JP2755151B2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and, more particularly, to a semiconductor substrate chemical processing apparatus having a nozzle.

[0002]

2. Description of the Related Art A conventional semiconductor manufacturing apparatus will be described with reference to the drawings. FIG. 7 is a front view of a conventional semiconductor manufacturing apparatus. FIG. 8 is a side view of a conventional semiconductor manufacturing apparatus. FIG. 9 is a plan view of a conventional semiconductor manufacturing apparatus. FIG. 10 shows a support rod 7 supporting the nozzle 6 and a support rod 7.
FIG. 2 is an enlarged view of a connection portion with a support rod 10 that supports the support rod. The nozzle 6 used here has a large number of small-diameter holes in a straight line on the bottom surface. The nozzle 6 is installed so as to face the semiconductor substrate 1 in the diametric direction, and the chemical solution 9 is discharged by surface tension. By rotating 2, the chemical solution 9 is loaded on the semiconductor substrate 1. In this case, in order to discharge the chemical solution 9 by surface tension, it is necessary to adjust the height of the nozzle 6 to make the gap between the nozzle 6 and the semiconductor substrate 1 about 1 mm, for example. If the distance between the nozzle 6 and the semiconductor substrate 1 becomes too small, the nozzle 6 comes into contact with the semiconductor substrate 1. If foreign matter is attached to the substrate, the foreign matter is removed through the nozzle 6 to another semiconductor substrate. Or the nozzle 6 may damage the semiconductor substrate. Further, if the nozzle 6 and the semiconductor substrate 1 are too far apart, the chemical solution 9 cannot be uniformly filled on the semiconductor substrate 1 or pressure is applied when the chemical solution 9 is dropped, and the size of the exposed pattern varies. Will occur.

Conventionally, as shown in FIGS. 8 to 10, a stopper 15 is attached to a round support rod 10 supported in a cantilever manner on a support 8, and the stopper 15 has a round shape. Support rod 7
Was attached with the screw 14A. A method for adjusting the height of the nozzle 6 will be described with reference to FIG. Screw 14A
And by operating the screw 14B, the support rod 7 supporting the nozzle 6 is pulled up above the semiconductor substrate 1 and has a desired height on a dummy semiconductor substrate having the same thickness as the semiconductor substrate 1. Place an object for height adjustment. Then, the nozzle 6 is lowered to a position where it comes into contact with the object, and in this state, the screw 14A is tightened, and the support rod 7 is attached to the stopper 1.
5, the nozzle 6 is fixed. In this state, the object for height adjustment and the dummy semiconductor substrate
, The height of the nozzle 6 was adjusted.

Alternatively, a nozzle is placed on a dummy semiconductor substrate having the same thickness as the semiconductor substrate, and screws 14A are loosened.
By operating the screw 14B, the support rod 7 supporting the nozzle 6 is pulled up, and it is desired to set while measuring the gap between the nozzle and the semiconductor substrate using a height adjusting jig (a gap gauge or the like). The height of the nozzle 6 was adjusted by moving the nozzle 6 to the height and fixing the nozzle 6 at that height position.

[0005]

In the conventional semiconductor device shown in the drawing, the support rod 10 is supported by the support 8 in a cantilever manner, so that the support rod 10 is not supported by the support 8. The side may be deflected by the weight of the nozzle 6 and the height position of the nozzle 6 may fluctuate. This is due to the fact that the semiconductor substrate becomes large and the weight of the nozzle increases, which further reduces the fluctuation of the height position of the nozzle 6. In extreme cases, the nozzle may come into contact with the semiconductor substrate and damage the semiconductor substrate.

A support rod 7 supporting the nozzle 6
Is fastened and fixed to the stopper 15 of the support rod 10 by two screws 14A, 14A. However, since the cross section of the support rod 10 is round, the stopper 15 rotates around the support rod 10. There is a possibility that the position of the support bar 7 shifts and the height of the nozzle 6 fluctuates, and since the shape of the support bars 7 and 10 is round, it is easy to rotate, and x, y,
There was a possibility that a shift may occur in the z direction.

As described above, in the conventional apparatus shown in the drawings, it is quite difficult to adjust the nozzle to a uniform height with respect to the semiconductor substrate, and a considerable amount of time has been spent to adjust the nozzle. .

A device for adjusting the height between the nozzle and the semiconductor substrate is a coating device.
There is a known example described in Japanese Patent No. 74150. In this known example, in order to adjust the height between the nozzle and the semiconductor substrate, the nozzle is provided with a plurality of adjusting pins that cover the entire surface of the semiconductor substrate and that are capable of variably adjusting the distance between the nozzle and the semiconductor substrate. The plate is fixed. However, with this device,
Since the adjustment pin makes point contact with a part of the semiconductor substrate,
If the semiconductor substrate is partially damaged or foreign matter adheres to the lower end of the adjustment pin that comes into contact with the semiconductor substrate, not only may the height of the nozzle fluctuate, but also the adhesion to the adjustment pin may occur. There is a possibility that the contaminants contaminate the semiconductor substrate, and the contaminants cause defects on elements on the substrate.

An object of the present invention is to provide a semiconductor manufacturing apparatus in which a nozzle is securely fixed at a predetermined height position with respect to a semiconductor substrate.

[0010]

In order to achieve the above object, a semiconductor manufacturing apparatus according to the present invention is a semiconductor manufacturing apparatus having a nozzle and a nozzle support, wherein the nozzle comprises:
It is installed at a position above the semiconductor substrate to be processed, and supplies a chemical solution dropwise onto the semiconductor substrate,
The nozzle support portion has a cross beam whose both ends are supported, supports the nozzle on the cross beam so as to be able to move up and down, and connects the cross beam and the nozzle.
Nozzle height measurement unit provided on the nozzle support rod to support
Thus, the height position of the nozzle with respect to the semiconductor substrate can be adjusted.

In addition, the cross beam penetrates vertically.
A square hole is provided, and the square hole has a sectional shape in front of the square.
The support rod is fitted so as to be able to move up and down .

Further, the semiconductor manufacturing apparatus according to the present invention has
A semiconductor manufacturing apparatus having a nozzle and a nozzle height adjusting unit.
Therefore , the nozzle is directed to the semiconductor substrate to be processed.
And a chemical solution is dropped on the semiconductor substrate.
The nozzle height adjustment unit is provided with the semiconductor substrate.
Measure the height position of the plate, and based on the measurement result,
Changes the position of the semiconductor substrate and moves the nozzle
The gap is adjusted .

[0013]

The nozzle support section supports the nozzle on a horizontal beam supported at both ends so as to be able to move up and down, and can adjust the height position of the nozzle with respect to the semiconductor substrate. The height position of the nozzle is measured by a nozzle height measurement unit, and the nozzle is moved based on the measured value to adjust the height position of the nozzle. Alternatively, the height position of the semiconductor substrate to be processed is measured, and the nozzle or the semiconductor substrate is moved relative to each other based on the measured value,
Adjust the height position of the nozzle.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) In FIGS. 1 and 2, a semiconductor manufacturing apparatus according to the present invention comprises a nozzle 6 and a nozzle support 1
The height of the nozzle 6 can be adjusted by moving the nozzle 6 up and down while measuring the height of the nozzle 6 with respect to the semiconductor substrate 1.

The nozzle 6 is disposed above the semiconductor substrate 1 to be processed, and a chemical solution 9 is provided on the semiconductor substrate 1.
Is supplied dropwise.

The nozzle support section 16 has a cross beam 10a having both ends supported, the nozzle 6 being supported by the cross beam 10a so as to be able to move up and down, and the height position of the nozzle 6 with respect to the semiconductor substrate 1 being adjustable. It is.

An embodiment of a semiconductor manufacturing apparatus according to the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the base 2 is provided rotatably,
The pulse motor 3 is driven to rotate. The outer peripheral side of the base 2 is surrounded by the lower lid 4. In addition, a drain port 5 is opened at a lower portion of the lower lid 4.

The cross beam 10a is suspended between two supports 8, 8 and both ends thereof are supported by the supports 8, 8. The lower ends of the supports 8, 8 are lifters 8a, 8a.
, And can be moved up and down by the elevators 8a, 8a. In addition, the horizontal girder 10a has FIG.
As shown in the figure, a rectangular hole 10b is provided penetrating in the vertical direction, and the rectangular hole 10b has a support rod 7a having a rectangular cross section.
Are supported so as to be able to move up and down, and the support bar 7a is detachably fixed to the cross beam 10a by tightening a screw 14. At the lower ends of the two support rods 7a, a nozzle 6 is mounted above the base 2 in a horizontal posture. The nozzle 6 has a length corresponding to the diameter dimension of the substrate 1, and has a lower end provided with a fine hole for discharging the chemical solution 9. Here, a nozzle support portion 7 that can adjust the height position of the nozzle 6 with respect to the semiconductor substrate 1 is constituted by the support rod 7a, the support 8, the elevator 8a, the screw 14, and the like.

According to the present invention, according to the present invention, the cross beam 10a for suspending and supporting the nozzle 6 is always held in a horizontal position because both ends thereof are supported by the support body 8. Is inclined and the semiconductor substrate 1 is
An accident that the plate surface is damaged can be prevented.
Further, the support bar 7a has a square cross section,
0a, so that it is fitted and supported in the square hole 10b, so that it does not rotate around the vertical axis, and is securely fixed by the screw 14, and the nozzle 6 is securely fixed at a predetermined height position. Becomes possible.

Embodiment 2 Further, as shown in FIG. 4, the apparatus of the present invention has a nozzle height measuring unit 11. The nozzle height measurement unit 11 measures the height position of the nozzle 6 based on the amount of vertical movement of the nozzle 6 with respect to the semiconductor substrate 1. The nozzle height measuring unit 11 of the embodiment shown in FIG. 4 attaches a scale 11a to the support bar 7a and the cross beam 10a, and measures the amount of movement of the support bar 7a (nozzle 6) in the vertical direction by the scale 11a. , The height position of the nozzle 6 is measured. In FIG. 4, the support rod 7a
Is the main scale of the caliper, the horizontal girder 10a is the vernier scale of the caliper,
The support bar 7a is provided with a vernier caliper scale, and the horizontal girder 10a is provided with a vernier caliper scale. By using the same structure as the caliper, the movement amount of the support bar 7a is measured more accurately. Is also good.

When adjusting the height of the nozzle 6, a dummy semiconductor substrate is vacuum-adsorbed on the base 2 instead of the semiconductor substrate 1, and the horizontal beam 10a is lowered by the elevator 8a to lower the lower end surface of the nozzle 6. It is in contact with the dummy semiconductor substrate.

In this state, the support bar 7a is pulled up to separate the nozzle 6 upward from the dummy semiconductor substrate. The upward movement amount of the support rod 7a is indicated by a scale 1
1a, when the support bar 7a is pulled up until the distance between the nozzle 6 and the substrate 1 becomes a predetermined distance, the support bar 7a is fixed to the cross beam 10a by the screw 14. Thereby, the nozzle 6 is adjusted and fixed at a predetermined height position with respect to the substrate.

After adjusting the height of the nozzle 6, the nozzle 6
From the semiconductor substrate 1 on the substrate 2,
Thereafter, the substrate 2 is rotated by the pulse motor 3 to apply a centrifugal force to the substrate 1 to diffuse the chemical solution over the entire surface of the substrate 1.

(Embodiment 3) FIG. 5 is an embodiment showing another embodiment of the nozzle height measuring section 11 of the present invention.

The nozzle height measuring section 11 of this embodiment is provided with a vertically extending rack 11b on one side surface of a support rod 7a, and a pinion 1 meshed with the rack 11b is provided on the cross beam 10a.
1c, a cross beam 10a is provided with a rotation angle scale 11d, and a gear train 11f for rotating a needle 11e supporting the scale 11d is connected to a pinion 11c.

When adjusting the height of the nozzle, the base 2
The dummy semiconductor substrate instead of the semiconductor substrate 1 is vacuum-sucked thereon, and the horizontal beam 10a is lowered by the elevator 8a to bring the lower end of the nozzle 6 into contact with the dummy semiconductor substrate.

In this state, the support bar 7a is pulled up to separate the nozzle 6 upward from the dummy semiconductor substrate. Then, the upward movement amount of the support rod 7a is measured by the rotation angle scale 11d and the needle 11e, and when the support rod 7a is pulled up until the distance between the nozzle 6 and the substrate 1 becomes a predetermined distance. Then, the support bar 7a is fixed to the cross beam 10a by screws 14.

(Embodiment 4) Further, as shown in FIG. 6, the present invention has a nozzle height adjusting section 12. In this embodiment, the base 2 is installed so as to be able to move up and down by the elevator 8b. Further, the nozzle height adjusting unit 12 of the present embodiment
Is a light beam (for example, He-Ne (632.8)) obliquely from above (for example, a 15 ° angle) with respect to the semiconductor substrate 1 on the base 2.
nm)), and a detector 13b that receives a light beam reflected on the substrate 1, measures the height of the substrate 1, and outputs a signal for monitoring the height position of the substrate. I have.

In this embodiment, the gap between the nozzle 6 and the substrate 1 is adjusted to a desired distance by moving the nozzle 6 or the base 2 with reference to the height position of the substrate 1 measured by the detector 13b. Adjust the height of the nozzle 6. Further, in this embodiment, when the semiconductor substrate 1 is fixed on the base 2, the height position of the substrate is measured, and the height of the nozzle can be monitored for each semiconductor substrate. Further, an alarm may be generated based on the monitoring signal from the detector 13b to notify an abnormal state of the nozzle height to the outside. Also,
The monitor signal from the detector 13b is subjected to arithmetic processing by a computer, and based on the arithmetic processing signal, the nozzle 6 or the base 2 is moved by the elevator 8a or 8b by the instruction of the controller to adjust the gap between the nozzle 6 and the substrate 1. You may do so.

[0031]

As described above, according to the present invention, since the nozzle is supported on the cross beam supported at both ends so as to be able to move up and down, the cross beam is directed toward one end by the weight of the nozzle. It is possible to prevent the nozzle from being erroneously hit on the semiconductor substrate and being damaged without tilting.

Further, the apparatus has a nozzle height measuring section, which can measure the height of the nozzle, so that the height of the nozzle can be adjusted without separately using a jig for measuring the gap gauge as in the related art. it can.

Further, the provision of the nozzle height adjusting section makes it possible to measure the reference height position of the semiconductor substrate, eliminating the need for a dummy semiconductor substrate for nozzle height adjustment, and further reducing the number of measurement components. it can. further,
Each time a new semiconductor substrate is placed at a position below the nozzle, a signal indicating the height position of the substrate is output,
The height position of the nozzle can be set to an appropriate value for each substrate. This has an effect that the present invention can perform a uniform chemical treatment on all substrates, as compared with the case where the height position of the nozzle is adjusted every 50 sheets as in the related art.

[Brief description of the drawings]

FIG. 1 is a partially sectional front view showing a first embodiment of the present invention.

FIG. 2 is a partially sectional side view showing the first embodiment of the present invention.

FIG. 3 is a plan view showing the first embodiment of the present invention.

FIG. 4 is an enlarged view illustrating a nozzle height measurement unit according to a second embodiment of the present invention.

FIG. 5 is an enlarged view illustrating a nozzle height measurement unit according to a third embodiment of the present invention.

FIG. 6 is an enlarged view illustrating a nozzle adjustment unit according to a fourth embodiment of the present invention.

FIG. 7 is a partially sectional front view showing a conventional example.

FIG. 8 is a partially sectional side view showing a conventional example.

FIG. 9 is a plan view showing a conventional example.

FIG. 10 is an enlarged view showing a connection portion between support rods in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor substrate 2 Base 3 Pulse motor 4 Lower lid 5 Drainage port 6 Nozzle 7 Nozzle support part 7a Support rod 8 Support body 9 Chemical solution 10a Cross beam 11 Nozzle height measurement part 12 Nozzle height adjustment part 13a Light source 13b Detector 14 screw

Claims (3)

(57) [Claims] 1. A semiconductor manufacturing apparatus having a nozzle and a nozzle support, wherein the nozzle is provided at a position above a semiconductor substrate to be processed, and supplies a chemical solution dropwise onto the semiconductor substrate. The nozzle support portion has a cross beam whose both ends are supported, supports the nozzle on the cross beam so as to be able to move up and down, and connects the cross beam and the nozzle.
Nozzle height measurement unit provided on the nozzle support rod to support
A semiconductor manufacturing apparatus, characterized in that is obtained by adjustable the height position of the nozzle relative to the semiconductor substrate by. 2. The cross beam has a rectangular shape penetrating vertically.
A hole having a rectangular cross section.
2. The semiconductor manufacturing apparatus according to claim 1, wherein the holding rod is fitted so as to be able to move up and down. 3. A nozzle having a nozzle and a nozzle height adjusting unit.
In a semiconductor manufacturing apparatus, a nozzle is oriented upward with respect to a semiconductor substrate to be processed.
It is installed in a device, and a chemical solution is supplied dropwise onto the semiconductor substrate.
The nozzle height adjustment unit measures the height position of the semiconductor substrate.
The position of the nozzle or semiconductor substrate is
To adjust the gap between the nozzle and the semiconductor substrate by changing
The semiconductor manufacturing apparatus characterized in that it.