JP2764212B2 - Heat sealable coating for styrene resin bonding - Google Patents
Heat sealable coating for styrene resin bondingInfo
- Publication number
- JP2764212B2 JP2764212B2 JP10139689A JP10139689A JP2764212B2 JP 2764212 B2 JP2764212 B2 JP 2764212B2 JP 10139689 A JP10139689 A JP 10139689A JP 10139689 A JP10139689 A JP 10139689A JP 2764212 B2 JP2764212 B2 JP 2764212B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sealing
- resin layer
- acrylic resin
- heat sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 title claims description 37
- 229920005989 resin Polymers 0.000 title claims description 37
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 title claims description 25
- 239000011248 coating agent Substances 0.000 title claims description 13
- 238000000576 coating method Methods 0.000 title description 8
- 238000007789 sealing Methods 0.000 claims description 57
- 239000004925 Acrylic resin Substances 0.000 claims description 24
- 229920000178 Acrylic resin Polymers 0.000 claims description 24
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 description 22
- 239000011888 foil Substances 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- XUBKPYAWPSXPDZ-UHFFFAOYSA-N [Ba].OS(O)(=O)=O Chemical compound [Ba].OS(O)(=O)=O XUBKPYAWPSXPDZ-UHFFFAOYSA-N 0.000 description 1
- -1 acrylamide alkyl ethers Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明はプラスチックフィルムや金属箔等の基材に塗
布してスチレン系樹脂に対して良好な熱封緘性を示す熱
可塑性樹脂層を形成し得る被覆剤に関し、更に詳しく
は、特にスチレン系樹脂製包装容器用蓋材としてのアル
ミニゥム箔に塗工することにより高い熱封緘強度を示す
熱封緘性樹脂層を形成することが出来る熱封緘性被覆剤
を提供するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention forms a thermoplastic resin layer exhibiting good heat sealing property with respect to a styrene resin by being applied to a base material such as a plastic film or a metal foil. More specifically, a heat-sealing coating capable of forming a heat-sealing resin layer having a high heat-sealing strength by coating an aluminum foil as a cover material for a styrene-based resin packaging container. The agent is provided.
(従来の技術) 従来、封緘用熱板(ヒートシール・バー)、高周波お
よび超音波等によってのプラスチック容器の蓋材を封緘
させることは広く行われている。その蓋材の一般的な形
態はアルミニゥム箔に代表される金属箔、紙や耐熱性プ
ラスチックフィルム或いはそれらの紙やフィルムに金属
蒸着を施したものを基材とし、その一方の面に熱可塑性
樹脂を基本成分とする熱封緘性樹脂層を設けたものであ
る。また、熱封緘性を向上させるために熱封緘性樹脂層
と基材との間に緩衝層としてポリエチレン樹脂層を設け
たりするなどの種々のバリエーションも行われている。
他方の面は一般に文字やデザインが印刷されており、そ
の保護のために耐熱性の透明な樹脂ワニスを塗工した
り、耐熱性プラスチックフィルムを積層したりされる。(Prior Art) Conventionally, it has been widely practiced to seal a lid material of a plastic container by using a sealing hot plate (heat seal bar), high frequency wave, ultrasonic wave or the like. The general form of the lid material is a metal foil typified by aluminum foil, paper or a heat-resistant plastic film, or a metal or a metal-deposited paper or film made of such a base material. Is provided with a heat-sealing resin layer having as a basic component. Further, in order to improve the heat sealing property, various variations such as providing a polyethylene resin layer as a buffer layer between the heat sealing resin layer and the base material have been performed.
On the other side, characters and designs are generally printed, and for protection, a heat-resistant transparent resin varnish is applied or a heat-resistant plastic film is laminated.
(発明が解決しようとする問題点) プラスチックの中でもスチレン系樹脂を主成分とする
容器を使用し、開口部を蓋材で封緘する所謂、シールパ
ックは食品包装分野を中心にして諸分野に広く使用され
ているが、それらの蓋材としてはアルミニゥム箔に熱封
緘性の接着剤を塗工したものが多く使用されている。(Problems to be Solved by the Invention) Among plastics, so-called seal packs, which use a container mainly composed of styrene resin and seal the opening with a lid material, are widely used in various fields, mainly in the food packaging field. As the lid material, those obtained by applying a heat-sealing adhesive to aluminum foil are often used.
スチレン系樹脂製容器用の蓋材の熱封緘性樹脂層を形
成するための被覆剤の主成分として種々の樹脂系のもの
が検討されているが、その中ではアクリル樹脂系のもの
が比較的良好な熱封緘性を示すものとして評価されてい
る。Various resin-based materials have been studied as a main component of a coating material for forming a heat-sealing resin layer of a lid material for a styrene-based resin container. It is evaluated as having good heat sealing properties.
しかしながら、熱封緘強度が必ずしも充分ではなく、
改良が求められているのが実状である。However, the heat sealing strength is not always sufficient,
The reality is that improvements are required.
(問題を解決するための手段) 本発明者は種々の樹脂系およびそれらのブレンド系に
ついても検討した結果、本発明の目的であるスチレン系
樹脂製容器用の蓋材の熱封緘性樹脂層を形成するための
被覆剤の主成分としては、従来から認められているよう
にアクリル樹脂系が良好であることがわかった。さらに
アクリル系樹脂に他の系の樹脂をブレンドしたり、接着
促進剤を添加したりするなど公知の手段により、場合に
よっては熱封緘強度が若干改良される結果も得られた。
しかし、熱封緘強度が向上するとスチレン系樹脂製容器
に熱封緘した蓋材を剥離する場合に蓋材の熱封緘性樹脂
層の凝集破壊を生じる傾向があり、破壊した樹脂層が内
容物を汚染したり、所謂、縁残りと称される容器の縁に
付着残存した樹脂層の断片が容器を食器として使用する
ときに不快感を与えたりするので実用上問題となる。(Means for Solving the Problems) As a result of studying various resin systems and their blend systems, the present inventors have found that the heat-sealing resin layer of the lid material for a styrene-based resin container, which is the object of the present invention, has been developed. As a main component of the coating agent for forming, it was found that an acrylic resin-based material was good as conventionally recognized. In some cases, the heat sealing strength was slightly improved by known means such as blending an acrylic resin with another resin or adding an adhesion promoter.
However, when the heat sealing strength is improved, the heat sealing resin layer of the lid material tends to undergo cohesive failure when the heat sealing resin is peeled off from the styrene resin container, and the broken resin layer contaminates the contents. In addition, fragments of the resin layer adhering to and remaining on the edge of the container, which is called a so-called edge residue, cause discomfort when the container is used as tableware, which poses a practical problem.
本発明者等は前記の問題点を解決して、スチレン系樹
脂製容器に対する蓋材の熱封緘強度が充分に大きく、し
かも蓋を剥離する際に熱封緘性樹脂層の破壊を生ぜず熱
封緘性樹脂層と容器との界面または熱封緘性樹脂層と蓋
材の基材であるアルミニゥム箔との界面で剥離すること
が出来る熱封緘性樹脂層を形成する熱封緘性被覆剤を得
るべく研究を重ねた結果、アクリル系樹脂溶液を主成分
とする熱封緘性被覆剤のアクリル系樹脂溶液の不揮発分
100部に対し、無機質充填材を2−25部添加することに
よりスチレン系樹脂製容器の蓋材の熱封緘強度として15
0℃前後の熱封緘温度に対して1.0kg/15mm以上の強度を
常に示し、かつ熱封緘した蓋材を剥離する時は凝集破壊
を生ぜず、界面剥離する熱封緘性樹脂層を形成し得る熱
封緘性被覆剤を与えることを見い出して本発明に到達し
たのである。The present inventors have solved the above-mentioned problems and have found that the heat sealing strength of the lid material for the styrene resin container is sufficiently large, and furthermore, when the lid is peeled off, the heat sealing resin layer is not broken without heat sealing. To obtain a heat-sealing coating material that forms a heat-sealing resin layer that can be peeled off at the interface between the heat-sealing resin layer and the container or at the interface between the heat-sealing resin layer and the aluminum foil as the base material of the lid material As a result, the non-volatile content of the acrylic resin solution of the heat-sealing coating agent containing the acrylic resin solution as a main component.
By adding 2-25 parts of the inorganic filler to 100 parts, the heat sealing strength of the lid material of the styrene-based resin container becomes 15
It always shows a strength of 1.0 kg / 15mm or more with respect to the heat sealing temperature of around 0 ° C, and does not cause cohesive failure when peeling off the heat-sealed lid material, and can form a heat-sealing resin layer that peels off at the interface. The inventors have found that a heat-sealing coating material is provided, and have reached the present invention.
本発明に使用されるアクリル系樹脂溶液は公知の製造
法によって得られる。即ち、懸濁重合法、乳化重合法、
塊状重合法等任意の方法によって製造されたアクリル系
樹脂を適当な有機溶媒を選択して溶解するか、または適
当な有機溶媒中でアクリル系樹脂の構成成分の単量体を
溶液重合することによって得られるアクリル系樹脂溶液
等が使用される。The acrylic resin solution used in the present invention can be obtained by a known production method. That is, suspension polymerization, emulsion polymerization,
An acrylic resin produced by an arbitrary method such as a bulk polymerization method is selected and dissolved in an appropriate organic solvent, or a monomer of an acrylic resin component is solution-polymerized in an appropriate organic solvent by solution polymerization. The resulting acrylic resin solution is used.
アクリル系樹脂の構成成分である単量体は一般にアク
リル系樹脂の製造に使用される公知の単量体が使用でき
る。代表的なものとしてはC1−18アルキル(メタ)アク
リレートがあるが、その他の単量体としてスチレン、ア
クリロニトリル、酢酸ビニル等共重合性であって単独重
合体の二次転移点が20℃以上程度の硬質単量体や(メ
タ)アクリル酸以外の官能基を有する単量体類、例えば
イタコン酸、クロトン酸、フマル酸等の重合性カルボン
酸、メチロール(メタ)アクリルアミドアルキルエーテ
ル類、ヒドロキシアルキル(メタ)アクリレート類、グ
リシジル(メタ)アクリレート類等がある。As the monomer which is a constituent component of the acrylic resin, a known monomer generally used for producing an acrylic resin can be used. A typical example is C1-18 alkyl (meth) acrylate, but other monomers such as styrene, acrylonitrile, and vinyl acetate are copolymerizable and have a secondary transition point of a homopolymer of about 20 ° C. or more. Monomers having a functional group other than the hard monomer and (meth) acrylic acid, for example, polymerizable carboxylic acids such as itaconic acid, crotonic acid and fumaric acid, methylol (meth) acrylamide alkyl ethers, hydroxyalkyl ( (Meth) acrylates and glycidyl (meth) acrylates.
アクリル系樹脂としては特に制約はないが、軟化点の
低過ぎるものはブロッキングを起こす恐れがあるから避
けるべきである。The acrylic resin is not particularly limited, but those having an excessively low softening point should be avoided because of the possibility of blocking.
無機質充填剤としては塗料や印刷インキに使用される
公知のものが使用可能であるが、それらの中でも例え
ば、無水珪酸、タルク、クレー、沈降性硫酸バリュー
ム、アルミナ、炭酸カルシウム、亜鉛華等体質顔料と呼
ばれるものが透明感があるので好ましい。しかし、その
他の有色顔料等も必要により使用することは自由であ
る。Known inorganic fillers used in paints and printing inks can be used. Among them, for example, silica, talc, clay, precipitated sulfuric acid barium, alumina, calcium carbonate, zinc oxide, etc. What is called is preferable because it has a sense of transparency. However, other colored pigments and the like can be freely used if necessary.
(作用および効果) 本発明のスチレン系樹脂接着用熱封緘性被覆剤におい
て使用する無機質充填材の割合はアクリル系樹脂溶液の
不揮発分100部に対して2−25部の範囲が適当である。(Function and Effect) The ratio of the inorganic filler used in the heat-sealing coating material for bonding a styrenic resin of the present invention is suitably in the range of 2 to 25 parts with respect to 100 parts of the nonvolatile content of the acrylic resin solution.
無機質充填材の添加量がアクリル系樹脂溶液の不揮発
分100部に対して2部より少ない場合は熱封緘強度が充
分に向上せず、スチレン系樹脂に熱封緘後、剥離すると
きに凝集破壊を生じる傾向も改善されない。また、25部
を超えると熱封緘温度が上昇して熱封緘が充分に行われ
なくなるために熱封緘強度が低下する。When the addition amount of the inorganic filler is less than 2 parts with respect to 100 parts of the non-volatile content of the acrylic resin solution, the heat sealing strength is not sufficiently improved. The tendency to occur is not improved. On the other hand, when the amount exceeds 25 parts, the heat sealing temperature rises and the heat sealing is not sufficiently performed, so that the heat sealing strength decreases.
以下、実施例等によってさらに詳細に説明する。 Hereinafter, the present invention will be described in more detail with reference to examples and the like.
参考例 (アクリル系樹脂溶液Aの製造例) 攪拌機、還流冷却器、滴下漏斗および不活性ガス導入
管を備えた容量1リットルの四ツ口フラスコに次の配合
組成A、B、C、D、EおよびFを仕込み、攪拌を開始
し、不活性ガス導入管より窒素ガスを緩やかに導入して
雰囲気の置換を行う。Reference Example (Production Example of Acrylic Resin Solution A) In a 1-liter four-necked flask equipped with a stirrer, a reflux condenser, a dropping funnel, and an inert gas inlet tube, the following formulation A, B, C, D, E and F are charged, stirring is started, and the atmosphere is replaced by gently introducing nitrogen gas from an inert gas introduction pipe.
A n−ブチルアクリレート 94.0g. B メチルメタクリレート 300.0g. C アクリル酸 6.0g. D 酢酸エチル 320.0g. E トルオール 240.0g. F アゾビスイソブチロニトリル 2.4g. 続いて加熱を開始し、30分間でフラスコの内温を70℃
に到達させ、そのまま70℃に2時間保持する。引き続い
て80℃に昇温して5時間保持した後、90℃まで昇温させ
て3時間後、酢酸エチル20.0g.およびトルオール20.0g.
を添加し、冷却してアクリル系樹脂溶液Aを得た。A N-butyl acrylate 94.0 g. B Methyl methacrylate 300.0 g. C Acrylic acid 6.0 g. D Ethyl acetate 320.0 g. E Toluol 240.0 g. F Azobisisobutyronitrile 2.4 g. To raise the internal temperature of the flask to 70 ° C
And kept at 70 ° C. for 2 hours. Subsequently, the temperature was raised to 80 ° C. and maintained for 5 hours, and then raised to 90 ° C., and after 3 hours, 20.0 g of ethyl acetate and 20.0 g of toluene.
Was added and cooled to obtain an acrylic resin solution A.
不揮発分40.5%、粘度10ポイズであった。 The nonvolatile content was 40.5% and the viscosity was 10 poise.
(アクリル系樹脂溶液Bの製造例) アクリル系樹脂溶液Aの製造例と同様のフラスコに次
の配合組成A〜Fのうち、Dを除く、A、B、C、Eお
よびFを添加し、攪拌を開始し、フラスコ内の雰囲気を
窒素ガスで置換する。(Production Example of Acrylic Resin Solution B) In the same flask as in the production example of the acrylic resin solution A, A, B, C, E, and F, excluding D, were added among the following composition A to F, Stirring is started, and the atmosphere in the flask is replaced with nitrogen gas.
A メチルメタアクリレート 260.0g. B スチレン 31.0g. C メタクリル酸 9.0g. D 過酸化ベンゾイル 3.6g. E メチルエチルケトン 300.0g. F トルオール 200.0g. 加熱してフラスコの内温を75℃に昇温させる。直ちに
D 過酸化ベンゾイル 3.6g.を別に準備したトルオー
ル100.0g.に溶解させた溶液の半分、すなわち51.8g.を
滴下漏斗から一時に添加して反応を開始し、75℃に2時
間保持した後、80℃に昇温し、10時間保持して反応を完
結させる。この間、80℃に到達した時点から5時間を要
して、前記の過酸化ベンゾイルのトルオール溶液の残部
51.8g.を均等に添加する。反応終了後、メチルエチルケ
トン100.0g.を添加し、冷却してアクリル樹脂ワニスを
得る。A Methyl methacrylate 260.0 g. B Styrene 31.0 g. C Methacrylic acid 9.0 g. D Benzoyl peroxide 3.6 g. E Methyl ethyl ketone 300.0 g. F Toluol 200.0 g. Heat to raise the internal temperature of the flask to 75 ° C. Immediately, half of a solution prepared by dissolving 3.6 g of D benzoyl peroxide in 100.0 g of separately prepared toluene, ie, 51.8 g, was added at a time from a dropping funnel to start the reaction, and the mixture was kept at 75 ° C. for 2 hours. The temperature was raised to 80 ° C. and maintained for 10 hours to complete the reaction. During this time, it took 5 hours from the point when the temperature reached 80 ° C., and the remainder of the toluene solution of benzoyl peroxide was
51.8 g. Are added evenly. After completion of the reaction, 100.0 g of methyl ethyl ketone is added, and the mixture is cooled to obtain an acrylic resin varnish.
前記アクリル樹脂ワニスを取り出し、別に調製した塩
化ビニル−酢酸ビニル共重合体(米国UCC社製、ビニラ
イトVMCH)の酢酸エチル/メチルエチルケトン(1対
1)混合溶媒の30%溶液150g.を添加混合してアクリル
系樹脂溶液Bを得た。The acrylic resin varnish was taken out, and 150 g of a 30% solution of a separately prepared mixed solvent of vinyl chloride-vinyl acetate copolymer (Vinylit VMCH manufactured by UCC, USA) in a mixed solvent of ethyl acetate / methyl ethyl ketone (1: 1) was added and mixed. An acrylic resin solution B was obtained.
不揮発分29.8%、粘度11.3ポイズであった。 It had a nonvolatile content of 29.8% and a viscosity of 11.3 poise.
実施例1 参考例のアクリル系樹脂溶液Aの300g.を秤取し、タ
ルク粉末(日本タルク社製;ミクロエースL−1)を2
7.6g.添加、容量800ccのバッチ式卓上型サンドミルを使
用して20分間、分散させて熱封緘性被覆剤を得た。Example 1 300 g of the acrylic resin solution A of the reference example was weighed, and talc powder (Microace L-1 manufactured by Nippon Talc Co., Ltd.) was added to 2 g of the talc powder.
7.6 g. The mixture was dispersed for 20 minutes using a batch type tabletop sand mill having a capacity of 800 cc to obtain a heat-sealing coating agent.
この熱封緘性被覆剤を厚さ50μの軟質アルミニゥム箔
に乾燥塗工量が約5g/m2になるように塗工し、雰囲気温
度180℃の乾燥炉中で10秒間加熱乾燥させて熱封緘性樹
脂層を形成した塗工アルミニゥム箔を作成した。This heat-sealable coating agent is applied to a soft aluminum foil having a thickness of 50 μm so that the dry coating amount is about 5 g / m 2, and then heat-dried in a drying furnace at an ambient temperature of 180 ° C. for 10 seconds to be heat-sealed. A coated aluminum foil having a conductive resin layer formed thereon was prepared.
次に得られた塗工アルミニゥム箔を厚さ0.5mmのハイ
インパクトポリスチレン(HIPS)・シート(旭ダウ社
性;スタイロン#470)に対して、それぞれ熱封緘温度1
30℃、150℃および170℃において圧力3.0kg/cm2、圧着
時間1.0秒の条件下で熱封緘を行い、熱封緘強度測定溶
試料とした。Next, the obtained coated aluminum foil was applied to a high-impact polystyrene (HIPS) sheet having a thickness of 0.5 mm (available from Asahi Dow; Styron # 470) at a heat sealing temperature of 1 respectively.
Heat sealing was performed at 30 ° C., 150 ° C. and 170 ° C. under the conditions of a pressure of 3.0 kg / cm 2 and a pressure bonding time of 1.0 second to obtain a heat sealed strength measurement molten sample.
前記熱封緘強度測定用試料についてオートグラフ(島
津製作所製)を使用して180度剥離試験(引張り速度200
mm/min.)を行い、熱封緘温度130℃、150℃および170℃
に対する強度として、それぞれ1,177、1,180および1,22
0g./15mmの値を得た。Using the autograph (manufactured by Shimadzu Corporation) for the heat sealing strength measurement sample, a 180 degree peel test (pulling speed 200
mm / min.), heat sealing temperature 130 ℃, 150 ℃ and 170 ℃
Are 1,177, 1,180 and 1,22, respectively.
A value of 0 g./15 mm was obtained.
また剥離はアルミニゥム箔と熱封緘性樹脂層との間で
起こっており、凝集破壊を起こして縁取りを生じる傾向
は全く見られなかった。Peeling occurred between the aluminum foil and the heat-sealing resin layer, and there was no tendency to cause cohesive failure and fringing.
少なくとも熱封緘温度150℃前後において熱封緘強度
として1,000g./15mm以上の値が得られれば実用上充分で
あるとされるから前記の値は満足すべきものである。At least at a heat sealing temperature of about 150 ° C., a heat sealing strength of 1,000 g./15 mm or more is considered to be sufficient for practical use, so the above value is satisfactory.
実施例2 実施例1においてタルク粉末の量を6.0g.に変更した
以外は全く同様の操作を行い、熱封緘強度測定用試料に
ついて180度剥離試験の結果として熱封緘温度130℃、15
0℃および170℃に対して、それぞれ1,047、1,173および
1,310g./15mmの強度を得た。Example 2 The same operation as in Example 1 was carried out except that the amount of talc powder was changed to 6.0 g. As a result of a 180 ° peel test on a sample for measuring heat sealing strength, a heat sealing temperature of 130 ° C., 15 ° C.
For 0 ° C and 170 ° C, respectively, 1,047, 1,173 and
A strength of 1,310 g./15 mm was obtained.
また剥離はアルミニゥム箔と熱封緘性樹脂層との間で
起こっており、凝集破壊を起こして縁残りを生じる傾向
は全く見られなかった。In addition, peeling occurred between the aluminum foil and the heat-sealing resin layer, and there was no tendency to cause cohesive failure and to leave an edge.
比較例1 実施例1においてタルク粉末を本発明の添加量の範囲
の上限を超えて、36.0g.添加した以外は同様の操作を行
った。熱封緘強度測定用試料についての180度剥離試験
の結果は剥離面は全てアルミニゥム箔と熱封緘性樹脂層
との間で起こっており、凝集破壊は起こしていなかった
が、熱封緘温度130℃、150℃および170℃に対する強度
はそれぞれ447、568および660g./15mmの値しか得られな
かった。Comparative Example 1 The same operation was performed as in Example 1, except that 36.0 g of talc powder was added, exceeding the upper limit of the range of the addition amount of the present invention. The results of the 180-degree peel test on the sample for measuring the heat sealing strength show that all the peeled surfaces have occurred between the aluminum foil and the heat-sealing resin layer, and no cohesive failure has occurred. The strengths at 150 ° C. and 170 ° C. were only 447, 568 and 660 g./15 mm, respectively.
比較例2 実施例1においてタルク粉末を添加せずに同様に操作
を行った。Comparative Example 2 The same operation as in Example 1 was performed without adding talc powder.
熱封緘強度測定用試料についての180度剥離試験の結
果は、それぞれ熱封緘温度が130℃、150℃および170℃
の場合に対して、それぞれ693、840および943g./15mmの
強度しか得られず、また剥離は熱封緘性樹脂層内の凝集
破壊によって起こっており剥離面に縁残りが生じてい
た。The results of the 180-degree peel test on the sample for measuring the heat sealing strength are as follows.
In the case of the above, only the strengths of 693, 840 and 943 g./15 mm were obtained, respectively, and the peeling was caused by cohesive failure in the heat-sealing resin layer, and the peeled surface had an edge residue.
実施例3 実施例1においてアクリル系樹脂溶液Aの代わりに参
考例のアクリル系樹脂溶液B400g.を使用し、タルク粉末
の代わりにシリカ粉末(富士デビソン社製;サイロイド
#24)6.0g.添加して実施例1と同様に操作して熱封緘
強度測定用試料を作成した。Example 3 In Example 1, 400 g of the acrylic resin solution B of the reference example was used in place of the acrylic resin solution A, and 6.0 g of silica powder (manufactured by Fuji Devison; Siloid # 24) was added instead of talc powder. In the same manner as in Example 1, a sample for measuring heat sealing strength was prepared.
前記熱封緘強度測定用試料について実施例1と同様に
180度剥離試験を行ったが、熱封緘温度130℃、150℃お
よび170℃に対する熱封緘強度として、それぞれ1,251、
1,366および1,420g./15mmの値を得た。For the heat seal strength measurement sample,
A 180-degree peel test was performed. The heat-sealing strength at 130 ° C, 150 ° C and 170 ° C was 1,251, respectively.
Values of 1,366 and 1,420 g./15 mm were obtained.
また剥離はアルミニゥム箔と熱封緘性樹脂層との間で
生じていた。Peeling occurred between the aluminum foil and the heat-sealing resin layer.
実施例4 実施例3において無機質充填剤としてシリカ粉末の代
わりに沈降性硫酸バリュウム24.0g.を使用した以外は全
く同様にして熱封緘強度測定用試料を得、180度剥離試
験を行い、熱封緘温度130℃、150℃および170℃の場合
に対する強度として、それぞれ1,105、1,237および1,34
0g./15mmの値を得た。Example 4 A heat seal strength measurement sample was obtained in the same manner as in Example 3 except that 24.0 g of sedimentable barium sulfate was used instead of silica powder as the inorganic filler, and a 180 ° peel test was performed. The strengths at temperatures of 130 ° C, 150 ° C and 170 ° C were 1,105, 1,237 and 1,34, respectively.
A value of 0 g./15 mm was obtained.
剥離面はアルミニゥム箔と熱封緘性樹脂層との間であ
って縁残りは見られなかった。The peeled surface was between the aluminum foil and the heat-sealing resin layer, and no margin was observed.
実施例5 実施例3において無機質充填剤としてシリカ粉末の代
わりに亜鉛華2号を12.0g.使用した以外は全く同様にし
て熱封緘強度測定用試料を得た。180度剥離試験は熱封
緘温度130℃、150℃および170℃に対して強度として、
それぞれ1,310、1,384および1,417g./15mmの値を得た。Example 5 A heat sealing strength measurement sample was obtained in the same manner as in Example 3, except that 12.0 g of Zinhua No. 2 was used instead of silica powder as the inorganic filler. 180 degree peeling test is as strength as heat sealing temperature 130 ℃, 150 ℃ and 170 ℃.
Values of 1,310, 1,384 and 1,417 g./15 mm, respectively, were obtained.
また剥離面はアルミニゥム箔と熱封緘性樹脂層との間
であって熱封緘性樹脂層の凝集破壊は見られなかった。The peeled surface was between the aluminum foil and the heat-sealing resin layer, and no cohesive failure of the heat-sealing resin layer was observed.
Claims (1)
量部、以下同様)に対し、無機質充填材を2−25部添加
してなるスチレン系樹脂接着用熱封緘性被覆剤。1. A heat-sealing coating agent for bonding a styrene resin, comprising 2 to 25 parts of an inorganic filler added to 100 parts (parts by weight, hereinafter the same) of a nonvolatile content of the acrylic resin solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10139689A JP2764212B2 (en) | 1989-04-20 | 1989-04-20 | Heat sealable coating for styrene resin bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10139689A JP2764212B2 (en) | 1989-04-20 | 1989-04-20 | Heat sealable coating for styrene resin bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02279782A JPH02279782A (en) | 1990-11-15 |
| JP2764212B2 true JP2764212B2 (en) | 1998-06-11 |
Family
ID=14299576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10139689A Expired - Fee Related JP2764212B2 (en) | 1989-04-20 | 1989-04-20 | Heat sealable coating for styrene resin bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2764212B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5098127B2 (en) * | 2001-09-12 | 2012-12-12 | 大日本印刷株式会社 | Adhesive composition and thermal transfer sheet |
| DE10224131A1 (en) * | 2002-05-29 | 2003-12-18 | Hydro Aluminium Deutschland | Foil made of an aluminum material |
| JP2006199720A (en) * | 2004-12-20 | 2006-08-03 | Riidaa:Kk | Heat sealing adhesive and lid material using the adhesive |
-
1989
- 1989-04-20 JP JP10139689A patent/JP2764212B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02279782A (en) | 1990-11-15 |
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