JP2750470B2 - Manufacturing method of alumina multilayer wiring board - Google Patents
Manufacturing method of alumina multilayer wiring boardInfo
- Publication number
- JP2750470B2 JP2750470B2 JP2223810A JP22381090A JP2750470B2 JP 2750470 B2 JP2750470 B2 JP 2750470B2 JP 2223810 A JP2223810 A JP 2223810A JP 22381090 A JP22381090 A JP 22381090A JP 2750470 B2 JP2750470 B2 JP 2750470B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- raw material
- material powder
- wiring board
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、アルミナ多層配線基板の製造方法に関し、
各種電子部品の製造等に利用される。The present invention relates to a method for manufacturing an alumina multilayer wiring board,
Used for manufacturing various electronic components.
アルミナ多層配線基板は、アルミナ原料粉末を用いて
作製されたアルミナグリーンシートを積層し、焼成して
製造される。An alumina multilayer wiring board is manufactured by laminating and firing alumina green sheets produced using alumina raw material powder.
かかるアルミナ原料粉末として通常使用されているも
のの平均粒径は、1〜3μm程度のものである。これに
対して、高精度の多層配線基板を製造する場合には、ア
ルミナグリーンシートの焼結性の向上が必要となり、こ
の目的達成のために平均粒径が1.0μm以下の微粒で活
性の高いものが用いられている。The average particle size of the alumina raw material powder usually used is about 1 to 3 μm. On the other hand, when manufacturing a high-precision multilayer wiring board, it is necessary to improve the sinterability of the alumina green sheet, and in order to achieve this purpose, the average particle size is 1.0 μm or less, and the activity is high. Things are used.
しかし、一般に微量の酸素の存在の下で雰囲気焼成し
製造する多層配線基板においては、このような微粒を用
いれば、グリーンシート中の気孔径が小さくなり過ぎ
て、有機バインダーの脱脂が十分でなくなり、その結
果、却って焼結性を阻害し、目的とする高精度の多層配
線基板を得にくい。However, in general, in a multilayer wiring board manufactured by firing in an atmosphere in the presence of a trace amount of oxygen, if such fine particles are used, the pore diameter in the green sheet becomes too small, and the degreasing of the organic binder becomes insufficient. As a result, on the contrary, the sinterability is hindered, and it is difficult to obtain the intended high-precision multilayer wiring board.
本発明は、上記観点に鑑みてなされたものであり、ア
ルミナ原料粉末を結晶性と粒径の面から選択することに
より、脱脂性及び焼結性の向上を図り、高精度の多層配
線基板を製造する方法を提供することを目的とする。The present invention has been made in view of the above viewpoint, and by selecting alumina raw material powder in terms of crystallinity and particle size, the degreasing and sintering properties are improved, and a high-precision multilayer wiring board is obtained. It is intended to provide a method of manufacturing.
本発明に係わるアルミナ多層配線基板の製造方法は、
アルミナ原料粉末を用いてアルミナグリーンシートを作
製し、該アルミナグリーンシートを積層し、焼成してア
ルミナ多層配線基板を製造する方法において、前記アル
ミナ原料粉末は、加熱後のα−アルミナ(104)面のX
線回折によるピーク半値幅が加熱処理前の半値幅と比べ
て0.0005Å以上減少するアルミナ原料粉末であり、且つ
該アルミナ原料粉末の平均粒径は3μm以上であること
を特徴とする。The method for producing an alumina multilayer wiring board according to the present invention comprises:
In a method for producing an alumina green sheet using an alumina raw material powder, laminating and firing the alumina green sheet, and manufacturing an alumina multilayer wiring board, the alumina raw material powder is obtained by heating the α-alumina (104) face after heating. X
It is characterized in that the raw material powder is an alumina raw material powder whose peak half width by line diffraction is reduced by at least 0.0005 ° as compared with the half width before the heat treatment, and the average particle size of the alumina raw material powder is 3 μm or more.
上記のように、アルミナ原料粉末に対する結晶性の評
価として、X線回折によるピーク半値幅の加熱処理前後
の差をとったのは、次の理由による。即ち、ピーク半値
幅の測定値そのものでは、使用するX線回折装置により
その値は異なるため、一律に結晶性を評価できないのに
対して、前記ピーク半値幅の差であれば、X線回折装置
の違いによらず普遍的に結晶性を表示することができる
からである。尚、かかるX線回折に際して、測定面とし
て(104)面を選択したのは、次の理由による、即ち、
X線源としてCuのKα線を使用することが一般的である
が、このKα線は、Kα1とKα2の僅かに波長の異な
ったX線より成り立っている。そして、X線回折の角度
が大きくなる程波長の違いによる影響が大きく現れ、ピ
ークの形状に歪みが生ずるようになる。従って、ピーク
半値幅を正確に評価する為には、できる限り小さな角度
で、且つ強い回折ピークを示す結晶面を選択することが
必要であり、(104)面はこの要求に合致する面だから
である。As described above, the difference between the peak half width by X-ray diffraction before and after the heat treatment was evaluated for the evaluation of the crystallinity of the alumina raw material powder for the following reason. In other words, the measured value of the peak half width itself differs depending on the X-ray diffractometer used, so that the crystallinity cannot be uniformly evaluated. This is because the crystallinity can be universally displayed irrespective of the difference. The reason why the (104) plane was selected as the measurement plane during such X-ray diffraction was as follows:
Although it is common to use a K [alpha ray of Cu as an X-ray source, the K [alpha line is made up from different X-ray a slightly wavelengths of K [alpha 1 and K [alpha 2. Then, as the angle of X-ray diffraction increases, the influence of the difference in wavelength appears more, and the shape of the peak is distorted. Therefore, in order to accurately evaluate the peak half-value width, it is necessary to select a crystal plane that exhibits a strong diffraction peak at an angle as small as possible, and the (104) plane is a plane that meets this requirement. is there.
前記「半値幅の減少を0.0005Å以上」とするのは、ア
ルミナ原料粉末の焼成前後にこの程度の半値幅の減少が
あれば、十分にアルミナ原料粉末の活性が高く、焼結性
がよいからである。The `` decrease in the half width at least 0.0005Å '' means that if there is such a decrease in the half width before and after firing the alumina raw powder, the activity of the alumina raw powder is sufficiently high and the sinterability is good. It is.
前記「アルミナ原料粉末の平均粒径」を3μm以上と
したのは、この程度の粗さがあれば、アルミナグリーン
シート中の気孔径も大きくなり脱脂性の向上を図ること
が可能となるからである。The reason why the “average particle size of the alumina raw material powder” is set to 3 μm or more is that if the roughness is such a degree, the pore size in the alumina green sheet becomes large and the degreasing property can be improved. is there.
以下実施例により本発明を具体的に説明する。 Hereinafter, the present invention will be described specifically with reference to examples.
本実施例においては、先ずアルミナ原料粉末の結晶性
と粒径が、焼結性に与える影響を調べた。In this example, first, the influence of the crystallinity and particle size of the alumina raw material powder on the sinterability was examined.
先ず、3種類の原料粉末A,B,Cの平均粒径、加熱処理
前後のピーク半値幅及びその差を測定した。First, the average particle size of the three types of raw material powders A, B, and C, the peak half width before and after the heat treatment, and the difference therebetween were measured.
この平均粒径は、LEEDS&NORTHRUP社製マイクロトラ
ック(商品名)を用い、レーザー式粒度分布測定法によ
り測定した。そして、累積数50%の粒径値を平均粒径と
した。これによれば、各原料粉末の平均粒径は、原料粉
末Aでは3.5μ、原料粉末Bでは2.2μm、原料粉末Cで
は3.6μmである。The average particle size was measured by a laser type particle size distribution measurement method using Microtrade (trade name) manufactured by LEEDS & NORTHHRUP. Then, the particle size value at a cumulative number of 50% was defined as the average particle size. According to this, the average particle diameter of each raw material powder is 3.5 μm for raw material powder A, 2.2 μm for raw material powder B, and 3.6 μm for raw material powder C.
一方、前記ピーク半値幅は、以下に例示するようにX
線回折図形における、同図のピーク高さの半分における
ピーク幅として求めた。この場合の測定条件は、以下の
通りである。On the other hand, the peak half width is X
It was determined as the peak width at half the peak height in the figure in the line diffraction pattern. The measurement conditions in this case are as follows.
測定面=(104)面 X線源=CuのKα線 (加速電圧;40kV,電流;100mA) Step/Sampling=0.004deg Background =No reduction Smoothing =有 Scan Spend =0.2deg/分 THRESHOLD WIDTH=0.08deg そして、この場合の測定結果の一例として、加熱処理
前の原料粉末Aに対するものを示せば、第1図のように
なり、これを分析すれば以下の通りとなる。Measurement surface = (104) surface X-ray source = Cu Kα ray (acceleration voltage; 40 kV, current; 100 mA) Step / Sampling = 0.004 deg Background = No reduction Smoothing = Yes Scan Spend = 0.2 deg / min THRESHOLD WIDTH = 0.08 deg FIG. 1 shows an example of the measurement result of the raw material powder A before the heat treatment as an example of the measurement result in this case, and the analysis is as follows.
ピーク位置(θ);35.133゜/2=17.5665゜ TOTAL=1506959、BACK=60157 NET =1446802 半値幅(dθ);0.189゜/2=0.0945゜ この半値幅の単位を、以下の式を用いて、角度から格
子定数に換算すると、0.0133Åとなる。Peak position (θ); 35.133 ゜ /2=17.5665 ゜ TOTAL = 1506959, BACK = 60157 NET = 1446802 Half width (dθ); 0.189 ゜ /2=0.0945 ゜ The unit of this half width is calculated using the following formula. Converted from the angle to the lattice constant, it is 0.0133 °.
d=λ/2sinθ(Å) 但し、上式中θは回折角度、λはX線の波長(1.5405
0Å)を示す。同様にして、加熱処理(1550℃×2時
間)後のA粉末分についても半値幅を求めれば、0.0122
Åであり、この結果焼成に伴う半値幅の減少量は0.0011
Åとなった。d = λ / 2sin θ (Å) where θ is the diffraction angle, λ is the X-ray wavelength (1.5405
0Å). Similarly, the half width of the A powder after the heat treatment (1550 ° C. × 2 hours) is 0.0122
こ の, and as a result, the decrease in the half-width due to firing was 0.0011.
It became Å.
更に、同様にして原料粉末Bについても測定すれば、
半値幅の減少量は0.0008Å(加熱処理前;0.0130Å、加
熱処理後;0.0122Å)であり、また原料粉末Cの場合は
0.0002Å(加熱処理前;0.0124Å、加熱処理後;0.0122
Å)であった。Furthermore, if the raw material powder B is similarly measured,
The decrease in the half width is 0.0008Å (before heat treatment; 0.0130Å, after heat treatment; 0.0122Å).
0.0002Å (Before heat treatment; 0.0124Å, After heat treatment; 0.0122
Å).
次いで、上記原料粉末A92%にSiO2を6%、MgCO3及び
CaCO3をそれぞれMgO、CaO換算で1%ずつ添加した系
で、周知の方法にて厚さ0.6mmのアルミナグリーンシー
トを作製した。更に、このアルミナグリーンシートを6
枚積層し、試験片A(50mm×45mm×3.6mm)を作製し
た。また、原料粉末B及び原料粉末Cについても同様の
方法により、試験片B及び試験片Cをそれぞれ作製し
た。Next, 6% of SiO 2 was added to 92% of the raw material powder A, and MgCO 3 and
In a system in which CaCO 3 was added by 1% in terms of MgO and CaO, respectively, an alumina green sheet having a thickness of 0.6 mm was produced by a known method. Furthermore, this alumina green sheet is
The test pieces A (50 mm × 45 mm × 3.6 mm) were laminated. Test pieces B and C were also prepared for the raw material powders B and C by the same method.
以上の試験片A、試験片B及び試験片Cのそれぞれに
対して、水素雰囲気中にて焼成温度を変化させながら焼
成試験を行った。この結果を第2図に示す。尚、同図
中、Δは、原料粉末A、原料粉末B及び原料粉末Cの各
粉末をそれぞれ加熱処理した場合に、その加熱処理前後
のX線回折によるピーク半値幅の差を示している。A firing test was performed on each of the test pieces A, B and C in a hydrogen atmosphere while changing the firing temperature. The result is shown in FIG. In the figure, Δ indicates the difference in peak half-width by X-ray diffraction before and after the heat treatment of each of the raw material powders A, B and C.
同図によれば、平均粒径が2.2μmと小さく、半値幅
差が0.0008と比較的小さい原料粉末Bを用いた場合は、
1460℃(低温域)で既に焼結密度の上昇がみられ、1490
℃を越えるあたりから、グリーンシート中に残留してい
る有機バインダーのため焼結性が阻害され焼結密度の低
下をまねき、更に高温になるに従いこの傾向は、顕著と
なる。According to the figure, when using the raw material powder B having a small average particle size of 2.2 μm and a relatively small half width difference of 0.0008,
At 1460 ° C (low temperature range), the sintering density already increased,
Around the temperature exceeding ℃, the sinterability is hindered due to the organic binder remaining in the green sheet, leading to a decrease in the sintering density. This tendency becomes more remarkable as the temperature becomes higher.
また、原料粉末Bに比べ、平均粒径は大きいが、半値
幅差が小さい原料粉末Cを用いた場合は、高温では焼結
密度が上昇するが、1500℃程度以下では、焼結密度は特
に低く、温度の上昇と共に急激に焼結が進んでおり、安
定焼成領域が非常に狭い。In addition, when the raw material powder C having a large average particle size but a small half-value width difference is used as compared with the raw material powder B, the sintering density increases at a high temperature. Low, the sintering progresses rapidly with increasing temperature, and the stable firing region is very narrow.
一方、原料粉末Aを用いた場合は、原料粉末Aの平均
粒径は大きく、且つ活性にも優れるので、約1500℃未満
の低温より焼結密度が緩やかに上昇し、高密度領域が広
いので、安定焼成領域が広い。On the other hand, when the raw material powder A is used, since the average particle size of the raw material powder A is large and excellent in activity, the sintering density gradually increases from a low temperature of less than about 1500 ° C., and the high-density region is wide. Wide stable burning area.
以上より、原料粉末Aのように、低結晶性(高活性)
と大きな粒径の原料粉末を選択すれば、脱脂性の向上、
及び焼結性の向上が図られ、品質の安定した焼結体を確
保することができる。From the above, low crystallinity (high activity) as in raw material powder A
If you select a raw material powder with a large particle size,
In addition, sinterability is improved, and a sintered body having stable quality can be obtained.
次に、前記試験片A(本発明品)及び前記試験片B
(比較品)と同様の試験片A′、B′(但し、寸法は、
120×120×3.6(厚さ)mmである。)をそれぞれ10ロッ
トずつ用意し、これらに対してすべて同一条件(1550℃
×1.5時間保持)で焼結を施し、焼結体(約100×100×
3.0(厚さ)mm)を製造した。そして、この焼結体の幅
×長さ寸法の測定を行って、寸法精度の検討を行った。Next, the test piece A (the product of the present invention) and the test piece B
Specimens A 'and B' (the dimensions are
It is 120 × 120 × 3.6 (thickness) mm. ) Are prepared in 10 lots each, and the same conditions (1550 ℃
Sintering for 1.5 hours, and a sintered body (about 100 × 100 ×
3.0 (thickness) mm). Then, the dimensions of the width × length of the sintered body were measured to examine the dimensional accuracy.
試験片B′より作製した焼結体の寸法精度は、標準偏
差の3倍区間に於いて0.7%のばらつきを示したの対し
て、試験片A′より作製した焼結体においては0.2%ま
でに低減した。従って、本発明品においては、従来品に
比して大幅な寸法精度の向上が達成されている。The dimensional accuracy of the sintered body made from the test piece B 'showed a variation of 0.7% in the section three times the standard deviation, whereas the dimensional accuracy of the sintered body made from the test piece A' was up to 0.2%. Reduced to Therefore, in the product of the present invention, a significant improvement in dimensional accuracy is achieved as compared with the conventional product.
尚、本発明においては、上記具体的実施例に示すもの
に限られず、目的、用途に応じて本発明の範囲内で種々
変更した実施例とすることができる。It should be noted that the present invention is not limited to the specific embodiments described above, but may be variously modified within the scope of the present invention in accordance with the purpose and application.
以上のように、アルミナセラミックスを結晶性と粒径
の両面から選択することで、脱脂性と焼結性の向上が図
ることができ、また、安定した焼結性を示すので高い寸
法精度を有する多層配線基板を容易に製造することがで
きる。As described above, by selecting the alumina ceramic from both the crystallinity and the grain size, the degreasing property and the sintering property can be improved, and the sintering property shows high dimensional accuracy because it shows stable sintering property. A multilayer wiring board can be easily manufactured.
第1図は半値幅の算出方法を例示するための加熱処理前
のアルミナ粉末に対するX線回折の結果を示す説明図
を、第2図は実施例に於ける焼成温度と焼結体密度の関
係を示すグラフである。 H;ピーク高さ、W;半値幅FIG. 1 is an explanatory view showing the result of X-ray diffraction of alumina powder before heat treatment for illustrating a method of calculating a half width, and FIG. 2 is a graph showing a relationship between a firing temperature and a sintered body density in Examples. FIG. H; peak height, W; half width
Claims (1)
ンシートを作製し、該アルミナグリーンシートを積層
し、焼成してアルミナ多層配線基板を製造する方法にお
いて、 前記アルミナ原料粉末は、加熱後のα−アルミナ(10
4)面のX線回折によるピーク半値幅が加熱処理前の半
値幅と比べて0.0005Å以上減少するアルミナ原料粉末で
あり、且つ該アルミナ原料粉末の平均粒径は3μm以上
であることを特徴とするアルミナ多層配線基板の製造方
法。1. A method for producing an alumina green sheet using an alumina raw material powder, laminating and firing the alumina green sheet to produce an alumina multilayer wiring board, wherein the alumina raw material powder is heated α- Alumina (10
4) Alumina raw material powder whose peak half-width by X-ray diffraction of the surface is reduced by at least 0.0005 ° as compared with the half-width before heat treatment, and wherein the average particle diameter of the alumina raw powder is 3 μm or more. Of manufacturing an alumina multilayer wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2223810A JP2750470B2 (en) | 1990-08-24 | 1990-08-24 | Manufacturing method of alumina multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2223810A JP2750470B2 (en) | 1990-08-24 | 1990-08-24 | Manufacturing method of alumina multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04106994A JPH04106994A (en) | 1992-04-08 |
| JP2750470B2 true JP2750470B2 (en) | 1998-05-13 |
Family
ID=16804078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2223810A Expired - Fee Related JP2750470B2 (en) | 1990-08-24 | 1990-08-24 | Manufacturing method of alumina multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2750470B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2606785B2 (en) * | 1992-09-30 | 1997-05-07 | 東陶機器株式会社 | Method of manufacturing corona discharger |
-
1990
- 1990-08-24 JP JP2223810A patent/JP2750470B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04106994A (en) | 1992-04-08 |
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