JP2720331B2 - Workpiece suction plate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention is, for example, integrated circuits (IC), transistors, and have contact to the steps of manufacturing the electronic component of the diode, and is used when machining the metal parts to be assembled to the electronic component The present invention relates to a workpiece suction plate.

[0002]

2. Description of the Related Art Conventionally, as a method of processing a lead frame for an integrated circuit as described above, for example, a method of punching a metal film formed in a band shape or a fixed shape into a predetermined shape and size by a punching machine is known. is there.

[0003]

However, due to the increase in the density of integrated circuits, thinning of lead frames to be assembled has been required .
In addition , with the above-described punching method, there is a limit in the processing accuracy of the lead frame. In recent years, as an alternative to the punching method, for example, there is a method of fusing a metal film into a predetermined shape and size by a laser beam such as a CO ₂ laser, but when the thickness of the metal film is reduced, loosening and wrinkles are likely to occur, There is a problem that it is difficult to maintain the flatness and the processing accuracy is deteriorated.

According to a first aspect of the present invention, a metal mother
Made of silicon carbide material in the concave fitting part formed on the upper surface side of the material
The metal film held by suction on the upper surface side of the porous suction plate is fused and fixed to a predetermined shape and size by a laser beam irradiated from a laser irradiation unit. precise? one can be accurately machined, and an object thereof is to provide a workpiece suction plate capable of improving the machining accuracy.

[0005] The invention according to claim 2 of the present invention is characterized in that
In addition to the object of the invention described in claim 1, the porous adsorbing plate is about 3
By setting the porosity to 0 to 80%, the negative pressure
Due to the suction action, a metal film is placed on the top side of the porous adsorption plate
Can obtain a uniform negative pressure suitable for holding by suction
The purpose of the present invention is to provide a workpiece suction plate.

[0006]

Means for Solving the Problems The invention of claim 1, wherein the present invention, when machining, the laser beam is irradiated
With a workpiece suction plate that holds the metal film by suction at the irradiation position
On the upper surface side of the metal base material arranged at the irradiation position.
Porous adsorption formed of silicon carbide material on formed concave fitting
The plate is mated and fixed, and the bottom of the concave fitting portion of the metal base material is
Many in the form of a lattice or grids facing the porous adsorption plate
Of the metal base material
A negative pressure generating means on the lower surface side of the metal base material in communication with each of the suction holes.
It is characterized in that it is a workpiece suction plate in which steps are connected .

[0007] The invention of claim 2, wherein the present invention, in conjunction with the configuration of the invention according to the first aspect, the porous suction plate workpiece was set at about 30% to about 80% porosity suction plate It is characterized by being.

[0008]

The workpiece suction plate according to the first aspect of the present invention drives a negative pressure generating means after supplying a metal film to an upper surface side of a porous suction plate made of a silicon carbide material fixed to a metal base material. By sucking air through each suction hole formed in the metal base material and the porous suction plate fixed to the metal base material, the metal film is suction-held by a negative pressure generated on the upper surface side of the porous suction plate. it can. Thereafter, the metal film suction-held on the upper surface side of the porous suction plate is blown into a predetermined shape and size by a laser beam irradiated from a laser irradiation unit,
Precision or One can be accurately machined.

According to a second aspect of the present invention, a workpiece suction plate is provided by setting the porous suction plate to a porosity of about 30% to about 80% in addition to the operation of the first aspect of the invention. ,
By the suction action of the negative pressure generating means, a negative pressure suitable for adsorbing and holding the metal film is uniformly generated on the upper surface side of the porous adsorption plate, and the metal film can be adsorbed and held without slack and wrinkles .

[0010]

According to the first aspect of the present invention , a porous fitting is formed in the concave fitting portion formed on the upper surface side of the metal base material.
Quality suction plate conforms fixed, than inhales through the suction <br/> pores formed in the metal matrix, and a porous suction plate matching fixed portion the fitting concave of the base material, Due to the negative pressure generated on the upper surface side of the porous suction plate, the metal film is sucked and held without slack and wrinkles, and the flatness of the metal film can be constantly maintained. In other words, warping or distortion occurs in the metal film while maintaining the flatness of the metal film.
Because blown into a predetermined geometry by laser beam remain not raised, together with the metallic film as traditional mechanical machining operations than punching is performed stably, it can be processed precisely and accurately, processed There is an effect that accuracy can be improved.

According to the second aspect of the present invention,
In conjunction with the effects of the invention described in claim 1, wherein, by the porosity of the porous suction plate formed carbide material, heat generated in the irradiation portion of the laser beam is diffused and heat dissipation, the metal film is partially heated Can be prevented from being melted by radiant heat, the work to blow the metal film into the specified shape and size can be performed accurately , and the suction action of the negative pressure generating means
To hold the metal film on the top side of the porous suction plate.
The effect of obtaining a uniform negative pressure suitable for holding
is there.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. The drawings illustrate the workpiece suction plate used when processed by laser processing machine the lead frame to be assembled into an integrated circuit (IC), 1, and have contact 2, the workpiece suction plate 1, the laser processing the metal matrix 3 is disposed in the irradiation position set on work table 6a of the machine 6, the metal film 2 in the irradiation position on the porous suction plate 4 fixed to the recessed fitting-in portion 3b of the base metal 3 After the supply, the negative pressure generator 7 is driven to form a plurality of intake holes 3c formed in the concave fitting portion 3b of the metal base material 3, and a porous suction plate fixed to the concave fitting portion 3b. The metal film 2 is sucked and held by the negative pressure generated on the upper surface side of the porous suction plate 4 by sucking air through the metal film 2. Thereafter, the metal film 2 adsorbed and held on the upper surface side of the porous adsorbing plate 4 is blown into a predetermined shape and size by a laser beam L emitted from a laser processing machine 6, and a lead frame to be mounted on the integrated circuit 9. 10 (see FIG. 4) .

[0013] metal matrix 3 described above, for example, a stainless steel alloy, a metal member such as an aluminum alloy to form a preform body 3a having a square, multi-porous suction plate on the upper surface central portion of the preform body 3a 4 to form a concave fitting-in portion 3b for fixing the fitting and together with the concave inner surface shape of the fitting-in portion 3b of the square porous suction plate 4 is formed in a size and shape to be matched fixed, 3 As shown in the figure, a large number of intake holes 3c are formed in a lattice shape or a grid shape at predetermined regular intervals on the bottom surface of the concave fitting portion 3b.

Further, the preform body 3a which is formed in a rectangular shape is mounted on the suction unit 5 the abutment surface of the cross meet fixed airtight to a respective suction holes 3c formed in the base material body 3a ..., adsorption an intake chamber 5a formed on the upper surface side central portion of the unit 5 as well as communicatively connected, mounted and fixed to the suction unit 5 into the irradiation position set on work table 6a Les chromatography the machine 6,
Inlet 5b formed on the bottom side central portion of the adsorption unit 5
And a suction port 7a of a negative pressure generator 7 provided in the laser processing machine 6 are connected to each other through an intake duct 8 to connect the negative pressure generator.
The outlet 7b of the device 7 is opened to the atmosphere side via a filter (not shown). For example, each suction hole 3c formed in the concave fitting portion 3b of the metal base material 3 by the suction force of the negative pressure generator 7 composed of a vacuum pump, a suction blower, and the like.
By sucking air through the porous suction plate 4 fixed to the concave fitting portion 3b, a negative pressure suitable for holding the metal film 2 by suction on the entire upper surface side of the porous suction plate 4 is uniformly generated. .

The porous suction plate 4 described above, the carbonization silicon (S
The suction plate body 4a having a square formed by iC) material to form an outer surface shape of the suction plate body 4a to the size and shape are matched fixed to the concave fitting-in portion 3b of the metallic base material 3 described above ing. In the embodiment of the present invention, the porosity of the suction plate main body 4a formed of silicon carbide (SiC) is set to about 30% to about 80%, but preferably about 40%.
%, And has a porosity of about 60% and a bending strength of 1 kg / mm ² .

The illustrated embodiment is configured as described above. Hereinafter, a method for processing the lead frame 10 of the integrated circuit 9 by the laser processing machine 6 using the workpiece suction plate 1 will be described.

[0017] Also not a, as shown in FIGS. 1 and 2, the suction unit 5 into the irradiation position on the work table 6a constituting the laser beam machine 6 is placed stationary, the metal matrix fixed to the suction unit 5 After the porous suction plate 4 is fitted into and fixed to the concave fitting portion 3b of the third work piece 3 and the workpiece suction plate 1 is set at the irradiation position on the processing table 6a, for example, the work suction plate 1 has a thickness of about 20 μm to about 30 μm. Then, the band-shaped metal film 2 wound in a roll shape or the metal film 2 formed in a fixed size is placed at the irradiation position on the porous adsorption plate 4 fixed to the concave fitting portion 3b of the metal base material 3. Supply.

Next, by driving the negative pressure generating device 7 provided in the laser beam machine 6, and the suction holes 3c ... formed in the narrowing portion 3b fitting recessed metal matrix 3, narrowing portion 3b fitting the concave By suctioning through the porous suction plate 4 fitted and fixed in the air, a negative pressure suitable for holding the metal film 2 by suction over the entire upper surface side of the porous suction plate 4 is uniformly generated, and the porous suction The negative pressure generated on the entire upper surface side of the plate 4 sucks and holds the metal film 2 in a state without slack and wrinkles.
Can always be maintained. In other words, add
Do not generate distortion or warp in the metal film 2 as a workpiece.
No.

Next, as shown in FIG.
While moving the processing head 6b at a preset speed and direction according to a program stored in a CPU (not shown), the processing head 6b is suction-held at the irradiation position on the porous suction plate 4. The metal film 2 is irradiated with a laser beam L. For example, CO ₂ laser (carbon dioxide laser), YAG
A laser beam (artificial crystal), an excimer laser (ultraviolet laser), or other laser beam L such as a solid material, a gaseous material, or a liquid material generated from a liquid material is irradiated to the irradiation position on the porous adsorption plate 4. Adsorbed and held metal film 2
Is blown into a predetermined shape and size. Note that lead frame 1
Corresponding to the material and thickness of the metal film 2 used for the 0, set in advance to light and an output suitable for the blow.

[0020] In have us when blown, the metal film 2 held by suction on the upper surface side of the porous suction plate 4 the laser beam L by continuously or intermittently irradiating a porous material properties and moderate suction plate 4 Due to the high porosity, the heat generated in the portion irradiated with the laser beam L is diffused and dissipated, so that the metal film 2
Can be accurately blown into a predetermined shape and size. FIG.
As shown in the figure, the lead frame 10 processed into a predetermined shape and dimensions is covered with a synthetic resin or ceramics or the like,
One integrated circuit 9 is manufactured.

[0021] As this, it is formed on the upper surface of the base metal 3
The porous adsorption plate 4 made of silicon carbide is inserted into the recessed fitting portion 3b.
Since the metal film 2 is fitted and fixed, the metal film 2 is sucked and held without slack and wrinkles, and the flatness of the metal film 2 can be constantly maintained. since blowing the geometry, machining work than mechanically punching the metal film 2 as traditional is performed stably, the integrated circuit 9
Lead frame 10 corresponding to the high density and miniaturization of
Can be processed precisely and accurately, and the processing accuracy can be improved. In addition, due to the material properties and the appropriate porosity of the porous adsorption plate 4, heat generated in the portion irradiated with the laser beam L is diffused and radiated, and the metal film 2 is partially heated or melted by radiant heat. Can be prevented, and the operation of fusing the metal film 2 into a predetermined shape and size can be performed accurately.

In the correspondence between the configuration of the present invention and the above-described embodiment, the laser irradiation means of the present invention corresponds to the laser processing machine 6 of the embodiment, and similarly, the negative pressure generating means corresponds to the negative pressure generating means. Although corresponding to the device 7, the present invention is not limited to the configuration of the above-described embodiment .

[Brief description of the drawings]

FIG. 1 is a side view showing an assembled state of a workpiece suction plate of the present invention to which a laser beam machine is attached.

FIG. 2 is a side view showing a separated state of a metal base material and a porous suction plate which constitute a workpiece suction plate.

FIG. 3 is a plan view showing an example in which each intake hole is formed in a lattice shape in a concave fitting portion of a metal base material.

FIG. 4 is a plan view showing a state in which a metal film is blown by a laser processing machine.

FIG. 5 is a plan view showing a state where the lead frame is assembled to the integrated circuit.

[Explanation of symbols]

 L: Laser beam 1 ... Workpiece adsorption plate 2 ... Metal film 3 ... Metal base material 3b ... Recessed fitting part 3c ... Intake hole 4 ... Porous adsorptionBoard 6 … Laser processingMachine  7 ... Negative pressure generatorPlace

Claims (2)

(57) [Claims] 1. A workpiece suction plate for attracting and holding a metal film at an irradiation position irradiated with a laser beam when the metal film is processed into a predetermined shape and size by a laser beam irradiated from a laser irradiation means. The concave formed on the upper surface side of the metal base material disposed at the irradiation position
The porous suction plate formed of silicon carbide material to meet <br/> fixed Johama addition unit, lattice or square shape opposite to the porous suction plate in a recessed fitting-in portion bottom surface portion of the base metal to thereby form a plurality of the intake holes, the workpiece suction plate in communication with the intake hole formed on the metal base material to connect the negative pressure generating means to the lower surface of the metal matrix. 2. The workpiece adsorption plate according to claim 1, wherein said porous adsorption plate is set to a porosity of about 30% to about 80% .