JP2769201B2 - Bonding method and apparatus - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding technique, and more particularly to a technique effective when applied to a bonding apparatus such as an inner lead bonder, an outer lead bonder, a bump bonder, or a pellet bonder. .

[Prior art] Regarding bonding devices such as inner lead bonder and outer lead bonder used in the assembly process of semiconductor integrated circuit device, Industrial Research Institute Co., Ltd., issued on November 20, 1985, "Electronic Materials Separate Volume, 1986 Edition" , LSI Manufacturing / Testing Equipment Guidebook ”, pp. 154 to P159.

The inner lead bonder mounts the semiconductor chip on the bonding stage with the surface on which the bump electrodes are formed facing upward, and then transports the tape carrier with the leads formed above the semiconductor chip, and also removes the leads. The semiconductor chip and the inner lead are aligned by aligning the inner lead with the bump electrode of the semiconductor chip, and then lowering the bonding tool from directly above the semiconductor chip to press and heat the inner lead to melt the bump. This is a bonding device for bonding the above.

By the way, in the bonding process, in order to secure the yield and quality of products, it is necessary to make the pressing force on the lower surface of the bonding tool uniform within the surface. Therefore, it is necessary to adjust the flatness of the pressing surface of the bonding tool with respect to the surface to be bonded, that is, the degree of parallelism between the surface to be bonded and the pressing surface of the bonding tool (hereinafter, referred to as tool flatness). is there. Conventionally, to adjust the tool flatness, for example, the following has been performed. That is, the operator observes the crushed state of the tape when the bonding tool is pressed against the dummy tape or the crushed state of the joint of the product subjected to the bonding process, and manually adjusts the mounting state of the bonding tool from the observation result. Was.

[Problems to be solved by the invention]

However, the present inventor has found that the above-described conventional technique for adjusting the flatness of the tool has the following problems.

That is, since the mounting state of the bonding tool has to be manually adjusted by an operator, the operation has been a troublesome operation requiring time and labor.
And because it is manual, unless you are an expert,
For example, even if it takes time, the adjustment is difficult, and there is a problem that improvement of the adjustment accuracy is hindered.

In order to maintain the flatness of the tool, every time the bonding process is performed a predetermined number of times, it is checked whether the flatness of the tool has been changed due to the aging of the mechanism or the like. The state has to be observed and confirmed, and there is a problem that the efficiency of the bonding process is reduced.

The present invention has been made in view of the above problem, and an object of the present invention is to provide a technique capable of easily and always accurately setting a tool flatness.

Another object of the present invention is to provide a technique capable of improving the efficiency of a bonding process.

The above and other objects and novel features of the present invention are as follows.
It will be apparent from the description technology and the accompanying drawings.

[Means for solving the problem]

The outline of a representative invention among the inventions disclosed in the present application will be briefly described as follows.

That is, in the first invention, an electrode is overlapped with an end of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end of the lead, thereby forming the lead. When joining the electrode and the electrode, optically detects the crushed state of the bump at the joint between the lead and the electrode, and determines the flatness of the pressing surface of the bonding tool with respect to the surface to be bonded based on the detection information. This is automatically corrected.

According to a second aspect of the present invention, an electrode is superimposed on an end of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end of the lead. When joining the electrode and the electrode, the connection state of the joint between the lead and the electrode is electrically detected, and the flatness of the pressing surface of the bonding tool with respect to the surface to be bonded is automatically detected based on the detected information. Is corrected.

Further, a third invention is a bonding apparatus including a bonding tool for bonding an electrode to an end of a lead formed on a tape carrier via a bump, wherein the bump is crushed at a bonding portion between the lead and the electrode. Optical detection means for optically detecting a state, electric detection means for electrically detecting the connection state of the joint, and detection based on information detected by the optical detection means and the electric detection means. The bonding apparatus has a flatness correction means for automatically correcting the flatness of the pressing surface of the bonding tool with respect to the bonding surface.

[Action]

According to the first aspect, for example, a normal crushed state of the bump is registered in advance, and the crushed state of the bump is compared with the crushed state of the bump optically detected.
If the detected crushed state of the bump is out of the predetermined allowable range, the tool flatness is not good, and the tool flatness is automatically corrected based on the detection information. In addition, it is possible to always set with high accuracy.

In addition, since the bonding process is performed while automatically correcting the tool flatness, each time the bonding process is performed a predetermined number of times, the crushed state of the tape when pressed against the dummy tape and the crushed state of the actual product joint are reduced. This eliminates the need for observation and manual adjustment of the mounting state of the bonding tool based on the observation result, thereby improving the efficiency of the bonding process.

According to the second aspect, the tool flatness is automatically corrected based on electrical detection information such as a short between adjacent leads or an open state between each lead and an electrode. Therefore, it is possible to easily and accurately set the tool flatness.

In addition, since the bonding process is performed while automatically correcting the tool flatness, each time the bonding process is performed a predetermined number of times, the crushed state of the tape when pressed against the dummy tape and the crushed state of the actual product joint are reduced. The work of observing and manually adjusting the attachment state of the bonding tool from the observation result is eliminated, and the efficiency of the bonding process can be improved.

According to the third aspect, it is possible to detect an electrical connection state that cannot be detected only by the optical detection means, and it is also possible to detect a crushed state of the bump that cannot be detected by the electric detection means alone. Therefore, the detection accuracy is improved as compared with the case of using only one of the detection means,
It is possible to further improve the correction accuracy of the tool flatness.

〔Example〕

FIG. 1 is a schematic structural view of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is a partially enlarged plan view of a tape carrier and a semiconductor chip mounted thereon, and FIG. Schematic diagram showing the flatness correction means and the flatness detection means, FIG.
FIG. 5 is a schematic configuration diagram showing an electrical detection means of the bonding apparatus. FIG. 5A is an enlarged plan view of a semiconductor chip showing a case where a joint between a lead and an electrode is normal, and FIG.
FIG. 4 is an enlarged plan view of a semiconductor chip showing a case where a joint between a lead and an electrode is abnormal.

Hereinafter, the bonding apparatus of this embodiment will be described with reference to FIG. 1, FIG. 3, FIG. 4 and FIG.

The bonding apparatus 1 of the present embodiment shown in FIG. 1 is, for example, an inner lead bonder.

The XY stage 3a, Θ
A stage 3b and a bonding stage 3c are mounted. XY stage 3a and Θ stage 3b
Is moved by the XY stage control circuit 3d.

On the bonding stage 3c, a semiconductor chip 4 supplied from a chip supply mechanism (not shown) is held by vacuum suction with a bump electrode formation surface described later facing upward. The semiconductor chip 4 is provided with a camera 5 provided thereabove, a position detection image processing unit 6 electrically connected to the camera 5, and electrically connected to the position detection image processing unit 6. The microcomputer 7 is positioned at a predetermined position by an alignment mechanism constituted by the microcomputer 7 and an XY stage control circuit 3d electrically connected to the microcomputer 7. Note that the camera 5
It is electrically connected to the monitor 8 so that the image detected by the camera 5 can be viewed on the monitor 8. Further, the camera 5 is also electrically connected to the marker generation circuit 9.

On the mount 2, a supply reel 10a, a roller 10b, a sprocket wheel 10c, and a take-up reel 10d are mounted.
The supply reel 10a houses a tape carrier 11 made of, for example, a polyimide resin. Tape carrier 11
Is transported from the supply reel 10a by the sprocket wheel 10c, is aligned with the semiconductor chip 4 by the alignment mechanism at the bonding position, and then the semiconductor chip 4 is mounted by the bonding process, and the take-up reel 10d
It is designed to be stored in.

FIG. 2 shows a tape carrier on which a semiconductor chip 4 is mounted.
11 is shown. In the center of the tape carrier 11, a plurality of rectangular device holes 12a are formed at regular intervals along the longitudinal direction of the tape carrier 11. In the vicinity of the side edge of the tape carrier 11, a sprocket hole 12b
Are perforated at regular intervals.

On the main surface of the tape carrier 11, a plurality of leads 13 made of, for example, copper are formed along the outer periphery of the device hole 12a. Then, the inner lead portion 13a at one end of the lead 13
Are projected into the device hole 12a and are electrically connected to the bump electrodes 14 of the semiconductor chip 4 arranged in the device hole 12a. Further, the other end of the lead 13 has a test pad 13b to which a probe to be described later abuts, for example, when inspecting a conduction state between the inner lead portion 13a and the bump electrode 14.
Are formed.

Above the bonding stage 3c of the bonding apparatus 1, a bonding tool 15 for bonding the inner lead portion 13a of the tape carrier 11 and the bump electrode 14 of the semiconductor chip 4 is provided. As shown in FIG. 3, a tool tip 15a is joined to a lower portion of the bonding tool 15. Further, the bonding tool 15 is provided with a heater 15b and a thermoelectric material 15c. The upper part of the bonding tool 15 is joined to the tool holder 16.
A plurality of contact knobs 16a extending downward are joined to a peripheral edge on the lower surface side of the tool holder 16. Tool holder 1
6, the upper surface is hemispherical, the hemispherical portion is fitted into a spherical seat formed on the lower surface side of the tool copying mechanism 17, and is punched from the side wall of the tool copying mechanism 17 into the spherical seat. Vacuum suction is performed by the vacuum suction hole 17a. Therefore, the bonding tool 15 is held by the tool copying mechanism 17 in a swingable state.

A tool vertical drive mechanism 19 is provided on the tool copying mechanism 17 via a load cell 18. Load cell 18
Is electrically connected to the load control circuit 20, converts the pressure applied by the tool up / down drive mechanism 19 into an electric signal, and transmits the signal to the load control circuit 20.

The tool up-down drive mechanism 19 includes, for example, a motor and a cam linked to the drive of the motor.
And a mechanism for pressing against the joint during the bonding process. The tool vertical drive mechanism 19 is mechanically connected to the tool height control mechanism 21.

The tool height control mechanism 21 includes a microcomputer 7, a load control circuit
A mechanism for electrically setting the height H of the bonding tool 15 based on a control signal transmitted from them and a tool flatness correction circuit (flatness correction means) 22.

The tool flatness correction circuit 22 is electrically connected to the microcomputer 7 and the flatness adjustment driving unit (flatness correction means) 23, and receives the tool flatness correction signal (hereinafter, correction signal) transmitted from the microcomputer 7. ), The driving amount of the flatness adjustment driving section 23 is controlled.

The flatness adjustment drive unit 23 includes a motor 23a and a moving unit 23b that moves in the horizontal direction in the figure in conjunction with driving of the motor 23a. The moving portion 23b has an end portion at the tool holder 1
The contact knob 16a provided at 6 is brought into contact with the contact knob 16a. The motor 23a is driven based on a correction signal from the microcomputer 7 to move the moving portion 23b in the horizontal direction in a state where the moving portion 23b is in contact with the contact knob 16a, and the bonding tool 15 is moved to the spherical seat of the tool copying mechanism 17. The tool flatness is automatically corrected by swinging along. Although not shown, a plurality of flatness adjustment drive units 23 are provided so that the tip of the tool tip 15a can be moved forward and backward, left and right, and rotated.

Further, in this embodiment, a flatness detecting means 24 for detecting the tool flatness is provided at a position different from the bonding position. The flatness detecting means 24 includes a height post 24a and a contact chip 24b provided on the height post 24a.
It is composed of The contact chip 24b is composed of, for example, a piezoelectric converter that converts pressure into an electric signal. The contact chip 24b is electrically connected to the microcomputer 7, and can transmit a detected electric signal to the microcomputer 7. Therefore, in the present embodiment, the bonding tool 15 is moved downward in FIG. 3 by a mechanism such as the tool vertical drive mechanism 19 and the tool height control mechanism 21,
The flatness of the tool can be detected by bringing the lower surface (pressing surface) into contact with the contact chip 24b.

Note that the bonding tool 15, the tool vertical mechanism 19, the tool height control mechanism 21, the tool flatness adjustment drive unit 23, and the like can be moved in a horizontal plane by an XY table (not shown).

On the other hand, in the present embodiment, a camera 25 as optical detection means is provided between the bonding tool 15 of the bonding apparatus 1 and the sprocket wheel 10c.
The camera 25 uses the bump electrode 4 (second
This is a detector for optically detecting the collapse state of the bump (see the figure), and is electrically connected to the monitor 26 so that the collapse state of the bump detected by the camera 25 can be visually observed. Further, the camera 25 is electrically connected to the microcomputer 7 via the position detection image processing unit 6 and the crush amount detection image processing unit 27. The crush amount detection image processing unit 27 includes, for example, a camera 25.
The crushed state of the valve transmitted from the camera 25 is compared with the normal crushed state of the bump registered in advance, and it is determined whether the crushed state of the bump transmitted from the camera 25 is normal or not. It is designed to be transmitted. If the bump crush state detected by the camera 25 is abnormal, the microcomputer 7 calculates the moving direction and the flatness correction amount of the bonding tool 15, and uses the result as a correction signal to perform tool flatness correction. The signal is transmitted to a circuit 22 (see FIG. 3). In addition, the camera 25 is electrically connected to the marker generation circuit 9 similarly to the camera 5 described above.

Further, in the present embodiment, a probe 28a serving as electrical detection means and an open / short checker 28b electrically connected to the probe 28a are provided downstream of the camera 25. FIG. 4 shows a continuity test probe 28a and an open / short checker 28b. One end of the probe 28a is in contact with the test pad 13b of the lead 13. The other end of the probe 28a is joined to a probe card 29, and the probe card 29 is joined to a card holder 30.
The card holder 30 is joined to the slide shaft 31a.
The slide shaft 31a is rotatably supported by a slide bearing 31b, and is linearly moved up and down by a vertical drive mechanism (not shown). And this slide shaft 31
The probe 28a is configured such that one end of the probe 28a comes into contact with the test pad 13b of the lead 13 or moves away from the test pad 13b by the vertical movement of a.

The open / short checker 28b is electrically connected to the microcomputer 7 that controls the bonding device 1. The microcomputer 7 adds, for example, the adjacent lead 1 to the detection signal transmitted from the open / short checker 28b.
When abnormalities such as short-circuit between 3, 13 and opening of each lead 13 and bump electrode 14 are confirmed, the moving direction and flatness correction amount of the bonding tool 15 are calculated based on the detection signal, and as a result, As a correction signal to the tool flatness correction circuit 22 (see FIG. 2).

Next, the bonding method of this embodiment will be described with reference to FIGS. 1 to 4 and FIGS. 5 (a) and 5 (b).

First, the bonding tool 15 is moved above the flatness detecting means 24 (see FIG. 3). Subsequently, the bonding tool 15 is moved to the tool vertical drive mechanism 19 and the tool height control mechanism 21.
It moves downward by such a mechanism. Then, the pressing surface of the bonding tool 15 against the surface to be bonded, that is, in this embodiment, the lower surface of the bonding tool 15 is brought into contact with the contact chip 24b to detect the tool flatness, and the detection signal is transmitted to the microcomputer 7. . Microcomputer 7
Calculates the moving direction of the tool and the flatness correction amount based on the detection signal, and transmits the result to the tool flatness correction circuit 22 as a correction signal. Tool flatness correction circuit 22
Moves the moving part 23b of the flatness adjusting drive part 23 in the horizontal direction by an amount equivalent to the correction amount with the end thereof in contact with the contact knob 16a, and moves the bonding tool 15 to the spherical seat of the tool copying mechanism 17. To automatically correct the tool flatness.

Next, the bonding tool 15 is moved to the bonding position, and the semiconductor chip 4 is subjected to a normal bonding process.
The bump electrodes 14 (see FIG. 2) of the tape carrier 11 are joined to the leads 13 of the tape carrier 11, and the semiconductor chip 4 is connected to the tape carrier 11.
Implement on top.

The state of the joint at this time is shown in FIGS. 5 (a) and 5 (b). In the bonding process, if the tool flatness is good, as shown in FIG. 5 (a), the bumps are crushed, the insulating states of the adjacent inner leads 13a, 13a, and the inner leads 13a and the bump electrodes are connected. The bonding state with 14 is good. Conversely, if the tool flatness is not good,
As shown in FIG. 5B, an abnormality occurs in the crushed state of the bump. The portion where the bonding tool 15 is in strong contact is such that the bump protrudes and the adjacent inner lead portions 13a, 13a are short-circuited. On the contrary, the portion where the tool is weakly contacted is the inner lead portion 13a and the bump electrode 14a. And the degree of joining with the wire cannot be sufficiently obtained, and the wire becomes open.

Camera 25 provided after the bonding tool 15
Means that the semiconductor chip 4 mounted on the tape carrier 11 is
When it is located below, the crushed state of the bump at the joint is optically detected, and the detection signal is transmitted to the crushed amount detection image processing unit 27. Then, the crush amount detection image processing unit 27
The tool flatness is determined by comparing the detected bump crush state with a preset normal bump crush state.
For example, when the information detected by the camera 25 is normal as shown in FIG. 5A, it is determined that the flatness of the tool is good. Conversely, for example, in the case shown in FIG. 5 (b), it is determined whether or not it is within the allowable range. To be transmitted. Microcomputer 7
Calculates the moving direction of the tool and the flatness correction amount based on the information, and transmits the result to the tool flatness correction circuit 22 as a correction signal. The tool flatness correction circuit 22
The flatness adjustment drive unit 23 is driven as described above to automatically correct the tool flatness.

Further, when the tape carrier 11 is conveyed and the semiconductor chip 4 mounted thereon is located below the probe 28a provided at the subsequent stage of the camera 25, the probe 28a moves downward, and the tip thereof is connected to the test pad of the lead 13. 13b (see FIG. 4), and adjacent inner lead portions 13a, 13a
The insulation state between them and the conduction state between each inner lead portion 13a and the bump electrode 14 are inspected.

At this time, if the joint is normal as shown in FIG. 5 (a), the open / short checker 28b includes:
A short circuit between the adjacent inner lead portions 13a, 13a and an open between each inner lead portion 13a and the bump electrode 14 are not detected. Therefore, it is confirmed that the tool flatness is good. Conversely, if the joint is abnormal, for example, as shown in FIG. 5 (b), the adjacent inner lead portions 13a, 13a,
Short between 13a and each inner lead 13a and bump electrode
Open with 14 is detected. In this case, the open / short checker 28b determines that the tool flatness is not good and transmits the information to the microcomputer 7. Microcomputer 7
Calculates the moving direction of the tool and the flatness correction amount based on the information, transmits the result to the tool flatness correction circuit 22 as a correction signal, and drives the flatness adjustment drive unit 23 to calculate the tool flatness. Correct automatically.

As described above, according to the present embodiment, the following effects can be obtained.

(1). At the subsequent stage of the bonding tool 15, a detecting means for optically detecting the crushed state of the bump is provided, and the tool flatness is automatically corrected based on the information transmitted from the detecting means, so that the tool flatness can be easily adjusted. , And can always be set with high accuracy. In addition, since the bonding process is performed while automatically correcting the tool flatness, the working efficiency of the bonding process can be greatly improved.

(2). A detecting means is provided at the subsequent stage of the optical means for electrically detecting a connection state of the joint, and the tool flatness is automatically corrected based on information transmitted from the detecting means, thereby facilitating the tool flatness. , And can always be set with high accuracy. In addition, since the bonding process is performed while automatically correcting the tool flatness, the working efficiency of the bonding process can be greatly improved.

(3). At a position different from the bonding position, a flatness detecting means 24 for detecting the tool flatness is provided, and the tool flatness is automatically corrected based on the information transmitted from the detecting means. In addition, it is possible to always set with high accuracy.

(4). By providing the detection means (1) to (3) and correcting the tool flatness based on the information detected by each detection means, it is possible to further improve the correction accuracy of the tool flatness.

(5). According to the above (1) to (4), a highly reliable semiconductor integrated circuit device can be obtained.

(6). According to the above (1) to (5), the yield and productivity of the semiconductor integrated circuit device are greatly improved.

As described above, the invention made by the inventor has been specifically described based on the embodiments. However, the present invention is not limited to the embodiments, and it can be said that various modifications can be made without departing from the gist of the invention. Not even.

For example, in the above-described embodiment, the case where the tool copying mechanism of the vacuum suction spherical seat type is applied has been described. However, the present invention is not limited to this, and various changes can be made. For example, the bearing swing type shown in FIG. The tool copying mechanism 17 may be applied. In this case, when the dial 32a is rotated, the bonding tool 15 swings back and forth in the figure,
When rotating 32b, the bonding tool 15 swings in the horizontal direction in the figure.
A motor (not shown) may be mechanically connected to the a and 32b, and the tool flatness may be automatically corrected by its rotational drive.

Further, in the above embodiment, the case where the bonding apparatus is provided with both the optical detecting means and the electrical detecting means is described. However, the present invention is not limited to this. For example, one of the detecting means may be provided. It is possible to obtain a sufficient effect by providing only.

In the above description, mainly the case where the invention made by the present inventor is applied to the inner lead bonder, which is the field of use as the background, is not limited to this, and various applications are possible, for example, the outer lead bonder. The present invention can be applied to a bonding apparatus such as a bumper, a bump bonder or a pered bonder.

〔The invention's effect〕

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

(1). That is, an electrode is overlapped with an end of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end of the lead to join the lead and the electrode. A first step of optically detecting a crushed state of a bump at a joint between the lead and the electrode, and automatically correcting flatness of a pressing surface of a bonding tool with respect to a surface to be bonded based on the detection information. According to the invention, it is possible to easily and always accurately set the tool flatness. In addition, the efficiency of the bonding process can be improved.

(2). An electrode is overlapped with an end of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end of the lead to join the lead and the electrode. According to the second invention, the connection state of the joint between the lead and the electrode is electrically detected, and the flatness of the pressing surface of the bonding tool with respect to the surface to be bonded is automatically corrected based on the detected information. In this case, it is possible to obtain the same effect as the above (1).

(3). What is claimed is: 1. A bonding apparatus comprising: a bonding tool for bonding an electrode to an end of a lead formed on a tape carrier via a bump, wherein the bonding tool optically detects a crushed state of a bump at a bonding portion between the lead and the electrode. Electrical detection means, electrical detection means for electrically detecting the connection state of the joining portion, and pressing of the bonding tool against the surface to be bonded based on information detected by the optical detection means and the electrical detection means. According to the third aspect in which the flatness correction means for automatically correcting the flatness of the surface is provided, it is possible to further improve the correction accuracy of the tool flatness.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is a partially enlarged plan view of a tape carrier and a semiconductor chip mounted thereon, and FIG. FIG. 4 is a schematic configuration diagram showing the flatness correction unit and the flatness detection unit, FIG. 4 is a schematic configuration diagram showing an electrical detection unit of the bonding apparatus, and FIG. 5 (a) is a joint between a lead and an electrode. FIG. 5B is an enlarged plan view of a semiconductor chip showing a case where a junction between a lead and an electrode is abnormal, and FIG. 6 is another embodiment of the present invention. It is a front view of the tool copying mechanism of the example bonding apparatus. DESCRIPTION OF SYMBOLS 1 ... Bonding device, 2 ... Stand, 3a ... XY stage, 3b ... {stage}, 3c ... Bonding stage, 3d ... XY stage control circuit, 4 ... Semiconductor chip, 5 ... Camera, 6 ... Image processing unit for position detection, 7 ...
... microcomputer, 8 ... monitor, 9 ... marker generation circuit, 10
a ... supply reel, 10b ... roller, 10c ... sprocket wheel, 10d ... take-up reel, 11 ... tape carrier, 12a ... device hole, 12b ... sprocket hole, 13 ...
... Lead, 13a ... Inner lead part, 13b ... Test pad, 14 ... Bump electrode, 15 ... Bonding tool,
16 ... Tool holder, 16a ... Contact knob, 17 ...
... Tool copying mechanism, 17a ... Vacuum suction hole, 18 ... Load cell, 19 ... Tool vertical drive mechanism, 20 ... Load control circuit, 21 ... Tool height control mechanism, 22 ... Tool flatness correction circuit ( Flatness correction means), 23 flatness adjustment drive unit (flatness correction means), 23a motor, 23b moving unit,
24 …… Tool flatness detection means, 24a …… Height post, 24b
... contact chip, 25 ... camera (optical detection means), 26 ... monitor, 27 ... image processing unit for crush amount detection, 28
a …… probe (electrical detection means), 28b …… open
Short checker (electrical detection means), 29: probe card, 30: card holder, 31a: slide shaft, 31b
…… Slide bearing, 32a, 32b …… Dial.

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Akihiro Nishimura 2-51, Inahei, Musashimurayama-shi, Tokyo 1 Shinkawachi Co., Ltd. 1 Shinkawachi Co., Ltd. (56) References JP-A-3-44041 (JP, A) JP-A-2-148747 (JP, A) JP-A-63-200541 (JP, A) (58) Fields investigated ( Int.Cl. ⁶ , DB name) H01L 21/60 311

Claims (8)

(57) [Claims] An electrode is superimposed on the end of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end of the lead, thereby forming the lead and the electrode. And a method of optically detecting a crushed state of a bump at a joint between the lead and the electrode, and based on the detected information, a flatness of a pressing surface of the bonding tool with respect to the surface to be bonded. The bonding method characterized in that the correction is automatically made. 2. A bonding apparatus provided with a bonding tool for bonding an electrode to an end of a lead formed on a tape carrier via a bump, wherein a bonding state of the bump at a bonding portion between the lead and the electrode is optically determined. A bonding apparatus, comprising: a flatness correction mechanism for automatically correcting the flatness of a pressing surface of a bonding tool with respect to a surface to be bonded, based on information detected in an automatic manner. 3. A bonding apparatus according to claim 2, wherein said flatness correcting mechanism detects flatness of a pressing surface of a bonding tool with respect to said surface to be bonded, and flattening of a bump at said bonding portion. Optical detecting means for optically detecting a state, and flatness correcting means for correcting flatness of a pressing surface of a bonding tool with respect to the surface to be bonded based on information detected from the respective detecting means. A bonding apparatus. 4. An electrode is overlapped with an end of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end of the lead, thereby forming the lead and the electrode. A connection state of a bonding portion between the lead and the electrode, and automatically determines a flatness of a pressing surface of the bonding tool with respect to the surface to be bonded based on the detection information. A bonding method characterized in that the correction is performed dynamically. 5. A bonding apparatus provided with a bonding tool for bonding an electrode to an end of a lead formed on a tape carrier via a bump, wherein a connection state of a bonding portion between the lead and the electrode is electrically determined. A bonding apparatus comprising: a flatness correction mechanism for automatically correcting flatness of a pressing surface of a bonding tool with respect to a surface to be bonded based on detected information. 6. The bonding apparatus according to claim 5, wherein the flatness correction mechanism detects flatness of a pressing surface of the bonding tool with respect to the surface to be bonded and flatness detection means, and determines a connection state of the bonding portion. An electrical detection means for electrically detecting, and flatness correction means for correcting the flatness of the pressing surface of the bonding tool with respect to the surface to be bonded based on the information detected from the respective detection means. Bonding equipment. 7. An electrode is superimposed on an end portion of a lead formed on a tape carrier via a bump, and a pressing surface of a bonding tool against a surface to be bonded is pressed against the end portion of the lead, thereby forming the lead and the electrode. A step of optically detecting a crushed state of a bump at a junction between the lead and the electrode, and a step of electrically detecting a connection state of a junction between the lead and the electrode. And automatically correcting the flatness of the pressing surface of the bonding tool with respect to the surface to be bonded based on the detection information obtained by the optical detection step and the detection information obtained by the electric detection step. A bonding method comprising: 8. A bonding apparatus provided with a bonding tool for bonding an electrode to an end of a lead formed on a tape carrier via a bump, wherein a bonding state between the lead and the electrode is crushed by an optical device. Optical detection means for electrically detecting, electrically detecting means for electrically detecting the connection state of the joint portion, and an optical detection means for detecting a connection state with respect to the surface to be bonded based on information detected by the optical detection means and the electrical detection means. A bonding apparatus comprising: flatness correcting means for automatically correcting flatness of a pressing surface of a bonding tool.