JP2759638B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting an IC package having a J-bend type lead and connecting the lead to an external circuit.

[0002]

2. Description of the Related Art A conventional J-bend type lead- like package is used.
As shown in FIG. 4, for example, as shown in FIG. 4, a first contact portion 1c provided on a first contact piece 1 of a bifurcated contact pin and a second contact piece a second contact portion 2c provided in the 2
By thus more sandwiching it leads R-shaped portion 8a, and 8b in the diagonally upward and diagonally downward, and at the same time to fix the IC package on the IC socket, by the contact pin contacts two points with respect to leads 81, lead 8 And were surely electrically connected.

In the IC socket shown in FIG. 5, two contact portions 1c and 2c are provided on one contact piece of a contact pin, and a lead 8 is sandwiched between the two contact portions 1c and 2c from the side. By fixing the IC package to the socket body 6 and making two-point contact with the lead 8, the lead 8 and the contact pin are reliably electrically connected.

[0004]

However, in the case of the IC socket shown in FIG. 4, since the first contact portion 1c of the contact pin contacts the R-shaped portion 8b of the lead diagonally from above, the socket body 6 When the IC package is taken out from the first contact portion 1c of the contact pin, the lead R
The shape portion 8b is easily caught and difficult to take out, and the lead 8 may be damaged.

Also, due to dimensional errors in the manufacture of the IC package, the R-shaped portion 8
a. 8b, the contact position between the contact pin and the lead 8 changes, and the contact pressure between the contact pin and the lead 8 may change for each IC package. When the contact pressure between the contact pin and the lead changes, the electrical resistance of the contact portion also changes. Therefore, in the case of the IC socket shown in FIG. 4, when an IC package mounting test or the like is performed, variations in electrical resistance may affect the test results and cause inconvenience.

In the case of the IC socket shown in FIG. 5, two contact portions, the first contact portion 1c and the second contact portion 2c, are brought into contact with the lead 8 by only one spring portion 9 of the contact pin. Contact portion 1c and second contact portion 2c
Of the first contact portion 1c and the second contact portion 2c
In some cases, contact resistance may vary or a connection failure may occur in performing an IC package mounting test or the like, resulting in inconvenience.

Further, the contact pins are branched into two branches as in the IC socket shown in FIG. 4 to provide two contact pieces 1 and 2, and contact portions 1c and 2c respectively provided on the two contact pieces 1 and 2. In both cases, when the vertical portion A of the lead 8 shown in FIG. 6 is to be securely contacted from the side, the size of the vertical portion A of the lead 8 is short, so that the first contact portion 1c and the second contact portion of the contact pin are formed. It is necessary to make the distance 2c extremely short, and when inserting the IC package into the socket body 6 from above, the lead 8 pushes and bends the second contact piece 2 of the contact pin toward the outside of the socket 1 body 6. Since the tapered portion 2b serving as a surface cannot be provided, and becomes substantially horizontal, there is a problem that the portion B of the lead 8 shown in FIG.

The base portion of the lead 8 close to the IC package body 7 may have burrs during molding of the IC package body 7 and may not be able to make electrical contact. It is desirable to avoid connection with the contact pins of the above.

[0009] The present invention provides an IC socket having contact pins so as to perform each contact portion two point contact provided on two contact pieces which are bifurcated, the package side, such as a J bend type leads When the IC package having the leads along is inserted into the socket body from above, the troubles such as the leads being put on the second contact portions of the contact pins are prevented, and furthermore, both the contact portions are can be reliably brought into contact with the lead from the side of the IC package, the package side
An object of the present invention is to provide an IC socket for an IC package having leads along the line .

[0010]

According to the present invention, two contact pieces are provided by branching a contact pin having elasticity into two branches, and a first contact piece is folded inward from above at a free end.
A first contact portion is formed at a lower portion of the tapered portion which is curved and inclined, and a second contact piece is provided at its free end with an engaging portion which engages with the first contact piece, while a second contact piece is formed at a lower portion thereof. Solving the above problems by forming a part

[0011]

According to the present invention, an IC having a J-bend type lead is provided.
When the package is inserted into the socket body from above, the lead first contacts the tapered portion provided on the first contact piece of the contact pin. When the IC package is further moved downward, the first contact piece bends outwardly of the socket body and comes into contact with the engagement portion above the tapered portion provided on the second contact piece, and the second contact piece also becomes a socket. Bend outward from the body.

When the IC package moves further down,
The lead comes into contact with the second contact portion below the tapered portion of the second contact piece that has already been bent outwardly of the socket body, and the second contact piece is further bent outwardly. And is placed on the socket body in contact with the placement section provided on the socket body. The contact pin is not damaged by the first contact portion of the first contact piece and the second contact portion of the second contact piece pressing the lead from the outside.
In addition, the electrical contact between the leads and the contact pins is ensured, and the IC package is fixed to the socket body.

[0013]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of an elastic contact pin according to the present invention. In the drawing, 1 is a first contact piece having a tapered portion 1a, a pressing portion 1b bent at the lower end thereof, and a first contact portion 1c having a convex shape, and 2 is a tapered portion 2a having a dimension shorter than the tapered portion 1a. An engaging portion 2b extending above the tapered portion 2a and a convex second contact portion 2c formed at the bent portion by bending the lower portion of the tapered portion 2a. A second contact piece 3 has a downwardly extending connecting portion for connecting to an external circuit, 4 has a hole for inserting a hook-shaped jig when the contact pin is pressed into the socket body, and 5 has a socket body. Notch for engaging with the positioning part.

FIG. 2 is a sectional view showing a state where the contact pins shown in FIG. 1 are mounted on the socket body, and FIG. 3 is a partially enlarged view showing a process of mounting the IC package on the IC socket shown in FIG. . In the figure, reference numeral 6 denotes a socket body, which has a mounting portion 6a, an elongated hole 6b for press-fitting the contact pin shown in FIG. 1, and a convex portion 6c which engages with the notch 5 of the contact pin. I have. 7, an IC package body; and 8, a J-bend type lead.

Next, the process of mounting the IC package having the J-bend type lead on the socket body will be described with reference to FIG. First, in the direction shown in FIG.
When the package 7 is inserted into the socket body 6 from above, the R-shaped portion 8a of the lead 8 comes into contact with the tapered portion 1a of the first contact piece, and as shown by an arrow in FIG. Is pressed and bent outward of the socket body 6. Then, as shown in FIG. 3C, the pressing portion 1b of the first contact piece comes into contact with the engaging portion 2b of the second contact piece, and the second contact piece 2 is also bent outward of the socket body 6. .

When the IC package is further moved downward, as shown in FIG.
Makes contact with the tapered portion 2a of the second contact piece that has already been bent outwardly of the socket body 6, and further slightly bends the second contact piece 2 outwardly of the socket body 6. Then, as shown in FIG. 3E, the IC package body 7 comes into contact with the mounting portion 6a of the socket body, and the first contact portion 1c of the first contact piece 1 and the second contact portion 2c of the second contact piece.
Both of them contact the vertical portion of the lead 8 and the portion A shown in FIG. 6 and press the lead 8 from both sides, so that the lead 8 and the contact piece 1.2 of the contact pin are securely contacted electrically. At the same time, the IC package is fixed to the socket body 6.

In the method of attaching the contact pins shown in FIG. 1 to the socket body 6, first, the contact pins shown in FIG. 1 are inserted into the long holes 6b provided in the socket body 6 from above with a small force. The portion of the bottom of the socket body 6 adjacent to the long hole is slightly lightened in advance.
Accordingly, a hook-shaped jig is inserted into the hole 4 of the contact pin from the slightly lightened portion, and the hook-shaped jig is pulled downward by a strong force, so that the contact pin is elongated. At the same time as the press-fitting of the contact pin 6b, the notch 5 of the contact pin and the projection 6c of the socket main body are engaged, and the contact pin is fixed to the socket main body 6.

[0018]

As described above, since the IC package socket having the J-bend type lead of the present invention can make two-point contact at the vertical portion of the lead, the contact at the R-shaped portion of the lead can be obtained. Compared with the conventional IC socket, the variation in the contact position between the contact pin and the lead is small, so that the contact pressure between the contact pin and the lead does not vary, and the electrical connection is reliable and stable.

Further, when molding the IC package body, the resin which has become burrs may adhere to the base portion of the lead near the IC package body.
In the case of the socket, the lead does not come into contact with the contact pin at the base portion near the IC package body, so that there is no fear of the contact failure due to the resin.

[Brief description of the drawings]

FIG. 1 is a side view showing an example of a contact pin according to the present invention.

FIG. 2 is a sectional view of a main part showing a state where the contact pin shown in FIG. 1 is mounted on a socket body.

3A and 3B are partial cross-sectional views showing a process of mounting an IC package having a J-bend type lead on the IC socket shown in FIG. 2, wherein FIG. 3A is before mounting, and FIGS. In the course of mounting, (e) shows a completely mounted state.

FIG. 4 is a cross-sectional view showing an example of a conventional IC package socket having a J-bend type lead.

FIG. 5 is a cross-sectional view showing another example of a conventional IC package socket having a J-bend type lead.

FIG. 6 is a cross-sectional view of a conventional IC package having a J-bend type lead.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st contact piece 1a taper part 1c 1st contact part 2 2nd contact piece 2a taper part 2b engaging part 2c 2nd contact part 3 connecting part 4 hole 5 notch part 6 socket body 7 IC package body 8 J bend type Lead

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 33/76

Claims (1)

(57) [Claims] The first contact piece and the second contact piece are formed from a common base.
The first and second contact portions of each of the contact pieces extend and extend upward.
But the lead along the side of the storage IC package and the vertical direction
With elasticity that is formed so as to contact on approximately the same line
IC socket with contact pins
And the first contact piece is bent inward from above at the free end.
An inclined taper portion is provided, and the first portion is provided at a lower end portion thereof.
Forming a contact portion, the upper free end portion of the second contact piece
Engage with the back side of the tapered portion tip of the first contact piece
Providing an engagement portion, the second contact portion below the engagement portion
Leads along the side of the package characterized by being formed
An IC package socket having: