第１図は、本発明の構造体における配線の製造方法の一
実施例を示す要部斜視図であり、第２図及び第３図は、
それぞれ工程を説明するための要部拡大縦断面図であ
る。 １……ブラケット、２……配線、３……電極、４……小
孔、５……パラジューム、６……モールド、７……溝、
８……無電解メッキの層、９……銅。FIG. 1 is a perspective view of an essential part showing one embodiment of a method of manufacturing a wiring in a structure of the present invention, and FIGS.
It is a principal part expanded longitudinal cross-sectional view for demonstrating each process. 1 ... Bracket, 2 ... Wiring, 3 ... Electrode, 4 ... Small hole, 5 ... Palladium, 6 ... Mold, 7 ... Groove,
8: layer of electroless plating, 9: copper.
Claims (1)
孔質にすると共に構造体を構成し、この構造体の表面を
パラジューム処理し、この構造体の表面の一部を残しモ
ールドして表面に溝を形成し、この溝にパラジュームの
触媒作用で無電解メッキを施し、さらに無電解メッキさ
れた溝に電極を接続して電気メッキによる銅メッキを施
すことを特徴とする構造体における配線の製造方法。1. A surface of an engineering plastic is made porous and a structure is formed. The surface of the structure is subjected to a palladium treatment, and a part of the surface of the structure is molded to form a groove on the surface. A method for producing a wiring in a structure, wherein the groove is subjected to electroless plating by a catalytic action of palladium, and further, an electrode is connected to the electrolessly plated groove and copper plating is performed by electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26134088A JP2711266B2 (en) | 1988-10-19 | 1988-10-19 | Method of manufacturing wiring in structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26134088A JP2711266B2 (en) | 1988-10-19 | 1988-10-19 | Method of manufacturing wiring in structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02109216A JPH02109216A (en) | 1990-04-20 |
| JP2711266B2 true JP2711266B2 (en) | 1998-02-10 |
Family
ID=17360466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26134088A Expired - Fee Related JP2711266B2 (en) | 1988-10-19 | 1988-10-19 | Method of manufacturing wiring in structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2711266B2 (en) |
-
1988
- 1988-10-19 JP JP26134088A patent/JP2711266B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02109216A (en) | 1990-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |