JP2758723B2 - How to flash electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flash method capable of reliably removing burrs between electronic components such as LSI products and composite components.

[0002]

2. Description of the Related Art An LSI product 10 having a large number of lead pins 11 as shown in FIG.
The burrs 12 may remain between one (hereinafter, between the feet). If the burrs 12 remain, inconveniences such as short-circuiting between the pins 11 through the burrs 12 or inability to securely insert the pins 11 into the terminals when mounting the LSI product 10 on a substrate or the like may occur, resulting in poor contact. . Therefore, the foot burrs 12 must be removed, and there is a flash method using a flash punch 20 shown in FIG.

In this method, a punch having a comb-like tip is formed by an LSI.
By inserting it between the feet on both sides of the product, the burrs remaining between the feet are removed at once. Specifically, the LSI product 10 having a large number of pins 11 as shown in FIG. 2 is arranged on the die 30 with the pins 11 locked as shown in FIG. Punch 20 provided with a number of legs 21 having a width that can be inserted between them
Is lowered from above the LSI product 10 and the legs 21 are inserted between the legs to remove burrs 40 remaining between the legs (see FIG. 3).

[0004]

However, when the legs 21 of the punch 20 are inserted between the feet, the burrs 41 are usually completely separated from the LSI product 10 as shown in FIG.
0, but some burrs 42 are separated from between the legs. However, since the burrs are broken and cut off, the burrs 42 hang down to the LSI product 10 side and adhere to the package wall surface of the LSI product 10. , Still remain in the LSI product 10. For this reason, it is essential to carry out a sorting operation for inspecting the presence or absence of foot burrs on the LSI product, which complicates the LSI manufacturing operation.

[0005] Accordingly, an object of the present invention is to reduce burrs between feet by LS.
An object of the present invention is to completely separate from an electronic component such as a product I, thereby eliminating the need for a sorting operation.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a flash method for removing burrs between feet (lead pins) of an electronic component by using a flash punch. A shield having a sharp portion along the inner surface of the punch leg and a space for accommodating the electronic component is disposed below the electronic component so as to face the punch, and a lead pin of the electronic component is locked on the die. The shield is inserted between the dies until the sharp portion of the shield abuts lightly on the base of the lead pin or reaches near the base of the lead pin. The electronic component flash, characterized in that the punch is lowered and the punch leg is inserted between the feet without bringing the electronic component body into contact with the punch and the shield. It is achieved by law.

In the method of the present invention, a flash is used together with a shield, which is conventionally used as shown in FIGS. 3 and 4, so that the burrs can be removed from the electronic parts (LSI) even after the inter-foot burrs are removed by the punch. Product) does not adhere to the package wall,
It falls from the gap between the die and the shield, and the burr between feet can be reliably removed.

Thus, the shield used in the present invention has a width that can be inserted between the legs of the flash punch, as shown in FIG. 1, for example. There is no particular limitation as long as it has a sharp portion along the inner surface of the punch leg when placed directly below the electronic component during the deburring operation so that it does not adhere. or,
When removing the burr between the feet, lock the lead pins of the electronic components on the die, and insert the shield between the dies until the sharp edge of the shield touches the base of the lead pin lightly or reaches near the base of the lead pin. In addition, it is important that the electronic component body (molded portion) is accommodated in the space between the punch and the shield, and that the electronic component body does not contact the punch and the shield, that is, that the electronic component body is not clamped by the punch and the shield. . As a result, compared to the case where the mold part of the electronic component is clamped from above and below with, for example, a mold, it is possible to prevent the occurrence of chipping in the mold part around the clamp (near the base of the lead pin) when removing the foot burr.

However, the tip of the punch is comb-shaped because it has a large number of legs, but the sharp portion does not necessarily have to be comb-shaped. Rather, the tip of the sharp portion has a continuous ridge line. Is easy to remove, and also functions as a support when the punch is inserted between the feet.

[0010] The material of the shield is not specified,
It is sufficient that the inter-foot burr removed by the punch does not adhere to the shield itself due to static electricity or the like, and falls in the gap between the die and the shield without resistance. Examples of such a material include iron and the like.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The flash method of the present invention will be described below in detail based on embodiments. FIG. 1 shows an example. First, an LSI product 10 having many lead pins 11
The pin 11 is horizontally arranged on the die 30 so as to be locked on the die 30. Above the LSI product 10, a punch 20 with a comb-like tip provided with a number of legs 21 having a width that can be inserted between the pins 11 is arranged. The space 20 between the legs 21 on both sides is the punch 20 in the LSI product 1
This is for preventing contact with zero.

In FIG. 1, a shield 1 used in this embodiment is shown.
Has a width capable of being inserted between the legs 21 on both sides of the punch 20, and is provided with a sharpened portion 2 along the inner surface of the legs 21 on each side. As can be seen from FIG. 1, the pointed portion 2 has a vertical surface on the opposite side (outer side) of the die 30 and an inclined surface on the inner side, and has a tapered shape as a whole, and has a tip formed by the vertical surface and the inclined surface. Make a continuous ridge. The space 3 between the sharp portions 2 on both sides is for accommodating the LSI product 10 like the space 22 between the punch legs 21.

The shield 1 is placed on the opposite side of the punch 20 (L
SI), the sharp portions 2 on both sides of the shield 1 are L
The shield 1 is inserted between the dies 30 until the pins 11 of the SI product 10 lightly contact the base of the pins 11 or reach the vicinity thereof, and are accurately positioned.

In this state, the punch 20 is lowered and each leg 21
Is inserted between the pins 11 to remove the burrs 45 remaining between the feet. The burrs 45 separated from the legs do not adhere to the package wall surface of the LSI product 10 again because the sharp portions 2 are located at or near the roots of the pins 11.
0 falls in the gap between the shield 1.

Further, the pin 11 is locked on the die 30, and the shield 1 is inserted between the dies 30 until the sharp portion 2 abuts slightly on the base of the pin 11 or reaches near the base of the pin 11. Punch 20 and spaces 22, 3 of shield 1
While the LSI product 10 (mold portion) is accommodated in the device, the punch 20 is lowered in a state where the LSI product 10 does not come into contact with the punch 20 and the shield 1, so that when removing the inter-foot burr 45, as shown in FIG. The LSI product 10, that is, the molded part, is not clamped from above and below by the punch 20 and the shield 1. For this reason, compared to the case where the LSI product 10 is clamped from above and below, for example, by using a mold, the molded portion near the root of the pin 11 (periphery of the clamp) is not chipped when the inter-foot burr 45 is removed.

As described above, by disposing the shield below the LSI product when using the flash punch, it is possible to surely prevent the intervening burrs removed by the punch from adhering to the LSI product. The shield shown in FIG. 1 is merely an example of a book, and it goes without saying that various changes can be made as long as the object of the present invention is achieved.

[0017]

According to the present invention, there is provided a method for flashing an electronic component.
With the configuration described above, foot burrs of an electronic component such as an LSI product can be reliably removed from the electronic component. There is no need for any sort of work to see what happens.
Also, when removing the burr between the feet, the electronic component main body (mold part) is accommodated in the space between the punch and the shield, and the electronic component main body is not brought into contact with the punch and the shield. Is not clamped, so compared to the case where the electronic component body is clamped from above and
Chipping does not occur in the mold part near the root of the lead pin (periphery of the clamp).

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a flash method using a shield to perform the method of the present invention.

FIG. 2 is a plan view showing a normal LSI product.

FIG. 3 is a cross-sectional view showing a conventional flash method.

FIG. 4 is an enlarged view of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Shield 2 Sharp part 10 LSI product (electronic component) 11 Lead pin 12 Burr between feet 20 Flash punch 30 Die

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/56

Claims (1)

(57) [Claims] In a flash method for removing burrs between feet (lead pins) of an electronic component using a flash punch, a flash punch having a space for accommodating the electronic component is arranged above the electronic component, and a punch leg of the punch is formed. disposing a shielding body having a space for accommodating the sharpened tip and the electronic component along the inner surface below the electronic component so as to face the punch, tip portion of the lead pin to and shield is engaged on the die of the electronic component insert the shield between the dies until light reaches the base near the abutment either or lead pins at the base of the lead pin, while accommodating the electronic component body (molded part) into the space of the punch and shield, electrons punch and shield A method for flashing an electronic component, comprising lowering a punch and inserting a leg of the punch between legs without contacting the component body.