JP2755814B2 - How to join ceramic members - Google Patents
How to join ceramic membersInfo
- Publication number
- JP2755814B2 JP2755814B2 JP29709490A JP29709490A JP2755814B2 JP 2755814 B2 JP2755814 B2 JP 2755814B2 JP 29709490 A JP29709490 A JP 29709490A JP 29709490 A JP29709490 A JP 29709490A JP 2755814 B2 JP2755814 B2 JP 2755814B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic members
- joining
- bonding
- foil
- processed product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Ceramic Products (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、セラミック部材の接合方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for joining ceramic members.
従来のセラミック部材の接合方法について、第3図に
示すように左右に配設された円柱状のセラミック材の加
工品13の相互の端面を接合して一体とする例により説明
する。A conventional method of joining ceramic members will be described with reference to an example in which the mutually end surfaces of columnar ceramic workpieces 13 arranged on the left and right are joined together as shown in FIG.
第3図において、接合面には薄い金属箔を接合箔2と
して挟み、加工品13は加圧装置10(第3図においては、
最も簡単な例を示すため万力を用いた場合を示す)によ
り左右から固く締めつけ、端面同志を強く圧着させる。In FIG. 3, a thin metal foil is sandwiched as a bonding foil 2 on the bonding surface, and a processed product 13 is a pressing device 10 (in FIG. 3,
(The case of using a vise is shown to show the simplest example).
上記接合箔2の相対する端部には、直流電源、コンデ
ンサ及びスイッチが直列接続された直流電源回路1を接
続し、接合施工時はスイッチを閉として接合箔2に瞬間
的に大電流を流す。これにより接合箔2はその電気抵抗
により発熱し高温化して溶融し、このあとスイッチを開
とすることにより冷却固化するが、この間にセラミック
材の加工品13の間に接合組織を形成していた。A DC power supply circuit 1 in which a DC power supply, a capacitor, and a switch are connected in series is connected to the opposite ends of the bonding foil 2, and the switch is closed during the joining process to instantaneously flow a large current through the bonding foil 2. . As a result, the bonding foil 2 generates heat due to its electrical resistance, rises to a high temperature and melts, and then is cooled and solidified by opening the switch. During this time, a bonding structure was formed between the ceramic material processed products 13. .
従来の接合方法においては、他の接合方法、たとえば
熱間静水圧成形方法や電気炉を用いる方法にくらべ、比
較的簡易で実用的であるが、次の課題があった。The conventional joining method is relatively simple and practical as compared with other joining methods such as a hot isostatic pressing method and a method using an electric furnace, but has the following problems.
(1) 予め加工品を左右より固く締めつける必要があ
るが、このため接合箔の溶融時(または再凝固時)に局
部的に熱膨張による熱応力が発生し部分的に変形ないし
ミクロ破壊に至り、接合面全体としては接合強度が劣化
することがある。(1) It is necessary to tighten the processed product more tightly from the left and right in advance. However, when the bonding foil is melted (or re-solidified), thermal stress is locally generated due to thermal expansion, which leads to partial deformation or micro-destruction. However, the bonding strength of the entire bonding surface may be degraded.
(2) 加工品が薄肉、または形状的に弱い場合にはこ
れを強く締めつけることにより破損することもある。ま
た、第4図に示すように長尺の薄肉平板などの加工品23
で、接合面が大きく加圧点aが複雑となる場合には各点
のバランスが悪いため破壊することもある。(2) If the processed product is thin or weak in shape, it may be damaged by strongly tightening it. Further, as shown in FIG. 4, a processed product 23 such as a long thin flat plate is used.
In the case where the joint surface is large and the pressing point a is complicated, the points may be unbalanced and may be broken.
本発明は、上記の課題を解決し、セラミック部材の良
好な接合が可能な方法を提供しようとするものである。An object of the present invention is to solve the above-mentioned problems and to provide a method capable of favorably joining ceramic members.
本発明のセラミック部材の接合方法は、互いに接合さ
れる複数のセラミック部材の接合面に金属箔を設けて固
定し、それを無重量状態とし、上記金属箔に直流大電流
を流すことにより接合を行うことを特徴としている。In the method for joining ceramic members of the present invention, a metal foil is provided and fixed on a joint surface of a plurality of ceramic members joined to each other, the weight is reduced, and a large direct current is applied to the metal foil to join the ceramic members. It is characterized by performing.
上記において、互いに接合面で接合される複数のセラ
ミック部材は、それぞれの接合面が密着するように所定
の加圧力により加圧され、固定される。上記セラミック
部材は上記の状態で無重量状態とされ、金属箔に直流大
電流が流され、金属箔は溶融する。In the above, the plurality of ceramic members joined to each other at the joint surface are pressed and fixed by a predetermined pressing force so that the respective joint surfaces are in close contact with each other. The ceramic member is put in a weightless state in the above state, a large direct current is applied to the metal foil, and the metal foil is melted.
上記溶融した金属箔は、無重量の状態においては毛細
常数が地上に比べ102〜104となり、狭い間隙内の固体面
に沿って濡れ拡がる距離が通常の地上におけるものの10
2〜104倍となるため、接合面の狭い間隙内を充分に拡が
り、セラミック部材固定のための加圧力は従来の方法に
比べて小さな加圧力により良好な接合が得られる。The molten metal foil has a capillary constant of 10 2 to 10 4 compared to the ground in a weightless state, and the distance of spreading along a solid surface in a narrow gap is 10 times that of a normal ground.
Since it is 2 to 10 4 times, the inside of the narrow gap of the joining surface is sufficiently widened, and a good joining can be obtained with a small pressing force for fixing the ceramic member as compared with the conventional method.
上記により、強固な締付を行わずにセラミック部材の
接合が可能となるため、局部的熱応力の発生が回避で
き、薄肉ないし大接合面のセラミック部材についても接
合が可能となる。As described above, since the joining of the ceramic members can be performed without performing the strong tightening, the occurrence of local thermal stress can be avoided, and the joining of the ceramic members having a thin or large joining surface is possible.
本発明の一実施例を第1図を用いて説明する。 One embodiment of the present invention will be described with reference to FIG.
第1図に示す本実施例は、薄肉円筒を半割れとした加
工品3の接合に適用したものである。This embodiment shown in FIG. 1 is applied to the joining of a processed product 3 in which a thin-walled cylinder is half-split.
第1図において、加工品3は相互に接合箔2を挟ん
で、台7の上にシュー4にて固定される。次に、送り機
構6に設けられた送り軸5をネジ駆動により左右に移動
させ、圧電素子8を介してシュー4を所定の力で加工品
3に押しつける。In FIG. 1, a processed product 3 is fixed on a stand 7 with a shoe 4 with the bonding foil 2 interposed therebetween. Next, the feed shaft 5 provided in the feed mechanism 6 is moved left and right by screw driving, and the shoe 4 is pressed against the workpiece 3 with a predetermined force via the piezoelectric element 8.
更に、加工品3に挟まれた接合箔2の相対する端部に
直流電源、コンデンサ及びスイッチが直列接続された電
源回路1を接続する。上記組立が完了した後、これを緩
衝装置内に収納し、約30m以上の落下塔による無重量発
生設備を利用して落下させながら、遠隔操縦により電源
スイッチを閉として加工品3の接合部を接合させる。Further, a power supply circuit 1 in which a DC power supply, a capacitor, and a switch are connected in series is connected to opposite ends of the joining foil 2 sandwiched between the processed products 3. After the above assembly is completed, this is stored in a shock absorber and dropped using a weightless facility with a drop tower of about 30 m or more, and the power switch is closed by remote control to close the joint of the workpiece 3. Join.
上記において、接合箔2を間に挟んだ加工品3はシュ
ー4の間に固定され、送り機構6により所定の力で押し
付けられる。この場合、圧電素子8により加圧力を計測
しながら締め付けを行い、加圧力が加工品の面粗さ、箔
の厚さ等の数値から設計された所定の値とする。この値
は一般に従来方法による場合の1〜2桁オーダの小さい
ものである。In the above, the processed product 3 sandwiching the bonding foil 2 is fixed between the shoes 4 and pressed by the feed mechanism 6 with a predetermined force. In this case, tightening is performed while measuring the pressing force by the piezoelectric element 8, and the pressing force is set to a predetermined value designed from numerical values such as the surface roughness of the processed product and the thickness of the foil. This value is generally as small as one to two orders of magnitude in the conventional method.
上記の組立作業により送り機構6等と一体化された加
工品3は落下塔により落下させ、無重量状態が形成され
た状態で接合箔2に通電し、加工品3の接合を行う。The processed product 3 integrated with the feed mechanism 6 and the like by the above assembling operation is dropped by the drop tower, and a current is applied to the bonding foil 2 in a state where the weightless state is formed, and the processed product 3 is bonded.
上記落下塔により得られる無重量状態は大略地上の重
力加速度の10-2〜10-4のレベルであり、このとき毛細常
数は地上にくらべ102〜104倍となる。これは接合面のよ
うな狭い間隙内で液が固体面に沿って濡れ拡がる距離が
102〜104倍となることである。The weightless state obtained by the drop tower is approximately at the level of the gravitational acceleration on the ground of 10 −2 to 10 −4 , and at this time, the capillary constant is 10 2 to 10 4 times that of the ground. This is because the distance over which the liquid spreads and spreads along the solid surface in a narrow gap such as the joint surface
10 2 to 10 4 times.
第2図は接合面をミクロに示すもので、固体(加工
品)3の面は数μm程度の凹凸があり、2つの面の間に
固体の接合箔2が挟んであるが、これが溶融したときに
は、ギャップdの中に液が濡れ拡がって充分にいきわた
れば接合性がよいことになる。無重量状態では上述のよ
うに毛細常数が桁ちがいに良くなり、この接合性が向上
する効果がある。FIG. 2 is a microscopic view of the bonding surface. The surface of the solid (processed product) 3 has irregularities of about several μm, and the solid bonding foil 2 is sandwiched between the two surfaces. In some cases, if the liquid gets wet and spreads in the gap d and spreads sufficiently, the bondability is good. In a weightless state, as described above, the capillary constant is significantly improved, and this has the effect of improving the bondability.
上記により、強固な締付けを行わずにセラミック材の
加工品の接合が可能となるため、局部的熱応力の発生が
回避でき、薄肉ないし大接合面の加工品についても接合
が可能となった。As described above, it is possible to join a processed product made of a ceramic material without performing a strong tightening, so that generation of local thermal stress can be avoided, and it becomes possible to join a processed product having a thin or large joint surface.
なお、上記無重量状態は航空機により形成することも
可能であり、この場合は、航空機内に第1図に示す装置
を設置し、航空機の放物線飛行により約20〜30秒間の無
重量環境をつくり、この間に接合を行うものである。操
作は手動あるいはタイマー作動とする。前者の場合には
着地時の10G程度の制動加速度、後者の場合には通常3
G、事故時を想定して10G程度の加速度に耐える状態とす
る必要があり、緩衝装置を設ける必要がある。The above weightless state can be formed by an aircraft. In this case, the device shown in Fig. 1 is installed in the aircraft, and a weightless environment for about 20 to 30 seconds is created by parabolic flight of the aircraft. The bonding is performed during this time. The operation is manual or timer operation. In the case of the former, braking acceleration of about 10G at landing, in the case of the latter, usually 3
G, assuming an accident, it is necessary to endure an acceleration of about 10G, and it is necessary to provide a shock absorber.
本発明のセラミック部材の接合方法は、互いの接合面
に金属箔を挟んで固定された複数のセラミック部材を、
無重量状態として上記金属箔に直流大電流を流して接合
することによって、強固な締付けを行わずにセラミック
部材の接合が可能となるため、局部的熱応力の発生が回
避でき、薄肉ないし大接合面を有するセラミック部材に
ついても接合が可能となった。The method for joining ceramic members of the present invention includes a plurality of ceramic members fixed to each other with a metal foil interposed therebetween,
By joining the metal foil by applying a large direct current to the metal foil in a weightless state, it becomes possible to join the ceramic members without performing a strong tightening, so that the occurrence of local thermal stress can be avoided, and the thin or large joining can be achieved. It has become possible to join ceramic members having surfaces.
第1図は本発明の一実施例の説明図、第2図は上記一実
施例に係る接合部分の拡大された断面図、第3図は従来
の方法の説明図、第4図は上記従来の方法に係る長尺の
薄肉平板の接合の説明図である。 1……電源回路、2……接合箔、3……加工品、 4……シュー、5……送り軸、6……送り機構、 7……台、8……圧電素子。FIG. 1 is an explanatory view of one embodiment of the present invention, FIG. 2 is an enlarged sectional view of a joint portion according to the one embodiment, FIG. 3 is an explanatory view of a conventional method, and FIG. It is explanatory drawing of joining of the long thin flat plate which concerns on the method of. DESCRIPTION OF SYMBOLS 1 ... Power circuit, 2 ... Bonding foil, 3 ... Workpiece, 4 ... Shoe, 5 ... Feed shaft, 6 ... Feed mechanism, 7 ... Stand, 8 ... Piezoelectric element.
Claims (1)
接合面に金属箔を設けて固定し、それを無重量状態と
し、上記金属箔に直流大電流を流すことにより接合を行
うことを特徴とするセラミック部材の接合方法。The present invention is characterized in that a metal foil is provided and fixed on a bonding surface of a plurality of ceramic members to be bonded to each other, the weight is reduced, and bonding is performed by applying a large direct current to the metal foil. Method of joining ceramic members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29709490A JP2755814B2 (en) | 1990-11-05 | 1990-11-05 | How to join ceramic members |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29709490A JP2755814B2 (en) | 1990-11-05 | 1990-11-05 | How to join ceramic members |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04175272A JPH04175272A (en) | 1992-06-23 |
| JP2755814B2 true JP2755814B2 (en) | 1998-05-25 |
Family
ID=17842128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29709490A Expired - Lifetime JP2755814B2 (en) | 1990-11-05 | 1990-11-05 | How to join ceramic members |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2755814B2 (en) |
-
1990
- 1990-11-05 JP JP29709490A patent/JP2755814B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04175272A (en) | 1992-06-23 |
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