JP2759637B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting a multi-terminal IC package to connect the package to an external circuit.

[0002]

2. Description of the Related Art FIG. 8 shows an example of a conventional IC socket.
A large number of thin partition walls 13 are formed around the accommodation space 1 and contact pins 2 corresponding to the IC lead terminals 12 are formed in holes formed in the bottom of the slits in slits formed between the partition walls. It is fixed by press fitting.

However, at present, the IC package 11 tends to be highly integrated and multi-terminal, and the lead terminals and terminal intervals are becoming narrower. In order to cope with this, the partition wall 13 is made thinner and higher in density. In addition, holes must be provided at the bottom of the slit for press-fitting and fixing the contact pins. When an IC socket is made of synthetic resin, a mold is required due to the fluidity of the synthetic resin during molding. In some cases, the portion corresponding to the periphery of the partition wall 13 or the hole for fixing the contact pin cannot be completely filled with the synthetic resin.

[0004] Therefore, the mounting portion of the contact pin 2,
Also, a method has been considered in which the partition wall 13 is formed separately from the socket body 4 and then attached to the socket body 4. The following is a conventional IC based on the above concept.
It is an example of a socket.

FIG. 9 is a sectional view of an IC socket formed of a socket body 4 and a base portion 14 which are divided into two parts.
Is press-fitted and fixed in a hole provided in the base portion 14, and the partition wall 1
Numeral 3 is formed integrally with the socket body 4 separately from the hole for fixing the contact pin 2. But,
In this method, since the socket body 4 and all of the partition walls 13 are integrally formed, if an attempt is made to make a multi-terminal IC socket by injection molding, the partition walls 13 are very thin and the number is large. In some cases, the wall 13 could not be completely filled with the synthetic resin.

FIGS. 10 and 11 show that only the partition walls 13 are separately formed one by one, and the contact pins 2 are attached. Then, as shown in FIG.
5 shows an example in which the members are fixed to each other and finally attached to a socket body (not shown).

However, in this method, since a plurality of the partition walls 13 are overlapped, a dimensional error in the manufacture of the partition walls 13 is accumulated, and the position of the contact pin 2 with respect to the socket body 4 is largely shifted. was there. In addition, the partition walls 13 are formed one by one using a multi-terminal IC.
In the case of a socket, a molding time is required, and the manufacturing cost is greatly increased.

Further, as will be described later, the connection terminal portion 2a of the contact pin of the external circuit connected to the IC socket and the connection hole portion are arranged in a staggered area in a straight line such as a stepped shape in order to facilitate connection. May not. In the above case, several types of contact pins must be implanted in the socket body in accordance with the external circuit.
In the case of such a method, several kinds of partition walls 13 are required,
It is necessary to prepare several types of molds for molding the partition wall 13, which further increases the manufacturing cost.

[0009]

In order to prevent the unfilled portion of the synthetic resin from being formed in the mold by injection molding, the shape of the product is simplified so that the flow path of the synthetic resin does not have a complicated structure. And to reduce the thin portion for one molded article. However, if a product is simply divided into small pieces so as to be easily formed and then assembled, there is a problem that dimensional errors in manufacturing are accumulated and a large dimensional error is generated.

In the case where the arrangement of the connection holes of the external circuit connected to the IC socket is not linear, a mold for forming the mounting portion of the contact pin of the IC socket according to the arrangement pattern of the connection holes is provided. It was hard to make.

[0011]

In order to achieve the above object, according to the present invention, a mounting portion of a contact pin of an IC socket is divided into a plurality of blocks separately from a main body, and is made by injection molding. The block divides a mounting portion of the contact pin according to an arrangement pattern of connection holes of an external circuit connected to the IC socket. For example, if the connection hole is 6
When the same pattern is repeated every other, a portion to which an integral multiple of 6 or 1/2 or 1/3 contact pins are attached is formed as one block.

[0012] Then, each block is divided, the positioning portion of the socket body is provided, the position in the socket body
A predetermined number of engaging portions that can be fitted to the setting portion are provided, and each of the blocks separately positions the socket body.

The contact pin is inserted from above between the partition walls provided on the block, and is fixed by press-fitting into a hole provided on the lower side of the block.

[0014]

According to the present invention, the mounting portion of the contact pin of the IC socket to be connected to the external circuit in which the pattern of the connecting hole portion is repeated in a certain pattern is divided into several blocks in consideration of the pattern and made by injection molding. . This gives 1
Since the number of partition walls per molded product is reduced, molding is facilitated. In addition, it is easy to make a mold for molding the mounting portion of the contact pin.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As an example for carrying out the present invention,
A description will be given of an IC socket for connecting a flat type IC package having a lead pitch of 0.3 mm to a circuit board for mounting test of the IC package manufactured according to the standard of EIAJ (Electronic Manufacturers Association of Japan). I do. Connection hole 1 with the IC socket of the mounting test circuit board
When schematically shown, as shown in FIG. 1, patterns arranged in a stepwise manner in six steps are arranged in a repeating manner. Therefore, in this case, it is preferable that the mounting portion of the contact pin of the IC socket is divided into blocks in which six contact pins can be implanted and molded.

However, the number of leads provided on one side of the actual IC package body is often not divisible by 6, and in such a case, it is necessary to prepare at least two types of dies. Then, one mold molds a block for implanting six contact pins, and the other mold molds a block for implanting the remaining fraction of contact pins.

Next, the structure of the block will be described with reference to FIGS. FIG. 2 is a perspective view of a contact pin of an IC socket according to the present invention and a block for attaching the contact pin, and FIG. 3 is a cross-sectional view when the contact pin is attached to the block. In the drawing, reference numeral 2 denotes six contact pins, each of which has a slightly different position of the connection terminal portion 2a connected to the connection hole portion 1 shown in FIG. 1, and three projection pins 3a and 3b on both sides and six grooves 3c. This is a block having holes 3d and 3e provided at the positions of the connection terminal portion 2a and the planting portion 2b of each contact pin planted at the bottom of the groove 3c.

Each of the contact pins 2 is inserted one by one into the groove 3c of the corresponding block, and the connection terminal portion 2a is inserted into the hole 3e.
Then, each contact pin 2 is fixed to the block 3 by press-fitting the planting portion 2b into the hole 3d.

The other type of block 3 'has the same structure as the block 3 except that the number of the grooves 3c and the holes 3d and 3e is different from that of the contact pin 2 to be implanted. 3 'is not shown.

The blocks 3 and 3 'have a simple structure in which a groove 3c and holes 3d and 3e are provided inside a rectangular parallelepiped and projections 3a and 3b are provided outside, as shown in FIGS.
When a mold is easy to make and injection molding is performed, the flow path of the synthetic resin in the mold does not become complicated.

Further, it is possible to easily form a mounting portion for the contact pin 2 in accordance with the pattern of the connection hole 1 with the IC socket of the circuit board connected to the IC socket.
In the case of IC sockets connected to a circuit board having the same pattern of the connection hole 1, the same block 3 can be used, so that the manufacture of the mold is simplified.

Next, a socket body to which the blocks 3 and 3 'are mounted will be described. FIG. 4 is a partial plan view showing an example of a state when the cover of the socket body according to the present invention is opened, and FIG. 5 is a partial sectional view showing a state where the block 3 is attached. 4 is a socket body, 5 is a cover, 6 is a hole which can be fitted to the block 3 or 3 'and is provided with a step 6a in the middle, 7 is a beam, 8 is four lateral holes into which a beam 7 can be press-fitted. , 9 are frames and 10 is four vertical holes. Further, the protrusions 3 of the block are provided on both sides of the hole 6.
a, 3b are provided with concave portions 6b, 6c to be fitted.

On a step 6a provided in the middle of the hole 6,
The blocks 3 and 3 'are inserted and mounted while fitting the projection 3a and the recess 6b and the projection 3b and the recess 6c. Then, the protrusion 3a is fixed to the recess 6b by press-fitting the beam 7 into the lateral hole 8 in the direction of arrow I in FIG. The beams 7 are similarly inserted into the other three lateral holes 8.

FIG. 6 is a perspective view of the frame 9, and 9 a is a hole for fixing to the socket body 4. The frame 9 has a hole 9a
Then, by inserting a rivet (not shown) into the vertical hole 10 and fixing the rivet to the socket body 4, the projection 3a is fixed to the concave portion 6a as shown in FIG.

The beam 7 may be fixed to the socket body 4 by a method such as welding after being inserted into the lateral hole 8. Similarly, the frame 9 may be fixed to the socket body 4 by welding or screwing. Alternatively, the block 3 or 3 'may be inserted and fixed to the socket body 4 from below as shown in FIG.

The number of the contact pins 2 implanted in the block 3 is not limited to six, but is appropriately set in consideration of the fluidity of the synthetic resin used, the performance of the injection molding machine, and the like. Things.

Also, the number of contact pins 2 implanted in the block 3 'must be set in consideration of various conditions as in the case of the block 3. In particular, when the number of the contact pins 2 to be implanted is too small, the partition wall must be thin in the case of an IC socket for an IC package having fine pitch leads, so that the block 3 'is required.
This problem must be taken into consideration, since this may cause a problem in the strength of the device.

In the case of the above-described embodiment, it is often desirable that the number of contact pins 2 implanted in the block 3 'be between 7 and 11.

The blocks 3 and 3 'are individually positioned with respect to the socket body 4, so that each of the blocks 3 and 3'
Of the contact pins 2 with respect to the socket body 4 is not largely shifted.

[0030]

As described above, according to the present invention, an IC socket having multiple terminals and a fine pitch can be easily made by injection molding, and the positioning of the contact pins with respect to the socket body is also easy.

Also, the contact pin mounting portion can be manufactured in accordance with the pattern of the connection portion of the circuit board connected to the IC socket to the IC socket. The use of the mounting part formed by a mold makes it easy to manufacture a mold.

[Brief description of the drawings]

FIG. 1 is a schematic view of a pattern of a connection hole portion connected to an IC socket of a mounting test circuit board for a 0.3 mm pitch flat type IC package made in accordance with the EIAJ standard.

FIG. 2 is a perspective view showing an example of a contact pin of an IC socket according to the present invention and a block for attaching the contact pin.

FIG. 3 is a cross-sectional view when a contact pin is attached to the block of FIG. 2;

FIG. 4 is a partially enlarged plan view showing an example of a state in which a cover of an IC socket is opened and a method of inserting a beam according to the present invention.

5 is a partially enlarged sectional view showing a state where the block shown in FIG. 3 is attached to the IC socket shown in FIG. 4;

FIG. 6 is a perspective view of a frame of the IC socket according to the present invention.

FIG. 7 is a partially enlarged sectional view of a second embodiment showing a state where a block is attached to an IC socket according to the present invention.

FIG. 8 is a side view showing a cross section of a part of a conventional IC socket and a side view of an IC package.

FIG. 9 is a partial perspective view of a conventional IC socket composed of a socket body and a base.

FIG. 10 is a perspective view of a conventional IC socket in which a contact pin is mounted on a partition wall, showing a state where the contact pin is mounted on the partition wall.

11 is a perspective view showing a method of stacking a large number of partition walls shown in FIG. 10 and integrating them using a fitting member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection hole part 2 Contact pin 3 Block 4 Socket body 5 Cover 6 Hole 7 Beam 8 Side hole 9 Frame 10 Vertical hole

Claims (3)

(57) [Claims] 1. An IC socket having a large number of contact pins arranged side by side at small intervals on a socket body, wherein a portion where the contact pins are implanted is divided into a plurality of blocks separately from the body and formed by injection molding . At the same time, a contact pin planting section composed of a plurality of fitting grooves is arranged in each of the blocks , and the contact pins are fixedly fitted in the grooves.
Constant allowed, yet while the each block providing the positioning portion, wherein the socket body Rutotomoni provided a fitting recess capable of fitting the above block and engaging said positioning portion
Be provided positioning engaging portion, the fixing member is provided which can be further fitted between the socket body and the block, the block
An IC socket, wherein the block is fixed to a socket body by fitting into a fitting concave portion by fitting engagement of a fixing member . Wherein said IC socket, IC socket according to claim 1, characterized by being provided a plurality of kinds of blocks having different planted設本number of contact pins. 3. The number of contact pins planted in the block is an integral multiple of 6, or 1/2 of 6, or 1/3 of 6.
3. The method according to claim 1 , wherein the number is one of the following:
An IC socket according to any one of the above .