JP2734367B2 - Multilayer printed wiring board and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method of manufacturing the same, and more particularly, to a multilayer printed wiring board formed by laminating a plurality of inner layers having circuit patterns formed thereon and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a multilayer substrate used as a printed wiring board is formed by laminating a plurality of inner layers on which circuit patterns are formed, and the inner layers are formed in the same shape. For this reason, when manufacturing, count the number of inner layer boards to check for insertion leaks and insertion errors and then configure the layers, or as a result of conducting an electrical continuity test after completing the multilayer board, Check. If a defective product is detected, the state of insertion of the inner layer substrate is observed by X-ray fluoroscopy of the defective product, and insertion failure and insertion error are confirmed. However, the former method has a drawback that there are many mistakes since it is an artificial operation. Also, in the latter method, insertion leakage and insertion error of the inner layer substrate are found after completion of the multilayer substrate, so that insertion leakage and insertion error of the inner layer substrate cannot be prevented before lamination and bonding, and that the insertion order is incorrect. There is a defect that cannot be found in the test, and the inspection by X-ray fluoroscopy has a drawback that it is difficult to accurately check the insertion leakage and insertion error of the inner layer substrate when the number of the inner layer substrates is greatly increased.

In order to solve the above-mentioned disadvantage, Japanese Patent Application Laid-Open No.
As disclosed in Japanese Patent Publication No. 02298, a mark for position confirmation is made in advance at the end of the inner layer substrate, the base material of the multilayer substrate is formed by lamination press, and the end of the base material is cut. By exposing the position confirmation mark, insertion leakage or insertion error of the inner layer substrate can be confirmed, or, as disclosed in Japanese Patent Application Laid-Open No. 2-54995, the position of the inner layer substrate is shifted in the stacking order and different symbols are used. Is formed, and it is determined whether or not there is a symbol by seeing through, and an insertion omission or an insertion error of the inner layer substrate is found.
As shown in FIG. 15, a plurality of inner-layer substrates 18, 19, 20 to be laminated have different-length portions 18 a, 19 a, 2 having different lengths on at least one side as shown in FIG.
A method of manufacturing a multi-layer substrate has been proposed in which at least a portion of the odd-shaped portion is protruded and at least a part of these irregular portions are exposed upward to prevent insertion leakage and insertion error.

[0004]

However, erroneous lamination has not been inconsistent with manual work. Further, it is difficult to detect erroneous lamination at a stage before component mounting of the multilayer printed wiring board, and the influence thereof is great. In addition, the method of exposing the mark for position confirmation after forming the base material of the multi-layer substrate is such that when the insertion leakage of the inner layer substrate or the insertion error is found, the lamination bonding has already been completed, so that it is impossible to correct and the damage is caused. There are major drawbacks. In addition, the method of shifting the position on the inner substrate and reading different symbols through the lamination order is in the form of a woven fabric using glass fiber as the material. When looking at the symbol of the final board from the first layer at the completion stage, such as when the number of layers or the thickness of the board has increased significantly, it is difficult to confirm the symbol,
It is difficult to detect insertion leakage or insertion error of the inner layer substrate, and as a result, even with this method, it is found after lamination and bonding, resulting in a large defect. Providing a deformed portion having a different length requires a new material area in addition to a product and a work margin which is required for conventional lamination and bonding, thereby deteriorating the use efficiency of the substrate material. So the material costs extra. Further, since a processing step for providing the deformed portion must be newly provided, there is a disadvantage that processing cost and processing time are required.

According to the present invention, there is provided a multi-layer printed wiring board which has a high production yield, is inexpensive and has a high reliability, and which is capable of confirming insertion leakage and insertion error of an inner layer board before laminating and adhering, thereby eliminating defective lamination. It is intended to provide a manufacturing method.

[0006]

The multilayer printed wiring board according to the present invention has at least the following inner layer substrates arranged sequentially.

(A) A first through hole located at a first position, a second through hole located at a second position, and a third through hole located at a third position. (B) a first inner layer substrate which is disposed immediately below the first inner layer substrate and serves as a ring- shaped display portion exposed by the first through hole;
And a fourth through-hole and a fifth through-hole disposed immediately below the second through-hole and the third through-hole.
Layer first inner substrate (c) is disposed immediately below the inner substrate of the second layer before Symbol second
And a second symbol serving as a ring- shaped display portion exposed by the through-hole and the fourth through-hole of the second-layer inner-layer substrate, and disposed immediately below the fifth through-hole of the second-layer inner-layer substrate. The first
6 through-holes and the inner substrate of the third layer herein with the said respective <br/> through holes same diameter, are arranged at the same pitch, wherein the through-hole symbols form a concentric, and the concentric Outside straight
Or diameter are positioned so as to form smaller than the diameter of the through hole, the through hole of each inner layer board is the same diameter,
The pitch of each corresponding through hole of each inner layer substrate is different from the pitch of each corresponding through hole of each of the other inner layer substrates, and The hole and said symbol are arranged to form a concentric circle , and the outer diameter of the concentric circle is
It is formed smaller than the diameter of the through hole, and the symbol is formed on at least one side of each inner layer substrate.

The method for manufacturing a multilayer printed wiring board according to the present invention includes the following steps.

(A) Arranged at a predetermined position on each of the inner layer substrates to be laminated at the same time as the through holes and the guide holes are formed.
The copper foil through the through hole of the step (c) said inner layer board to form a symbol by a copper foil pattern at a predetermined position at the same time given the inner layer substrate to form a step (b) wiring pattern for drilling a through hole that Patter
Laminating combining said respective inner <br/> board so symbols can be observed by over emissions

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing the structure of a multilayer printed wiring board according to a first embodiment of the present invention. In the first embodiment of the present invention, as shown in FIG. 1, the drilling work of the inner substrates 1 to 5 is not provided with a special process, and is used for forming a circuit of the inner substrates 1 to 5 and a lamination guide hole (not shown). The through hole (hereinafter, referred to as a hole) is formed in a hole forming step of forming a hole. In addition, since the material of the inner layer substrates 1 to 5 is made by impregnating a resin with a glass woven cloth as a core to have mechanical strength, the material is translucent or opaque depending on the transparency of the glass woven cloth and the color of the resin. . Therefore, first, a first hole 1a having a diameter of 6 mm is formed in the first inner layer substrate 1, and a second hole 1b, a third hole 1c, and a fourth hole 1d are formed at a pitch of 15 mm with the first hole 1a. Opening 1
An outer diameter of 5.8 m is located directly below the first hole 1a of the inner substrate 1 of the layer.
A ring-shaped copper foil pattern having a diameter of 4.8 mm and an inner diameter of 4.8 mm and a numeral “2” in the center of the copper foil pattern are provided as a symbol 6 provided on the second inner layer substrate 2. Next, the second hole 1b and the third hole 1 of the first inner substrate 1 are formed in the second inner substrate 2.
c, the first hole 2 having the same hole size just below the fourth hole 1d.
a, the second hole 2b, and the third hole 2c are provided in the third inner substrate 3 directly below the first hole 2a of the second inner substrate 2 with an outer diameter of 5.8 mm and an inner diameter of 4.8 mm. And a numeral “3” at the center of the ring-shaped copper foil pattern and a symbol 7 provided on the third inner layer substrate 3. Next, the first hole 3a and the second hole 3b having the same hole size are provided immediately below the third hole 4b and the fourth hole 2c of the second inner substrate 3 in the third inner substrate 3. And the first hole 3 of the third inner layer substrate 3 is provided.
A ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm and a numeral “4” in the center of the copper foil pattern are provided on the fourth inner layer substrate 4 directly below the fourth inner layer 4. The symbol 8 is provided on the substrate 4. Next, a first hole 4a having the same hole size is provided in the fourth inner layer substrate 4 immediately below the second hole 3b of the third inner layer substrate 3, and the first hole 4a of the fourth inner layer substrate 4 is formed. 1
The inner diameter of the fifth inner-layer substrate 5 immediately below the hole 4a is 5.8.
A ring-shaped copper foil pattern having an inner diameter of 4.8 mm and a diameter of 4.8 mm, and a numeral “5” provided at the center of the copper foil pattern are provided as symbols 9 provided on the fifth inner layer substrate 5.

FIG. 2 is a plan view showing the structure of the inner substrate layer shown in FIG. Due to the above-described layer structure of the inner layer substrate, as shown in FIG. 2, the symbol 6 provided from the first hole 1a of the first layer inner substrate 1 to the second layer inner substrate 2 is changed from the second hole 1b to the second hole 1b. The symbol 7 provided on the third inner substrate 3 from the third hole 1c, the symbol 8 provided on the fourth inner substrate 4 from the third hole 1c was provided on the fifth inner substrate 5 from the fourth hole 1d. Symbol 9 can be observed. The diameters of 1a, 1b, 1c, 1d of the first inner layer substrate and the outer diameters of the copper foil patterns of symbols 6, 7, 8, 9 have a difference of 0.2 mm in size. And the outer diameter of the copper foil pattern are easily distinguished from each other by providing an interval of 0.1 mm in the mutual positional relationship. Thus, the symbol 6 of the second inner layer substrate 2 from the first hole 1a provided in the first inner layer substrate 1 and the third inner layer from the second hole 1b provided in the first inner layer substrate 1 Symbols 7 and 8 of the fourth inner layer substrate 4 from the third hole 1c provided in the first inner layer substrate 1 and the symbol 7 of the substrate 3
The symbol 9 of the fifth inner substrate 5 can be confirmed from the fourth hole 1d provided in the first inner substrate 1 by the relation of the symbols, and each of the inner substrates 1 to 5 is correctly formed. It can be clearly evaluated that there is no displacement.

FIGS. 3A to 3C are plan views illustrating examples of erroneous lamination of the first embodiment of the present invention. Next, three examples in which the order of the inner layer substrates 1 to 5 in the first embodiment of FIG. 1 is incorrect will be described. FIG. 3A shows an example of an error in which the second-layer inner-layer substrate 2 is forgotten to be inserted or an error in which the third-layer inner-layer substrate 3 is formed before the second-layer inner-layer substrate 2. FIG. 3 (b)
Is an example of an error in which the third-layer inner-layer substrate 3 is forgotten to be inserted or an error in which the fourth-layer inner-layer substrate 4 is configured before the third-layer inner-layer substrate 3. FIG. 3 (c) shows an error where the fourth inner layer substrate 4 is forgotten to be inserted or the fifth inner layer substrate 5
This is an example of an error configured before the inner substrate 4 of the layer. In this manner, insertion omissions and insertion errors can be determined easily and clearly at the configuration stage before lamination. In addition, by reducing the size of the hole in the substrate in front of the inner layer substrate that displays the symbol, the positional relationship between the symbol and the inner layer substrate in front of the symbol is emphasized, making it easier to visually check and making high-magnification optical equipment. The effect of the depth of field when the automatic apparatus is used to determine the relative position between the hole edge and the outer diameter of the symbol can be minimized.
Also, the edge of the hole closest to the outer diameter of the symbol is designed at a distance of 0.1 mm, and if the distance between the outer diameter of the symbol and the distance between the edge of the symbol is recognized or precisely measured, the position between the inner layer substrates is determined. You can also check the accuracy.

FIG. 4 is a perspective view showing the structure of a multilayer printed wiring board according to a second embodiment of the present invention. In the second embodiment of the present invention, as shown in FIG.
A first hole 1a having a diameter of 6 mm is formed in the first hole 1a.
A second hole 1b, a third hole 1c, and a fourth hole 1d having a diameter of 6 mm are formed at a pitch of 5 mm.
A ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm immediately below the hole 1a of FIG. And Next, the first inner layer substrate 1 is placed on the second inner layer substrate 2.
The first hole 2a, the second hole 2b, and the third hole 2c having the same hole size are provided immediately below the second hole 1b, the third hole 1c, and the fourth hole 1d. And a ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm, and a numeral “C” in the center of the copper foil pattern on the third inner layer substrate 3 immediately below the first hole 2 a of the inner layer substrate 2. 3 "and the symbol 7 provided on the third inner layer substrate 3. Next, the first hole 3a and the second hole 3b are formed in the third inner layer substrate 3 immediately below the second hole 2b and the third hole 2c of the second inner layer substrate 2 with the same hole size. Is established,
A ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm and a center of the copper foil pattern are formed on a fourth inner substrate 4 immediately below the first hole 3 a of the third inner substrate 3. A numeral “4” is provided and the symbol 8 is provided on the fourth inner layer substrate 4. Next, a first hole 4a having the same hole size is provided immediately below the second hole 3b of the third-layer inner substrate 3 to be directly below the first hole 4a of the fourth-layer inner substrate 4. A ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm was provided on the fifth inner layer substrate 5, and a numeral “5” was provided at the center of the copper foil pattern to provide the fifth inner layer substrate 5. The symbol is 9.

Next, a description will be given of a state when viewed from the back side of the fifth inner layer substrate 5. A first hole 10a having a diameter of 6 mm is formed from a side opposite to the first hole 1a of the first inner layer substrate 1 on the back surface of the fifth inner layer substrate 5, and a second hole is formed at a pitch of 15 mm with the first hole 10a. Hole 10b, third hole 10c, and fourth hole 10
Leave d open. However, the fourth hole 10d is provided at a distance of at least 15 mm from the center of the symbol 9 provided on the fifth inner layer substrate 5, and the fourth hole 10d just above the first hole 10a of the fifth inner layer substrate 5 is provided. 5.8 mm outside diameter and 4.8 m inside diameter on the inner layer substrate 4
The ring-shaped copper foil pattern of m and the numeral “2” in the center of the copper foil pattern are provided as a symbol 14 on the back surface provided on the fourth inner layer substrate 4. Next, the first hole having the same hole size is placed in the fourth inner layer substrate 4 immediately above the second hole 10b, the third hole 10c, and the fourth hole 10d of the fifth inner layer substrate 5. 11a
And a second hole 11b and a third hole 11c are provided in the third inner substrate 3, which is located directly above the first hole 11a of the fourth inner substrate 4, and has an outer diameter of 5.8 mm and an inner diameter of 4.0 mm. 8mm ring-shaped copper foil pattern and the number "3" in the center of the copper foil pattern
And the symbol 15 on the back surface provided on the third inner layer substrate 3. Next, the first hole 12a and the second hole 12a of the same size are placed in the third inner layer substrate 3 immediately above the second hole 11b and the third hole 11c of the fourth inner layer substrate 4 of the fourth layer. 12b, a ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm is formed on the second inner substrate 2 directly above the first hole 12a of the third inner substrate 3 and its copper. The number 1 on the back surface provided on the second inner layer substrate 2 with the numeral “4” provided in the center of the foil pattern
6 is assumed. Next, a hole 13a of the same size is provided in the second inner layer substrate 2 directly above the second hole 12b of the third inner layer substrate 3, and directly above the hole 13a of the second inner layer substrate 2. A ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm and a numeral “5” at the center of the copper foil pattern are provided on the first inner substrate 1. The symbol 17 is provided on the back surface.

FIGS. 5A and 5B are a plan view and a bottom view, respectively, after the structure of the inner substrate layer shown in FIG. With the above-described layer structure of the inner layer substrate, as shown in FIG. 5A, the symbol 6 provided in the second layer inner substrate 2 from the first hole 1a of the first layer inner substrate 1 is changed to the second layer. The symbol 7 provided on the third inner layer substrate 3 from the hole 1b, the symbol 8 provided on the fourth inner layer substrate 4 from the third hole 1c, and the fifth inner layer substrate 5 from the fourth hole 1d. Can be observed. The holes 1a, 1b, 1c, 1d of the first inner layer substrate 1 and the symbols 6, 7,.
The copper foil patterns 8 and 9 have a difference of 0.2 mm in size, and the edge of the hole and the outer diameter of the copper foil pattern are spaced 0.1 mm apart from each other so that they can be easily distinguished. ing.

Similarly, as shown in FIG. 5B, the symbol 14 on the back surface provided on the fourth inner layer substrate 4 from the first hole 10a of the fifth inner layer substrate 5 is changed to the second hole 10b. The symbol 15 on the back surface provided on the inner layer substrate 3 of the third layer from the third hole 10c
From the fourth hole 10d, the symbol 16 on the back surface provided on the second inner layer substrate 2 and the symbol 17 on the back surface provided on the first inner layer substrate can be observed. The holes 10a, 10b, 10c, 10d of the inner layer substrate having five layers and the symbol 1
4,15,16,17 copper foil pattern is 0.2 in size
A difference of 0.1 mm is provided, and the edge of the hole and the outer diameter of the copper foil pattern are easily distinguished from each other by a 0.1 mm interval in the mutual positional relationship.

FIGS. 6 (a) and 6 (b) are a plan view and a bottom view for explaining an example of erroneous lamination according to the second embodiment of the present invention.
(A), (b) is a plan view and a bottom view for explaining another example of misstacking of the second embodiment of the present invention. FIG. 6 (a),
As shown in FIG. 7 (b) and FIGS. 7 (a) and 7 (b), in the second embodiment, the mechanism for confirming the layer structure is different from the front and back sides of the first inner substrate 1 side and the fifth inner substrate 5 side. Since it has a structure with both sides, the layer structure can be confirmed from either side,
The error that the inner substrate 2 of the third layer is erroneously inserted between the inner substrate 3 of the third layer and the inner substrate 4 of the fourth layer, and that the inner substrate 3 of the third layer is the inner substrate 4 of the fourth layer and the fifth inner layer Errors inserted between the two can be easily and clearly determined from either side. In this embodiment, an example has been described in which holes and symbols are arranged symmetrically at the same diameter and the same pitch on both front and back surfaces, but they may be arranged asymmetrically at different diameters and different pitches.

FIG. 8 is a perspective view showing the structure of a multilayer printed wiring board according to a third embodiment of the present invention. In the third embodiment of the present invention, as shown in FIG.
A first hole 1a having a diameter of 6 mm is formed in the first holes 1a and 20a.
The second holes 1b are made at a pitch of mm. Next second hole 1
b and the pitch between the third hole 1c and the third hole 1c and the fourth hole 1c.
The pitch of d is different from the pitch of the first hole 1a and the pitch of the second hole 1b. Holes are formed at a pitch of 15 mm and an outer diameter of 5.8 mm is provided immediately below the first hole 1a of the first inner layer substrate 1. 4.8 inside diameter
A ring-shaped copper foil pattern of mm and a numeral “2” in the center of the copper foil pattern are provided as symbols 6 provided on the second-layer inner layer substrate 2. Next, the second hole 1b, the third hole 1c, and the fourth hole 1d of the first inner substrate 1 are formed in the second inner substrate 2.
The first hole 2a and the second hole 2 having the same hole size
b, a third hole 2c is provided, and an outer diameter of 5.8 m is formed in the third inner layer substrate 3 directly below the first hole 2a of the second inner layer substrate 2.
A ring-shaped copper foil pattern having a diameter of 4.8 mm and an inner diameter of 4.8 mm, and a numeral “3” provided at the center of the copper foil pattern is designated as a symbol 7 provided on the third inner layer substrate 3. Next, the second hole 2b and the third hole 2c of the second inner layer substrate 2 are formed in the third inner layer substrate 3.
The first hole 3a and the second hole 3b having the same hole size just below
Is provided on the fourth inner layer substrate 4 directly below the first hole 3a of the third inner layer substrate 3 with an outer diameter of 5.8 mm and an inner diameter of 4.8 m.
A ring-shaped copper foil pattern of m and a numeral “4” in the center of the copper foil pattern are provided as a symbol 8 provided on the fourth inner layer substrate 4. Next, the first hole 4 having the same size and directly under the second hole 3 b of the third inner layer substrate 3 is formed in the fourth inner layer substrate 4.
a, an outer diameter of 5.8 mm and an inner diameter of 4.8 are provided in the fifth inner substrate 5 immediately below the first hole 4 a of the fourth inner substrate 4.
The ring-shaped copper foil pattern of mm and the numeral “5” in the center of the copper foil pattern are provided as a symbol 9 provided on the fifth inner layer substrate 5.

FIG. 9 is a plan view after the formation of the inner substrate layer of FIG. According to the above-described layer structure of the inner layer substrate, as shown in FIG. 9, the symbol 6 provided from the first hole 1a of the first layer inner substrate 1 to the second layer inner substrate 2 is changed from the second hole 1b to the second hole 1b. The symbol 7 provided on the third inner substrate 3 from the third hole 1c, the symbol 8 provided on the fourth inner substrate 4 from the third hole 1c was provided on the fifth inner substrate 5 from the fourth hole 1d. Symbol 9 can be observed. In addition, the holes 1a, 1b, 1c,
1d and the copper foil patterns of symbols 6, 7, 8, and 9 are provided with a difference of 0.2 mm in the size, and the hole edge and the outer diameter of the copper foil pattern are 0.1 mm in relation to each other. Spacing is provided to make it easier to distinguish. Further, the pitch of the symbol 6 seen from the first hole 1a and the symbol 7 seen from the second hole 1b, the symbol 7 seen from the other second hole 1b, the symbol 8 seen from the third hole 1c, and the third hole Since the pitch between the symbol 8 viewed from 1c and the symbol 9 viewed from the fourth hole 1d is intentionally different, it is clearly evaluated that each of the inner layer substrates 1 to 5 has a correct layer structure and no displacement. can do.

FIGS. 10 (a) to 10 (c) are plan views for explaining an example of erroneous lamination of the third embodiment of the present invention. FIG. 11 is a plan view of an inner layer substrate having a different product name according to the third embodiment of the present invention. It is a top view explaining the example of mixing. In the case where the order of the inner substrates 1 to 5 in the third embodiment of FIG. 8 is incorrect, as shown in FIGS. 10 (a) to 10 (c), the first substrates shown in FIGS. As in the embodiment, the determination can be made simply and clearly at the configuration stage before lamination.

On the other hand, as shown in FIG.
Even when the second inner layer substrate 2 of the embodiment of the present invention is inserted into the inner layer substrate of the present embodiment, the symbols 7, 8, 9 on the inner layer substrate surface and the holes 1b, 1c, 1d on the symbols 7, 8, 9 are formed. An error can be easily determined by the deviation. That is, if the principle of the third embodiment is applied to a product unit of a different design, it is possible to prevent an error that an inner layer substrate having a different product name is used. In this embodiment, the arrangement of each hole and each symbol is a one-dimensional example. However, the present invention can be applied two-dimensionally. This embodiment is also applicable to the second embodiment in which the symbols are arranged on both sides. Applicable.

FIG. 12 is a perspective view showing the structure of a multilayer printed wiring board according to a reference example of the present invention. In the present reference example , as shown in FIG. 12, first, a first hole 1a having a diameter of 6 mm is formed in the first inner layer substrate 1, and the second hole 1b is formed at a pitch of 15 mm with the first hole 1a. A third hole 1c and a fourth hole 1d,
A ring-shaped copper foil pattern having an outer diameter of 5.8 mm and an inner diameter of 4.8 mm and a number in the center of the copper foil pattern are formed on the second inner substrate 2 immediately below the first hole 1 a of the first inner substrate 1. "2" is provided and the symbol 6 is provided on the second inner layer substrate 2. Next, a first hole 2a having a size of 5.8 mm is formed in the second inner layer substrate 2 directly below the second hole 1b, the third hole 1c, and the fourth hole 1d of the first inner layer substrate 1. And the second hole 2b and the third hole 2c are formed concentrically, and the second inner layer substrate 2 is formed.
And a ring-shaped copper foil pattern having an outer diameter of 5.6 mm and an inner diameter of 4.6 mm on the third inner layer substrate 3 immediately below the second hole 2a, and the numeral "3" in the center of the copper foil pattern as a concentric circle. The symbol 7 is provided on the third inner layer substrate 3. Next, the second inner layer substrate 2 is attached to the third inner layer substrate 3.
5.6 m directly below the second hole 2b and the third hole 2c
The first hole 3a and the second hole 3b are formed concentrically so that the outer diameter of the first hole 3a and the second hole 3b of the fourth inner layer substrate 4 directly below the first hole 3a of the third inner layer substrate 3 is 5. 4.4mm inside diameter at 4mm
In the center of the ring-shaped copper foil pattern and the copper foil pattern, the numeral "4" is provided concentrically and is a symbol 8 provided on the fourth inner layer substrate 4. Next, a first hole 4a having a size of 5.4 mm and a concentric circle is provided in the fourth inner substrate 4 immediately below the second hole 3b of the third inner substrate 3,
A ring-shaped copper foil pattern having an outer diameter of 5.2 mm and an inner diameter of 4.2 mm and a center of the copper foil pattern are formed on a fifth inner substrate 5 directly below the first hole 4 a of the fourth inner substrate 4. The numeral “5” is provided so as to form a concentric circle, and the symbol “9” is provided on the fifth inner layer substrate 5.

FIG. 13 is a plan view after the inner substrate layer structure of FIG. 12 is formed. According to the above-described layer structure of the inner layer substrate, as shown in FIG. 13, the symbol 6 provided in the first layer 1a of the first layer inner substrate 1 in the second layer 2 is replaced with the symbol 6 in the second hole 1b. The symbol 7 provided on the inner layer substrate 3 of the layer is changed from the third hole 1c to 4
The symbol 8 provided on the inner substrate 4 of the layer and the symbol 9 provided on the inner substrate 5 of the fifth layer from the fourth hole 1d can be observed. The first hole 1a of the inner substrate 1 of the first layer and symbols 6 and 2
The first hole 2a of the inner substrate 2 of the layer and the symbol 7, the first hole 3a of the inner substrate 3 of the third layer and the symbol 8 and the inner substrate 4 of the fourth layer
The first hole 4a and the copper foil pattern of symbol 9 have a difference of 0.2 mm in size, and the hole edge and the outer diameter of the pattern have an interval of 0.1 mm in relation to each other. To make it easier to distinguish. The second hole 1b of the first inner layer substrate 1 vertically adjacent to the first hole 2b of the second inner layer substrate 2
a, the third hole 1c of the first inner layer substrate 1, the second hole 2b of the second inner layer substrate 2, the third hole 3a of the third inner layer substrate 3, the first inner layer substrate The first hole 1 d, the third hole 2 c of the second inner substrate 2, the second hole 3 b of the third inner substrate 3, and the first hole 4 a of the fourth inner substrate 4 are: The size is provided with a difference of 0.2 mm, and the hole edge and the hole edge are spaced apart by 0.1 mm in relation to each other so as to be easily distinguished. On the other hand, the first hole 1a of the first-layer inner layer substrate 1, the first hole 2a of the symbol 6 and the second hole 2a of the second layer inner substrate 2, and the first hole 3a of the symbol 7 and the third layer inner substrate 3 The first hole 4a of the inner layer substrate 4 of the eighth and fourth layers and the symbol 9 are provided with a difference of 0.2 mm in size, and the hole edge and the outer diameter of the copper foil pattern are different from each other in the positional relationship. An interval of 0.1 mm is provided for easy distinction. In other words, the sizes of the holes and the symbols of the respective inner-layer substrates are 0.2 mm in order depending on the order of the layer structure. That is, the alignment state of each inner layer substrate can be viewed . For example, a 0.1mm when equally distributes the difference in size to the outside diameter of the hole edge or symbols. Here, a step-like concentric circle for observing the symbol from the first inner layer substrate can be seen. Therefore, if there is no deviation in the center of the concentric circle, it can be determined that the positional relationship between the inner substrates is correct.

FIGS. 14A to 14C are plan views for explaining examples of erroneous lamination of the reference example . Reference of FIG. 12 of the present invention
Examples of order wrong inner substrate 1-5 example, FIG. 14 (a)
As shown in FIGS. 3A to 3C, the present invention shown in FIGS.
As in the first embodiment, the determination can be made simply and clearly at the configuration stage before lamination.

[0025]

As described above, according to the present invention, a plurality of holes are provided in the first inner layer substrate, and symbols and holes are provided immediately below the holes in the first inner layer substrate of the second and subsequent inner layer substrates. By combining the relationships and observing the symbols through the holes, it is possible to clearly evaluate that the layers were correctly formed at the layer formation stage before lamination, and also to judge that the inner layer substrates of different products were mixed. Further, by observing the deviation in the center of the concentric circle, the positional relationship between the inner layer substrates can be correctly combined to completely eliminate the lamination failure, thereby improving the production yield and the reliability.

On the other hand, as a manufacturing method, holes can be provided in a through hole forming step for forming a through hole or a circuit, or in a hole forming step such as a guide hole in laminating an inner layer. It can be formed at the same time in the process, and has an effect that it can be provided at low cost without particularly requiring a new process.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a plan view after the configuration of an inner substrate layer of FIG. 1;

FIGS. 3A to 3C are plan views illustrating examples of erroneous lamination according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing a configuration of a multilayer printed wiring board according to a second embodiment of the present invention.

5 (a) and 5 (b) are a plan view and a bottom view after the configuration of the inner substrate layer of FIG. 4;

FIGS. 6 (a) and 6 (b) are a plan view and a bottom view illustrating an example of erroneous lamination according to the second embodiment of the present invention.

FIGS. 7A and 7B are a plan view and a bottom view for explaining another example of the erroneous lamination according to the second embodiment of the present invention.

FIG. 8 is a perspective view showing a configuration of a multilayer printed wiring board according to a third embodiment of the present invention.

FIG. 9 is a plan view after the configuration of the inner substrate layer of FIG. 8;

FIGS. 10A to 10C are plan views illustrating examples of erroneous lamination according to the third embodiment of the present invention.

FIG. 11 is a plan view illustrating an example of mixing of an inner layer substrate with a different product name according to the third embodiment of the present invention.

FIG. 12 is a perspective view illustrating a configuration of a multilayer printed wiring board according to a reference example of the present invention.

FIG. 13 is a plan view after the configuration of the inner substrate layer of FIG. 12;

FIGS. 14A to 14C are plan views illustrating examples of erroneous lamination of a reference example of the present invention.

FIG. 15 is a plan view of an inner layer substrate for explaining an example of a configuration of a conventional multilayer printed wiring board.

[Explanation of symbols]

1,2,3,4,5,18,19,20,21 Inner layer substrate 1a, 1b, 1c, 1d, 2a, 2b, 2c, 3a, 3
b, 4a, 10a, 10b, 10c, 10d, 11a,
Holes 11b, 11c, 12a, 12b, 13a Symbols 6, 7, 8, 9 Symbols 14, 15, 16, 17 Symbols on back side 18a, 19a, 20a Irregular part

Claims (5)

(57) [Claims] 1. A multilayer printed wiring board comprising at least one of the following inner layer substrates arranged sequentially. (A) 1 having a first through-hole arranged at a first position, a second through-hole arranged at a second position, and a third through-hole arranged at a third position (B) a first inner layer substrate which is disposed immediately below the first inner layer substrate and is a ring- shaped display portion exposed by the first through hole;
And a fourth through-hole and a fifth through-hole disposed immediately below the second through-hole and the third through-hole.
Layer first inner substrate (c) is disposed immediately below the inner substrate of the second layer before Symbol second
And a second symbol serving as a ring- shaped display portion exposed by the through-hole and the fourth through-hole of the second-layer inner-layer substrate, and disposed immediately below the fifth through-hole of the second-layer inner-layer substrate. The first
Third inner layer substrate having six through holes Wherein said through holes are the same diameter of the inner layer board,
Are arranged at the same pitch, the through holes and the symbols are arranged so as to form a concentric circle , and the outer diameter of the concentric circle
The multilayer printed wiring board according to claim 1, wherein is formed smaller than the diameter of the through hole . In claim 3, wherein each of said through-hole is the same diameter of the inner layer board, the corresponding pitch of the through holes of the corresponding pitch at least one location of the through holes, the other of each inner substrate of each inner substrate
Disposed Ji and yl so, the through-hole and the symbols are arranged to form a concentric, and lateral rectus of the concentric
The diameter of the through hole is smaller than the diameter of the through hole.
The multilayer printed wiring board according to the above. 4. The multilayer printed wiring board according to claim 2 , wherein each of the symbols is formed on at least one surface of each inner layer substrate. 5. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (A) a step of drilling through holes arranged at predetermined positions on each of the inner layer substrates to be laminated simultaneously with the drilling of through holes and guide holes; and (b) a step of forming a wiring pattern and simultaneously defining predetermined inner layer substrates. Forming a symbol by a copper foil pattern at the position of (c) the copper foil pattern through the through hole of the inner layer substrate
Laminating combining the respective inner layer board so symbols can be observed by over emissions