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JP2724764B2 - Method for producing silicon nitride based sintered body - Google Patents
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JP2724764B2 - Method for producing silicon nitride based sintered body - Google Patents

Method for producing silicon nitride based sintered body

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Publication number
JP2724764B2
JP2724764B2 JP2174063A JP17406390A JP2724764B2 JP 2724764 B2 JP2724764 B2 JP 2724764B2 JP 2174063 A JP2174063 A JP 2174063A JP 17406390 A JP17406390 A JP 17406390A JP 2724764 B2 JP2724764 B2 JP 2724764B2
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JP
Japan
Prior art keywords
sintered body
temperature
silicon nitride
firing
based sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2174063A
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Japanese (ja)
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JPH0465362A (en
Inventor
広一 田中
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Kyocera Corp
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Kyocera Corp
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Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、窒化珪素質焼結体の製造方法に関するもの
で、詳細には大型形状の熱機関構造材料を製造にあた
り、内外差のない均一な焼結体を作成するための改良に
関する。
Description: FIELD OF THE INVENTION The present invention relates to a method for producing a silicon nitride sintered body, and more particularly, to producing a heat engine structural material having a large shape and having no difference between inside and outside. The present invention relates to an improvement for producing a simple sintered body.

(従来技術) 窒化珪素質焼結体は、従来から強度、硬度、熱的化学
的安定性に優れた材料としてエンジニアリングセラミッ
クス、特にターボロータやガスタービン等の熱機関への
応用が進められている。
(Prior Art) Conventionally, silicon nitride based sintered bodies have been applied to engineering ceramics, particularly to heat engines such as turbo rotors and gas turbines, as materials having excellent strength, hardness and thermochemical stability. .

このような窒化珪素質焼結体を得る方法としては、焼
結助剤としてY2O3および稀土類元素酸化物の他にAl
2O3、MgO、SrO等を添加し、これを常圧焼成、ホットプ
レス焼成、窒素ガス加圧焼成、熱間静水圧焼成等の手法
によって1500〜2000℃の非酸化性雰囲気中で焼成するこ
とにより得られている。
As a method for obtaining such a silicon nitride sintered body, in addition to Y 2 O 3 and a rare earth element oxide as a sintering aid, Al
2 O 3 , MgO, SrO, etc. are added, and this is fired in a non-oxidizing atmosphere at 1500 to 2000 ° C. by a method such as normal pressure firing, hot press firing, nitrogen gas pressure firing, hot isostatic pressure firing, etc. It has been obtained by.

一方、窒化珪素質焼結体は優れた特性を有する反面、
1200℃を越える高温でその特性が大きく劣化する傾向に
ある。これは前述した方法によって得られる焼結体が窒
化珪素結晶粒子と粒界相とから構成されており、この粒
界相に焼結助剤や不純物から構成される低融点ガラス相
が生成されるためと考えられている。
On the other hand, a silicon nitride sintered body has excellent characteristics,
At a high temperature exceeding 1200 ° C., the properties tend to deteriorate significantly. This is because the sintered body obtained by the above-described method is composed of silicon nitride crystal grains and a grain boundary phase, and a low melting point glass phase composed of a sintering aid and impurities is generated in the grain boundary phase. It is thought to be.

そこで、従来から高温特性を改善するために高温強度
を劣化させる要因の1つとして考えられている窒化珪素
原料粉末中の不純物酸素を低減するために、焼成初期に
おいて低温で長時間保持するか、または成形体を窒化珪
素や窒化硼素、窒化アルミニウム粉末により埋め焼き
し、不純物酸素を成形体より抽出する方法等が提案され
ている。
Therefore, in order to reduce impurity oxygen in the silicon nitride raw material powder, which has been conventionally considered as one of the factors for deteriorating high-temperature strength in order to improve high-temperature characteristics, it is necessary to hold at a low temperature for a long time in the initial stage of firing, Alternatively, a method has been proposed in which a compact is embedded and baked with silicon nitride, boron nitride, or aluminum nitride powder to extract impurity oxygen from the compact.

(発明が解決しようとする問題点) 上記のような特性を改善する方法は、小型の焼結体を
作成する場合にはある程度の効果が認められるが、形状
の大きい焼結体を作成する場合にはいずれも焼結体の内
部と表面部とが組成的あるいは組織的にも不均質となる
傾向にあった。即ち、従来のいずれの場合においても、
表面部の不純物酸素は除去され成形体表面に緻密層が形
成されるものの、内部に不純物酸素が残存し内外におい
て酸素量が異なったり、あるいはこれに伴い焼結助剤ま
でも不均質になるといった問題があった。このような内
部と表面部との相違に起因し、特性的には第4図に示す
ように焼結体内部の高温特性が表面部の特性に比較して
大きく劣化するといった問題があった。
(Problems to be Solved by the Invention) The above-described method for improving the characteristics has a certain effect when producing a small-sized sintered body, but is effective when producing a large-sized sintered body. In any case, the inside and the surface of the sintered body tended to be heterogeneous in composition or organization. That is, in any of the conventional cases,
Although the impurity oxygen on the surface is removed and a dense layer is formed on the surface of the compact, the impurity oxygen remains inside and the amount of oxygen differs inside and outside, or the sintering aid becomes heterogeneous with this. There was a problem. Due to such a difference between the inside and the surface portion, there is a problem in that the high-temperature characteristics inside the sintered body are greatly deteriorated as compared with the characteristics of the surface portion, as shown in FIG.

(問題点を解決するための手段) 本発明者は、大型形状の成形体を焼成する方法につい
て検討を重ねたところ、焼成工程において、高温焼成に
より表面部に緻密質が形成されないようにして、ある程
度密度を高めた後に、一旦低温にて所定時間保持するこ
とにより内部と表面部との組成的あるいは組織的な均質
化を図ることができ、その後高温において焼結を進行さ
せることにより、均一で且つ高温特性に優れた大型の窒
化珪素質焼結体が得られることを知見した。
(Means for Solving the Problems) The present inventor has repeatedly studied a method of firing a large-sized molded body. In the firing step, the high-temperature firing is performed so that denseness is not formed on the surface portion. After increasing the density to some extent, it is possible to homogenize the composition or organization of the inside and the surface part by holding once at a low temperature for a predetermined time, and then to promote sintering at a high temperature, It has been found that a large silicon nitride sintered body having excellent high-temperature characteristics can be obtained.

即ち、本発明の窒化珪素質焼結体の製造方法によれ
ば、焼結助剤として周期律表第IIIa族元素酸化物を含有
する成形体を非酸化性雰囲気中で焼成するに際して、ま
ず、該成形体を1600〜1800℃の温度で表面部に緻密層が
形成されない条件で相対密度75〜90%まで密度を高めた
後、一旦温度を1500〜1750℃に下げて保持し均質化を図
り、その後、温度を1800〜2000℃に高め相対密度95%以
上に緻密化することを特徴とするものである。
That is, according to the method for producing a silicon nitride-based sintered body of the present invention, when firing a molded body containing a Group IIIa element oxide of the periodic table as a sintering aid in a non-oxidizing atmosphere, first, After increasing the density of the molded body to a relative density of 75 to 90% at a temperature of 1600 to 1800 ° C under which no dense layer is formed on the surface, the temperature is once lowered to 1500 to 1750 ° C and maintained for homogenization. Thereafter, the temperature is increased to 1800 to 2000 ° C., and the density is increased to a relative density of 95% or more.

以下、本発明を詳述する。 Hereinafter, the present invention will be described in detail.

本発明の製造方法における大きな特徴は、大型形状の
焼結体を作成するに際し、表面部および内部の均質化を
図るために焼結工程を改善した点にある。
A major feature of the production method of the present invention is that, when producing a large-sized sintered body, the sintering step is improved in order to homogenize the surface portion and the inside.

本発明における焼結工程は、大きく3つの工程から構
成される。
The sintering step in the present invention is mainly composed of three steps.

まず、第1の工程において、添加された焼結助剤や不
純物酸素により液相を生成させて焼結を進行させ、ある
程度緻密化を図り相対密度75〜90%程度の焼結体を得
る。この相対密度が75%未満では、その後の焼結過程に
おいて高緻密質の焼結体を得るのは困難となり、90%を
越える密度まで緻密化してしまうとその後の均質化処理
時、内外の均質化を図ることができない。また、本発明
によれば、第1の工程において成形体の表面に緻密な層
が生成されないようにすることが重要である。これは、
後の均質化工程において、第1の工程で表面に緻密質な
相が形成されてしまうと、表面部と内部とで接する雰囲
気等が異なるために、例えば不純物酸素や助剤の存在状
態に内部と表面部に差が生じ、均質化が達成されないた
めである。この第1の工程における条件としては、温度
を1600〜1800℃に設定することが必要で、温度が1600℃
より低いと、相対密度を前述した所定の密度まで高める
のが困難であり、また1800℃を越えると表面に緻密層が
形成されてしまう。また、この時の雰囲気は、窒素を含
む非酸化性雰囲気であり、特に窒素ガス圧力は1.0〜5.0
atmが望ましく、1.0atmより低いと窒化珪素の分解が生
じ、5.0atmより高いと焼結体内部に高圧のガスがトラッ
プされ緻密化が阻害される。このような条件で0.5〜3
時間焼成される。
First, in the first step, a liquid phase is generated by the added sintering aid and impurity oxygen to promote sintering, and a certain degree of densification is achieved to obtain a sintered body having a relative density of about 75 to 90%. If the relative density is less than 75%, it becomes difficult to obtain a high-density sintered body in the subsequent sintering process, and if the density exceeds 90%, the inner and outer Cannot be achieved. Further, according to the present invention, it is important that a dense layer is not generated on the surface of the molded body in the first step. this is,
In the subsequent homogenization step, if a dense phase is formed on the surface in the first step, the atmosphere in contact with the surface part and the inside are different. This is because a difference occurs between the surface and the surface portion, and homogenization cannot be achieved. As a condition in the first step, it is necessary to set the temperature to 1600 to 1800 ° C.
If it is lower, it is difficult to increase the relative density to the above-mentioned predetermined density, and if it exceeds 1800 ° C., a dense layer will be formed on the surface. The atmosphere at this time is a non-oxidizing atmosphere containing nitrogen, and particularly, the nitrogen gas pressure is 1.0 to 5.0.
Atm is desirable. If it is lower than 1.0 atm, silicon nitride is decomposed, and if it is higher than 5.0 atm, high-pressure gas is trapped inside the sintered body and densification is inhibited. Under these conditions, 0.5-3
Fired for hours.

次に、上記第1の工程によって得られた焼結体を引き
続き、第1の工程よりも低い温度にて保持し、内部、表
面部の均質化を図る。具体的には第1の工程における温
度よりも低い1500〜1750℃の温度に保持する。この工程
では、焼結体の緻密化は実質的に進行することなく、焼
結体の表面部および内部とも温度や雰囲気とも同様な条
件下で保持されるために不純物酸素や焼結助剤が内外差
なく均質に拡散され、あるいは均質に揮散するために焼
結体の組成あるいは組織的に均質化が図れるのである。
この時の温度を上記の範囲に設定したのは、保持温度が
1500℃より低いと焼結体内の各元素の拡散や、不純物酸
素の揮散等が生じないために焼結体の均質化が達成され
ない。また1750℃より高いと表層部に緻密な層が形成さ
れるために表面部と内部を同様な条件に保持することが
できないために均質化が図れない。なお、この第2の工
程では窒素ガスは第1工程と同様に1.0〜5.0atmに保持
される。またこの第2の工程における均質化は3時間以
上保持することによりほぼ達成される。
Next, the sintered body obtained in the first step is kept at a lower temperature than in the first step to homogenize the inside and the surface. Specifically, the temperature is kept at 1500 to 1750 ° C. lower than the temperature in the first step. In this step, densification of the sintered body does not substantially proceed, and since the surface and the inside of the sintered body are maintained under the same conditions at the same temperature and atmosphere, impurity oxygen and sintering aids are removed. In order to uniformly diffuse or volatilize uniformly without difference between inside and outside, the composition or composition of the sintered body can be homogenized.
The reason for setting the temperature at this time to the above range is that the holding temperature is
If the temperature is lower than 1500 ° C., diffusion of each element in the sintered body, volatilization of impurity oxygen and the like do not occur, so that the sintered body cannot be homogenized. On the other hand, if the temperature is higher than 1750 ° C., since a dense layer is formed on the surface layer, the surface portion and the inside cannot be maintained under similar conditions, so that homogenization cannot be achieved. In the second step, the nitrogen gas is maintained at 1.0 to 5.0 atm as in the first step. Further, the homogenization in the second step is substantially achieved by keeping the temperature for 3 hours or more.

第3の工程によれば、第2の工程により均質化が図ら
れた焼結体を1800〜2000℃の温度に保持し相対密度95%
以上まで緻密化する。この時の温度が1800℃より低いと
緻密化が不足し、2000℃を越えると窒化珪素の粒成長あ
るいは窒化珪素の分解が生じ焼結体の強度が劣化する。
なお、この時の雰囲気は窒化珪素の分解を抑制すること
を目的として5〜100atmの窒素ガス加圧雰囲気に保持さ
れることが望ましい。また保持時間は1〜6時間が適当
である。
According to the third step, the sintered body homogenized in the second step is maintained at a temperature of 1800 to 2000 ° C. and a relative density of 95%
Densify to above. If the temperature at this time is lower than 1800 ° C., densification is insufficient, and if it is higher than 2000 ° C., grain growth of silicon nitride or decomposition of silicon nitride occurs, and the strength of the sintered body is deteriorated.
The atmosphere at this time is desirably maintained at a nitrogen gas pressurized atmosphere of 5 to 100 atm for the purpose of suppressing the decomposition of silicon nitride. An appropriate holding time is 1 to 6 hours.

これら第1、第2、第3の工程における焼成温度は、
第2、第1、第3の順で高く設定し、その温度差を30℃
以上に設定することが望ましい。
The firing temperature in these first, second and third steps is:
Set the temperature higher in the second, first, and third order, and set the temperature difference to 30 ° C.
It is desirable to set above.

このようにして得られる窒化珪素質焼結体は、内部お
よび表面部ともに均質化が達成され、特性上において内
部の特性の劣化を防止することができる。
The silicon nitride-based sintered body obtained in this way achieves homogenization in both the inside and the surface, and can prevent deterioration of the internal characteristics in terms of characteristics.

また、さらに高密度化を図るために上記の焼結体を熱
間静水圧焼成により1000〜2000atmの高圧雰囲気で1600
〜2000℃で焼成することもできる。
Further, in order to further increase the density, the above sintered body was heated in a high pressure atmosphere of 1000 to 2000 atm by hot isostatic pressure firing to 1600.
It can be fired at 20002000 ° C.

本発明において、上述のような焼成に付される成形体
としては、窒化珪素を主体とし、焼結助剤としてY2O3
Er2O3、Yb2O3、Dy2O3、Sc2O3等の周期律表第IIIa族元素
酸化物(RE2O3)ならびにSiO2成分からなる3成分から
なることが最終焼結体の高温特性に優れることから最も
適当であり、周期律表第IIIa族元素酸化物が1〜5モル
%、SiO2成分は2〜15モル%の割合で調合することが望
ましい。なおSiO2成分としては窒化珪素原料粉末中に含
まれる不純物酸素量をSiO2換算したものも含まれる。ま
た、上記焼成助剤成分は、SiO2/RE2O3のモル比が2〜3
であることが望ましい。これはこのモル比が2より小さ
いと緻密化に必要な液相が生成されにくく緻密体が得ら
れず、3を越えるとSiO2量が多くなり高温強度が劣化す
る。
In the present invention, the molded body subjected to the above-described firing is mainly composed of silicon nitride, and as a sintering aid, Y 2 O 3 ,
The final firing is made up of the three components of the Group IIIa element oxide (RE 2 O 3 ) of the periodic table such as Er 2 O 3 , Yb 2 O 3 , Dy 2 O 3 , Sc 2 O 3 and the SiO 2 component. It is most suitable because it has excellent high-temperature properties of the sintered body. It is desirable that the oxide of the Group IIIa element of the periodic table be prepared at a ratio of 1 to 5 mol% and the SiO 2 component at a ratio of 2 to 15 mol%. The SiO 2 component also includes a value obtained by converting the amount of impurity oxygen contained in the silicon nitride raw material powder into SiO 2 . In addition, the sintering aid component has a molar ratio of SiO 2 / RE 2 O 3 of 2-3.
It is desirable that If the molar ratio is less than 2, a liquid phase required for densification is hardly generated, and a dense body cannot be obtained. If the molar ratio exceeds 3, the amount of SiO 2 increases and the high-temperature strength deteriorates.

また、用いる窒化珪素原料としては平均粒径が0.1〜
1.0μmのα型、β型のいずれでも使用できる。
The average particle diameter of the silicon nitride raw material used is 0.1 to
Both 1.0 μm α-type and β-type can be used.

上記の割合で調合されたものを公知の成形手段、例え
ば、プレス成形、押し出し成形、射出成形、鋳込み成
形、冷間静水圧成形等により成形すればよい。
What has been prepared in the above ratio may be molded by known molding means, for example, press molding, extrusion molding, injection molding, casting molding, cold isostatic pressing and the like.

この成形体を前述した焼成方法によって焼成し得られ
る最終焼結体としては、その組成においてSiO2/RE2O3
モル比が0.8〜2.0、特に1.3〜1.9であることが望まし
く、このモル比が0.8より小さいと高温における耐酸化
性が劣化しやすく、2.0より大きいと高温強度が劣化す
る傾向にある。また、組織的には窒化珪素結晶相と粒界
相から構成され、粒界相にはYAM、アパタイト、ウォラ
ストナイト構造のSi3N4-RE2O3-SiO2系結晶相が存在する
ことが望ましい。
As a final sintered body obtained by firing this molded body by the firing method described above, the molar ratio of SiO 2 / RE 2 O 3 in the composition is preferably 0.8 to 2.0, particularly preferably 1.3 to 1.9. If the ratio is less than 0.8, the oxidation resistance at high temperatures tends to deteriorate, and if it is more than 2.0, the high temperature strength tends to deteriorate. In addition, it is structurally composed of a silicon nitride crystal phase and a grain boundary phase, and the grain boundary phase includes a YAM, apatite, and wollastonite structure Si 3 N 4 —RE 2 O 3 —SiO 2 system crystal phase. It is desirable.

また、本発明において用いられる焼結助剤としては、
前述した周期律表第IIIa族元素酸化物を含有するもので
あるが、その他にAl2O3、MgO、SrO、WC、WO3等も知られ
ているが、焼結体の高温強度の観点からAl2O3やMgOは焼
結体の粒界に低融点のガラス相を生成する場合があるこ
とから、窒化珪素との反応により高融点物質を生成しや
すいためにその量は0.2重量%以下に抑えることが望ま
しい。なお、WCやWO3等は結晶化を促進することから1.0
重量%以下の割合で添加してもなんら差し支えない。
Further, as the sintering aid used in the present invention,
Although it contains the Group IIIa element oxide of the periodic table described above, in addition, Al 2 O 3 , MgO, SrO, WC, WO 3 and the like are also known, but from the viewpoint of the high-temperature strength of the sintered body Because Al 2 O 3 and MgO may form a low-melting glass phase at the grain boundary of the sintered body, a high-melting substance is easily generated by the reaction with silicon nitride. It is desirable to keep it below. In addition, WC and WO 3 promote crystallization, so 1.0
There is no problem if it is added at a ratio of not more than weight%.

以下、本発明を次の例で説明する。 Hereinafter, the present invention will be described with reference to the following examples.

(実施例) 原料粉末として平均粒径0.6μm、α化率98%、酸素
含有量1.3重量%の窒化珪素原料粉末を用いて、さらに
平均粒径が0.5μmのY2O3、Sc2O3、Er2O3、Yb2O3、Ho2O
3、Dy2O3の各粉末およびSiO2粉末を用いてSiO2/RE2O3
ル比が1.8〜3.5になるように調合しこれをバインダーと
ともにメタノール中で混合粉砕した。得られたスラリー
乾燥造粒後、プレス成形し真空中で脱バインダーした
後、冷間静水圧成形により直径60mm、厚さ30mmの大型形
状の成形体を作成した。
(Example) As a raw material powder, a silicon nitride raw material powder having an average particle diameter of 0.6 μm, an α conversion of 98%, and an oxygen content of 1.3% by weight was used, and Y 2 O 3 and Sc 2 O having an average particle diameter of 0.5 μm were further used. 3 , Er 2 O 3 , Yb 2 O 3 , Ho 2 O
3 , Dy 2 O 3 powder and SiO 2 powder were used to prepare a SiO 2 / RE 2 O 3 molar ratio of 1.8 to 3.5, which was mixed and pulverized in methanol with a binder. After the obtained slurry was dried and granulated, it was press-molded and debindered in vacuum, and then a large-sized compact having a diameter of 60 mm and a thickness of 30 mm was prepared by cold isostatic pressing.

これを第1表に示す条件で焼成を行った。 This was fired under the conditions shown in Table 1.

得られた焼結体に対して、アルキメデス法により相対
密度を、JIS-R1601に従いそれぞれの焼結体の表面部と
内部から抗折試験片を切り出し、常温および1400℃の抗
折強度を測定した。
For the obtained sintered body, relative density by Archimedes method, a bending test piece was cut out from the surface part and the inside of each sintered body according to JIS-R1601, and the bending strength at room temperature and 1400 ° C. was measured. .

なお、各焼結体のSiO2/RE2O3モル比の算出にあたって
は、窒素酸素同時分析装置(LECO社)により全酸素量
を、またICP分析により各元素の定量を行い、これらの
データから全酸素量からRE2O3(RE:周期律表第IIIa族元
素)として結合している酸素量を差し引いた残りの酸素
量をSiO2換算し求めた。
In calculating the SiO 2 / RE 2 O 3 molar ratio of each sintered body, the total oxygen content was determined by a nitrogen-oxygen simultaneous analyzer (LECO), and each element was quantified by ICP analysis. The remaining oxygen content obtained by subtracting the oxygen content bound as RE 2 O 3 (RE: Group IIIa element of the periodic table) from the total oxygen content was calculated as SiO 2 .

結果は第1表に示した。 The results are shown in Table 1.

なお、第1表中の試料No.1(本発明品)と試料No.11
(従来品)についてその焼成パターンを第1図および第
2図に、また表面図と内部の室温、1000℃、1200℃、14
00℃の抗折強度を第3図および第4図に示した。
In Table 1, sample No. 1 (product of the present invention) and sample No. 11
Fig. 1 and Fig. 2 show the firing pattern of the (conventional product), the surface view and the internal room temperature, 1000 ° C, 1200 ° C,
The flexural strength at 00 ° C. is shown in FIGS. 3 and 4.

第1表によれば、第1の焼成工程において、その温度
が低い試料No.4では最終焼結体の密度が低く、また、焼
成温度が高い試料No.5では、第1工程での密度が高く、
表面に緻密層が形成されており、最終焼結体において内
部と表面部とに特性差が見られた。
According to Table 1, in the first firing step, the density of the final sintered body was low in Sample No. 4 where the temperature was low, and the density in the first step was low in Sample No. 5 where the firing temperature was high. Is high,
A dense layer was formed on the surface, and there was a difference in characteristics between the inside and the surface of the final sintered body.

第2の工程において、その焼成温度が1500℃より低い
試料No.6では、均質化が不十分で、1750℃より高い試料
No.7では、焼結が進行し表面に緻密層が形成され、いず
れも内外差が生じた。
In the second step, in sample No. 6 whose firing temperature is lower than 1500 ° C., the homogenization is insufficient and the sample higher than 1750 ° C.
In No. 7, sintering progressed, and a dense layer was formed on the surface, and there was a difference between inside and outside.

第3の工程において、その焼成温度が1800℃を下回る
試料No.9では、焼結体自体の緻密化が不十分であり、温
度が2000℃を越える試料No.10では、窒化珪素の分解が
生じ、強度の低下が見られた。
In the third step, in Sample No. 9 in which the firing temperature is lower than 1800 ° C., the densification of the sintered body itself is insufficient, and in Sample No. 10 in which the temperature exceeds 2000 ° C., decomposition of silicon nitride occurs. And a decrease in strength was observed.

さらに、第2の工程における焼成温度が第1の焼成温
度より高い試料No.11では、緻密化が不十分となり強度
が低下した。
Furthermore, in sample No. 11, in which the firing temperature in the second step was higher than the first firing temperature, the densification was insufficient and the strength was reduced.

これらの比較例に対して、本発明の試料はいずれも内
部の強度と表面部との強度差が±50MPa以下に抑えるこ
とができ、その中でも調合組成においてSiO2/RE2O3比が
2〜3の試料では内部における室温強度800MPa以上、14
00℃における強度500MPa以上が達成された。
In contrast to these comparative examples, all of the samples of the present invention can suppress the difference in strength between the internal strength and the surface part to ± 50 MPa or less, and among them, the SiO 2 / RE 2 O 3 ratio in the prepared composition is 2 In the samples of ~ 3, the room temperature strength inside was 800MPa or more, 14
A strength of 500 MPa or more at 00 ° C. was achieved.

(発明の効果) 以上詳述した通り、本発明の窒化珪素質焼結体の製造
方法によれば、焼成中において所定の温度である程度緻
密化を図った後に、一旦低温に保持して均質化処理を行
い、その後高温焼成することにより大型形状の焼結体に
おいて、内部と表面部との特性差のない均質な焼結体を
得ることができる。
(Effects of the Invention) As described in detail above, according to the method for producing a silicon nitride-based sintered body of the present invention, after a certain degree of densification is performed at a predetermined temperature during firing, the temperature is once maintained at a low temperature and homogenized. By performing the treatment and then sintering at a high temperature, a large-sized sintered body can be obtained with a homogeneous sintered body having no difference in properties between the inside and the surface.

これにより、大型形状の各種熱機関用部品等を製造す
る際にその焼結体の信頼性を高め、安定した特性の製品
を供給することができる。
This makes it possible to increase the reliability of the sintered body when manufacturing various heat engine parts and the like having a large shape, and to supply a product having stable characteristics.

【図面の簡単な説明】[Brief description of the drawings]

第1図、第2図は、いずれも焼成パターンを示す図、第
3図、第4図はいずれも焼結体の内部と表面部の温度と
抗析強度との関係を示した図であり、第1図および第3
図は、本発明品(試料No.1)、第2図および第4図は、
比較品(試料No.11)のものを示す。
FIGS. 1 and 2 each show a firing pattern, and FIGS. 3 and 4 show the relationship between the temperature of the inside and the surface of the sintered body and the precipitation strength. , FIGS. 1 and 3
The figure shows the product of the present invention (sample No. 1), FIG. 2 and FIG.
This is for the comparative product (Sample No. 11).

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】窒化珪素を主体とし、焼結助剤として周期
律表第IIIa族元素酸化物を含有する成形体を非酸化性雰
囲気中で焼成し相対密度95%以上の焼結体を得る窒化珪
素質焼結体の製造方法において、前記焼成工程が、 (a)1600〜1800℃の温度に保持し、該成形体の表面部
に緻密層を形成することなく相対密度75〜90%まで密度
を高める工程と、 (b)(a)工程より低い1500〜1750℃の温度に保持し
組織の均質化を図る工程と、 (c)1800〜2000℃の温度に保持し相対密度95%以上に
緻密化する工程と からなることを特徴とする窒化珪素質焼結体の製造方
法。
1. A sintered body mainly composed of silicon nitride and containing a Group IIIa element oxide of the periodic table as a sintering aid in a non-oxidizing atmosphere to obtain a sintered body having a relative density of 95% or more. In the method for producing a silicon nitride-based sintered body, the sintering step includes: (a) maintaining a temperature of 1600 to 1800 ° C. and forming a relative density of 75 to 90% without forming a dense layer on the surface of the molded body; (B) a step of maintaining the temperature at 1500 to 1750 ° C. lower than that of the step (a) to homogenize the structure; and (c) a temperature of 1800 to 2000 ° C. and a relative density of 95% or more. A method for producing a silicon nitride-based sintered body, comprising the steps of:
JP2174063A 1990-06-29 1990-06-29 Method for producing silicon nitride based sintered body Expired - Fee Related JP2724764B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2174063A JP2724764B2 (en) 1990-06-29 1990-06-29 Method for producing silicon nitride based sintered body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2174063A JP2724764B2 (en) 1990-06-29 1990-06-29 Method for producing silicon nitride based sintered body

Publications (2)

Publication Number Publication Date
JPH0465362A JPH0465362A (en) 1992-03-02
JP2724764B2 true JP2724764B2 (en) 1998-03-09

Family

ID=15971975

Family Applications (1)

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Country Link
JP (1) JP2724764B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000247748A (en) * 1999-02-22 2000-09-12 Kyocera Corp High toughness silicon nitride sintered body
CN115124355B (en) * 2022-07-21 2023-09-01 新乡市固元陶瓷科技有限公司 Method for burying and burning large-size ceramic spheres
CN115974559B (en) * 2022-12-23 2023-11-21 衡阳凯新特种材料科技有限公司 Low-thermal-conductivity silicon nitride wave-transparent ceramic material

Also Published As

Publication number Publication date
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