JP2764781B2 - IC socket for suction type handler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for a suction type handler for inserting a lead of a semiconductor integrated circuit device (IC) and performing an automatic test or the like. There is known a configuration in which various semiconductor integrated circuit devices (ICs) are sucked and conveyed to a hand portion of a suction type handler, and a lead of the semiconductor integrated circuit device is inserted into an IC socket of an automatic test device. There is a need for improved sockets.

[0002]

2. Description of the Related Art FIG. 5 is an explanatory view of a conventional example, in which a contact piece 22 is held by a socket body 21 made of an insulating material.
Reference numeral 3 protrudes below the socket body 21 and is connected to a printed wiring or a lead wire connected to a test device or the like. For such an IC socket, the semiconductor integrated circuit device 26 sucked by the hand portion 28 of the suction type handler is used.
Is conveyed and descends toward the IC socket, so that the leads 27 of the semiconductor integrated circuit device 26
Will come into contact with 2.

At least the upper part of the contact piece 22 of the IC socket is plated with gold in order to reduce the contact resistance with the lead 27, and the hand part 28 of the suction type handler is used.
Is set so that the lead 27 of the semiconductor integrated circuit device 26 is brought into contact with the contact piece 22 at a predetermined pressure.

[0004]

SUMMARY OF THE INVENTION Semiconductor integrated circuit device 2
6 and the contact piece 22 are in point contact with each other. In a characteristic test or the like of the semiconductor integrated circuit device 26,
It is necessary to reduce the contact resistance. For this purpose, the lowering position of the hand unit 28 of the suction type handler is lowered, and the contact pressure is increased. Thereby, the contact piece 22
Wear of the gold plating increases, and the life of the IC socket is shortened. Therefore, there was a disadvantage that the expensive IC socket had to be replaced frequently. Semiconductor integrated circuit device 26
The size, angle, elasticity, and the like of the lead 27 vary depending on the type of the lead 27 and the like. Therefore, it is necessary to adjust the suction type handler according to the type of the semiconductor integrated circuit device 26, so that the operation becomes complicated. Further, since it is necessary to accurately position the contact piece 22 of the IC socket and the lead 27 of the semiconductor integrated circuit device, the positioning accuracy of the suction-type handler must be increased, resulting in an expensive structure. . SUMMARY OF THE INVENTION An object of the present invention is to reduce contact resistance and extend life by a relatively simple configuration.

[0005]

The IC socket for a suction-type handler according to the present invention will be described with reference to FIG. 1. The lead 7 of the semiconductor integrated circuit device 6 which is sucked by the hand portion 8 of the suction-type handler will be described. The socket body 1 holding the contact piece 2 which is inserted by lowering of the hand unit 8 and contacts the lead 7 from both sides, and the concave portion 3a for mounting and positioning the semiconductor integrated circuit device 6 adsorbed on the hand unit 8 Positioning guide 3 having a shielding metal thin film at least in a portion facing semiconductor integrated circuit device 6
And a semiconductor mounted on the concave portion 3a of the positioning guide 3 as the positioning guide 3 is supported so as to be vertically movable with respect to the socket body 1 and the hand 8 of the suction type handler is raised. The lead 7 of the integrated circuit device 6 is
And a support portion 4 having a return spring 4a for detaching the support spring 4a.

[0006]

The concave portion 3a of the positioning guide 3 has a taper. When the semiconductor integrated circuit device 6 is mounted, the semiconductor integrated circuit device 6 is guided by the taper and positioned with respect to the IC socket. When the hand portion 8 of the suction type handler is lowered in the direction of the arrow, the leads 7 of the semiconductor integrated circuit device 6 are connected to the long piece 2a and the short piece 2b of the contact piece 2.
And is inserted between them, and comes into contact with the contact piece 2 so as to sandwich both sides of the lead 7. Therefore, the contact resistance can be reduced. When the hand 8 of the suction-type handler is raised in the direction opposite to the arrow by applying a rising force to the positioning guide 3 by the return spring 4a of the support 4, the positioning guide 3 is also raised. Then, the lead 7 of the semiconductor integrated circuit device 6 can be separated from the contact piece 2. That is, the lead 7 of the semiconductor integrated circuit device 6 can be brought into and out of contact with the contact piece 2 by lowering and raising the hand unit 8.

[0007]

FIG. 1 is a sectional view of a main part of an embodiment of the present invention.
1 is a socket body made of an insulating material, 2 is a contact piece, 2a is a long piece, 2b is a short piece, 2c is a connecting portion, 2d is a contact portion, 3 is a positioning guide portion made of an insulating material, 3a is a concave portion, and 4 is a concave portion. The support portion, 4a is a return spring, 4b is a support rod, 4c is an outer cylinder, 5
Is a printed board, 6 is a semiconductor integrated circuit device (IC), 7 is a lead, and 8 is a hand part of a suction type handler. The semiconductor integrated circuit device 6 is sucked and conveyed by the hand unit 8, and the lead 7 of the semiconductor integrated circuit device 6 is brought into contact with or separated from the contact piece 2 as the hand unit 8 is lowered or raised.

A metal thin film is formed on the outside and bottom of the side wall of the socket body 1, and a metal thin film is also formed on the concave portion 3a of the positioning guide 3 for shielding. This recess 3a
The metal thin film can be connected to the metal support rod 4b through the outside or through holes or the like, and can be connected to the ground through the metal outer cylinder 4c. As the means for forming the metal thin film, various known means such as electroless plating can be used.

The contact piece 2 is held by the socket body 1,
For example, the socket body 1 is fixed to the printed board 5, and the connecting portion 2c of the contact piece 2 is projected from the back of the printed board 5,
Connected to the printed wiring with solder. The printed wiring in this case is connected to, for example, a test device not shown. The concave portion 3a of the positioning guide 3 has a tapered surface corresponding to the size of the semiconductor integrated circuit device 6. Accordingly, when the semiconductor integrated circuit device 6 sucked by the hand unit 8 of the suction type handler is placed in the concave portion 3a, the leads 7 of the semiconductor integrated circuit device 6 correspond to the contact pieces 2 by the tapered surface. Positioned.
That is, since the positioning error of the suction type handler can be absorbed by the concave portion 3a of the positioning guide 3, the cost of the suction type handler can be reduced.

FIG. 2 is a side view of an embodiment of the present invention, and FIG. 3 is a perspective view of a positioning guide portion of the embodiment of the present invention. It has vertical pieces 3b, 3c on both sides, and the vertical pieces 3b, 3c
Are guided between the side walls on both sides of the socket body 1, and are supported by the support portion 4 so as to be vertically movable. This support 4
As shown in FIG. 1, a return spring 4a is provided in an outer cylinder 4c to apply a force for raising the support rod 4b.

FIG. 4 is an exploded perspective view of a main part of the embodiment of the present invention, showing a state in which the contact piece 2 and the socket body 1 are disassembled. The contact piece 2 is formed by bending an elastic metal piece such as phosphor bronze. It is composed of a long piece 2a, a short piece 2b, a connecting part 2c, and a contact part 2d, and the lead 7 of the semiconductor integrated circuit device is guided and inserted between the long piece 2a and the short piece 2b, and the contact part 2d In this case, the lead 7 and the contact piece 2 come into contact with each other so as to sandwich both sides of the lead 7. In addition, gold plating is applied to reduce contact resistance.

The socket body 1 has an inclined portion 1b for inserting and holding the contact piece 2 between the partition walls 1a and a hole 1c. When the connecting portion 2c of the contact piece 2 is inserted into the hole 1c, the inclined portion 1b is formed. The contact piece 2 is held by the socket body 1 in a state where the long piece 2a is opposed to 1b, and the contact piece 2 is insulated and isolated by the partition 1a.

In the above-described configuration, when the semiconductor integrated circuit device 6 is sucked and transferred to the hand portion 8 of the suction type handler, and the semiconductor integrated circuit device 6 is placed in the concave portion 3a of the positioning guide portion 3, As described above, the recesses 3a position the leads 7 of the semiconductor integrated circuit device 6 and the contact pieces 2 so as to correspond to each other.

When the hand portion 8 is lowered, the lead 7 is guided between the long piece 2a and the short piece 2b of the contact piece 2 and inserted into the contact portion 2d, and the lead 7 is sandwiched from both sides thereof. To come into contact with the contact piece 2. Therefore,
Even if there are variations in the size, angle, elasticity, and the like of the leads 7, the change in the contact resistance can be made negligible without adjusting the suction type handler. The contact resistance in that case could be, for example, 20 mΩ or less. On the other hand, in the conventional IC socket, a point contact is made, so that the contact resistance becomes about 40 to 50 mΩ or more, and the contact resistance varies depending on the contact pressure.

A characteristic test of the semiconductor integrated circuit device 6 is performed by completely bringing the lead 7 of the semiconductor integrated circuit device 6 into contact with the contact piece 2 of the IC socket. When it is raised, the positioning guide portion 3 is raised by the return spring 4a of the support portion 4, whereby the lead 7 of the semiconductor integrated circuit device 6 is separated from the contact portion 2d of the contact piece 2. .
That is, the return spring 4a only needs to have a force against the frictional resistance between the lead 7 and the contact portion 2d, and is a relatively small spring.
The positioning guide 3 can be returned.

The present invention is not limited to the above-described embodiment, but can be variously added and changed. For example, the vertical pieces 3b and 3c of the positioning guide 3 are also used as the support 4. Thus, it is also possible to provide the return spring 4a.

[0017]

As described above, according to the present invention, the positioning of the lead 7 and the contact piece 2 of the semiconductor integrated circuit device 6 can be easily performed by the concave portion 3a of the positioning guide 3, and the lead 7 The contact piece 2 is configured to be in contact with the contact piece 2 so that both sides of the lead 7 are sandwiched between the lead piece 7 and the lead piece 7. Is not required to be adjusted according to the type of the semiconductor integrated circuit device 6.

Also, there is an advantage that the abrasion of the gold plating of the contact piece 2 due to the insertion and detachment of the lead 7 is reduced, so that the frequency of replacing the IC socket can be significantly reduced. In addition, since a metal thin film for shielding is formed in a portion of the concave portion 3a of the positioning guide portion 3 facing the semiconductor integrated circuit device 6, the influence of external noise is reduced, and the above-described fluctuation of the contact resistance is negligible. This has the advantage that the reliability of the characteristic test of the semiconductor integrated circuit device 6 can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an embodiment of the present invention.

FIG. 2 is a side view of an embodiment of the present invention.

FIG. 3 is a perspective view of a positioning guide according to the embodiment of the present invention.

FIG. 4 is an exploded perspective view of a main part of the embodiment of the present invention.

FIG. 5 is an explanatory diagram of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body 2 Contact piece 2a Long piece 2b Short piece 3 Positioning guide part 3a Depression 4 Support part 4a Return spring 5 Printed board 6 Semiconductor integrated circuit device 7 Lead 8 Hand part of suction type handler

Claims (1)

(57) [Claims] In an IC socket for a suction-type handler provided with a contact piece for making contact with a lead of a semiconductor integrated circuit device sucked by a hand of the suction-type handler, the suction is performed by the hand of the suction-type handler. The lead of the semiconductor integrated circuit device is inserted by lowering of the hand part, and the socket body (1) holding the contact pieces (2) to be in contact with both sides of the lead and the hand part of the suction type handler. A positioning guide (3) having a concave portion (3a) for mounting and positioning the sucked semiconductor integrated circuit device and having a shielding metal thin film formed at least at a portion facing the semiconductor integrated circuit device; The positioning guide (3) is supported so as to be able to move up and down with respect to the socket body (1), and the hand of the suction type handler is raised. The positioning guide (3)
And a support (4) having a return spring (4a) for detaching the lead of the semiconductor integrated circuit device placed in the recess (3a) from the contact piece (2). IC socket for type handler.