JP2744072B2 - Electrodeposition equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electrodeposition apparatus, and more particularly, to an electrodeposition apparatus capable of improving electrodeposition automation and productivity.

[Conventional technology]

In a fluorescent display tube used for a fluorescent dot array tube or a bar code display tube for an optical printer, it is necessary to form a good fluorescent surface on the segment electrodes in which dots are arranged on a substrate. An electrodeposition method capable of effectively forming a phosphor screen or the like has already been proposed (see, for example, JP-A-62-291836 and JP-A-64-21845).

In this conventional technique, the stability of liquid stirring during electrodeposition is increased,
The present invention provides an electrodeposition method capable of precisely adhering the phosphor particles to only the segment electrodes.The electrodeposition liquid in which the phosphor particles are dispersed is accommodated in a container. The electrodeposited substrate is formed in a polygonal shape, and opposed electrodes are provided so as to face the segment electrodes located on the surface of each electrodeposited substrate so as not to cause a relative displacement with respect to the segment electrodes, A power source is connected between the counter electrode and the segment electrode to form an electric field, and a flow of an electrodeposition liquid is generated by the stirring means between the counter electrode and the electrodeposited substrate having the polygonal shape. In addition, electrode particles are electrodeposited on the segment electrodes.

According to this electrodeposition method, since the electrodeposition is performed in a state in which a liquid flow is generated in the electrodeposition liquid by the stirring means arranged corresponding to the electrodeposition substrate, the effect of scraping off the phosphor particles by the liquid stirring is obtained. As a result, it is possible to obtain an effect that the phosphor particles adhere to the segment electrode portion densely even if the arrangement density is large, and that the phosphor particles hardly adhere to portions other than the segment electrode portion.

[Problems to be solved by the invention]

By the way, effective electrodeposition can be performed by applying the above-described electrodeposition method. However, in the configuration described in the above-described conventional technique, setting of a substrate in an electrodeposition tank or the like must be performed manually. However, there is a problem in that the productivity is poor and the practicality of the electrodeposition apparatus is poor and insufficient.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an electrodeposition apparatus that can perform an electrodeposition operation continuously and efficiently and that can be easily automated.

[Means for solving the problem]

In order to achieve the above object, in the electrodeposition apparatus according to the present invention, a cylindrical electrodeposition tank that is installed on a gantry and contains an electrodeposition liquid in which phosphor particles are dispersed, and is provided at the center of the electrodeposition tank. A stirring member for vortexing the electrodeposited liquid, and a cylindrical member having a polygonal outer peripheral surface, supporting the electrodeposition substrate on each surface, inserting the electrodeposition tank into the electrodeposition tank, and electroplating the electrodeposition substrate. Substrate mounting jig to be immersed in the liquid, a cleaning tank installed on the same gantry as the above electrodeposition tank, for cleaning the substrate mounting jig after electrodeposition, vertical movement and swivel operation A jig mounting arm for transferring the substrate mounting jig having a plurality of arm portions and holding the respective arm portions to the electrodeposition tank or the cleaning tank, and inserting the substrate mounting jig into the electrodeposition tank or the cleaning tank. And an arm support mechanism for vertically moving and turning the jig mounting arm. It is characterized in.

[Action]

In the electrodeposition apparatus according to the present invention, by providing a stirring member for vortexing the electrodeposition liquid in the electrodeposition bath,
Effective electrodeposition can be performed.

In addition, by providing a cleaning tank for cleaning the substrate mounting jig after the electrodeposition, it is possible to wash out the clumps of the phosphor particles adhered to the substrate mounting jig, and to re-enter the electrodeposition liquid. Mixing is prevented.

Further, the substrate mounting jig is constituted by a cylindrical member having an outer peripheral surface in a polygonal shape, and the substrate for electrodeposition is supported on each surface portion, so that the same number of substrates can be mounted on one substrate mounting jig. A plurality of substrates can be electrodeposited at one time.

Further, the substrate mounting jig is held by the jig mounting arm, is conveyed to the electrodeposition tank or the cleaning tank by the jig mounting arm, and is inserted into the electrodeposition tank or the cleaning tank. The electrodeposition work can be easily automated by automatically controlling the arm support mechanism for performing the vertical movement and the turning operation.

〔Example〕

Hereinafter, the present invention will be described in detail based on one embodiment shown in the drawings.

The present invention relates to an electrodeposition apparatus for adhering and forming a phosphor on a segment electrode 23 or the like having a dot pattern formed on a substrate 22 such as glass as shown in FIG. The substrate 22 is immersed in an electrolytic solution in which phosphor particles are dispersed, and a potential is applied between the segment electrode 23 and a counter electrode provided in the electrodepositing solution, and the phosphor particles in the electrodepositing solution are applied. For electrodepositing the electrodeposition on the segment electrode, and to provide an electrodeposition apparatus capable of continuously and efficiently performing the electrodeposition work and enabling mass production of electrodeposited products.

 Hereinafter, specific examples will be described.

FIG. 1 is a side view showing an outline of an electrodeposition apparatus according to the present invention, and FIG. 2 is a top view of the same apparatus. In FIG. 1 and FIG. Reference numeral 3 denotes a coupling, reference numeral 3 denotes a coupling, reference numeral 4 denotes an arm rotation bearing, reference numeral 5 denotes an arm rotation shaft, reference numeral 6 denotes a nut, reference numeral 7 denotes an arm rotation motor, and reference numeral 8 denotes an electrodeposition liquid stirring propeller shaft. , Symbol 9 is an electrodeposition tank, symbol 10 is an electrodeposition liquid, symbol
11 is a propeller for stirring the electrodeposition liquid, 12 is a sealing material, 13
Is a ball screw for vertically driving the arm, reference numeral 14 is a slide rail for vertically driving the arm, reference numeral 15 is a bearing for vertically driving the arm, reference numeral 16 is a nut for vertically driving the arm, reference numeral 17 is a pulley for vertically driving the arm, and reference numeral 18 is an electrodeposition liquid. A stirring pulley, numeral 19 indicates a substrate mounting jig, numeral 20 indicates a gantry, and numeral 21 indicates an ultrasonic cleaning tank.

In the electrodeposition apparatus according to the present invention shown in FIGS. 1 and 2,
A cylindrical electrodeposition bath 9 which is placed on a gantry 20 and contains an electrodeposition solution 10 in which phosphor particles are dispersed, and a central portion of the electrodeposition bath 9 for vortexing the electrodeposition solution 10 The electrodeposition liquid stirring propeller 11 and a cylindrical member having a polygonal outer peripheral surface as shown in FIG. 3, each of which supports the electrodeposition substrate 22 and is inserted into the electrodeposition tank 9. A substrate mounting jig 19 for immersing the electrodeposited substrate 22 in the electrodeposition liquid 10 and a substrate mounting jig 19 for cleaning the substrate mounting jig 19 after being electrodeposited on the same base 20 as the electrodeposition bath 9. The ultrasonic cleaning tank 21 and the substrate mounting jig 19 having a plurality of arms that can move up and down and rotate can be transferred to the electrodeposition tank 9 or the cleaning tank 21 by holding the substrate mounting jig 19 held by each arm. The jig mounting arm 1 for inserting the mounting jig 19 into the electrodeposition bath 9 or the cleaning bath 21 and the jig mounting arm 1 are moved up and down and swiveled. It consists structure and a of the arm supporting mechanism.

The electrodeposition liquid stirring propeller 11 is attached to one end of the electrodeposition liquid stirring propeller shaft 8 located inside the electrodeposition tank 9. The electrodeposition liquid stirring propeller shaft 8 is disposed outside the electrodeposition tank 9. The electrodeposition liquid agitating pulley 18 is attached to the other end located at. The electrodeposition liquid stirring pulley 18 is connected to an electrodeposition liquid stirring motor via a belt (not shown), and the electrodeposition liquid stirring propeller shaft 8 is rotated at a predetermined rotation speed by the electrodeposition liquid stirring motor. The electrodeposition liquid 10 in the electrodeposition tank 9 is stirred by the electrodeposition liquid stirring propeller 11 which rotates and rotates integrally with the electrodeposition liquid stirring propeller shaft 8.

The jig mounting arm 1 has a plurality of arms (four in the example shown in FIG. 2), and a board mounting jig 19 is mounted on each arm. The center of the arm 1 is fixed to an arm pivot 5. The arm turning shaft 5 is rotatably supported by the arm turning holder 2 via the arm turning bearing 4, and the shaft end of the arm turning shaft 5 is connected to the arm turning motor 7 via the coupling 3. It is connected to the rotating shaft. Therefore,
The jig mounting arm 1 is turned around an arm turning shaft 5 by rotation of an arm turning motor 7. The arm turning holder 2 is supported by an arm vertical driving ball screw 13 via an arm vertical driving nut 16, and is vertically moved along an arm vertical driving slide rail 14 by the rotation of the arm vertical driving ball screw 13. It is being moved. An arm vertical drive pulley 17 is fixed to the lower end of the arm vertical drive ball screw 13, and the arm vertical drive pulley 17 is connected to an arm vertical drive motor via a belt (not shown). The rotation of the arm vertical drive motor rotates the arm vertical drive ball screw 13, moves the arm pivot holder 2 up and down along the arm vertical drive slide rail 14, and moves the jig mounting arm 1 up and down. ing.

Therefore, in the electrodeposition apparatus having the structure shown in FIGS. 1 and 2, the rotation and vertical movement of the jig mounting arm 1 are controlled by controlling the rotation of the arm rotation motor 7 and the arm vertical drive motor (not shown). Then, the substrate mounting jig 19 is transported by the jig mounting arm 1 to the electrodeposition tank 9 or the cleaning tank 21 and inserted into the electrodeposition tank 9 or the cleaning tank 21.

The substrate mounting jig 19 is provided rotatably with respect to the jig mounting arm 1, so that the work of attaching and detaching the electrodeposited substrate can be easily performed. In addition, the mounting work of the board is usually performed at the position A in FIG.
Usually, this is performed at the position D in FIG.

Next, the operation of the electrodeposition apparatus having the configuration shown in FIGS. 1 and 2 will be described.

First, as shown in FIG. 3, the electrodeposited substrate 22 is mounted on each surface of the substrate mounting jig 19 held by the jig mounting arm 1 at the position A in FIG. The board mounting jig 19 for this board
It can be easily automated using a robot arm or the like.

Next, after the mounting of the electrodeposited substrate 21 on the substrate mounting jig 19 is completed, the jig mounting arm 1 is raised to the top dead center by the above-described arm vertical movement mechanism, and thereafter, the clock is rotated by the above-described turning mechanism. The substrate mounting jig 19 is turned around 90 degrees and transported to the electrodeposition tank 9 installed at the position B in FIG. Then, the jig mounting arm 1 is lowered by the arm up / down movement mechanism, the substrate mounting jig 19 is inserted into the electrodeposition bath 9, and the electrodeposited substrate is immersed in the electrodeposition liquid 10. When the substrate mounting jig 19 is mounted in the electrodeposition tank 9, the electrodeposition liquid stirring propeller 11 is rotated to stir the electrodeposition liquid 10 in a spiral shape, and the electrode on the substrate is
A voltage of a predetermined potential is applied between the electrode and a counter electrode (not shown) provided in the electrodeposition tank to perform electrodeposition. This electrodeposition operation is usually performed for about 2 minutes, and at the time of the electrodeposition, the electrodeposition liquid 10 is constantly stirred in a spiral by an electrodeposition liquid stirring propeller 11.

After the completion of the electrodeposition, the jig mounting arm 1 is raised by the arm up / down movement mechanism, and the substrate mounting jig 19 is taken out of the electrodeposition tank 9. Then, the jig mounting arm 1 is turned 90 degrees clockwise by the turning mechanism and temporarily stopped, and the stopped state is continued for several minutes. That is, since the substrate mounting jig 19 and the electrodeposited substrate 22 immediately after being taken out of the electrodeposition bath 9 are in a wet state with the electrodeposition liquid, it is necessary to dry the liquid, and the time required for this drying ( Usually, it takes about 2 to 3 minutes).

After this drying is performed, the jig mounting arm 1 is turned clockwise by 90 degrees by the turning mechanism, stopped at the position D in FIG. 2, and the substrate is removed at this position.
22 is removed from the substrate mounting jig 19. The removal of the board from the board mounting jig 19 can be easily automated using a robot arm or the like.

By the way, the electrodeposition operation of one stroke is performed as described above, and by repeating this series of operations sequentially,
Electrodeposition can be performed continuously. Further, by controlling each of the above-mentioned steps by a microcomputer or the like, the electrodeposition work can be automated.

When the electrodeposition operation is repeated a plurality of times, the amount of the phosphor adhered to the substrate mounting jig 19 increases, and the phosphor adhering to the substrate mounting jig 19 becomes a lump at the next electrodeposition. The jig is cleaned at a rate of about once every 10 electrodepositions because the jig may be mixed into the liquid. At the time of this cleaning, the jig mounting arm 1 is rotated without mounting the electrodeposited substrate, and the substrate mounting jig 19 is inserted into the ultrasonic cleaning tank 21 arranged at the position C in FIG. The tool 19 is subjected to ultrasonic cleaning. The board mounting jig mounted on each jig mounting arm 1
After the completion of the ultrasonic cleaning in step 19, the operation returns to the above-described electrodeposition work operation.

〔The invention's effect〕

As described above with reference to the illustrated embodiment, in the electrodeposition apparatus according to the present invention, by providing a stirring member for vortexing the electrodeposition liquid in the electrodeposition tank, effective electrodeposition is achieved. Can be worn.

In addition, by providing a cleaning tank for cleaning the substrate mounting jig after the electrodeposition, it is possible to wash out the clumps of the phosphor particles adhered to the substrate mounting jig, and to re-enter the electrodeposition liquid. Mixing is prevented.

Further, the substrate mounting jig is constituted by a cylindrical member having an outer peripheral surface in a polygonal shape, and the substrate for electrodeposition is supported on each surface portion, so that the same number of substrates can be mounted on one substrate mounting jig. A plurality of substrates can be electrodeposited at one time.

Further, the substrate mounting jig is held by the jig mounting arm, is conveyed to the electrodeposition tank or the cleaning tank by the jig mounting arm, and is inserted into the electrodeposition tank or the cleaning tank. The electrodeposition work can be easily automated by automatically controlling the arm support mechanism for performing the vertical movement and the turning operation.

Therefore, according to the present invention, since the electrodeposition operation can be performed continuously and efficiently, a large quantity of electrodeposited substrates with stable quality can be produced, and the electrodeposition operation can be easily automated. Therefore, the production cost can be easily reduced, and the cost of the electrodeposited substrate can be reduced.

[Brief description of the drawings]

FIG. 1 is a side view schematically showing an electrodeposition apparatus according to the present invention, FIG. 2 is a top view of the same apparatus, FIG. 3 is a cross-sectional view showing an example of a substrate mounting jig, and FIG. It is a perspective view which shows an example. 1 ... Jig mounting arm, 2 ... Arm turning holder,
3 ... Coupling, 4 ... Arm swivel bearing, 5 ...
Arm rotating shaft, 6 Nut, 7 Arm rotating motor, 8 Propeller shaft for electrodeposition liquid stirring, 9 Electrodeposition tank, 10 Electrodeposition liquid, 11 Electrodeposition liquid stirring Propellers, 12 ...
… Seal material, 13… Ball screw for vertical drive of arm, 14…
… Slide rail for vertical drive of arm, 15… Bearing for vertical drive of arm, 16… Nut for vertical drive of arm, 17
... pulley for arm vertical drive, 18 ... pulley for electrodeposition liquid stirring, 19 ... substrate mounting jig, 20 ... stand, 21 ... cleaning tank,
22 ... Electrodeposited substrate.

Claims (1)

(57) [Claims] A cylindrical electrodeposition tank which is placed on a gantry and contains an electrodeposition liquid in which phosphor particles are dispersed, and is provided at the center of the electrodeposition tank to agitate the electrodeposition liquid in a vortex shape. A stirring member, and a cylindrical member having a polygonal outer peripheral surface, supporting a substrate for electrodeposition on each surface, and mounting the substrate for being immersed in the electrodeposition liquid by being inserted into the electrodeposition bath. A jig, a washing tank installed on the same gantry as the electrodeposition tank, and a washing tank for washing the substrate mounting jig after the electrodeposition, and a plurality of arms capable of moving up and down and rotating. The jig mounting arm that transports the substrate mounting jig held by the arm to the electrodeposition tank or cleaning tank and inserts the substrate mounting jig into the electrodeposition tank or cleaning tank, and vertically moves the jig mounting arm. And an arm support mechanism for performing a turning operation.