JP2711960B2 - Cutting method for base sheet with backing sheet - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a base sheet with a backing sheet, which cuts a label or an adhesive sheet, and cuts only the base material using a laser while leaving the backing sheet.

[0002]

2. Description of the Related Art As a means for peeling a substrate from a mount, there is a method using a laser. As this prior art, there is, for example, JP-A-59-147382. In this technique, a metal such as aluminum is used for the mount, and when the laser is irradiated, cutting of the mount is prevented, and only the base material is cut while leaving the mount.

[0003]

However, as described above, when a metal such as aluminum is used as the backing paper, there is a problem that when the material is supplied in a roll form, the weight increases. In addition, the cutting of only the base material requires delicate control of the laser output. In particular, when a perforation is made on the base material or the backing sheet with a laser, there is a problem that the control design and the equipment aspect become complicated. .

The present invention has been proposed in view of the above, and it is an object of the present invention to make a perforation by a simple means without causing an increase in weight, and to peel a base material from a backing paper. It is an object of the present invention to provide a method for cutting a base sheet with a mount.

[0005]

SUMMARY OF THE INVENTION The present invention provides a method for cutting a base sheet by irradiating a base sheet and a base sheet with a base sheet having a peelable base sheet provided on the base sheet with a laser beam. In the above, the above object is achieved by making the laser light a ripple pulse.

[0006]

As described above, the present invention uses a rectangular wave-shaped ripple pulse as a laser output, forms a through hole in a base sheet or backing paper at a high energy pulse portion, and makes a base sheet at a low energy pulse portion. A cut is formed only in the portion, and a perforation is formed by these. The base sheet can be peeled off from the backing sheet through the perforation formed by the cut and the through hole in the base sheet portion.

[0007]

1 to 3 show a first embodiment of the present invention. FIG. 1 shows the state of the ripple pulse of the laser beam 1 used in the present invention. This ripple pulse has a pulse portion 1a having a high energy with respect to time and a pulse portion 1b having a lower energy with respect to time, and is a rectangular pulse.

FIG. 2 shows a state in which the base sheet 3 can be peeled off from the base sheet 4 provided with the backing sheet provided on the backing sheet 2 by using the ripple pulse.

In this case, the ripple pulse laser beam 1
Is applied to the base sheet 4 with the backing sheet from almost directly above in the direction of arrow a. The through-hole 5 is perforated in the base sheet 3 or the backing sheet 2 by the high energy pulse portion 1a of the ripple pulse.
In addition, a notch 6 is formed in the base sheet 3 from the surface to a predetermined depth by the pulse portion 1b.

In this case, the interval between the through holes 5 can be arbitrarily set by appropriately controlling the pulse width by a pulse width control circuit. In addition, the cutting depth of the base sheet 3 can be arbitrarily set by adjusting the energy level of the pulse portion 1b. FIG. 3 is an explanatory sectional view taken along line A in FIG. The lower shaded portion is the remaining portion of the backing sheet 2 after the laser irradiation, and the upper portion is the remaining portion of the base sheet 3, and the base residue is small and is perforated. The base sheet 3 can be easily peeled from the backing sheet 2.

FIG. 4 is a schematic perspective view of the whole process. In the process of winding the base material-attached base sheet 4 from the base material-attached base roll 7 in the direction of the arrow B in the direction of arrow B, a laser cutting device 9 that emits a so-called ripple pulse movable in a predetermined direction provides a perforation. Is inserted. Thereafter, the substrate sheet 3 peeled off as shown by the arrow is used as a label or the like. Also, the backing paper 2 is a backing paper winding roll 8.
It is wound up. The material of the mount 2 is paper or an appropriate material similar thereto.

FIGS. 5 to 8 show a second embodiment of the present invention. In this embodiment, as shown in FIG. 5, a first pulsed laser beam 1 and a second pulsed laser beam 1A having ripple phases shifted from each other are used, and as shown in FIG. On the other hand, it is characterized in that irradiation is performed while crossing in an X shape from above the bevel. These two laser beams 1,
The intersection of 1A is set at a predetermined depth from the surface of the base material sheet 3 so that the base material sheet 3 can be peeled off, a through hole 5 is formed in a high energy pulse part 1a, and a low energy pulse part 1b is formed. Cuts 6 are made in the base sheet 3 to a predetermined depth.

FIG. 7 shows a state in which perforations made of cuts 6 or penetrating products 5 are formed in the base sheet 4 with a mount using two laser beams 1, 1A. Two cuts 6 are formed in parallel on the surface, and the through holes 5 are formed in the cuts 6 with the positions shifted.
Are alternately formed. FIG. 6 described above is a cross section taken along line A in FIG. 7, and FIG. 8 is a cross section taken along line B in FIG.

[0014]

As described above, according to the present invention, the base sheet 3 provided on the backing sheet 2 at the low-energy pulse portion 1b using the ripple pulse laser light whose energy is high and low is used. A cut 6 having a predetermined depth is made, and a perforation is made at a high-energy pulse portion 1a. A paper material or the like is sufficient for the mount 2, and a metal material such as aluminum is not used. In addition, the base sheet 3 can be easily peeled off without delicate control of the laser output.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an energy state with respect to time of a laser beam of a ripple pulse used in a first embodiment of the present invention.

FIG. 2 is an explanatory view of a state in which a substrate sheet with a backing sheet is irradiated with a laser beam.

FIG. 3 is a sectional view taken along line A in FIG. 2;

FIG. 4 is an overall view of a substrate peeling process.

FIG. 5 is an explanatory view of two phase-shifted laser beams used in a second embodiment of the present invention.

FIG. 6A shows the cutting state of the base sheet with the backing sheet in FIG.
Sectional view along the line.

FIG. 7 is an explanatory diagram of a cutting state by two laser beams.

FIG. 8 is a sectional view taken along line B in FIG. 7;

[Explanation of symbols]

 1, 1A laser beam 2 mount 3 base sheet 4 base sheet with mount 5 through hole 6 cut 7 base roll with mount 8 mount take-up roll 9 laser cutting device

 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-12834 (JP, A) JP-A-2-123394 (JP, A) JP-A-1-193195 (JP, A) JP-A-56- 24112 (JP, A)

Claims (2)

(57) [Claims] 1. A method for cutting a base sheet by irradiating a base sheet and a base sheet with a base sheet provided with a peelable base sheet on the base sheet with a laser beam, wherein the laser beam is a ripple pulse. A method for cutting a substrate sheet with a backing sheet, characterized in that: 2. A method for irradiating a base material and a base material-attached base sheet having a detachable base material sheet provided with the base material with a laser beam to cut the base material sheet, wherein two phases are shifted from each other. 2. The method for cutting a base material sheet with a backing sheet according to claim 1, wherein the laser light is applied in a crossed manner.