JP2754151B2 - Heat conduction control member and heat management device - Google Patents
Heat conduction control member and heat management deviceInfo
- Publication number
- JP2754151B2 JP2754151B2 JP2818294A JP2818294A JP2754151B2 JP 2754151 B2 JP2754151 B2 JP 2754151B2 JP 2818294 A JP2818294 A JP 2818294A JP 2818294 A JP2818294 A JP 2818294A JP 2754151 B2 JP2754151 B2 JP 2754151B2
- Authority
- JP
- Japan
- Prior art keywords
- heat conduction
- temperature
- heat
- control member
- predetermined temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 9
- 230000005684 electric field Effects 0.000 claims description 7
- 230000007423 decrease Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Control Of Temperature (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱利用機器に用いられ
る熱伝導制御部材および熱管理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat conduction control member and a heat management device used for heat utilization equipment.
【０００２】[0002]
【従来の技術】従来、熱利用機器において、熱伝導係数
の可変な熱伝導制御部材が使用されたことはなかった。2. Description of the Related Art Conventionally, a heat conduction control member having a variable heat conduction coefficient has not been used in a heat utilization apparatus.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、僅かな制御
電力で熱伝導係数を変えることができ、熱利用機器に用
いて有用な熱伝導制御部材を提供することをその目的と
するものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a heat conduction control member that can change the heat conduction coefficient with a small amount of control power and is useful for heat utilization equipment. is there.
【０００４】また、本発明は、前記熱伝導制御部材を用
いて熱効率の良好な熱管理装置を提供することをその目
的とするものである。Another object of the present invention is to provide a thermal management device having good thermal efficiency using the thermal conduction control member.
【０００５】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに、請求項１記載の発明は、容器に収容された、電界
の大きさにより粘性が変化する電気粘性流体と、該電気
粘性流体に電界を加える電極と、該電極に可変電圧を印
加する電源とから成り、該電気粘性流体に加える電界の
大きさを変えることにより電気粘性流体を通過する熱の
伝導係数が変化するものであることを特徴とし、請求項
２記載の発明は、被熱管理物の外側に前記熱伝導制御部
材が、その外側に加熱装置または冷却装置が夫々配設さ
れ、前記加熱装置または冷却装置は、被熱管理物が所定
温度より下降または上昇したとき作動し、該所定温度よ
り上昇または下降したとき不作動になるように構成さ
れ、前記熱伝導制御部材は、被熱管理物が所定温度より
下降または上昇したとき電極に印加する電圧の大きさが
変わってその熱伝導係数が小から大になり、該所定温度
より上昇または下降したとき電極に印加する電圧の大き
さが変わってその熱伝導係数が大から小に変わるように
構成されたことを特徴とする。In order to achieve the above object, the invention according to claim 1 comprises an electrorheological fluid housed in a container, the viscosity of which changes with the magnitude of an electric field; And an electric source for applying a variable voltage to the electrodes, and by changing the magnitude of the electric field applied to the electrorheological fluid, the conduction coefficient of heat passing through the electrorheological fluid changes. The invention according to claim 2 is characterized in that the heat conduction control member is provided outside the object to be heated, and a heating device or a cooling device is provided outside the member, and the heating device or the cooling device is The heat management object is configured to operate when the heat management object falls or rises below a predetermined temperature, and to become inactive when the heat management object rises or falls below the predetermined temperature. Rose The magnitude of the voltage applied to the electrode changes and the coefficient of thermal conductivity changes from small to large, and when the temperature rises or falls below the predetermined temperature, the magnitude of the voltage applied to the electrode changes and the coefficient of thermal conductivity changes from large to small. It is characterized by being configured to change to small.
【０００６】[0006]
【作用】請求項１記載の発明によれば、容器に収容され
た電気粘性流体に電界を加えると、該流体の粘度が変化
し、熱伝導係数が変化する。したがって、加熱装置また
は冷却装置と被熱管理物との間に本案熱伝導制御部材を
配置してこれに加える電界を変化すると、その変化に応
じて電気粘性流体の熱伝導係数が変化するため、被熱管
理物に伝導する熱が変化し、被熱管理物の温度が制御さ
れる。According to the first aspect of the present invention, when an electric field is applied to the electrorheological fluid contained in the container, the viscosity of the fluid changes, and the heat conduction coefficient changes. Therefore, when the electric conduction control member is arranged between the heating device or the cooling device and the object to be heated and the electric field applied thereto is changed, the heat conduction coefficient of the electrorheological fluid changes according to the change. The heat conducted to the object to be heated changes, and the temperature of the object to be heated is controlled.
【０００７】請求項２記載の発明によれば、被熱管理物
の温度が所定温度から下降したときは、電気粘性流体の
粘度が小になり、熱伝導制御部材の熱伝導係数が大にな
って、作動した加熱装置から被熱管理物への熱の伝導が
容易になり、所定温度から上昇したときは、電気粘性流
体の粘度が大になり、前記熱伝導係数が小になって、被
熱管理物から不作動になった加熱装置への放熱が少なく
なる。また、被熱管理物が、例えば、発熱してその温度
が所定温度より上昇したときは、電気粘性流体の粘度が
小になり、熱伝導制御部材の熱伝導係数が大になって、
被熱管理物から作動した冷却装置への放熱が容易にな
り、所定温度より下降したときは、前記熱伝導係数が小
になり、被熱管理物から不作動になった冷却装置への放
熱が小になる。According to the second aspect of the invention, when the temperature of the object to be heated falls from the predetermined temperature, the viscosity of the electrorheological fluid becomes small, and the heat conduction coefficient of the heat conduction control member becomes large. Therefore, heat transfer from the activated heating device to the object to be heated is facilitated, and when the temperature rises from a predetermined temperature, the viscosity of the electrorheological fluid increases, the coefficient of heat conduction decreases, and the heat transfer coefficient decreases. The heat radiation from the thermal management object to the inactivated heating device is reduced. Also, when the object to be heated is, for example, heated and its temperature rises above a predetermined temperature, the viscosity of the electrorheological fluid becomes small, and the heat conduction coefficient of the heat conduction control member becomes large,
When the temperature falls below a predetermined temperature, the heat conduction coefficient becomes small, and the heat radiation from the heat management object to the cooling device that has become inactive is facilitated. Become small.
【０００８】[0008]
【実施例】以下に本発明の実施例を図面を参照して説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【０００９】図１は本発明に係る熱伝導制御部材を用い
た熱管理装置を示す。同図において、１は被熱管理物と
しての、吸熱反応が行なわれる反応槽、２は熱伝導制御
部材、３は加熱装置を示す。熱伝導制御部材２は、反応
槽１を包囲する容器４に電気粘性流体５を収容すると共
に容器４の対向する両側壁に電極６1、６2を設け、該電
極６1、６2に電源７を接続し、該電源７を、反応槽１の
温度を検出する温度センサ８に接続して構成され、該電
源は、反応槽１の温度が下降して所定温度以下になった
とき出力電圧が小になり、該温度が上昇して所定温度以
上になったとき出力電圧が大になるように構成されてい
る。FIG. 1 shows a heat management apparatus using a heat conduction control member according to the present invention. In the figure, reference numeral 1 denotes a reaction tank in which an endothermic reaction is performed as a heat-controlled object, 2 denotes a heat conduction control member, and 3 denotes a heating device. The heat conduction control member 2 accommodates an electrorheological fluid 5 in a vessel 4 surrounding the reaction tank 1 and provides electrodes 6 1 , 6 2 on opposite side walls of the vessel 4, and supplies power to the electrodes 6 1 , 6 2 . 7 is connected, and the power supply 7 is connected to a temperature sensor 8 for detecting the temperature of the reaction vessel 1. The power supply is configured to output the voltage when the temperature of the reaction vessel 1 falls below a predetermined temperature. Is small, and when the temperature rises to a predetermined temperature or higher, the output voltage becomes large.
【００１０】電気粘性流体５は、絶縁油に電気分極性の
粒子、例えば、高分子芯体に特殊酸化チタン系の表層を
設けた粒子を分散させた分散型または液晶型が用いられ
る。加熱装置３は、例えば、図示しないヒ−タを備え、
前記温度センサ８に接続されて、反応槽１の温度が下降
して所定温度以下になったとき図示しないスイッチがオ
ンになってヒ−タに通電し、該温度が上昇して所定温度
以上になったとき該スイッチがオフになってヒ−タが電
源から切り離されるようになっている。As the electrorheological fluid 5, a dispersion type or a liquid crystal type in which electrically polarizable particles, for example, particles in which a special titanium oxide-based surface layer is provided on a polymer core, is dispersed in an insulating oil is used. The heating device 3 includes, for example, a heater (not shown),
Connected to the temperature sensor 8, when the temperature of the reaction vessel 1 falls below a predetermined temperature, a switch (not shown) is turned on to energize the heater, and the temperature rises to above the predetermined temperature. When this happens, the switch is turned off and the heater is disconnected from the power supply.
【００１１】前記熱伝導制御部材２がなく、その他はす
べて上記構成と同じであるとすると、反応槽１内の温度
は、図３に示すように変化するが、上記実施例の構成に
よれば、反応槽１の温度が下降し所定温度以下になる
と、熱伝導制御部材の両電極６1、６2に印加される電圧
が小になって電気粘性流体５の粘度が低下し、その熱伝
導係数が大になる。一方、加熱装置３は、ヒ−タに通電
されるので、その発生熱は熱伝導係数の大きい電気粘性
流体５を通って反応槽１を加熱する。反応槽１の温度が
上昇して所定温度以上になると、熱伝導制御部材２の両
電極６1、６2に印加される電圧が大きくなって電気粘性
流体５の粘度が高くなりその熱伝導係数が小さくなる。
一方、加熱装置２は、不作動になるので、熱伝導係数の
小さい電気粘性流体５を通して放熱される。かくて、図
２に示すように、反応槽１が所定温度以下になったとき
は反応槽１は加熱装置３により速やかに加熱されて温度
が上昇し、所定温度以上になったときは、熱伝導制御部
材２の熱伝導係数が小さくなったことによる保温効果で
緩やかに温度が低下する。所定温度以下に低下したとき
は、再び加熱装置３が作動し、前と同じ動作を繰り返
す。Assuming that the heat conduction control member 2 is not provided and all other components are the same as the above configuration, the temperature in the reaction tank 1 changes as shown in FIG. 3, but according to the configuration of the above embodiment, When the temperature of the reaction vessel 1 drops below a predetermined temperature, the voltage applied to both electrodes 6 1 and 6 2 of the heat conduction control member decreases, and the viscosity of the electrorheological fluid 5 decreases, and the heat conduction Coefficient becomes large. On the other hand, since the heater 3 is energized to the heater, the generated heat passes through the electrorheological fluid 5 having a large heat conduction coefficient to heat the reaction tank 1. When the temperature of the reaction tank 1 rises and becomes equal to or higher than a predetermined temperature, the voltage applied to both electrodes 6 1 and 6 2 of the heat conduction control member 2 increases, the viscosity of the electrorheological fluid 5 increases, and the heat conduction coefficient thereof increases. Becomes smaller.
On the other hand, since the heating device 2 becomes inoperative, heat is radiated through the electrorheological fluid 5 having a small heat conduction coefficient. Thus, as shown in FIG. 2, when the temperature of the reaction vessel 1 becomes lower than the predetermined temperature, the reaction vessel 1 is quickly heated by the heating device 3 and the temperature rises. The temperature gradually lowers due to the heat retaining effect due to the lower heat conduction coefficient of the conduction control member 2. When the temperature falls below the predetermined temperature, the heating device 3 operates again and repeats the same operation as before.
【００１２】前記実施例では、被熱管理物として、吸熱
が行なわれる反応槽１を用いたが、例えば、発熱反応が
行われる反応槽１でも良く、その場合には、加熱装置３
の代わりに冷却装置を用い、熱伝導制御部材２の電源に
は、反応槽１の温度が上昇して所定温度以上になったと
き出力電圧が小になり、該温度が下降して所定温度以下
になったとき出力電圧が大になるように構成されたもの
を用い、冷却装置には、反応槽１の温度が上昇して所定
温度以上になったとき作動し、該温度が下降して所定温
度以下になったとき不作動になるように構成されたもの
を用いる。その他の構成は前記実施例と同じである。In the above-described embodiment, the reaction tank 1 in which heat is absorbed is used as the object to be heated, but the reaction tank 1 in which an exothermic reaction is performed may be used.
Instead of using a cooling device, the power supply of the heat conduction control member 2 is provided with an output voltage that decreases when the temperature of the reaction tank 1 rises to a predetermined temperature or more, and the temperature decreases and falls below a predetermined temperature. When the temperature of the reaction tank 1 rises to a predetermined temperature or higher, the cooling device is operated, and the cooling device is operated when the temperature falls to a predetermined temperature. Use a device that is configured to be inoperative when the temperature falls below the temperature. Other configurations are the same as those of the above-described embodiment.
【００１３】また、前記実施例では、被熱管理物とし
て、反応槽１を用いたが、それ以外にも適用できること
はもち論である。In the above embodiment, the reaction vessel 1 was used as the object to be heated. However, it is a matter of course that the present invention can be applied to other objects.
【００１４】[0014]
【発明の効果】請求項１記載の発明によれば、わずかな
制御電力により熱伝導係数を変えることができ、熱利用
機器に用いて有用であるという効果がある。また、請求
項２記載の発明によれば、従来のものに比べて熱効率の
良好な温度管理を行うことができるという効果を有す
る。According to the first aspect of the present invention, it is possible to change the heat conduction coefficient with a small amount of control power, and there is an effect that it is useful for heat utilization equipment. Further, according to the second aspect of the present invention, there is an effect that temperature control with better thermal efficiency can be performed as compared with the conventional one.
【図１】 請求項１記載の発明を利用した請求項２記載
の発明の１実施例の概略構成図。FIG. 1 is a schematic configuration diagram of one embodiment of the invention described in claim 2 utilizing the invention described in claim 1;
【図２】 図１の実施例で行われる温度制御の状態を示
す図。FIG. 2 is a diagram showing a state of temperature control performed in the embodiment of FIG.
【図３】 従来装置で行われる温度制御の状態を示す
図。FIG. 3 is a diagram showing a state of temperature control performed by a conventional apparatus.
１ 反応槽 ２ 熱伝導制
御部材 ３ 加熱装置 ４ 容器 ５ 電気粘性流体 ６1,６2 電極 ７ 電源 ８ 温度セン
サDESCRIPTION OF SYMBOLS 1 Reaction tank 2 Heat conduction control member 3 Heating device 4 Container 5 Electrorheological fluid 6 1 , 6 2 Electrode 7 Power supply 8 Temperature sensor
Claims (2)
粘性が変化する電気粘性流体と、該電気粘性流体に電界
を加える電極と、該電極に可変電圧を印加する電源とか
ら成り、該電気粘性流体に加える電界の大きさを変える
ことにより電気粘性流体を通過する熱の伝導係数が変化
するものであることを特徴とする熱伝導制御部材。An electrorheological fluid whose viscosity changes according to the magnitude of an electric field, an electrode for applying an electric field to the electrorheological fluid, and a power supply for applying a variable voltage to the electrode are contained in a container. A heat conduction control member wherein the conduction coefficient of heat passing through the electrorheological fluid changes by changing the magnitude of the electric field applied to the electrorheological fluid.
が、その外側に加熱装置または冷却装置が夫々配設さ
れ、前記加熱装置または冷却装置は、被熱管理物が所定
温度より下降または上昇したとき作動し、該所定温度よ
り上昇または下降したとき不作動になるように構成さ
れ、前記熱伝導制御部材は、被熱管理物が所定温度より
下降または上昇したとき電極に印加する電圧の大きさが
変わってその熱伝導係数が小から大になり、該所定温度
より上昇または下降したとき電極に印加する電圧の大き
さが変わってその熱伝導係数が大から小に変わるように
構成されたことを特徴とする熱管理装置。2. The heat conduction control member is provided outside the object to be heated, and a heating device or a cooling device is provided outside the member. The heating device or the cooling device causes the temperature of the object to be heated to fall below a predetermined temperature. Alternatively, the heat conduction control member is configured to be activated when the temperature rises and become inactive when the temperature rises or falls below the predetermined temperature, and the voltage applied to the electrode when the object to be heated falls or rises below the predetermined temperature. And the heat conduction coefficient changes from small to large, and when the temperature rises or falls below the predetermined temperature, the magnitude of the voltage applied to the electrode changes to change the heat conduction coefficient from large to small. Thermal management device characterized by having been done.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818294A JP2754151B2 (en) | 1994-02-25 | 1994-02-25 | Heat conduction control member and heat management device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818294A JP2754151B2 (en) | 1994-02-25 | 1994-02-25 | Heat conduction control member and heat management device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07234091A JPH07234091A (en) | 1995-09-05 |
| JP2754151B2 true JP2754151B2 (en) | 1998-05-20 |
Family
ID=12241578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2818294A Expired - Fee Related JP2754151B2 (en) | 1994-02-25 | 1994-02-25 | Heat conduction control member and heat management device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2754151B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5987699B2 (en) * | 2013-01-11 | 2016-09-07 | 藤倉化成株式会社 | Electrorheological gel and molded article with variable thermal conductivity |
-
1994
- 1994-02-25 JP JP2818294A patent/JP2754151B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07234091A (en) | 1995-09-05 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |