JP2752038B2 - BGA-PGA converter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a BGA (Ball Grid Ar
ray) type electronic components (ICs, etc.)
The present invention relates to a BGA-PGA converter used for detachably connecting to an id Array) type socket.

[0002]

2. Description of the Related Art A plurality of electrode patterns are formed on the lower surface of a BGA type electronic component, and solder (spherical electrodes) H is applied to these electrode patterns in a spherical shape as shown in FIG. Have been. Such BGA type IC
(Electronic component: also shown as IC in the figure) is directly mounted on a substrate P on which a foot pattern F is formed at a position facing the spherical electrode H, as shown in FIG. H is solder-bonded to the foot pattern F, so that it is mounted on the substrate P. By using such a BGA type IC, it is possible to reduce the thickness of the entire substrate P on which it is mounted, that is, to achieve a low profile.

There are electronic components of the PGA type compared to the BGA type, but when this electronic component is mounted on the substrate, a socket (PGA type socket) for removably receiving the electrode pins of the electronic component is mounted on the substrate. Often do. Thus, the electronic component can be made detachable from the substrate.

[0004]

By the way, when a BGA type electronic component is mounted (soldered) on a substrate,
There is a problem that it is difficult to remove the electronic component from the board. For this reason, for example, when testing a board with electronic components attached, if the electronic components are mounted on the board, it is possible to test multiple boards using the same electronic component. become unable. Further, after the electronic component is mounted on the board, the soldered portion (the lower surface of the electronic component) can hardly be seen, so that there is a problem that it is not possible to confirm whether or not the soldering has been performed reliably.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a BGA-PGA conversion device capable of detachably connecting a BGA type electronic component to a substrate. I have.

[0006]

In order to achieve the above object, a BGA-PGA converter according to the present invention comprises a plurality of conductive electrodes connected to the spherical electrodes at positions facing the respective spherical electrodes of the electronic component. A holding member having a through hole and a holding member which is pressed into each through hole and held by the holding member, protrudes from each through hole at a position facing each socket contact of the PGA type socket, and is inserted into and removed from the socket contact. And a plurality of conductive pin contacts to be connected. Further, a plurality of air circulation holes that penetrate the holding member and allow air to flow therethrough are formed in the holding member adjacent to the through holes.

[0007]

[0008]

In such a BGA-PGA converter, the BG
The spherical electrode of the A-type electronic component is soldered to a through hole formed in the holding member. Then, the electronic component is inserted into and removed from the socket contact of the PGA type socket on the board while the pin contact is pressed into the through hole (that is, electrically connected and held). It can be detachably attached to it.

Furthermore, since the holding member has an air flow hole, air (hot air) heated for reflowing the solder for connecting the spherical electrode and the through-hole passes through the air flow hole to the electronic component. And the holding member. For this reason, the solder bonding to the through holes of all the spherical electrodes is performed reliably and efficiently.

[0010]

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a BG according to the present invention.
4 shows an A-PGA conversion device. This conversion device 1
It comprises a holding plate 2 and a pin contact 3. The holding plate 2 is formed in a rectangular plate shape from an insulating material, and has substantially the same size (area) as an electronic component described later. As shown in FIG. 2, the holding plate 2 is formed with a plurality of through holes 21 that are opened on the upper surface and the lower surface and are aligned vertically and horizontally. A ring-shaped foot pattern 22 made of a conductive material is formed around the opening of each through hole 21 on the upper surface and the lower surface of the holding plate 2. A conductive material layer 23 is formed on the inner surface of each through hole 21.
2 is connected to the inner circumference.

At positions adjacent to the through holes 21 in the holding plate 2, air flow holes 26 having an inner diameter slightly larger than the through holes 21 and opening at the upper and lower surfaces of the holding plate 2 are formed. ing.

The pin contact 3 is, as shown in FIG.
A lead portion 31 integrally formed of a conductive material and extending in the vertical direction; a flange portion 32 formed at the upper end of the lead portion 31 and having an outer diameter larger than the lead portion 31; And a press-fit portion 33 having an outer diameter smaller than the flange portion 32 and larger than the lead portion 31. In addition. A stopper 33a whose outer diameter becomes larger toward the lower side is formed at an intermediate portion of the press-fitting portion 33 in the vertical direction.

The press-fit portion 33 of the pin contact 3 formed as described above is connected to the through hole 2 in the holding plate 2.
1 is press-fitted from below. Thereby, the press-fit portion 33 is electrically connected to the upper and lower foot patterns 22 via the conductive material layer 23. The pin contact 3 is positioned at a vertical position where the upper surface of the flange portion 32 contacts the lower foot pattern 22. Since the retaining portion 33a is provided, after the press-fitting portion 33 is press-fitted into the through-hole 21, it does not come off from here.

Next, the conversion device 1 thus assembled
How to use will be described. As shown in FIG. 3, a precoat solder (reflow solder) 27 is applied to the upper surface of each foot pattern 22, and a cover seal 28 is attached to the upper surface of all the precoat solders 27. With the precoat solder 27 protected by the cover seal 28, the converter 1 is transported and supplied to an assembly process (or an assembly maker).

In the assembling step, first, the cover seal 28 is peeled off from the pre-coated solder 27. Then, as shown in FIG. 4A, a BGA type IC (electronic component: also shown as IC in the drawing) is attached. The IC has a plurality of flat electrode patterns (not shown) on the lower surface, and solder H is applied to each electrode pattern in a spherical shape (hereinafter, the electrode pattern and this solder are collectively referred to as a spherical electrode). . The IC is configured such that each spherical electrode H is brought into contact with each foot pattern 22 (specifically, as shown in FIG. 4B, the lower part of the spherical electrode H projects into the through hole 21). Placed on top. As shown in FIG. 5A, a fixing jig 5 is attached to the converter 1 on which the IC is mounted. The fixing jig 5 is formed by appropriately bending an elastic plate material, and presses the IC against the upper surface of the conversion device 1 to fix and hold the IC so that they do not separate.

The conversion device 1 with the IC fixed and held by the fixing jig 5 is mounted on a PGA socket 60 mounted on the substrate P. Here, the PGA socket 60 includes a plate-like holding member 61 and a socket contact 62 aligned and held by the holding member 61. As shown in FIG. 5B, the socket contact 62 extends downward from a cylindrical main body 62a, a flange 62b formed at an upper end of the main body 62a, and a lower end of the main body 62a. And a lead portion 62c. An opening space that opens at the upper end is formed inside the main body 62a, and an elastic holding member 62d that is electrically connected to the main body 62a is disposed in the opening space.

This socket contact 62 is
2a is pressed into the through hole 61a formed in the holding member 61 from above, so that the lead portion 62c is
Is held by the holding member 61 in a state of protruding downward.
On the other hand, a through hole h is formed in the substrate P so as to penetrate in the vertical direction and have a conductive material layer formed on the inner surface. PG
The A socket 60 is mounted on the board P by inserting the lead portion 62c of the socket contact 62 into the through hole h.

Then, as shown in FIG. 5 (B), the conversion device 1 inserts the lead portion 31 of the pin contact 3 into the opening space of the socket contact 62 and makes the elastic holding member 62d contact and hold the PGA. It is mounted on the socket 60. Thus, the IC is fixed by the fixing jig 5.
Are held in the converter 1 and the converter 1 is mounted on the PGA socket 60 and the substrate P, and these are inserted into a heating furnace (not shown).

In the heating furnace, hot air W is blown against the converter 1 as shown in FIG. At this time, the hot air W blown on the lower side of the converter 1 is
It rises through the inside and blows into the narrow space between the lower surface of the IC and the upper surface of the holding plate 2. For this reason, IC
Is sufficiently and efficiently heated and melted, and the spherical electrode H is securely joined to the foot pattern 22. As described above, since the holding plate 2 has a minimum size that is almost the same as the IC, thermal deformation of the holding plate 2 (such as warpage) is larger than when a larger holding plate is used. ) Is unlikely to occur.

Thus, the IC is composed of the converter 1 and the PGA
Electrically connected to the substrate P via the socket 60 for use.
Note that the conversion device 1 is connected to the PGA socket 6 by a known locking device (not shown) provided in the PGA socket 60.
It is held so as not to deviate from 0.

The substrate P to which the IC is connected can undergo a predetermined test. After completion of the test, the IC and the converter 1 can be removed from the board P by releasing the holding by the lock device and removing the lead portion 31 of the pin contact 3 from the socket contact 62. Therefore, another substrate (not shown) can be tested using the same IC.

In the above embodiment, the conversion device 1 is connected to the PGA socket 60 using the lead insertion type contact 62.
Has been described, but the PGA socket to which the converter according to the present invention is mounted is not limited to this. For example, as shown in FIG. 7A, it can be attached to a PGA socket 70 using a surface mount type contact 72. The surface mount type contact 72
As shown in detail in FIG. 7 (B), it has a tail portion 72t extending downward with the same outer diameter as the main body portion 72a and having a lower end pointed in an inverted cone shape. The plurality of surface mount contacts 72 thus formed are also aligned and held by the holding member 71. As shown in FIG. 7B, the PGA socket 70 has a tail portion 72 of a surface mount type contact 72.
The lower end of t is brought into contact with the foot pattern F 'formed on the upper surface of the substrate P', and the two are joined by solder H 'as shown by a dashed line in the figure, thereby mounting on the substrate P' (surface mounting). Is done.

[0023]

As described above, with the use of the converter of the present invention, a BGA type electronic component can be removably mounted on a board on which a PGA type socket is mounted. Therefore, for example, a test of a plurality of substrates can be performed using one BGA type electronic component soldered to the conversion device. Furthermore, the heated air for reflowing the solder can flow through the air flow holes into the gap between the lower surface of the electronic component and the upper surface of the holding member. (Conversion device) can be reliably and efficiently performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conversion device according to the present invention.

FIG. 2 is an explanatory view for assembling the conversion device.

FIG. 3 is a side view of the conversion device.

FIG. 4 is an explanatory view of use of the conversion device and a partially enlarged view (cross-sectional view).

FIG. 5 is an explanatory diagram of use of the conversion device.

FIG. 6 is an explanatory view of use of the conversion device and a partially enlarged view (cross-sectional view).

FIG. 7 is an explanatory view of use of the conversion device and a partially enlarged view.

FIG. 8 is a side view of an electronic component and a partially enlarged view showing a conventional connection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conversion device 2 Holding plate 3 Pin contact 21 Through hole 22 Foot pattern 26 Air circulation hole 60, 70 PGA socket H Spherical electrode (ball solder) P, P 'board

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 33/76 H01R 33/94

Claims (2)

(57) [Claims] A BGA-PGA conversion device for detachably connecting a BGA type electronic component having a plurality of spherical electrodes to a PGA type socket having a plurality of socket contacts into which electrode pins and the like are removably inserted. A holding member having a plurality of conductive through-holes soldered to the spherical electrodes at positions facing the respective spherical electrodes, and being pressed into the respective through-holes and held by the holding member. A plurality of conductive pin contacts that protrude from the through holes at positions facing the respective socket contacts and are inserted and connected to the socket contacts so as to be able to be inserted and removed, and the holding member penetrates the holding member. A BGA-PGA conversion device, wherein a plurality of air flow holes through which air can flow are formed. 2. The BGA-PGA converter according to claim 1, wherein the air flow holes are formed adjacent to the respective through holes.