JP2718383B2 - Optical semiconductor array module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor array module, and more particularly to an optical semiconductor array module used for optical parallel transmission.

[0002]

2. Description of the Related Art An optical parallel transmission system has a higher transmission speed, transmission distance and EMI (Ele) resistance than an electric parallel transmission system.
ctro-Magnetic Interferenc
e) It is expected to be widely used as a computer interface because of its excellent properties and the ability to greatly reduce the size of the transmission path. In order to realize a compact and economical module serving as a light emitting source or a receiving light source for optical parallel transmission, it is extremely effective to form an array of optical semiconductor elements as light emitting elements or light receiving elements and an array of optical fibers. .

FIG. 2 shows an example of a conventional optical semiconductor array module in which optical semiconductor elements and optical fibers are arrayed, particularly an LED (Light Emitted Diode).
FIG. 4 is a partially broken perspective view showing a configuration of a conventional LED array module using an array element. This conventional L
The ED array module includes, inside a package 32, an LED array element 21 including four LED units 21A to 21D arranged at equal intervals, and four LED units 21A to 21D.
Four optical fibers 25 arranged in an array at equal intervals as 1D
A to 25D optical fiber array and four driving ICs for driving the LED units 21A to 21D, respectively.
(Integrated Circuit) 26A-2
6D and a lead 35 for electrical connection with the outside of the package 32.

The LED array element 21 is a rectangular parallelepiped LED.
The LED carrier 22 is fixed at the center of the bottom surface of the package 32. The LED carrier 22 includes an LED section 21A.
To 21D are formed.

The optical fibers 25A to 25D are held so as to be sandwiched by an optical fiber holding member 24 including a lower holding member 24A and an upper holding member 24B, and are optically connected to the LED sections 21A to 21D for each channel. Is joined to. The optical fiber holding member 24 is fixed at a position near the front end of the bottom surface of the package 12.

The driving ICs 26A to 26D are surface-mounted ICs, and are mounted on the upper surface of a rectangular plate-shaped IC carrier 29, respectively. The IC carrier 29 is L
The package 32 is fixed at a position near the rear end of the bottom surface of the package 32 so as to be located on the opposite side of the optical fiber holding member 24 with respect to the ED carrier 22. A wiring pattern 30 is provided on the upper surface of the IC carrier 29, and the wiring pattern 30 and the driving ICs 26 </ b> A to 26 </ b> D are electrically connected by bonding wires 27.

The wiring pattern 36 on the LED carrier 22
The driving ICs 26 </ b> A to 26 </ b> D on the IC carrier 29 are electrically connected by bonding wires 23.

The leads 35 are soldered to and electrically connected to wiring patterns 34A and 34B formed on the upper surfaces of the lead carriers 36A and 36B. The lead carriers 36 </ b> A and 36 </ b> B are fixed to the bottom surface of the package 32 by being half inserted into openings formed near the rear ends of the left and right side walls of the package 32. The wiring patterns 34A and 34B on the lead carriers 36A and 36B correspond to the wiring patterns 30 on the IC carrier 29.
Are electrically connected to each other by bonding wires 33.

As illustrated in FIG. 2, in the conventional optical semiconductor array module, the optical semiconductor array element is disposed on the input / output end face side of the optical fiber array, and the optical semiconductor array element is located at a position opposite to the optical fiber array with respect to the optical semiconductor array element. A plurality of optical semiconductor element driving semiconductor elements are mounted by disposing a carrier for mounting the optical semiconductor element driving semiconductor element on the optical element, and the optical semiconductor element driving semiconductor element and the optical semiconductor array element are electrically connected. I was

An example of a parallel optical transmission module in which optical semiconductor elements and optical fibers are arrayed is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 4-291771. This parallel optical transmission module hermetically seals a signal terminal, a power supply terminal, and a ground terminal connected to an IC for driving an optical device array on a side surface opposite to a side surface hermetically sealing the optical fiber array. The purpose of the present invention is to reduce the size of the module and increase the mounting density. However, similarly to the conventional LED array module shown in FIG. 2, an LD array is arranged on the input / output end face side of the optical fiber array. A subcarrier on which an IC for driving an LD array is mounted is disposed at a position opposite to the optical fiber array with respect to the array.

[0011]

In the above-mentioned conventional optical semiconductor array module, the optical semiconductor array element is arranged on the input / output end face side of the optical fiber array, and the optical semiconductor array element is located at a position opposite to the optical fiber array with respect to the optical semiconductor array element. A carrier for mounting the optical semiconductor element driving semiconductor element is disposed on the optical semiconductor element driving semiconductor element, and the optical semiconductor element driving semiconductor element and the optical semiconductor array element are electrically connected. Therefore, the holding member for the optical fiber, the mounting member for the optical semiconductor element, and the mounting member for the semiconductor element for driving the optical semiconductor element must be sequentially arranged in the optical axis direction, and the size of the optical semiconductor array module in the optical axis direction is large. There was a problem that it had to be.

In view of the above, an object of the present invention is to pay attention to the fact that the upper surface of the optical fiber holding member is empty, and to provide a wiring pattern on the upper surface of the optical fiber holding member to realize a semiconductor element for driving an optical semiconductor element. It is an object of the present invention to provide an optical semiconductor array module that can be downsized in the optical axis direction by being mounted.

[0013]

An optical semiconductor array module according to the present invention includes a plurality of optical semiconductor elements arranged side by side in a direction perpendicular to an optical axis, and the plurality of optical semiconductor elements.
An optical semiconductor element carrier to be mounted, a plurality of optical fibers arranged so as to be optically coupled to the plurality of optical semiconductor elements, an optical fiber holding member for holding the plurality of optical fibers collectively, and An optical semiconductor array module comprising: an optical semiconductor element driving semiconductor element for driving the optical semiconductor element; and a wiring pattern provided on a surface horizontal to the optical axis of the optical fiber holding member to form a surface-mounted type
Mounting the plurality of semiconductor elements for driving an optical semiconductor element formed of an integrated circuit, and bonding the optical semiconductor element on the optical semiconductor element carrier and the semiconductor element for driving the optical semiconductor element on the optical fiber holding member to a bonding wire; By one pair
It is characterized by being electrically connected to one .

[0014]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram showing a configuration of an optical semiconductor array module according to one embodiment of the present invention. The optical semiconductor array module of this embodiment has four channels of L.
An ED array module, in which an LED array element 1 including four LED units 1A to 1D arranged at equal intervals and four LEDs arranged in an array at equal intervals with the LED units 1A to 1D inside a package 12. An optical fiber array 5 including optical fibers 5A to 5D, four driving ICs 6A to 6D for driving the LED units 1A to 1D, respectively, and leads 15 for electrical connection to the outside of the package 12 are provided. It is configured.

The LED array element 1 is made of, for example, InGaAs.
The LED sections 1A to 1D made of an sP-based semiconductor are formed monolithically, and the intervals between the LED sections 1A to 1D are equal to about 250 μm. The lower surface of the LED array element 1 is metallized to form a common ground plane, and the ground plane is soldered and fixed to the front side surface of the LED carrier 2.

The LED carrier 2 is formed in a horizontally long rectangular parallelepiped shape of ceramics, and is fixed by soldering to a position near the rear end of the bottom surface of the package 12. The lower surface of the LED carrier 2 is metallized for fixing the solder to the package 12. The front surface of the LED carrier 2 is also metallized for fixing the solder to the LED array element 1. Further, four wiring patterns 17 are formed from each of the LED sections 1A to 1D of the LED array element 1 to the front edge of the upper surface of the LED carrier 2.

The optical fibers 5A to 5D are made of a quartz or optical plastic material and have a diameter of, for example, about 125 μm.
Are held in an array at equal intervals of, for example, about 250 μm. The optical fibers 5A to 5D are held such that the rear ends thereof protrude from the optical fiber holding member 11 by about several mm, and are optically coupled to the LED units 1A to 1D of the LED array element 1 for each channel. Have been. The rear ends of the optical fibers 5A to 5D are metallized for solder fixing with the optical fiber holding member 11.

The driving ICs 6A to 6D are surface-mount type ICs.
C, having a signal output bonding pad (not shown) near the rear edge of the upper surface, and a signal input, power supply and ground bonding pad (not shown).
Near the front end of the upper surface. The driving ICs 6A to 6D
The optical fiber holding members 11 are arranged at substantially equal intervals along the rear edge.

The optical fiber holding member 11 comprises a lower holding member 11A and an upper holding member 11B.
The lower holding member 11A and the upper holding member 11B are made of ceramics and are formed in a substantially square plate shape of about 2 mm × 2 mm in length and width. Four V-grooves in the direction of the optical axis are formed in the upper surface of the lower holding member 11A and the lower surface of the upper holding member 11B by photoetching so as to correspond to each other. Each V-groove is connected to the LED unit 1
They are formed at intervals of A to 1D, for example, at intervals equal to 250 μm. The upper surface of the lower holding member 11A and the lower surface of the upper holding member 11B are metallized for solder fixing.

On the upper surface of the upper holding member 11B, a total of twelve wiring patterns 10, three for the driving ICs 6A to 6D (signal input, power supply and ground), are formed by photolithography. , The right half is L
It is bent in the shape of a letter and faces the wiring pattern 14B on the lead carrier 16B. The six left half portions are bent in an inverted L-shape to face the wiring pattern 14A on the lead carrier 16A. Further, on the upper surface of the upper holding member 11B, the driving ICs 6A to
6D is fixed by soldering. Driving IC 6A
6D bonding pads (for signal input, power supply and ground) and the wiring pattern 10 are electrically connected one-to-one by bonding wires 3.

The wiring pattern 17 on the LED carrier 2 and the bonding pads (for signal output) of the driving ICs 6A to 6D are electrically connected one-to-one by bonding wires 7.

The package 12 is made of a metal such as Kovar alloy (iron-nickel-cobalt alloy) and has a thickness of 1 m.
It is formed in a box shape of about m, about 5 mm in length, and about 3 mm in width. Although not shown in FIG. 1, the package 12 is provided with a cap formed of the same material.

The leads 15 are made of, for example, a metal plate having a thickness of about 0.3 mm and a width of about 0.5 to 1.0 mm, and are arranged one-to-one near the outer ends of the wiring patterns 14A and 14B on the lead carriers 16A and 16B. It is brazed and fixed.

The lead carriers 16A and 16B are
It is formed of ceramic in a rectangular parallelepiped shape, and has six wiring patterns 14A and 14B formed on the upper surface thereof in a direction orthogonal to the optical axis direction. The lead carriers 16 </ b> A and 16 </ b> B are inserted only in half into openings formed in the left and right side walls of the package 12 and are fixed to the bottom surface of the package 12 by soldering. The lower surfaces of the lead carriers 16 </ b> A and 16 </ b> B are metallized for fixing the solder to the package 12. Wiring patterns 14A and 14 on leads 15 and lead carriers 16A and 16B
4B is electrically connected one-to-one by brazing. Further, lead carriers 16A and 16B
The upper wiring patterns 14A and 14B and the wiring pattern 10 on the optical fiber holding member 11
Are electrically connected one to one.

Next, a description will be given of an assembling process of the optical semiconductor array module according to the present embodiment thus configured.

First, the read carriers 16A and 16A
Six wiring patterns 14A and 14B are respectively formed on the upper surface of B by photolithography, and the leads 15 are brazed one-to-one on the left and right outer ends of the wiring patterns 14A and 14B. Next, each lead carrier 16A
The lead carriers 16A and 16B are fixed to the bottom surface of the package 12 by soldering while the carriers 16A and 16B are inserted halfway into the package 12 from the openings formed in the left and right side walls of the package 12.

On the other hand, the front surface of the LED carrier 2
The D array element 1 is fixed by soldering, and a wiring pattern 17 is formed by photolithography from each of the LED sections 1A to 1D of the LED array element 1 to the front edge of the upper surface of the LED carrier 2.

Further, the drive I is formed on the upper surface of the upper holding member 11B of the optical fiber holding member 11 by photolithography.
A wiring pattern 10 including metallized surfaces for solder fixing of C6A to 6D is formed, and thereafter, the driving ICs 6A to 6D are fixed to the metallized surfaces on the upper holding member 11B by soldering.

Next, the LED array element 1 is fixed to the front side surface, and the LE pattern in which the wiring pattern 17 is formed from each LED section 1A to 1D of the LED array element 1 to the front edge of the upper surface.
The D carrier 2 is fixed by soldering to a position near the rear end of the bottom surface of the package 12.

Subsequently, the rear ends of the optical fibers 5A to 5D are inserted through four through holes formed in the front wall of the package 12, and the rear ends of the optical fibers 5A to 5D are connected to the lower holding member 11A. After being arranged in the V-groove, the upper holding member 11B on which the wiring patterns 10 are formed and the driving ICs 6A to 6D are fixed is covered and integrated by soldering, and the integrated optical fiber holding member 11 is connected to the optical fibers 5A to 5D by LEDs. Part 1A ~
1D is positioned so as to be optically coupled to each channel, and the lower holding member 11A is fixed to a position near the front end of the bottom surface of the package 12 by soldering. An adhesive is applied to the optical fibers 5A to 5D at the contact portions with the through holes of the package 12, and fixed.

Next, the driving IC is connected to the bonding wire 3.
The bonding pads 6A to 6D (for signal input, power supply and ground) and the wiring pattern 10 are electrically connected one to one, and the bonding pattern 7 on the LED carrier 2 and the driving ICs 6A to Each of the LED units 1A to 1D is electrically connected to a 6D bonding pad (for signal output) in a one-to-one manner, thereby driving IC 6A.
6D, the wiring pattern 10 on the optical fiber holding member 11 and the lead carriers 16A and 16B.
By electrically connecting the upper wiring patterns 14A and 14B one-to-one with the bonding wires 13, the driving ICs 6A to 6D and the leads 15 are electrically connected.

Finally, a cap is put on the package 12 and both are fixed by seam welding to seal the LED array module.

In this embodiment, the optical semiconductor element is LE
Although the case of D is described as an example, the optical semiconductor element is not limited to this, and may be a light emitting element or a light receiving element, an LD (Laser Diode) element, a PIN-PD (PIN- Photo Diode)
Element, ADP (Amorphus Photo Dio)
de) It goes without saying that the present invention can be realized in the same manner even with an element or the like.

Although the number of the LED sections 1A to 1D and the number of the optical fibers 5A to 5D are four, the number is not limited to this and may be larger or smaller.

Furthermore, the intervals between the LED units 1A to 1D are equal here, but are not limited to this.

Furthermore, although the coupling between the LED sections 1A to 1D and the optical fibers 5A to 5D is shown by direct coupling, the coupling method is not limited to this, and it goes without saying that a lens or the like may be used. Nor.

[0038]

As described above, according to the present invention, the wiring pattern is provided on the upper surface of the optical fiber holding member, and the semiconductor element for driving the optical semiconductor element is mounted. Can be effectively used, and a space for mounting the semiconductor element for driving an optical semiconductor element, which has been conventionally used, can be omitted, so that downsizing of the optical semiconductor array module in the optical axis direction can be achieved. This has the effect.

Further, since the member for mounting the semiconductor element for driving the optical semiconductor element which has been conventionally used can be omitted, the number of parts and the number of assembling steps can be reduced.

[Brief description of the drawings]

FIG. 1 is a partially broken perspective view showing a configuration of an LED array module as an example of an optical semiconductor array module according to one embodiment of the present invention.

FIG. 2 is a partially broken perspective view showing a configuration of an LED array module as an example of a conventional optical semiconductor array module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 LED array element 1A-1D LED part 2 LED carrier 3 Bonding wire 5 Optical fiber array 5A-5D Optical fiber 6A-6D Driving IC 7 Bonding wire 10 Wiring pattern 11 Optical fiber holding member 11A Lower holding member 11B Upper holding member 12 Package 13 Bonding Wire 14A, 14B Wiring Pattern 15 Lead 16A, 16B Lead Carrier 17 Wiring Pattern

Claims (5)

(57) [Claims] 1. A plurality of optical semiconductor elements arranged side by side in a direction perpendicular to an optical axis, and the plurality of optical semiconductor elements are mounted.
An optical semiconductor element carrier to be mounted, a plurality of optical fibers arranged so as to be optically coupled to the plurality of optical semiconductor elements, an optical fiber holding member for holding the plurality of optical fibers collectively, and An optical semiconductor array module comprising an optical semiconductor element driving semiconductor element for driving the optical semiconductor element, wherein a wiring pattern is provided on a surface horizontal to the optical axis of the optical fiber holding member to form a surface-mounted integrated circuit. Mounting the plurality of semiconductor elements for driving an optical semiconductor element,
The optical semiconductor device on a carrier and the optical fiber holding unit
Bondi and the optical semiconductor element driving semiconductor element on wood
An optical semiconductor array module, wherein the optical semiconductor array module is electrically connected one-to-one by a wiring. 2. The optical semiconductor array module according to claim 1, wherein said plurality of optical semiconductor elements are light emitting elements. 3. The optical semiconductor array module according to claim 1, wherein said plurality of optical semiconductor elements are light receiving elements. 4. The optical semiconductor array module according to claim 1, wherein said plurality of optical semiconductor elements are arranged at regular intervals. 5. The optical semiconductor array module according to claim 1, wherein said plurality of optical semiconductor elements are formed in one optical semiconductor array element.