JP2768655B2 - Manufacturing method of chip parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a method of manufacturing a tip piece to be surface mounted on a circuit board.

[0002]

2. Description of the Related Art Conventionally, for example, for a chip resistor or the like mounted on a circuit board, various electrode patterns for a plurality of chips are formed on an insulating substrate, and these are firstly divided into columns and divided. After printing the side electrode on the surface and firing it,
It is manufactured by subdividing into individual chip shapes and plating the terminal electrode portions. Also, for example, a mold type chip inductor is manufactured by mounting a winding as a separate body on a substrate and covering the whole with a resin, and a multilayer type chip inductor is manufactured by using a ferrite green sheet to form a conductor. It is manufactured by alternately laminating and printing magnetic materials and firing.

[0003] Further, as a planar inductance element in which a separate coil is not mounted or lamination printing is not performed,
In some cases, a spiral conductive pattern was formed on an insulating substrate. FIG. 17 shows an example in which such a planar inductance element according to the prior art is formed in a chip shape. In FIG. 17 , a spiral conductive pattern 13 is formed on a substrate, and its outer peripheral end is connected to one terminal electrode 1.
8 is connected to the other terminal electrode 18 via an air bridge 17. The steps of forming the chip inductor by patterning the conductor film in a spiral shape as described above are as follows. First, as shown in FIG. 18 , a resist film 11 is patterned on the upper surface of the substrate 10,
As shown in FIG. 19 , a conductor film 12 is vapor-deposited on the whole, and the resist film 11 is lifted off to form a spiral conductor pattern 13. Subsequently, patterning the resist film 14 as shown in FIG. 2 1, sputtering a feeding layer 15 on the surface thereof, the resist except portions to be formed an air bridge as shown in FIG. 2 2 film 16
To form an air bridge 17 by plating. Then, removing the resist film 14 by ion milling as shown in FIG. 2 3, as shown in FIG. 2 4, and cutting each chip from the substrate to form a terminal electrode 18 on its end.

[0004]

However, in the above-mentioned conventional chip components, the terminal electrodes on the side surfaces must be formed individually after separating the chip-shaped sections from the substrate, regardless of the type. Was. Moreover, since chip component such as a multilayer chip inductor according to the thick film printing to form a multilayer conductive pattern, there is a problem that the production steps is increased, also, an air-bridge as shown in FIG. 1 7 In such a case, the resist film for forming the air bridge must be removed by a special process, which complicates the entire manufacturing process.

An object of the invention, the conductor pattern and the terminal electrodes required for the chip component allowed to be formed at substantially the same time, is to provide a method of manufacturing a chip part products which solves the above problems.

Another object of the present invention is to make it possible to form a conductor pattern necessary for a chip component by a substantially single-layer conductor pattern without using a conventional air bridge or the like. Tip that solved the problem
An object of the present invention is to provide a method for manufacturing a product .

Another object of the present invention is to provide a conventional technology in which a plurality of terminal electrodes are provided at opposite ends, and a conductor pattern extending from each of the plurality of terminal electrodes is provided on the front and back surfaces of the substrate. and to provide a small and a manufacturing method of the multi-functional chip unit products were not.

[0008]

According to a first aspect of the present invention, there is provided a method for manufacturing a chip component, wherein a predetermined conductive pattern and a terminal electrode can be simultaneously formed. Or a step of forming a terminal electrode forming hole which has a U-shape facing each other and a part of the inner surface thereof becomes a part of a terminal electrode of a chip component, on a substrate in which a conductor film is formed in advance on an insulating plate; Forming a conductive film on the substrate and on the inner surface of the terminal electrode forming hole by plating,
The conductor film on the substrate or the conductor film on the inner surface of the terminal electrode forming hole together with the conductor film on the substrate is patterned by an etching method to form a terminal electrode continuous with the five surfaces of the chip component. Forming a predetermined conductor pattern including:
Forming a slit or a groove at a position on the substrate passing through a portion of the chip component where no terminal electrode is formed, and separating the chip component from the substrate.

In the method for manufacturing a chip component according to the first aspect, a U-shaped terminal electrode forming hole facing each other is formed in advance on a substrate, and a conductive film is formed on an inner surface of the terminal electrode forming hole by plating. Is formed, and the conductive film on the inner surface of the terminal electrode forming hole is patterned together with the conductive film on the substrate or the conductive film on the substrate by an etching method to form five surfaces.
A predetermined conductor pattern including continuous terminal electrodes is formed.
It is, then, since the chip components from the substrate at a portion where the terminal electrode is not formed is separated, is formed with a conductor pattern and the terminal electrodes required simultaneously, the terminal electrodes before and is separated as a chip component formed Continuation on 5 sides
The manufacturing cost of a chip component having a terminal electrode is greatly reduced.

According to a second aspect of the present invention, there is provided a method for manufacturing a chip component, wherein an electrically conductive pattern is formed on the front and back surfaces of the substrate, and an insulating substrate is provided for facilitating conduction between the two. Alternatively, on a substrate in which a conductor film is formed in advance on an insulating plate, a U-shaped terminal electrode forming hole and a chip component forming region opposed to each other , in which a part of the inner surface becomes a part of the terminal electrode of the chip component. Forming a via hole in the substrate, forming a conductive film on the front and back surfaces of the substrate, the inner surface of the terminal electrode formation hole and the inner surface of the via hole by plating, and forming a conductive film on the front and back surfaces of the substrate. predetermined conductor pattern including a body membrane or terminal electrodes continuous to five surfaces of the chip component with a conductive film on the front and back surfaces of the conductive film of the inner surface of the terminal electrode-forming holes are patterned by etching of the substrate Forming, the forming slits or grooves in position on the substrate through a chip component parts are the terminal electrode is not formed in, and a step of separating the chip components from the substrate.

[0011]

A method for manufacturing a chip component according to claim 2By law
Has holes for terminal electrodes and holes for via holes in the substrate.
After being formed, the front and back surfaces of the substrate, terminal electrodes
Conductor film is formed on the inner surfaces of the formation holes and via holes.
And the conductive film on the front and back surfaces of the substrate is etched
Or terminal electrode formation holes with the conductor film on the front and back of the substrate.
The inner conductive film is patternedEdge that is continuous on 5 sides
A predetermined conductor pattern including a child electrode is formed,afterwards
Since the chip components are separated from the board,
Via holes with predetermined conductor patterns and terminal electrodes
Will also be formed at the same time,Terminals connected to 5 sides
With polesThe conductor pattern on the front and back of the substrate is the substrate
Easy to manufacture chip components that conduct through the inside
become.

[0013]

[0014]

[0015]

[0016]

[0017]

DETAILED DESCRIPTION OF THE INVENTION explaining the manufacturing method of the chip part article according to the first embodiment of the present invention below based on FIGS. 1 to 11.

FIG. 1 is a partial perspective view showing a state in which a terminal electrode forming hole and a via hole are formed in an insulating substrate. In FIG. 1, reference numeral 1 denotes an insulating substrate, on which U-shaped terminal electrode forming holes 2 facing each other are arranged vertically and horizontally. Also, via-holes 3 are formed in the chip component formation region.

FIG. 2 is a partial perspective view showing a state in which a conductive film is plated on the entire surface of the substrate from the state shown in FIG. 1, a photoresist film is applied, exposed, developed, and then etched. In FIG. 2, reference numerals 6 denote terminal electrodes located at opposite ends of the chip component, each being formed continuously on five surfaces. 3 'is a via hole formed by forming a conductive film on the inner surface of the via hole (3). A spiral conductive pattern 7 extending from the terminal electrode 6 to the via hole 3 'is formed on the front and back surfaces of the region to be the chip component.

FIG. 3 is a perspective view of a single chip component separated from the substrate 1 by cutting off a two-dot chain line portion from the state shown in FIG. 2, and FIG. 4 is a perspective view of the chip component shown in FIG. 3A and 3B are a top view and a bottom view, respectively. However, the protective film is omitted in FIGS. 3 and 4. By forming the conductor patterns 7 extending spirally from the terminal electrodes 6 to the via holes 3 'on the front and back surfaces of the substrate, a predetermined inductance is generated between the two opposing terminal electrodes 6-6. Become.

Next, a method of manufacturing the above-mentioned chip component will be described with reference to FIGS.
This will be described with reference to FIG.

[0022] First, by sea urchin shown in FIG. 5, for example, to select the insulating substrate 1 such as a glass cloth-epoxy glass substrate. As shown in FIG. 6, a hole 2 for forming a terminal electrode and a hole 3 for a via hole are formed in the same substrate 1 by milling with an NC drilling machine or pressing with a press machine in the same step. Next, as shown in FIG. 7, the conductor film 4 is applied to the front and back surfaces of the substrate and the inner surfaces of the holes by electroless plating of copper or the like and electrolytic plating. Subsequently, as shown in FIG. 8, a photoresist film is applied to the entire surface by an electrodeposition method. Thereafter, a photomask is patterned on the both surfaces of the substrate by irradiating the photomask with scattered light and developing the photomask as shown in FIG. Subsequently, the conductor film 4 is etched and the resist film 5 is removed to form a spiral-shaped conductor pattern 7 on both surfaces of the substrate as shown in FIG. Form. Then, FIG.
The protective film 8 is printed on portions other than the terminal electrodes 6 as shown in FIG. Finally, as shown by a two-dot chain line in FIG. 2, individual chip components are separated at positions passing through portions where terminal electrodes are not formed. This is performed by forming a groove having a V-shaped cross section with a V-cut machine (slitter) and dividing the groove, or by dicing with a dicing saw.

Although FIGS. 5 to 11 show an example in which the insulating substrate 1 is used as a starting material, for example, a copper-clad laminated substrate in which an insulating base material is laminated with a copper foil is similarly used as a starting material. be able to.

Next, another example of the terminal electrode forming hole will be described in the second.
Third and fourth embodiments will be described with reference to FIGS.

FIG. 12 is a plan view of a terminal electrode forming hole according to the second embodiment. In FIG. 12, reference numerals 2 denote terminal electrode forming holes, and a region indicated by A is a chip component forming region. In this manner, the terminal electrode forming holes of the adjacent chip components may be provided as continuous holes.

[0026]

[0027] Figure 1 3 is a plan view of the terminal electrode forming holes according to the third embodiment. In this example, a C-shaped terminal electrode forming hole 2 is provided to form a terminal electrode 6, which is separated at one location indicated by a two-dot chain line.

[0028] Figure 1 4 is a plan view of the terminal electrode forming holes according to a fourth embodiment. In this example, the terminal electrode forming holes 2 are formed, and the terminal electrodes 6a and 6b are formed at the four corners of the chip component forming region, respectively, to obtain a four-terminal chip component.

[0029] Next, a perspective view of a chip component according to a fifth embodiment in FIG 5. The chip component is obtained by separating from the substrate by a two-dot chain line portion from the state shown in FIG 4. As described above, the terminal electrodes 6a and 6b are formed at the four corners of the substrate 1, and both ends of the terminal electrodes 6a and 6b are formed on the substrate surface.
a, serpentine conductor pattern 7 connected to 6a
Are formed, and both terminal electrodes 6 are also provided on the back side of the substrate 1.
A serpentine conductor pattern connected to b and 6b is formed. Thereby, the space between the terminal electrodes 6a and 6b functions as a transformer such as a transformer.

[0030] Then 1 6 a configuration of a chip component according to a sixth embodiment as external perspective view. In this example, six via holes 3 'are formed in the substrate 1, a distributed constant circuit is formed by these via holes, and the terminal electrode 6 and a part of the via holes are connected on the front surface or the back surface of the substrate. ing. According to the present invention, the conductor pattern required for the chip component, the via hole, and the terminal electrode are formed substantially at the same time, and thus the chip component incorporating the distributed constant circuit using the plurality of via holes can be easily formed. Is obtained.

[0031]

According to the first aspect of the present invention, a conductor pattern and a terminal electrode required for a chip component are simultaneously formed, and the terminal electrode is formed before being separated as a chip component. Costs are greatly reduced.

According to the second aspect of the present invention, the conductor pattern, the via hole, and the terminal electrode required for the chip component are formed simultaneously, and the terminal electrode is formed before being separated as the chip component. A chip component having conductor patterns on the front and back surfaces of the substrate and conducting both conductor patterns through the inside of the substrate can be easily manufactured.

[0033]

[0034]

[Brief description of the drawings]

FIG. 1 is a partial perspective view showing a state in the course of manufacturing a chip component according to a first embodiment.

FIG. 2 is a partial perspective view showing a state during the manufacture of the chip component according to the first embodiment.

FIG. 3 is an external perspective view of a chip component.

FIG. 4 is a top view and a bottom view of the chip component.

FIG. 5 is a sectional view of an insulating substrate.

FIG. 6 is a cross-sectional view after forming a terminal electrode forming hole and a via hole.

FIG. 7 is a cross-sectional view after a conductor film is formed.

FIG. 8 is a sectional view after a photoresist film is formed.

FIG. 9 is a cross-sectional view after patterning the photoresist film.

FIG. 10 is a cross-sectional view after conductor film etching.

FIG. 11 is a cross-sectional view after a protective film is applied.

FIG. 12 is a plan view showing an example of forming a terminal electrode forming hole according to a second embodiment.

FIG. 13 is a plan view illustrating an example of forming a terminal electrode forming hole according to a third embodiment.

FIG. 14 is a plan view showing an example of forming terminal electrode forming holes according to a fourth embodiment.

FIG. 15 is an external perspective view of a chip component according to a fifth embodiment.

FIG. 16 is an external perspective view of a chip component according to a sixth embodiment.

FIG. 17 is a plan view of a conventional chip inductor.

FIG. 18 is a sectional view showing a state where a resist film is patterned on a substrate.

FIG. 19 is a cross-sectional view after a conductor film is formed.

FIG. 20 is a cross-sectional view after a conductor pattern is formed.

FIG. 21 is a cross-sectional view after patterning of a resist film and formation of a conductor film.

FIG. 22 is a cross-sectional view after an air bridge is formed.

FIG. 23 is a cross-sectional view after removing a resist film.

FIG. 24 is a cross-sectional view after a terminal electrode is formed.

[Explanation of symbols]

 Reference Signs List 1-substrate 2-hole for forming terminal electrode 3-hole for via hole 3'-via hole 4-conductor film 5-photoresist film 6-terminal electrode 7-conductor pattern 8-protective film 10-substrate 11-resist Film 12-conductor film 13-conductor pattern 14-resist film 15-conductor film 16-resist film 17-conductor film (air bridge) 18-terminal electrode

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 3/00 H01F 17/00

Claims (2)

(57) [Claims] 1. An insulating substrate or a substrate in which a conductor film is formed on an insulating plate in advance has a U-shape facing each other.
A step portion of the inner surface forms part become terminal electrode forming holes of the terminal electrodes of the chip component with the steps of forming by plating a conductive film on the inner surface of the substrate and the terminal electrode formed holes A terminal film that is formed by patterning the conductor film on the substrate or the conductor film on the inner surface of the terminal electrode forming hole together with the conductor film on the substrate by an etching method and is continuous with the five surfaces of the chip component. Forming a predetermined conductor pattern including: forming a slit or groove at a position on the substrate passing through a portion of the chip component where no terminal electrode is formed, and separating the chip component from the substrate. And a method for manufacturing a chip component. 2. An insulated substrate or a substrate in which a conductor film is formed on an insulating plate in advance has a U shape facing each other.
A step portion of the inner surface forms part become terminal electrode forming holes and chip components holes for via holes in the forming region of the terminal electrodes of the chip component with front and back surfaces of the substrate, for the terminal electrode formation Forming a conductive film on the inner surface of the hole and the via hole by a plating method; and forming a conductive film on the front and back surfaces of the substrate or the inner surface of the terminal electrode forming hole together with the conductive film on the front and back surfaces of the substrate. 5 of the chip component the conductor film is patterned by etching
Forming a predetermined conductor pattern including a terminal electrode continuous on a surface ; forming a slit or a groove at a position on the substrate passing through a portion of the chip component where the terminal electrode is not formed; Separating the chip component from the substrate.