JP2740966B2 - High frequency dielectric component and method of manufacturing the same - Google Patents

Description

The present invention relates to a resonator used for an antenna duplexer used for a radio communication device such as a car phone, a mobile phone, and a cordless phone, a resonator used for a voltage controlled oscillator, and the like. Or
The present invention relates to a high-frequency dielectric component used in a microwave frequency region, such as a filter used for a CATV tuner, and a method of manufacturing the same.

2. Description of the Related Art A high-frequency dielectric component is used in a microwave frequency range (1 GHz to 30 GHz), such as a wireless communication device such as an automobile telephone, and typically includes a resonator,
There are filters and so on.

Conventionally, as a high-frequency dielectric component of this type, by using a high dielectric constant material, the wavelength of the high frequency is reduced to the length of ε _r ^-1/2 (ε _r : relative permittivity) in a vacuum, It is generally known that a microwave having a wavelength of 1 wavelength, 1/2 wavelength, or 1/4 wavelength at the frequency is confined in a high-frequency dielectric component and has a small size so as to obtain a predetermined effect. I have.

FIGS. 12 (a) and 12 (b) show an example of a resonator conventionally used as this kind of high-frequency dielectric component.

This resonator is called a coaxial dielectric resonator, and an internal electrode 53 is formed on the inner peripheral surface of a dielectric component main body 51 formed in a cylindrical shape, that is, on the wall surface of a cavity 52. At the same time, an external electrode 54 is formed on the outer peripheral surface of the dielectric component body 51.

FIGS. 13A and 13B show an example of a conventionally used filter as another example of the high-frequency dielectric component.

This filter is called a block filter, and has a dielectric component body 51 formed in a substantially rectangular parallelepiped shape.
A pair of left and right cavities 52, 52 penetrates, and internal electrodes 53, 53 are formed on the wall surfaces of these cavities 52, 52, respectively.
54 are formed.

This filter has a structure in which two resonators are connected in series.

In the resonator and the filter, the dielectric component body 51 is formed by pressing a ceramic powder to which a binder is added with a mold to form a molded body, or molding a mixture of the ceramic powder and the binder by an extrusion molding machine. To form a molded body and sintering the molded body.

In addition to this, a resonator using a microstrip line as shown in FIGS. 14 (a) and 14 (b) is known as a high-frequency dielectric component conventionally used. In this type of resonator, an electrode portion 55 corresponding to the internal electrode 53 and an excitation electrode 59 are formed on the surface of a substantially rectangular flat plate-shaped dielectric component body 51, and an electrode 56 corresponding to the external electrode 54 is formed on the back surface. Is provided. In general, a resonator of this type in which the electrode portion 55 is formed in a ring shape to increase the Q value at the resonance frequency is generally used.

There is also a resonator in which a slit portion 57 is provided in the ring-shaped electrode portion 55 so as to use a half wavelength at the resonance frequency.

Problems to be Solved by the Invention In the coaxial dielectric resonator shown in FIG. 12 and the block filter shown in FIG. 13, as described above, in the process of manufacturing the dielectric component body 51, press molding or extrusion is performed. Since the molded body was manufactured by molding, if it is desired to form the shape of the hollow portion 52 into a complicated shape such as a U-shape or an S-shape, the manufacturing becomes difficult, and it cannot be formed especially by extrusion molding. There were drawbacks.

Further, when the shape of the cavity 52 becomes complicated, there is a disadvantage that it is difficult to form a stable internal electrode 53 even in terms of so-called metallization.

Further, in a resonator having a so-called step impedance structure as shown in FIGS. 15 (a) and 15 (b), the wall thickness t of the large-diameter portion 58 of the cavity 52 becomes thin, and cracks and the like occur in this portion. And there is a disadvantage that it is easily broken.

Extending the microwave transmission path in the high-frequency dielectric component by making the shape of the cavity 52 ring-shaped or ring-shaped with slits is a method of confining a longer electromagnetic wave within a certain volume. This is important in reducing the weight and weight of body parts.

However, in the related art, as described above, since there is a machining process after press molding or the like, it is not possible to form the cavity 52 having a complicated shape, and there is a limit in reducing the size and weight. There was a point.

In the case where a microstrip line is applied, the above-described manufacturing problem does not occur, but since the conductor is exposed to the outside and one surface of the conductor is in contact with air, the effective relative permittivity is reduced. However, there is a problem that the reliability is low, the radiation loss is high, the system is easily affected by the outside world, and the reliability is low.

The present invention has been made in view of such a problem, and without reducing the effective relative permittivity, increases the degree of freedom in design, and achieves a high-frequency dielectric component that can be made thinner and smaller. It is an object of the present invention to provide a manufacturing method thereof.

Means for Solving the Problems In order to achieve the above object, a high-frequency dielectric component according to the present invention has a structure in which two flat internal electrodes have no gaps inside a dielectric block, and their main surfaces are vertically oriented. A first external electrode is formed on the outer surface of the dielectric block, and one end of one of the two internal electrodes is connected to the first external electrode. While being connected, one end of the other internal electrode is exposed to the open end face, and the other end of the two internal electrodes is connected to a second external electrode formed on the outer surface of the dielectric block. The second external electrode and the first external electrode are separated from each other (1).

In addition, two flat plate-like internal electrodes are buried inside the dielectric block such that there are no gaps and their main surfaces are vertically overlapped, while a predetermined depth is provided between the internal electrodes of the dielectric block. A slit is formed, an external electrode connected to one end of the internal electrode is formed on the outer surface of the dielectric block, and the other ends of the two internal electrodes are exposed to the open end faces. (2).

In the first manufacturing method, an organic material having a predetermined thickness is printed on a predetermined portion of a high-frequency dielectric green sheet on which an internal electrode is formed on one side, and at least an appropriate number of high-frequency dielectric green sheets are printed on at least the printed surface. After laminating the sheets, then pressing and sintering them to form a dielectric block having voids in which the organic substances have been burned off, then filling the voids with molten metal and solidifying to form internal electrodes, After that, an external electrode is formed on an outer surface of the dielectric block.

In a second manufacturing method, a high-frequency dielectric green sheet on which an organic material having a predetermined thickness is printed is formed on a predetermined portion of a high-frequency dielectric green sheet having an internal electrode formed on one surface, and the main surfaces of the internal electrodes are arranged at predetermined positions. After laminating so as to be overlapped in the vertical direction with an interval, these are pressed and sintered and formed to form a dielectric block having a void from which the organic matter has been removed by burning, and then the molten metal has been filled and solidified by filling the void. After the electrodes are formed, an external electrode is further formed on the outer surface of the dielectric block.

A third manufacturing method is the same as the above-described second manufacturing method, wherein the gap is filled with a molten metal to solidify, an internal electrode is formed, the internal electrodes laminated are connected, and the outer surface of the dielectric block is further formed. An external electrode is formed on the substrate.

According to the high-frequency dielectric component described in the above (1), a high-frequency dielectric component having a stable high effective relative permittivity can be obtained, and the second external electrode can be operated as a part of the resonance line, and Since the capacitance between the resonance lines on the open end side of the internal electrode can be increased, the effect of shortening the resonance wavelength can be obtained, and the length of the internal electrode can be set short. Also, two flat internal electrodes are folded type 1
Since the second external electrode that operates as one resonant electrode and connects the internal electrodes is not embedded in the dielectric block, the length of the dielectric block is longer than that of the embedded type. Can be set shorter accordingly. Further, the width of the dielectric block can be set to be shorter than that of a type in which flat internal electrodes are arranged in a horizontal direction, and as a result, the size can be reduced.

According to the high-frequency dielectric band component described in the above (2),
A high-frequency dielectric component having a stable and high effective relative permittivity is obtained, and the slit is sandwiched between the main surfaces of the opposed internal electrodes, compared to a type in which a slit is formed between internal electrodes arranged in a horizontal direction. Therefore, the amount of change in the degree of coupling between the two resonators can be increased to facilitate these controls, and at the same time, the width of the dielectric block can be set short, and the size can be reduced.

Further, according to the first, second, and third manufacturing methods, a complicated print pattern made of an organic material is easily formed on the surface of the high-frequency dielectric green sheet, and the voids are also arbitrary corresponding to the print pattern. The complicated shape is maintained, and therefore, the complicated shape of the internal electrode is easily formed by the injection of the metal or the alloy. Therefore, the degree of freedom of the shape of the internal electrode is dramatically improved as compared with a resonator obtained by conventional press molding or the like.

Furthermore, since the high-frequency dielectric component manufactured by the first, second and third manufacturing methods is of a laminated type in which high-frequency dielectric green sheets are stacked, it is possible to omit the cavity in the conventional example. Thus, the thickness of the resonator can be reduced.

In addition, since the internal electrodes are completely protected by the dielectric block, there is almost no radiation loss, the effective relative permittivity increases, and the influence of the outside world, compared to a resonator using a microstrip line. Without this, stable performance is obtained and reliability is high.

When a material having a low melting point, such as Ag, Al, or Cu, or an alloy containing these metals is used as the material of the internal electrode for filling the voids used in the first, second, and third manufacturing methods, the metal is melted and hardened. And the internal electrodes are easily formed.

Since these materials have low resistance in the microwave region, the internal electrodes formed of these materials have excellent conductivity in the microwave region.

Embodiment Hereinafter, an embodiment according to the present invention will be described in detail with reference to the drawings.

Example 1 FIGS. 1A, 1B, and 1C show a resonator as a high-frequency dielectric component according to Example 1, in which an internal electrode 1 was formed in a U-shaped cross section. In the case of the folded resonator, the internal electrode 1 is formed on the front surface 6 side of the dielectric block 2 as shown in FIGS.
The external electrode 3 is partially formed also on the front surface 6 side so that one end of the external electrode 3 is an open end and the other end is electrically connected to the external electrode 3. As shown in FIG. 1 (c), on the back surface 7 side of the dielectric block 2, the external electrodes 3 are provided only on the peripheral edge of the dielectric block 2 so that the internal electrodes 1 and the external electrodes 3 are not short-circuited. Are formed. The internal electrodes 1 are connected to each other by the second external electrode 3 ', and the formation of the second external electrode 3' can be performed simultaneously with the formation of the external electrode 3.

For metal conductors used for internal electrodes, Ag, Au,
By using a metal such as Cu, Al, Pd, or an alloy containing at least one of them, it is possible to obtain a part having good integral moldability, and furthermore, a high-frequency dielectric part having excellent microwave conductivity. Obtainable.

Example 2 FIGS. 2 (a) and (b) show 1 of the resonance frequency.
It is a filter as a high-frequency dielectric component according to the second embodiment in the case of using a wavelength, and is an example of a so-called superposition type filter. Therefore, the internal electrodes 1 in the high-frequency dielectric component shown in FIG. 2 are respectively connected to the external electrodes 3 on the back surface.

In a filter that can be manufactured by such a method, it is easy to completely overlap conductor portions in the resonator. For example, two laminates of a first high-frequency dielectric green sheet having an internal electrode 1 formed on the surface and a second high-frequency dielectric green sheet having no internal electrode formed on the surface are manufactured. After they are superimposed on each other, they are sintered and integrally molded to obtain the dielectric block 2, and a desired filter can be easily obtained.

The high-frequency dielectric component shown in FIG. 2 is configured such that the internal electrode 1 is formed on the surface of the first high-frequency dielectric green sheet by printing or the like. The high frequency dielectric component can be easily formed, so that the size and thickness of the high frequency dielectric component can be reduced, and the degree of coupling between the resonators can be freely adjusted. Also, the number of the second high frequency dielectric green sheets laminated on the first high frequency dielectric green sheet can be arbitrarily selected, so that it is easy to change the specifications of impedance and resonance frequency. This can be dealt with, and it is easy to make the multi-stage filter compact.

Furthermore, since the internal electrodes 1 are embedded in the dielectric block 2, a high-frequency dielectric component having a stable and high effective relative permittivity can be obtained.

[Embodiments 3 to 8] FIG. 3 shows a manufacturing process of a resonator (embodiment 3) using a quarter wavelength at a resonance frequency, and FIG. 4 shows a resonator manufactured through the above manufacturing process. (Example 3) is shown. FIG. 5 shows a manufacturing process of a resonator (Example 4) using one wavelength at a resonance frequency.
The figure shows a resonator manufactured through the above manufacturing process (Example 4)
Is shown. First, a first method for manufacturing these resonators will be described with reference to FIGS. 3 and 5.

First, as shown in FIGS. 3 (I) and 5 (I), the surface of a second high-frequency dielectric green sheet 5 made of a high-frequency dielectric material is formed of carbon, a polymer material, or the like. A third high frequency dielectric green sheet is formed by forming a printing pattern 10 by screen printing or the like using an organic composition (hereinafter, referred to as “organic substance”) such as a paste.
It is assumed to be 14. In the embodiment shown in FIG. 3 (I), the print pattern 10 is formed in a strip shape. FIG. 5 (I)
In the embodiment shown in FIG. 5, the internal electrode 9 for excitation, the opening 11 for metal injection, and the printed pattern 10 to be the ring-shaped internal electrode 1 are formed.
Is formed. In order to manufacture a resonator using a half wavelength at the resonance frequency (FIG. 7), a slit may be formed in the ring-shaped portion.

As described above, the print pattern 10 can be formed on the surface of the second high-frequency dielectric green sheet 5 in any shape.

Next, as shown in FIG. 3 (II) and FIG. 5 (II), a third high-frequency dielectric green sheet 14 is laminated on the second high-frequency dielectric green sheet 5, and the third high-frequency dielectric green sheet 14 is further laminated. An appropriate number of second sheets are placed on the high-frequency dielectric green sheet 14.
Are laminated. In these embodiments, two second high-frequency dielectric green sheets 5 are placed on the third high-frequency dielectric green sheet 14.
Are stacked, but the number of stacked layers can be freely selected according to the impedance and resonance frequency of the resonator.

In these embodiments, one second high-frequency dielectric green sheet 5 is also laminated below the third high-frequency dielectric green sheet 14, but the number is arbitrary and may be omitted. Is also possible.

The second high-frequency dielectric green sheet 5 is also made of the same high-permittivity high-frequency material as the third high-frequency dielectric green sheet 14.

Next, the third high-frequency dielectric green sheet 14 and the second high-frequency dielectric green sheet 5 are formed by appropriate means.
And crimp.

Thereafter, the temperature is gradually increased to about 500 ° C., and the organic substances constituting the print pattern 10 are burned and removed, as shown in FIGS. 3 (III) and 5 (III).
The void 12 and the opening 11 are formed.

Next, in this state, the third dielectric green sheet for high frequency 14 and the second dielectric green sheet 5 for high frequency are
Sintered at 1,000 ° C to 1,400 ° C and molded integrally,
As shown in FIG. 5 (IV) and FIG. 5 (IV), a dielectric block 2 is formed.

Then, a predetermined metal or alloy is injected into the gap 12 and the opening 11 by a so-called impregnation method, and as shown in FIG. 3 (V) and FIG. 5 (V), the internal electrode 1 and the excitation An internal electrode 9 is formed. That is, Cu, Al,
After the above-mentioned specific metal or alloy such as Ag is melted in a suitable container, the dielectric block 2 is immersed in the molten metal in this container, and the metal or alloy is immersed in the cavity 12 and the opening 11. inject. Thereafter, the dielectric block 2 is pulled out of the container, the dielectric block 2 is cooled, and the metal or alloy injected into the gap 12 and the opening 11 is hardened,
The internal electrode 1 and the internal electrode 9 for excitation are formed.

In order to prevent the metal or alloy from adhering to the dielectric block 2, it is preferable to perform an appropriate pretreatment before immersing the dielectric block 2 in the container.

Finally, in the embodiment shown in FIG. 3 (VI), an external electrode is formed on the outer surface of the dielectric block 2 except for the front surface 6 of the dielectric block 2 by a plating method, an electrode baking method, a vapor deposition method, or the like. 5 is formed, and in the embodiment shown in FIG. 5 (VI), the excitation internal electrode 9 and the opening of the dielectric block 2 are formed.
The external electrodes 3 are formed on the outer surface of the dielectric block 2 except for 11 and the manufacture of the resonator shown in FIGS. 4 and 6 is completed. In FIG. 6, the opening 11 is omitted. The external electrode 3 is, as described above, 1 / at the resonance frequency.
In the case of FIG. 4 using four wavelengths, the back surface (not shown) is electrically connected to the internal electrode 1, and in the case of a resonator using one wavelength at the resonance frequency (FIG. 6). Is not connected between the external electrode 3 and the internal electrode 1.

Since the opening 11 (FIG. 5) used at the time of injection remains bonded to the resonance portion even after the internal electrode 1 is hardened, its shape needs to be designed so as not to adversely affect resonance. Therefore, it is desirable that the internal electrode 1 be as short as possible to the outside.

In such a resonator, a printed pattern 10 made of an organic substance such as a carbon paste can be easily formed on the surface of the second high-frequency dielectric green sheet 5 even if it has a complicated ring shape or a ring shape having slits. The gap 12 can be easily formed into an arbitrary complicated shape corresponding to the print pattern 10. Since the internal electrode 1 is formed by injecting the predetermined metal or alloy into the space 12, the internal electrode 1 having a complicated shape can be easily formed.

That is, the degree of freedom of the shape of the internal electrode 1 is dramatically improved as compared with a resonator obtained by conventional press molding or the like.

Further, in the resonator obtained by the conventional press molding or the like, when the specifications such as the impedance and the resonance frequency of the resonator were changed, it was necessary to cope with the change in the mold, but in the above-described embodiment, the change was made in the mold. The shape of the print pattern 10 formed on the surface of the second high-frequency dielectric green sheet 5 is changed to a third high-frequency dielectric green sheet 14, or the number of stacked second high-frequency dielectric green sheets 5 , It is possible to easily cope with the specification change.

Further, since the resonator according to the above embodiment is of a laminated type in which the second high-frequency dielectric green sheet 5 is laminated on the third high-frequency dielectric green sheet 14, the cavity 52 (the 12, 13 and 15) can be omitted, and the thickness of the resonator can be reduced.

Further, since the internal electrode 1 is completely protected by the dielectric block 2, compared with a resonator using a microstrip line, there is almost no radiation loss, the effective relative permittivity is increased, and , Stable performance is obtained and reliability is high.

Unlike the dielectric substrates that are superposed and bonded with an adhesive or the like, the dielectric substrates are not adversely affected by the adhesive or glass.

Further, in the resonator according to the above embodiment, the internal electrode 1
As the metals used as the raw material, Cu, Ag, Al or an alloy containing at least one of them is suitable. That is, since these metals or alloys have a low melting point, they can be easily melted and hardened, which is convenient for injecting the metal into the voids 12 by the above-described impregnation method or the like. Also,
Since these metals or alloys have low resistance in the microwave region, they also have excellent conductivity as high-frequency dielectric components.

According to the first manufacturing method described above, a high-frequency dielectric component having the structure shown in FIGS. 8 to 11 can be easily manufactured.

That is, FIGS. 8A and 8B show a resonator (Example 5) as a high-frequency dielectric component manufactured by the first manufacturing method, and the resonator transmits microwaves. The internal electrode 1 is formed in a U-shape. That is, by forming the internal electrode 1 in a U-shape, the microwave transmission line in the resonator is substantially increased, a quarter wavelength of the resonance frequency is confined in the resonator, and the size of the resonator is reduced. It is intended. In this embodiment, the internal electrodes 1
Is open, and the other end is electrically connected to the external electrode 3. The external electrode 3 is also formed on a part of the open end face 2 a of the dielectric block 2.

FIGS. 9 (a) and 9 (b) show a resonator (Example 6) as a high-frequency dielectric component manufactured by the first manufacturing method. The resonator has an internal portion through which microwaves are transmitted. The electrode 1 is formed in an S-shape. That is, by forming the internal electrode 1 in an S-shape, as in the fifth embodiment, the microwave transmission path is substantially lengthened, a quarter wavelength of the resonance frequency is confined, and the size of the resonator is reduced. It was made possible.

FIGS. 10 (a) and (b) show a resonator (Example 7) as a high-frequency dielectric component manufactured by the first manufacturing method, which has a so-called step impedance structure. In the past, since it was manufactured by press molding or the like, as described in the section of “Problems to be Solved by the Invention”, cracks and the like occurred in the portion where the thickness t (see FIG. 15) became thin. There was a risk of damage. In the present invention, since the internal electrode 1 is formed on the surface of the third dielectric green sheet 14 for high frequency and the cavity 52 corresponding to the conventional example is not formed, the above-described damage does not occur.

Further, according to the present invention, although not shown, a step impedance structure having three or more steps can be easily formed, and the internal electrode 1 for continuously changing the impedance is also substantially trapezoidal. It can be easily formed by adopting the configuration described above.

FIGS. 11 (a) and (b) show a filter (Embodiment 8) as a high-frequency dielectric component manufactured by the manufacturing method of FIG. 1, in which a slit 8 is provided to increase the degree of coupling between the two resonators. Is an example of a so-called side-by-side filter in which is formed.
In this high-frequency dielectric component, a slit 8 is formed to prevent the pair of left and right internal electrodes 1 and 1 from interfering with each other and adversely affecting the performance of the filter.

Furthermore, the high-frequency dielectric components (FIGS. 1 and 2) according to the first and second embodiments can be easily manufactured by the second and third manufacturing methods according to substantially the same procedure as the first manufacturing method. it can.

It should be noted that the present invention is not limited to the embodiments described above, and can be changed without departing from the scope of the invention.
For example, in the above embodiment, the printed pattern 10 made of an organic material is formed on the surface of the second high-frequency dielectric green sheet 5 in order to form the gap 12, but the gap 12 is formed by such a method. Instead of forming, a sheet made of an organic material on which a predetermined pattern is formed is laminated on the second high-frequency dielectric green sheet 5, and the second high-frequency dielectric green sheet 5 is laminated thereon, and then pressed. Then, the organic substance may be removed by the same method as described above to form the void portion 12.

Effect of the Invention As described in detail above, in the high-frequency dielectric component according to the above (1), a high-frequency dielectric component having a stable and high effective relative permittivity can be obtained, and the second external electrode can be used. In addition to operating as a part of the resonance line, the capacitance between the resonance lines on the open end side of the internal electrode can be increased, so that the effect of shortening the resonance wavelength can be obtained, and the length of the internal electrode is set short. be able to. Further, since the second external electrode connecting between the internal electrodes is not embedded in the dielectric block, the length of the dielectric block can be set shorter than that of the embedded type. . Further, the width of the dielectric block can be set shorter than that of the type in which the plate-shaped internal electrodes are arranged in the horizontal direction, and as a result, the size can be reduced.

Further, in the high frequency dielectric component according to the above (2), a high frequency dielectric component having a stable and high effective relative permittivity can be obtained, and a slit is formed between the internal electrodes arranged in the horizontal direction. Since the slit is sandwiched between the main surfaces of the internal electrodes facing each other, the amount of change in the degree of coupling between the two resonators can be increased, and the control thereof can be facilitated. The width of the dielectric block can be set short, and the size can be reduced.

In the first, second and third manufacturing methods,
A printed pattern made of organic matter can be easily formed on the surface of the dielectric green sheet for high frequency even if it is a complicated pattern, and voids can be easily formed into any complex shape corresponding to the printed pattern. Therefore, an internal electrode having a complicated shape can be easily formed by injecting a metal or an alloy. Therefore, the degree of freedom of the shape of the internal electrode is dramatically improved as compared with a resonator obtained by conventional press molding or the like.

The specifications can be easily changed by changing the print pattern formed on the surface of the high-frequency dielectric green sheet, changing the number of laminated high-frequency dielectric green sheets, or the like.

Furthermore, since the high-frequency dielectric component manufactured by the first, second and third manufacturing methods is of a laminated type in which high-frequency dielectric green sheets are stacked, it is possible to omit the cavity in the conventional example. The thickness of the resonator can be reduced.

In addition, since the internal electrodes are completely protected by the dielectric block, there is almost no radiation loss, the effective relative permittivity increases, and the influence of the outside world, compared to a resonator using a microstrip line. Without this, stable performance is obtained and reliability is high.

[Brief description of the drawings]

FIG. 1 (a) is a perspective view showing a high-frequency dielectric component according to Embodiment 1 of the present invention, and FIG. 1 (b) is FF of FIG. 1 (a).
1 (c) is a rear view of FIG. 1 (a), FIG. 2 (a) is a perspective view showing a high-frequency dielectric component according to Embodiment 2, and FIG. 2 (b) is a second view. FIG. 3A is a sectional view taken along line GG, FIGS. 3A to 3C are process diagrams showing a method for manufacturing a high-frequency dielectric component according to the third embodiment, and FIG. 4 is a high-frequency dielectric component according to the third embodiment. FIGS. 5 (I) to (VI) are process diagrams showing a method for manufacturing a high-frequency dielectric component according to the fourth embodiment, and FIG. 6 shows a high-frequency dielectric component according to the fourth embodiment. FIG. 7 is a perspective view of a resonator using a half wavelength of a resonance frequency, FIG. 8 (a) is a perspective view showing a high-frequency dielectric component according to a fifth embodiment, and FIG. 8 (b). 9A is a cross-sectional view taken along the line BB in FIG. 8A, FIG. 9A is a perspective view showing a high-frequency dielectric component according to the sixth embodiment, and FIG. 9B is a view C in FIG. -C sectional view, FIG. 10 (a) Is a perspective view showing a high-frequency dielectric component according to Example 7, FIG. 10 (b) is a cross-sectional view taken along line DD of FIG. 10 (a), and FIG. 11 (a) is a high-frequency dielectric material according to Example 8; 11 (b) is a cross-sectional view taken along line E-E of FIG. 11 (a), FIG. 12 (a) is a perspective view showing a first conventional example, and FIG. 13 (a) is a perspective view showing a second conventional example, FIG. 13 (b) is a YY sectional view of FIG. 13 (a), FIG. 14 (a) is a perspective view showing a conventional example to which a microstrip line using one wavelength is applied, and FIG. 14 (b) is
FIG. 15 (a) is a perspective view showing a conventional example to which a microstrip line using 1/2 wavelength is applied, FIG. 15 (a) is a perspective view showing a conventional example, and FIG.
FIG. 15 is a sectional view taken along the line ZZ in FIG. DESCRIPTION OF SYMBOLS 1 ... Internal electrode, 2 ... Dielectric block, 3 ... External electrode, 5 ... Second high frequency dielectric green sheet, 12 ... Void, 14 ... Third high frequency dielectric green sheet .

Claims (5)

(57) [Claims] An internal electrode having two flat plates is buried inside a dielectric block so as to have no gap and their main surfaces are vertically overlapped with each other. An external electrode is formed, and the first external electrode is
One of the internal electrodes is connected to one end of one of the internal electrodes, one end of the other internal electrode is exposed to the open end face, and the other end of the two internal electrodes is connected to the outside of the dielectric block. A high-frequency dielectric component, wherein a second external electrode formed on the surface is connected, and the second external electrode and the first external electrode are separated from each other. 2. Two internal electrodes in the form of a flat plate are buried inside a dielectric block so that there are no gaps and their main surfaces are vertically overlapped, and between the internal electrodes of the dielectric block. Is formed with a slit of a predetermined depth, an external electrode to which one end of the two internal electrodes is connected is formed on the outer surface of the dielectric block, and the other end of the two internal electrodes is an open end face. A high-frequency dielectric component that is exposed. 3. An organic material having a predetermined thickness is printed on a predetermined portion of a high-frequency dielectric green sheet on which an internal electrode is formed on one side, and an appropriate number of high-frequency dielectric green sheets are laminated on at least the printed surface. Then, after pressing and sintering to form a dielectric block having a void in which the organic matter has been removed by burning, the void is filled with molten metal and solidified to form an internal electrode. A method for manufacturing a high-frequency dielectric component, comprising forming an external electrode on an outer surface of a body block. 4. A high-frequency dielectric green sheet having a predetermined thickness of an organic material printed on a predetermined portion of a high-frequency dielectric green sheet having an internal electrode formed on one side thereof, wherein the main surfaces of the internal electrodes are spaced from each other by a predetermined distance. After laminating so as to overlap in the vertical direction, these are press-bonded and sintered and formed to form a dielectric block having voids in which the organic substances have been burned off, and then the voids are filled and solidified with a molten metal to form internal electrodes. After forming, an external electrode is further formed on the outer surface of the dielectric block. 5. An internal electrode is formed by filling and solidifying a molten metal in a void, connecting the laminated internal electrodes, and forming an external electrode on an outer surface of the dielectric block. A method for manufacturing a high-frequency dielectric component according to claim 4.