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JP2771196B2 - Prediction method of pressure loss in mold and mold flow path design method using the same - Google Patents
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JP2771196B2 - Prediction method of pressure loss in mold and mold flow path design method using the same - Google Patents

Prediction method of pressure loss in mold and mold flow path design method using the same

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Publication number
JP2771196B2
JP2771196B2 JP63272966A JP27296688A JP2771196B2 JP 2771196 B2 JP2771196 B2 JP 2771196B2 JP 63272966 A JP63272966 A JP 63272966A JP 27296688 A JP27296688 A JP 27296688A JP 2771196 B2 JP2771196 B2 JP 2771196B2
Authority
JP
Japan
Prior art keywords
flow path
mold
resin
section
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63272966A
Other languages
Japanese (ja)
Other versions
JPH02120643A (en
Inventor
準一 佐伯
勇 吉田
愛三 金田
和宏 杉野
邦彦 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63272966A priority Critical patent/JP2771196B2/en
Priority to KR1019890015521A priority patent/KR920004583B1/en
Priority to EP89120184A priority patent/EP0367218B1/en
Priority to DE68925343T priority patent/DE68925343T2/en
Priority to US07/429,471 priority patent/US5125821A/en
Publication of JPH02120643A publication Critical patent/JPH02120643A/en
Application granted granted Critical
Publication of JP2771196B2 publication Critical patent/JP2771196B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は熱硬化性樹脂の成形用金型に係り、特に製品
の欠陥低減に好適な金型流路設計法に関する。
Description: BACKGROUND OF THE INVENTION The present invention relates to a mold for molding a thermosetting resin, and more particularly to a mold flow path design method suitable for reducing defects in products.

〔従来の技術〕[Conventional technology]

従来の熱硬化性樹脂用キャビティ多数ヶ取り金型流路
の設計法は、特公昭55−17697号に記載のように金型の
ランナ底を樹脂の流れの方向に漸次減少させるとともに
ゲートの絞り角をポットからランナに沿って遠ざかる各
キャビティに対応させて漸次増加するように流路を形成
し、ランナとゲートにおける圧力損失の合計が各々のキ
ャビティに対して一定になるようにしていた。
The conventional method of designing a multi-cavity mold flow path for thermosetting resin is to reduce the runner bottom of the mold gradually in the direction of resin flow and to restrict the gate as described in JP-B-55-17697. The flow path was formed so that the corner was gradually increased corresponding to each cavity moving away from the pot along the runner, so that the total pressure loss at the runner and the gate was constant for each cavity.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

上記従来技術は、複雑な流路形状の中を温度、粘度が
変化しながら流動する樹脂の流動挙動の予測法について
は考慮されておらず、樹脂を実際に各キャビティへ同速
度で充填させることは困難で、製品品質の向上には限界
があった。
The above prior art does not consider a method for predicting the flow behavior of a resin flowing while changing the temperature and viscosity in a complicated flow path shape, and it is necessary to actually fill each cavity with the resin at the same speed. Was difficult and the improvement of product quality was limited.

本発明の目的は、金型内の樹脂の流動状態を迅速、か
つ、高精度にシミュレートして最適金型諸元、成形条件
を設定し、製品開発期間の大幅な短縮と製品品質の向上
を図ることにある。
It is an object of the present invention to quickly and accurately simulate the flow state of a resin in a mold to set optimal mold specifications and molding conditions, thereby significantly shortening a product development period and improving product quality. It is to plan.

〔課題を解決するための手段〕[Means for solving the problem]

上記目的は、金型流路を複数の区間に分割し、各区間
において流路固有の形状抵抗βと流量Qを算出するとと
もに、各区間の円管形状に置き換え、この形状で流動シ
ミュレーションを行い、各部の樹脂の温度、粘度、流
速、平均見掛け粘度aを算出し、圧力損失ΔPをΔP
=βaQで求めて流動予測を行うことにより達成され
る。この解析システムの構成を第1図に示す。第1図に
おいて、まず入力部では、シミュレーションに必要な樹
脂物性値、成形条件、金型流路諸元が入力される。次に
入力された金型流路諸元データは流路体積演算部と区間
分割部に入り、それぞれ流路全体の体積と分割すべき区
間とが求められる。区間分割部で処理されたデータは区
間体積演算部と区間形状抵抗演算部に入り、それぞれ各
区間の流路体積と形状抵抗が求められる。一方、区間体
積演算部で処理されたデータは円管流路置換部に入り、
各区間は円管流路の組み合わせに置換される。さらに、
流路体積演算部と区間体積演算部で処理されたデータ、
ならびに入力部に入力された成形条件の中の移送時間の
データは区間流量、区間通過時間演算部に入り、ここ
で、各区間を通過する樹脂の流量と区間を通過する時間
が求められる。そして、この演算部で処理されたデータ
と円管流路置換部で処理されたデータならびに入力部に
入力された成形条件データとを用いて、円管内の流動シ
ミュレーションを行い、流路各部の樹脂の温度、粘度、
流速、平均見掛け粘度などを算出する。この流動シミュ
レーション部での演算結果は粘度比較部に入り、結果に
問題があった場合はシミュレーションをやめ、入力条件
変更部で入力データの一部を変え、再び最初に戻る。一
方、粘度比較部で問題のない場合は、流動シミュレーシ
ョンで求まった各区間の平均見掛け粘度、ならびに各区
間の流量と形状抵抗とを用いて圧力損失演算部におい
て、各区間の圧力損失とこれを累積した総合圧力損失を
求める。この結果は圧力損失比較部に入り、計算された
圧力損失が所定の圧力損失よりも大きい場合には入力条
件変更部に入り、入力データの一部を変え再び最初に戻
る。圧力損失比較部で問題がないと判定された場合は、
出力部において、最終金型流路諸元、成形条件、その他
の必要な情報が出力される。
The above object is to divide the mold flow path into a plurality of sections, calculate the flow resistance Q and the flow rate unique to each section in each section, and replace each section with a circular pipe shape, and perform a flow simulation with this shape. , Calculate the temperature, viscosity, flow velocity, and average apparent viscosity a of the resin in each part, and calculate the pressure loss ΔP by ΔP
= ΒaQ to achieve flow prediction. FIG. 1 shows the configuration of this analysis system. In FIG. 1, first, an input unit inputs resin physical property values, molding conditions, and mold channel parameters required for a simulation. Next, the input mold flow path specification data enters the flow path volume calculation section and the section division section, and the volume of the entire flow path and the section to be divided are obtained. The data processed by the section dividing section enters the section volume calculating section and the section shape resistance calculating section, and the flow volume and the shape resistance of each section are obtained. On the other hand, the data processed by the section volume calculation unit enters the tubular flow passage replacement unit,
Each section is replaced with a combination of circular pipe channels. further,
Data processed by the channel volume calculation section and the section volume calculation section,
The data of the transfer time in the molding conditions input to the input section is input to the section flow rate and section passage time calculation section, where the flow rate of the resin passing through each section and the time passing through the section are obtained. Then, by using the data processed by the calculation unit, the data processed by the circular pipe flow replacement unit, and the molding condition data input to the input unit, a flow simulation in the circular pipe is performed, and the resin of each part of the flow path is analyzed. Temperature, viscosity,
Calculate the flow rate, average apparent viscosity, etc. The calculation result in the flow simulation unit enters the viscosity comparison unit. If there is a problem in the result, the simulation is stopped, a part of the input data is changed in the input condition changing unit, and the process returns to the beginning. On the other hand, when there is no problem in the viscosity comparing unit, the average apparent viscosity of each section obtained by the flow simulation, and the pressure loss calculation unit using the flow rate and the shape resistance of each section, and Obtain the accumulated total pressure loss. The result is input to the pressure loss comparing unit. If the calculated pressure loss is larger than the predetermined pressure loss, the input condition changing unit is changed, a part of the input data is changed, and the process returns to the beginning. If the pressure loss comparison section determines that there is no problem,
The output unit outputs final mold flow path specifications, molding conditions, and other necessary information.

〔作用〕[Action]

上記方法によれば、最適金型流路設計に必要な圧力損
失の計算で、流路固有の形状抵抗と流量は厳密に求ま
る。一方、流動解析が繁雑で莫大な計算時間を要する複
雑な実機金型流路形状は円管流路の組み合せに置き換
え、この中で平均見掛け粘度の計算を行うため、極めて
計算時間が短くてすみ、しかも実用上十分な圧力損失の
予測精度が確保できる。
According to the above method, the shape resistance and the flow rate specific to the flow path are strictly determined by calculating the pressure loss required for the optimal mold flow path design. On the other hand, the flow path is complicated and the flow path is complicated and the calculation time is enormous.Complicated actual machine mold flow path shape is replaced with a combination of circular pipe flow paths, and the average apparent viscosity is calculated. In addition, practically sufficient pressure loss prediction accuracy can be ensured.

〔実施例〕〔Example〕

以下、本発明の一実施例を第2〜13図、表1,2により
説明する。まず、円管内の流動シミュレーション手法に
ついて述べる。
Hereinafter, one embodiment of the present invention will be described with reference to FIGS. First, a flow simulation method in a circular pipe will be described.

熱硬化性樹脂用の等温粘度式を次のモデルで表わす。 The isothermal viscosity equation for thermosetting resins is represented by the following model.

ここで、η:粘度,η0:初期粘度,t0:ゲル化時間,c:粘
度上昇係数,T:絶対温度,t:時間である。また、 η(T)=aexp(b/T) ……(2) t0(T)=dexp(e/T) ……(3) c(T)=f/T−g ……(4) とする。a,b,d,e,f,gは成形条件に左右されないパラメ
ータである。(1)式は次の境界条件を満足する。
Here, η: viscosity, η 0 : initial viscosity, t 0 : gel time, c: viscosity increase coefficient, T: absolute temperature, and t: time. Also, η 0 (T) = aexp (b / T) (2) t 0 (T) = dexp (e / T) (3) c (T) = f / T−g (4) ). a, b, d, e, f, and g are parameters independent of molding conditions. Equation (1) satisfies the following boundary condition.

t=0のときη=η(T) ……(5) t=t0(T)のときη=∞ ……(6) 任意温度Tにおける(1)式の特性を第2図に示す。When t = 0, η = η 0 (T) (5) When t = t 0 (T), η = ∞ (6) The characteristic of equation (1) at an arbitrary temperature T is shown in FIG. .

金型内では樹脂は管壁から熱を受けながら流動するた
め非等温状態になっている場合が殆どである。次にこの
場合の粘度の予測法について説明する。まず、(1)式
を無次元整理すると次式が得られる。
In most cases, the resin flows in the mold while receiving heat from the tube wall, so that the resin is in a non-isothermal state. Next, a method of estimating the viscosity in this case will be described. First, the following expression is obtained by dimensionlessly rearranging the expression (1).

ここで、μ={η/η(T)}1/C(T) ……(8) τ=t/t0(T) ……(9) である。この曲線はτ=0でμ=1,τ=1でμ=∞とな
る特性を持つ。この曲線を第3図に示す。いま、第3図
において、τ=τでμ=μとなっており、このとき
の時間がt1,温度がT2とする。そして、時間がΔt経過
したときに温度もΔT増加し、時間,温度がそれぞれ
t2,T2になったときの新しい粘度を求めることにする。
(9)式よりτはtとTの関数になっており、新しい状
態τまでのτの増分Δτは次式で求められる。
Here, μ = {η / η 0 (T)} 1 / C (T) (8) τ = t / t 0 (T) (9) This curve has the property that μ = 1 at τ = 0 and μ = ∞ at τ = 1. This curve is shown in FIG. Now, in Figure 3, has a mu = mu 1 with tau = tau 1, In this case, time is t 1, the temperature and T 2. Then, when the time Δt has elapsed, the temperature also increases by ΔT, and the time and the temperature are respectively increased.
A new viscosity at t 2 and T 2 will be determined.
From equation (9), τ is a function of t and T, and the increment Δτ of τ up to the new state τ 2 is obtained by the following equation.

また、(9),(3)式より、次式が得られる。 Further, the following expression is obtained from the expressions (9) and (3).

(10)式のΔt,ΔTは第3図のようにあらかじめ分かっ
ており、(11)式にT=T1を(12)式にT=T1,τ=τ
を代入することにより、Δτが求まる。したがって、 τ=τ+Δτ ……(13) となり、(7)式でτ=τとしてμが求まる。
The Δt and ΔT in equation (10) are known in advance as shown in FIG. 3, and T = T 1 in equation (11) and T = T 1 and τ = τ in equation (12).
By substituting 1 , one obtains Δτ. Therefore, τ 2 = τ 1 + Δτ (13), and μ 2 is obtained from Expression (7) as τ = τ 2 .

そして、(8)式から次式が得られる。 Then, the following equation is obtained from the equation (8).

η=η(T)μC(T) ……(15) この(15)式にT=T2,μ=μの値を代入して、 より、新しい状態の粘度ηが求まる。η = η 0 (T) μ C (T) (15) By substituting the values of T = T 2 and μ = μ 2 into this equation (15), Thus, the viscosity η 2 in a new state is obtained.

この手法をτ=0から1までくり返すことにより、非
等温状態での初期からゲル化するまでの粘度変化を算出
することができる。
By repeating this method from τ = 0 to 1, it is possible to calculate the change in viscosity from the initial stage in a non-isothermal state to gelation.

樹脂が金型内を流動中の状態を解析するためには、上
記の粘度予測法と各種保存則の基礎式を組み合わせて解
くことが必要であり、円管流路の場合の各式を次に示
す。
In order to analyze the state of the resin flowing in the mold, it is necessary to solve by combining the above-mentioned viscosity prediction method and the basic equations of various conservation laws. Shown in

(17),(18),(19)式はそれぞれ,連続の式、運動
量、エネルギーの保存式である。(17)〜(19)式で、
Q:流量,R:円管半径、υZ:管軸方向流速、γ:管径方向
距離、Z:管軸方向距離、P:圧力、η:粘度、P:密度、T:
温度、t:時間、λ:熱伝導率である。(17)〜(19)式
を(1)〜(4)の等温粘度式、(7)〜(16)の非等
温粘度予測法と組み合わせて、与えられた初期条件、境
界条件の下に差分法、有限要素法などの数値解析法で解
けば、円管流路内での流動シミュレーションができる。
本実施例で用いたシミュレーションプログラムの概要を
第4図に示す。出力では、ニュートン流体が定常等温層
流しているものとみなしたときの平均見掛け粘度の値も
求められる。
Equations (17), (18), and (19) are continuous equations, momentum, and energy conservation equations, respectively. In equations (17) to (19),
Q: flow rate, R: circular pipe radius, υ Z : pipe axial velocity, γ: pipe radial distance, Z: pipe axial distance, P: pressure, η: viscosity, P: density, T:
Temperature, t: time, λ: thermal conductivity. The equations (17) to (19) are combined with the isothermal viscosity equations (1) to (4) and the non-isothermal viscosity prediction methods (7) to (16) to calculate the difference under the given initial conditions and boundary conditions. Solving with a numerical analysis method such as the finite element method enables a flow simulation in a circular pipe flow path.
FIG. 4 shows an outline of the simulation program used in this embodiment. In the output, the value of the average apparent viscosity when the Newtonian fluid is assumed to be in a steady isothermal laminar flow is also obtained.

表1に本実施例で用いた半導体封止用エポキシ樹脂の
物性値を示す。
Table 1 shows the physical property values of the epoxy resin for semiconductor encapsulation used in this example.

ここで、p,c,λは市販の熱物性測定装置を用いて得た値
である。また、a,b,d,e,f,gは(2),(3),(4)
式中のパラメータであり、これらの値は径の異なる数種
類の円管流路と数種類の金型温度条件を組み合わせて、
各条件での樹脂の平均見掛け粘度を実測し、これらの特
性値を元にして、外挿法やカーブフィッティング法など
により決定した。表1の物性値を第3図のシミュレーシ
ョンプログラムに入力して、円管流路内での平均見掛け
粘度ηaを算出したときの計算値と実測値の比較を第5
図に示す。各金型温度において両者は非常によく一致し
ており、本シミュレーション手法の妥当性が検証され
た。
Here, p, c, and λ are values obtained using a commercially available thermophysical property measuring device. A, b, d, e, f, g are (2), (3), (4)
These are the parameters in the formula, these values are obtained by combining several types of circular pipe channels with different diameters and several types of mold temperature conditions,
The average apparent viscosity of the resin under each condition was actually measured, and determined based on these characteristic values by an extrapolation method, a curve fitting method, or the like. The physical property values shown in Table 1 were input to the simulation program shown in FIG. 3, and the calculated value when the average apparent viscosity ηa in the circular pipe flow path was calculated was compared with the actually measured value in FIG.
Shown in the figure. At each mold temperature, the two agreed very well, and the validity of the simulation method was verified.

第6−a〜6−d図に樹脂封止半導体の製造プロセス
の概要を示す。第6−a図はリードフレーム1上にチッ
プ2を搭載し、これらを金線3で結線した状態の拡大図
および、このデバイスを複数ヶ搭載した多連リードフレ
ーム1を示す。第6−b図は上記デバイスを樹脂封止す
るプロセスを示したものである。まず、リードフレーム
1は下型4のキャビティ5の上に置かれ、上型6が閉じ
て金型内に固定される。一方、タブレット状に予備成形
された熱硬化性樹脂7は高周波予熱機(図示せず)で予
備加熱した後にポット8内に投入され、成形機(図示せ
ず)に取り付けられたプランジャー9を下降させる。こ
のとき、ヒーター10により加熱された金型から熱を受け
た樹脂7は溶融し、ランナ11,ゲート12を通ってキャビ
ティ5に流入する。キャビティ5内に樹脂7が充填完了
後、所定時間経過すると樹脂7は硬化し、第6−c図の
状態で金型から取り出される。そして、リードフレーム
1の切断,折り曲げ工程をへて、第6−d図の最終形状
が出来上がる。第6−b図において、各キャビティ5内
への樹脂7の充填時刻がずれると、樹脂の粘度,流速,
硬化状態が異なり、これらの要因に基ずく、ボイドの残
存、金線3の変形などが生じる問題がある。したがっ
て、次に樹脂7の充填状況を均一にするための流路設計
法について述べる。
6-a to 6-d show the outline of the manufacturing process of the resin-encapsulated semiconductor. FIG. 6A shows an enlarged view of a state in which chips 2 are mounted on a lead frame 1 and these are connected by gold wires 3, and a multiple lead frame 1 in which a plurality of such devices are mounted. FIG. 6-b shows a process of sealing the device with resin. First, the lead frame 1 is placed on the cavity 5 of the lower mold 4, and the upper mold 6 is closed and fixed in the mold. On the other hand, the thermosetting resin 7 preformed in the form of a tablet is preheated by a high frequency preheater (not shown) and then put into a pot 8, and the plunger 9 attached to the molding machine (not shown) is removed. Lower it. At this time, the resin 7 that has received heat from the mold heated by the heater 10 melts and flows into the cavity 5 through the runner 11 and the gate 12. After a predetermined time elapses after the cavity 7 is completely filled with the resin 7, the resin 7 is cured and taken out of the mold in the state shown in FIG. 6-c. Then, through the cutting and bending steps of the lead frame 1, the final shape shown in FIG. 6-d is completed. 6B, when the filling time of the resin 7 into each cavity 5 is shifted, the viscosity of the resin, the flow velocity,
The cured state is different, and there is a problem that the void remains, the gold wire 3 is deformed, and the like based on these factors. Therefore, a flow path design method for making the filling state of the resin 7 uniform will now be described.

樹脂の各キャビティへの充填状況を揃えるためには各
キャビティへ同流量を分配するときの各キャビティに到
るまでのランナとゲート部での圧力損失の和を等しくで
きる金型流路諸元を求めればよい。したがって、流路内
の圧力損失を見積るための計算が必要となるが、第6−
b図のランナ11,ゲート12の断面形状は半円底あるいは
逆台形になっており、しかも流動方向に沿って断面積が
変化する場合が殆どである。このような複雑な境界条件
のままで先の流動シミュレーションを行う計算時間が膨
大になり、実用的な設計システムにならない。したがっ
て、本発明では以下の手法を用いるようにした。すなわ
ち、流路を複数の区間に分割し、各区間において流路固
有の形状抵抗βと流量Qを算出するとともに、各区間を
円管形状に置き換え、この形状で流動シミュレーション
を行い、各部の樹脂の温度、粘度、流速、平均見掛け粘
度aを算出し、圧力損失ΔPを次式で求めるようにし
た。
In order to make the filling state of the resin into each cavity uniform, the mold flow path specifications that can equalize the sum of the pressure loss at the runner and the gate part until reaching each cavity when distributing the same flow rate to each cavity Just ask. Therefore, a calculation for estimating the pressure loss in the flow path is required.
The cross-sectional shape of the runner 11 and the gate 12 in FIG. b is a semicircular bottom or inverted trapezoid, and in most cases, the cross-sectional area changes along the flow direction. The calculation time required to perform the flow simulation in advance with such complicated boundary conditions becomes enormous, and it is not a practical design system. Therefore, the present invention uses the following method. That is, the flow path is divided into a plurality of sections, the flow path-specific shape resistance β and the flow rate Q are calculated in each section, and each section is replaced with a circular pipe shape, and a flow simulation is performed using this shape, and the resin , The temperature, the viscosity, the flow velocity, and the average apparent viscosity a were calculated, and the pressure loss ΔP was determined by the following equation.

ΔP=aQ ……(20) 第7−a図に流動方向に沿って断面積が変化する流路の
1区間の例を示す。Xは基準点から流動方向に沿う距離
であり、X1,X2はそれぞれ区間の始点、終点である。ま
た、Wは流路幅、hは流路深さであり、いずれもXの関
数となる。いま、この区間において、W≧hとするとβ
は次式で求められる。
ΔP = aQ (20) FIG. 7-a shows an example of one section of the flow path whose cross-sectional area changes along the flow direction. X is the distance along the flow direction from the reference point, and X 1 and X 2 are the start point and end point of the section, respectively. W is the width of the flow channel, h is the depth of the flow channel, and both are functions of X. Now, in this section, if W ≧ h, β
Is obtained by the following equation.

ここで、Fは流路断面形状およびWとhの比により決ま
る形状係数である。(21)式において、W,h,FをXの関
数形にして与え、解析的、あるいはシンプソンの公式な
どによる近似積分を行えばβが求まる。なお、W<hの
条件では を用いる。さらに、区間内にW≧hとなる箇所とW<h
となる箇所が共存する場合は、それぞれの位置で(2
1),(22)式を使い、足し合わせればよい。第7−b
図に置き換えた円管流路を示す。区間X1〜X2において、
管径が一様な円管とする。この径は第7−a図の区間体
積と第7−b図の区間体積とが同じになるように計算し
て決める。また、第7−b図の破線は流動方向に沿って
先細りの流路での区間X1〜X2の前後の区間での円管への
置き換え後の形状を示したものである。このように置き
換えをしたので、先に述べた円管内の流動シミュレーシ
ョン手法がそのまま使え、各区間での平均見掛け粘度
aを見積ることができる。また区間通過流量Qは、金型
流路体積Vfとプランジャの樹脂注入時間tpから、まず、
ポットから排出される流量QpをQp=Vf/tpで計算し、さ
らに、流路の分岐数に応じてQpを分配することによりあ
らかじめ求まる。以上により、各区間の圧力損失が求ま
り、これを累積して総合圧力損失ΔPTが求まる。
Here, F is a shape factor determined by the flow path cross-sectional shape and the ratio of W to h. In equation (21), β is obtained by giving W, h, F in the form of a function of X, and performing analytical or approximate integration by Simpson's formula or the like. In the condition of W <h, Is used. Further, a portion satisfying W ≧ h in the section and W <h
When there are coexisting locations, (2
What is necessary is just to add up using Formulas 1) and (22). 7-b
The figure shows the replaced circular channel. In the section X 1 to X 2,
A circular pipe with a uniform pipe diameter. This diameter is determined by calculation so that the section volume in FIG. 7-a is the same as the section volume in FIG. 7-b. The broken line of the 7-b diagram shows the shape after replacement of the circular tube before and after the section of the section X 1 to X 2 in the flow path of the tapered along the flow direction. Since the replacement is performed in this manner, the flow simulation method in a circular pipe described above can be used as it is, and the average apparent viscosity a in each section can be estimated. In addition, the section passing flow rate Q is first determined from the mold channel volume V f and the resin injection time tp of the plunger.
The flow rate Qp discharged from the pot is calculated in advance by Qp = Vf / tp, and is obtained in advance by distributing Qp according to the number of branches of the flow path. As described above, the pressure loss in each section is obtained, and the accumulated pressure loss is obtained to obtain the total pressure loss ΔP T.

第8図に第6−b図に示した構造のキャビティ多数ヶ
取り金型で各キャビティでの樹脂の充填状況を揃えるた
めのランナ,ゲート設計用フローチャートを示す。ま
ず、樹脂物性値、成形条件、金型諸元を入力する。この
うち、樹脂物性値は表1の記号に示した各樹脂毎の物理
量である。成形条件は、プランジャの樹脂注入時間tp,
成形機の設定プランジャ最大圧力PM,樹脂の予熱温度,
金型温度である。金型諸元は、第1回目の計算用とし
て、キャビティ間のピッチ,流路レイアウトなどの固定
因子以外の諸元は仮の値を入力しておく。次に、流路全
体の体積Vfを計算するとともに、流路を区間分割する。
このとき、区間の接合面の数は少なくとも流路の分岐数
と同じにし、区間内では樹脂の流れの分岐はないように
する。そして、区間体積Vnと区間形状抵抗βnを算出す
る。以上から、まず、ポットから排出される流量QpをQp
=Vf/tpで計算し、さらに流路の分岐数に応じてQpを分
配し、各区間の流量Qnを求める。このとき、各キャビテ
ィへ同流量を分配している状態を前提としておく。そし
て、Vn/Qnにより各区間の樹脂通過時間tnを求める。ま
た、Vnから体積が等しい円管流路の径を各区間毎に求め
る。このようにして置き換えた円管流路内での流動シミ
ュレーションを与えられた初期、境界条件の元に上流側
から逐次行い、各区間での樹脂の温度、粘度η、流速分
布、平均見掛け粘度ηaを算出する。ここで、各区間の
半径方向の所定位置において、下流側と上流側のηを比
較し、下流側が上流側よりもが上昇しないことをチェッ
クする。そして、もし下流側でηの上昇が起きた場合に
は、成形条件や金型諸元を変更して再計算を行う。これ
は、ηの上昇が流動途中で起きる条件は、キャビティ内
へ硬化反応の進んだ高粘度の樹脂が流入するため、成形
不良を起こす可能性が極めて高く、これを予め防止する
ことが目的である。ηの上昇のない条件が得られると、
まず、ランナ各区間の圧力損失ΔPRnをΔPRn=βn・
anQnで計算し、これを累積してランナ内の圧力損失ΔP
RTを求める。次に、比較用に予め設定したランナ内圧力
損失ΔPRs≦ΔPRTを比較し、ΔPRS≦ΔPRTとなったとき
には、金型流路、諸元、ブランジャの樹脂注入時間、樹
脂の予熱温度、金型温度のうち、少なくとも一条件の値
を変えて再入力してそのときのΔPRTを求め、逐次条件
変更を行いΔPRS>ΔPRTを満足するところで、ランナ諸
元と成形条件を決定する。これは、圧力損失が成形機の
設定プランジャ最大圧力PMに近づくと、プランジャが一
定速度で下降できなくなり、流動途中での樹脂の滞留に
より、成形不良を多発する現象があり、これをまずラン
ナ部で防止することが目的である。なお、ΔPRSはPM
りもかなり低い値にしておく。続いて、各キャビティに
到るまでのランナ部圧力損失とゲート部圧力損失の和が
一定になるように各ゲート部での圧力損失を設定する。
このとき、予め設定した圧力損失ΔPsと計算で求めた総
合圧力損失ΔPTを比較し、ΔPs≦ΔPTのときには、成形
条件、金型流路諸元の一部を再度変えて再計算を行う。
そして、ΔPs>ΔPTとなったところで、ゲート部に持た
せるべき圧力損失ΔPGnを決定する。なお、ΔPsはΔPRs
とPMの中間の値とする。そして、ΔPGnと流動シミュレ
ーションにより求めたゲート部平均見掛け粘度aG;な
らびにゲート部流量QGnから各ゲートで持たせるべき形
状抵抗βGnをβGn=ΔPGn/aG・QGnにより計算する。
そして、(21),(22)式に示した関係式を利用して、
ゲート部の諸元を逆算する。さらに、得られた諸元がゲ
ート部での制約条件、例えば流動方向に沿う先細り部の
角度の上,下限値,深さの上,下限値などを満足しない
場合は、金型諸元、成形条件の一部を変更して、制約条
件を満足するところでゲート諸元を決定する。
FIG. 8 is a flow chart for designing runners and gates for adjusting the resin filling state in each cavity in the multi-cavity mold having the structure shown in FIG. 6-b. First, a resin physical property value, molding conditions, and mold data are input. Among these, the resin physical property values are physical quantities for each resin indicated by the symbols in Table 1. The molding conditions are the resin injection time of the plunger tp,
Maximum setting of the molding machine plunger pressure P M, the resin preheating temperature,
Mold temperature. For the specifications of the mold, for the first calculation, provisional values are input for the specifications other than the fixed factors such as the pitch between cavities and the flow path layout. Next, the volume Vf of the entire channel is calculated, and the channel is divided into sections.
At this time, the number of junction surfaces in the section is at least equal to the number of branches in the flow path, and there is no branch in the resin flow in the section. Then, the section volume Vn and the section shape resistance βn are calculated. From the above, first, the flow rate Qp discharged from the pot is defined as Qp
= Vf / tp, and Qp is distributed according to the number of branches in the flow path to obtain the flow rate Qn in each section. At this time, it is assumed that the same flow rate is distributed to each cavity. Then, the resin passage time tn of each section is obtained from Vn / Qn. Further, the diameter of the circular pipe flow path having the same volume is obtained for each section from Vn. The flow simulation in the circular pipe channel replaced in this manner is sequentially performed from the upstream side under the given initial and boundary conditions, and the resin temperature, viscosity η, flow velocity distribution, and average apparent viscosity ηa in each section. Is calculated. Here, at a predetermined position in the radial direction of each section, η on the downstream side and that on the upstream side are compared, and it is checked that the downstream side does not rise above the upstream side. If an increase in η occurs on the downstream side, recalculation is performed by changing the molding conditions and mold specifications. This is because the condition under which the rise of η occurs during the flow is because the high-viscosity resin whose curing reaction has advanced flows into the cavity, and the possibility of molding failure is extremely high, and the purpose is to prevent this in advance. is there. When a condition without an increase in η is obtained,
First, the pressure loss ΔP Rn of each section of the runner is calculated as ΔP Rn = βn ·
Calculate with anQn, accumulate this and pressure loss ΔP in the runner
Ask for RT . Next, the pressure loss ΔP R s ≦ ΔP RT in the runner set in advance for comparison is compared, and when ΔP RS ≦ ΔP RT , the mold flow path, specifications, resin injection time of the plunger, resin preheating Change the value of at least one of the temperature and mold temperature and re-enter to find the ΔP RT at that time, change the conditions sequentially, and change the runner specifications and molding conditions where ΔP RS > ΔP RT is satisfied. decide. This is because if the pressure loss approaches the set plunger maximum pressure P M of the molding machine, the plunger can no longer be moved down at constant speed, the retention of the resin in the middle flow, there is a phenomenon that frequently molding defects, first runner this The purpose is to prevent in some parts. It should be noted, ΔP RS will keep the much lower value than the P M. Subsequently, the pressure loss at each gate portion is set so that the sum of the pressure loss at the runner portion and the pressure loss at the gate portion until reaching each cavity is constant.
At this time, the preset pressure loss ΔPs is compared with the total pressure loss ΔP T obtained by calculation, and when ΔPs ≦ ΔP T , re-calculation is performed by changing molding conditions and part of the mold flow path parameters again. .
Then, upon reaching the ΔPs> ΔP T, to determine the pressure loss [Delta] P G n should be given to the gate portion. ΔPs is ΔP R s
To an intermediate value of P M. Then, [Delta] P G n and the flow gate portion average apparent viscosity was determined by simulation a G; · and the shape resistance beta G n should be given at each gate from the gate unit flow rate Q G n β G n = ΔP G n / a G Calculated by Q G n.
Then, using the relational expressions shown in Expressions (21) and (22),
Inversely calculates the specifications of the gate. Further, if the obtained specifications do not satisfy the constraints at the gate portion, such as the upper and lower limits of the angle of the tapered portion along the flow direction, the upper and lower limits of the depth, etc. A part of the condition is changed, and gate specifications are determined where the constraint condition is satisfied.

第9−a〜9−c図に、本手法を用いて設計した金型
のランナ11,ゲート12の構造を示す。第9−a図は、第
6−b図を上方から見たときのランナ11,ゲート12の構
造である。ここでは、第15−b図においてポット8およ
びポットに接続して折れ曲がる部分までのランナ11,キ
ャビティ5は省略してある。第9−b図は第9−a図の
側面図であり、ランナ11は各キャビティまでの樹脂の到
達時刻のずれを少なくするために深さを流動方向に沿っ
て漸次減少させた構造とした。第9−c図は第9−a〜
b図のA−A断面、B−B断面を示した図であり、ゲー
トの絞り角θを下流側ほど広げ、各キャビティに到るま
でのランナ部とゲート部の圧力損失の和を等しくする構
造とした。なお、ゲート絞り角に制約条件がある場合
は、ゲート出口13の幅、深さも変化させ、各ゲートでの
必要な圧力損失の値を確保してもよい。
9-a to 9-c show the structures of the mold runner 11 and the gate 12 designed using this method. FIG. 9-a shows the structure of the runner 11 and the gate 12 when FIG. 6-b is viewed from above. Here, in FIG. 15-b, the pot 8 and the runner 11 and the cavity 5 up to the bent portion connected to the pot are omitted. FIG. 9-b is a side view of FIG. 9-a, and the runner 11 has a structure in which the depth is gradually reduced along the flow direction in order to reduce the deviation of the arrival time of the resin to each cavity. . FIG. 9-c is a view of FIG.
FIG. 4B is a diagram showing a cross section taken along the line AA and a cross section taken along the line BB of FIG. Structured. If there is a constraint on the gate throttle angle, the width and depth of the gate outlet 13 may be changed to secure the necessary pressure loss value at each gate.

次に、本発明の効果を説明する。第10−a,b図は、流
動シミュレーション手法を用いずに、樹脂の粘度を一定
と仮定したうえで第9−a,b,cの構造の金型を設計した
従来手法でのキャビティ内の樹脂の充填状況を示したも
のである。第10−a図の縦軸は各キャビティでの樹脂の
無次元充填率、横軸はキャビティへ樹脂が入り始めてか
らの無次元充填時間であり、図中の点線が各キャビティ
内を樹脂が同時、同速度で充填を行う理想充填を示す。
従来手法では、各キャビティへの樹脂の充填が理想充填
から大きくずれている。第10−b図は第9−a図の無次
元充填時間0.5における樹脂7の充填状況を示したもの
であり、上流側のキャビティ5から樹脂が早く充填して
いる。第11−a図は流動シミュレーション手法を用いた
本発明により設計した金型でのキャビティ内の樹脂の充
填状況を示したものである。どのキャビティでも理想充
填に非常に近い充填状況が得られた。第11−b図は第11
−a図の無次元充填時間0.5における樹脂7の充填状況
を示したものであり、どのキャビティでも同じように樹
脂7が充填している。
Next, the effects of the present invention will be described. FIGS. 10-a and b show the inside of the cavity by the conventional method in which the mold having the structure of 9-a, b and c was designed on the assumption that the viscosity of the resin was constant without using the flow simulation method. It shows the filling state of the resin. The vertical axis in FIG. 10-a shows the dimensionless filling rate of the resin in each cavity, and the horizontal axis shows the dimensionless filling time since the resin started to enter the cavity. Shows the ideal filling at the same speed.
In the conventional method, the filling of each cavity with the resin greatly deviates from the ideal filling. FIG. 10-b shows the state of filling of the resin 7 at the dimensionless filling time 0.5 in FIG. 9-a, in which the resin is rapidly filled from the cavity 5 on the upstream side. FIG. 11-a shows the filling state of the resin in the cavity in the mold designed according to the present invention using the flow simulation method. Filling conditions very close to ideal filling were obtained in all cavities. FIG.
FIG. 3A shows the state of filling of the resin 7 at the dimensionless filling time 0.5 in FIG.

第12図にキャビティ内樹脂最大流速と、樹脂滞留時間
の比較を示す。ここでtpは樹脂注入時間を示す。従来手
法で設計した金型では下流側のキャビティほど流速が大
きくなる。これは、第10−a,b図に示した充填状況のた
め、上流側から樹脂が充填完了するたびに流量が下流に
シフトしていく、結果を示している。一方、本発明で設
計した金型では第11−a,b図に示したように均一に樹脂
が充填するため流量集中は起こらず、流速は各キャビテ
ィとほぼ同じ値を示す。一方、従来手法で設計した金型
では樹脂の滞留時間が上流側のキャビティほど大きくな
る。ここで、滞留時間とはそのキャビティで樹脂が充填
を完了してから、プランジャ停止までの時間である。本
発明で設計した金型ではどのキャビティでもほとんど滞
留時間はない。
FIG. 12 shows a comparison between the resin maximum flow velocity in the cavity and the resin residence time. Here, tp indicates the resin injection time. In the mold designed by the conventional method, the flow velocity becomes higher in the cavity on the downstream side. This indicates a result that the flow rate shifts to the downstream every time the resin is completely filled from the upstream side due to the filling state shown in FIGS. 10-a and 10-b. On the other hand, in the mold designed by the present invention, as shown in FIGS. 11A and 11B, the resin is uniformly filled, so that the flow rate concentration does not occur, and the flow velocity shows almost the same value as each cavity. On the other hand, in the mold designed by the conventional method, the residence time of the resin increases in the cavity on the upstream side. Here, the residence time is the time from completion of filling of the resin in the cavity to stop of the plunger. In the mold designed by the present invention, there is almost no residence time in any cavity.

第13図に金線変形不良発生率の比較を示す。ここで
は、径の太い金線Aと径の細い金線Bの2種類を用いた
ときの結果を示す。金線Aの場合は従来手法で設計した
金型でも本発明手法で設計した金型でも金線変形不良は
ない。一方、金線Bでは、従来手法で設計した金型では
下流側のキャビティほど不良発生率は高くなる。これ
は、第12図の流速の増加と対応しており、流速の増加に
伴い、径が小さく剛性の小さい金線では変形しやすくな
ることを示している。一方、本発明手法で設計した金型
では流速増加がないため金線Bでも不良の発生はない。
FIG. 13 shows a comparison of the incidence rate of defective gold wire deformation. Here, the results when two types of the gold wire A having a large diameter and the gold wire B having a small diameter are used are shown. In the case of the metal wire A, there is no metal wire deformation defect in the metal mold designed by the conventional method or the metal mold designed by the method of the present invention. On the other hand, in the case of the gold wire B, in the mold designed by the conventional method, the defect generation rate becomes higher toward the cavity on the downstream side. This corresponds to the increase in the flow velocity in FIG. 12, and indicates that the gold wire having a small diameter and a small rigidity tends to be deformed as the flow velocity increases. On the other hand, in the mold designed by the method of the present invention, there is no increase in the flow velocity, so that no defect occurs even in the wire B.

表2に成形品の外観不良の発生率の比較を示す。 Table 2 shows a comparison of the occurrence rate of appearance defects of molded products.

tpが18sの条件ではどちらの手法でも不良の発生はない
が、tpが30sになると従来手法で計算した金型では不良
発生率100%となった。これは、この条件になると第11
図に示したゲートの滞留時間が非常に長くなり、キャビ
ティ内に十分に圧力が加わらないまま樹脂が硬化してし
まうためである。一方、ゲート滞留の殆どない本発明に
よる金型ではこの条件でも不良の発生はない。
Under the condition that tp was 18 s, no defect occurred in either method, but when tp reached 30 s, the defect rate of the mold calculated by the conventional method was 100%. This is the eleventh
This is because the residence time of the gate shown in the figure becomes very long, and the resin hardens without sufficiently applying pressure in the cavity. On the other hand, in the mold according to the present invention having almost no gate stagnation, no defect occurs even under this condition.

〔発明の効果〕〔The invention's effect〕

本発明によれば、量産金型の最適流路諸元の設計や最
適成形条件の選定を机上で迅速、かつ、高精度に行える
ので、試作工程の廃止による新製品開発期間の短縮、成
形欠陥低減、金線の細径化の実施などによる原価低減な
どの効果が非常に大きい。
According to the present invention, the design of the optimal flow path specifications and the selection of the optimal molding conditions for mass-produced dies can be performed quickly and with high precision on a desk. The effect of reducing costs and reducing costs by reducing the diameter of the gold wire is very large.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の解析システムの構成図、第2図は本発
明の一実施例に用いる等温粘度式モデルの特性図、第3
図は非等温状態での粘度変化を算出するための説明図、
第4図は流動シミュレーションの概略フローチャート、
第5図は閉館見掛け粘度a測定値と計算値の比較図、
第6−a〜6−d図は半導体の樹脂封止プロセスの説明
図、第7−a〜7−bは、流路内の圧力損失を算出する
ための説明図、第8図はキャビティ多数ヶ取り金型のラ
ンナ,ゲート設計用フローチャート、第9−a〜9−c
図は金型のランナ、ゲート構造を示す図、第10−a,10−
b図は従来手法でのキャビティ内の樹脂充填状況を示す
図、第11−a,11−b図は本発明による手法でのキャビテ
ィ内の樹脂充填状況を示す図、第12図はキャビティ内レ
ジン最大流速と樹脂滞留滞留時間の比較図、第13図は金
線変形不良発生率の比較図。 4……下型、5……キャビティ、6……上型、7……熱
硬化性樹脂、8……ポット、11……ランナ、12……ゲー
ト。
FIG. 1 is a configuration diagram of the analysis system of the present invention, FIG. 2 is a characteristic diagram of an isothermal viscosity model used in one embodiment of the present invention, and FIG.
The figure is an explanatory diagram for calculating the change in viscosity in a non-isothermal state,
FIG. 4 is a schematic flowchart of a flow simulation,
FIG. 5 is a comparison diagram of the measured value of apparent viscosity a and the calculated value,
FIGS. 6-a to 6-d are explanatory views of the resin sealing process of the semiconductor, FIGS. 7-a to 7-b are explanatory views for calculating the pressure loss in the flow path, and FIG. Flowchart for runner and gate design of casting die, 9-a to 9-c
The figure shows the mold runner and gate structure, 10-a, 10-
Fig. b is a diagram showing the state of resin filling in the cavity by the conventional method, Figs. 11-a and 11-b are diagrams showing the state of resin filling in the cavity by the method of the present invention, and Fig. 12 is a resin in the cavity. Fig. 13 is a comparison diagram of the maximum flow velocity and the resin residence time, and Fig. 13 is a comparison diagram of the occurrence rate of defective gold wire deformation. 4 ... lower mold, 5 ... cavity, 6 ... upper mold, 7 ... thermosetting resin, 8 ... pot, 11 ... runner, 12 ... gate.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 杉野 和宏 神奈川県横浜市戸塚区吉田町292番地 株式会社日立製作所生産技術研究所内 (72)発明者 西 邦彦 東京都小平市上水本町5丁目20番1号 株式会社日立製作所武蔵工場内 (56)参考文献 特開 昭59−88656 (JP,A) (58)調査した分野(Int.Cl.6,DB名) G01N 11/00 - 11/04──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kazuhiro Sugino 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside Hitachi, Ltd. Production Research Laboratory (72) Inventor Kunihiko Nishi 5--20, Josuihoncho, Kodaira-shi, Tokyo No. 1 Inside the Musashi Plant of Hitachi, Ltd. (56) References JP-A-59-88656 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) G01N 11/00-11/04

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】ポットとこれに接続した流路を設けた金型
の設計において、予め設定した流路諸元から流路体積Vf
を算出し、該ポット内に投入した熱硬化性樹脂を該流路
内に注入するためのプランジャの樹脂注入時間tpを設定
し、ポットから該流路へ注入される樹脂流量QpをQp=Vf
/tpで算出しておき、該流路の分岐数に応じてQpを分配
し、該流路の任意箇所の流量Qnを算出しておくととも
に、該流路を樹脂の流動方向に垂直な任意断面で複数の
区間に分割し、各区間において、流路幅、深さ、断面形
状と長さから決まる流路の形状抵抗値βを算出すると
ともに、該各区間を流動方向に沿って円管形状に置き換
え、該円管内において、与えられた初期、境界条件の元
に樹脂の粘度変化輸送現象を記述する基礎方程式を解
き、該円管各部の樹脂の平均見掛け粘度anを算出し、
各区間で生じる圧力損失ΔPnをΔPn=β anQnで計算
し、ΔPnを累積して総合圧力損失ΔPTを求めることを特
徴とする金型内の圧力損失予測方法。
In the design of a mold provided with a pot and a flow path connected to the pot, a flow path volume V f
Is calculated, setting the resin injection time t p of the plunger for injecting a thermosetting resin was charged into the pot in the flow passage, the resin flow rate Q p is injected from the pot into the flow path Q p = Vf
/ t p , and distributes Q p according to the number of branches of the flow path, calculates the flow rate Q n at an arbitrary position in the flow path, and moves the flow path in the flow direction of the resin. Divide into a plurality of sections at any vertical cross section, and in each section, calculate the flow path resistance value β n determined from the flow path width, depth, cross-sectional shape and length, and set each section in the flow direction. Along with the shape of a circular pipe, solve the basic equation describing the viscosity change transport phenomenon of the resin under the given initial and boundary conditions in the circular pipe, and calculate the average apparent viscosity an of the resin in each part of the circular pipe And
The pressure loss [Delta] P n occurring in each section calculated in ΔP n = β n an Q n , the pressure loss prediction method in the mold, characterized in that determining the total pressure loss [Delta] P T by accumulating [Delta] P n.
【請求項2】請求項1記載において、比較用に予め設定
した圧力損失ΔPSと計算で求めた該総合圧力損失ΔPT
比較し、ΔPS≦ΔPTとなったときに、該流路諸元、該プ
ランジャの注入時間、該金型の温度、該樹脂の予熱温度
のうち、少なくとも一条件の値を変えて再入力してその
ときのΔPTを求め、逐次条件変更を行いΔPS>ΔPTを満
足する範囲内で流路諸元と成形条件を決定することを特
徴とする金型流路設計方法。
2. The method of claim 1, wherein, when comparing the overall pressure drop [Delta] P T determined by calculation the pressure loss [Delta] P S set in advance for comparison, was a ΔP S ≦ ΔP T, the flow path Of the specifications, the injection time of the plunger, the temperature of the mold, and the preheating temperature of the resin, at least one of the conditions is changed and the value is re-input to obtain ΔP T at that time, and the conditions are sequentially changed to obtain ΔP S > A mold flow path design method characterized in that flow path specifications and molding conditions are determined within a range satisfying> ΔP T.
【請求項3】請求項2記載において、ΔPS>ΔPTを満足
し、かつ、該各区間で置き換えた該円管内の半径方向の
所定位置において、下流側の樹脂粘度が上流側よりも上
昇しないことを満足する範囲内で流路諸元と成形条件を
決定することを特徴とする金型流路設計方法。
3. The method according to claim 2, wherein the resin viscosity on the downstream side is higher than that on the upstream side at a predetermined position in the radial direction within the circular pipe replaced in each section, satisfying ΔP S > ΔP T. A flow path design method for a mold, characterized in that flow path specifications and molding conditions are determined within a range not satisfying the requirement.
【請求項4】請求項1記載において、金型は該ポットに
接続したランナにゲートを介して分岐接続されたキャビ
テイを複数上記ランナに沿って配設した構造で、該各区
間の接合面の数は少なくとも流路の分岐数と同じにし、
該各キャビテイに同流量を分配することを前提にして、
該ランナ及び該ゲートにおける圧力損失の合計が各々の
キャビテイに対して一定になるように各キャビテイ毎に
ゲート諸元を変えることを特徴とする金型流路設計方
法。
4. The mold according to claim 1, wherein the mold has a structure in which a plurality of cavities branched and connected via a gate to a runner connected to the pot are arranged along the runner. The number should be at least the same as the number of branches in the channel,
Assuming that the same flow rate is distributed to each cavity,
A method of designing a mold flow path, comprising changing gate specifications for each of the cavities so that the total pressure loss in the runner and the gate is constant for each of the cavities.
JP63272966A 1988-10-31 1988-10-31 Prediction method of pressure loss in mold and mold flow path design method using the same Expired - Fee Related JP2771196B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63272966A JP2771196B2 (en) 1988-10-31 1988-10-31 Prediction method of pressure loss in mold and mold flow path design method using the same
KR1019890015521A KR920004583B1 (en) 1988-10-31 1989-10-27 Method and apparatus for measuring flow and curing characteristices of resin
EP89120184A EP0367218B1 (en) 1988-10-31 1989-10-31 A resin flow and curing measuring device
DE68925343T DE68925343T2 (en) 1988-10-31 1989-10-31 Device for measuring the flow and crosslinking properties of a resin.
US07/429,471 US5125821A (en) 1988-10-31 1989-10-31 Resin flow and curing measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63272966A JP2771196B2 (en) 1988-10-31 1988-10-31 Prediction method of pressure loss in mold and mold flow path design method using the same

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JP2771196B2 true JP2771196B2 (en) 1998-07-02

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JP2007047870A (en) * 2005-08-05 2007-02-22 Fuji Heavy Ind Ltd Part model generation apparatus and part model generation method
JP4820318B2 (en) * 2007-03-22 2011-11-24 株式会社日立製作所 Resin molded product design support apparatus, support method, and support program
JP5946627B2 (en) * 2011-11-11 2016-07-06 東洋ゴム工業株式会社 Flow path cross-sectional shape design apparatus, method and program thereof
JP6029559B2 (en) * 2013-09-30 2016-11-24 本田技研工業株式会社 Computer-aided mold design equipment
CN105243228A (en) * 2015-10-30 2016-01-13 鹿晓阳 Establishment method for internal pressure distribution model of 90-degree curved pipe for crude oil transmission
CN105243229A (en) * 2015-10-30 2016-01-13 鹿晓阳 Establishment method for internal pressure distribution model of 90-degree curved pipe for ethylene gas transmission
CN113076703B (en) * 2021-03-02 2022-10-28 浙江博汇汽车部件有限公司 Hot stamping die water channel flow velocity analysis method based on database
CN119200421B (en) * 2024-11-29 2025-05-06 山东济矿鲁能煤电股份有限公司阳城煤矿 Optimized control method of long-wall lane-by-lane cemented filling system

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