JP2790076B2 - Glass substrate with minute recess and method of manufacturing the same - Google Patents
Glass substrate with minute recess and method of manufacturing the sameInfo
- Publication number
- JP2790076B2 JP2790076B2 JP7111639A JP11163995A JP2790076B2 JP 2790076 B2 JP2790076 B2 JP 2790076B2 JP 7111639 A JP7111639 A JP 7111639A JP 11163995 A JP11163995 A JP 11163995A JP 2790076 B2 JP2790076 B2 JP 2790076B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- minute
- substrate
- corrosion
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 145
- 239000011521 glass Substances 0.000 title claims description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000005530 etching Methods 0.000 claims description 49
- 230000007797 corrosion Effects 0.000 claims description 40
- 238000005260 corrosion Methods 0.000 claims description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 25
- 239000011651 chromium Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 10
- 239000005357 flat glass Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 26
- 230000001681 protective effect Effects 0.000 description 21
- 239000005361 soda-lime glass Substances 0.000 description 16
- 230000007547 defect Effects 0.000 description 15
- 230000003746 surface roughness Effects 0.000 description 10
- 239000010453 quartz Substances 0.000 description 9
- 229910019923 CrOx Inorganic materials 0.000 description 8
- 239000006061 abrasive grain Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000008119 colloidal silica Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 239000011163 secondary particle Substances 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000005358 alkali aluminosilicate glass Substances 0.000 description 1
- -1 and if necessary Chemical compound 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Surface Treatment Of Glass (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、平面ガラス基板凹部に
透明樹脂等を充填してなる平板型マイクロレンズを製造
するのに適した微小凹部付きガラス基板およびその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate having minute concave portions suitable for manufacturing a flat microlens in which concave portions of a flat glass substrate are filled with a transparent resin or the like, and a method of manufacturing the same.
【0002】[0002]
【従来の技術】透過型液晶表示素子を用いたプロジェク
タテレビジョン(以下、PTV)が、実用化されてい
る。現在、このPTVの開発において、スクリーン上で
の高輝度をいかに実現するかがその焦点となっており、
高出力のライトバルブや光学装置の開発や、平板マイク
ロレンズの応用等が精力的に検討されている。2. Description of the Related Art A projector television (hereinafter, PTV) using a transmission type liquid crystal display device has been put to practical use. Currently, in the development of this PTV, the focus is on how to achieve high brightness on the screen.
The development of high-power light valves and optical devices, and the application of flat microlenses are being studied energetically.
【0003】このPTVに平板マイクロレンズを用いれ
ば、液晶表示素子のブラックマトリクスや画素電極部分
に入射し、画素開口部の照明には寄与していない光を大
きく低減できるため、照明光の強度を上げることなくス
クリーン上の輝度を向上することができ、この結果、表
示素子の光および熱による特性の劣化の問題を解決する
ことが可能となる。If a flat microlens is used for the PTV, light that is incident on the black matrix or the pixel electrode portion of the liquid crystal display element and does not contribute to the illumination of the pixel opening can be greatly reduced. The brightness on the screen can be improved without increasing the brightness, and as a result, it is possible to solve the problem of deterioration of characteristics of the display element due to light and heat.
【0004】この場合、平板マイクロレンズは、液晶表
示素子の光入射側に配置され、ブラックマトリクスや画
素電極部分に入射していた光を、画素開口部に集光して
有効に利用し、実効的開口効率を向上させる働きを持っ
ている。In this case, the flat microlens is disposed on the light incident side of the liquid crystal display element, and condenses the light incident on the black matrix and the pixel electrode portion to the pixel opening to effectively use the light. It has the function of improving the target aperture efficiency.
【0005】従来、平板マイクロレンズとしては、ソー
ダライムガラスにTi等の耐食性保護皮膜(マスク膜)
を成膜し、周知のフォトリソグラフィ技術を用いて、円
形あるいは直線スリット状の開口を設け、これを溶融塩
に浸漬して開口部からイオン交換を行う、いわゆるイオ
ン交換法により、その断面が略半円状の屈折率分布を形
成した平板マイクロレンズアレイ(特開昭57−537
02号)や、また化学エッチングによってガラス基板表
面に半球面状凹部を形成し、これに透明樹脂等を充填し
レンズとした平板型マイクロレンズが知られている(特
開平5−45624号)。またさらに、ドライエッチン
グによって、半導体基板表面に凹部を形成する方法が開
示されている(特開平1−219702号)。Conventionally, as a flat plate microlens, a soda lime glass has a corrosion-resistant protective film (mask film) of Ti or the like.
By using a well-known photolithography technique, a circular or linear slit-shaped opening is provided, and the cross-section is substantially formed by a so-called ion exchange method in which this is immersed in a molten salt and ion-exchanged from the opening. Flat microlens array having a semicircular refractive index distribution (Japanese Patent Laid-Open No. 57-537)
No. 02), and a flat microlens in which a hemispherical concave portion is formed on the surface of a glass substrate by chemical etching and filled with a transparent resin or the like and used as a lens is known (Japanese Patent Application Laid-Open No. 5-45624). Furthermore, a method of forming a concave portion on the surface of a semiconductor substrate by dry etching is disclosed (JP-A-1-219702).
【0006】[0006]
【発明が解決しようとする課題】特に、微小開口を多数
その表面に設けたマスク膜付き平面ガラス基板に、化学
エッチングを施し、前記微小開口からエッチングを等方
的に進めることにより得られる半球面状凹部に、透明樹
脂等を充填しレンズとした平板型マイクロレンズの製造
においては、化学エッチングの際に欠陥が生じることが
あった。具体的には、本来半球状凹部となるべきところ
が、いびつな楕円球状(ラグビーボール状)凹部となっ
たり、また化学エッチングの途中でマスク膜が、ガラス
基板から剥離してしまうことがあった。In particular, a hemispherical surface obtained by performing chemical etching on a flat glass substrate with a mask film having a large number of fine openings formed on the surface thereof, and performing isotropic etching from the fine openings. In the production of a flat microlens having a lens formed by filling a transparent resin or the like into a concave portion, a defect sometimes occurs during chemical etching. Specifically, a portion that should originally become a hemispherical concave portion may become an irregular elliptical spherical (rugby ball-shaped) concave portion, or a mask film may be peeled off from a glass substrate during chemical etching.
【0007】また、微小開口を多数その表面に設けたマ
スク膜付きガラス基板に、ドライエッチングを施し得ら
れる凹部は、そのエッチングメカニズムから完全な球面
状とはなり得ない。Further, a concave portion obtained by performing dry etching on a glass substrate provided with a mask film having a large number of fine openings formed on the surface thereof cannot be formed into a completely spherical shape due to its etching mechanism.
【0008】本発明の目的は、エッチング法によって形
成され1次元または2次元に配列された微小凹部の輪郭
形状が円形である平板型マイクロレンズ用のガラス基板
を、また微小凹部の断面が円弧から形成される平板型マ
イクロレンズ用のガラス基板を提供するものである。さ
らに、それを用いた平板型マイクロレンズを提供する。An object of the present invention is to provide a flat microlens glass substrate in which the contours of minute recesses formed by etching and arranged one-dimensionally or two-dimensionally are circular, and the cross-section of the minute recesses is formed from an arc. An object of the present invention is to provide a glass substrate for a formed flat microlens. Further, a flat microlens using the same is provided.
【0009】[0009]
【課題を解決するための手段】本発明は、耐食性膜付き
ガラス基板をエッチャントに浸漬し、マイクロレンズの
微小半球状凹部を形成する際に生じる楕円球状欠陥およ
び耐食性膜の剥離が、前記ガラス基板表面の研磨程度、
特に表面粗さによって支配されているという知見に基づ
きなされたものである。According to the present invention, there is provided a glass substrate provided with a corrosion resistant film, which is immersed in an etchant to form micro hemispherical concave portions of microlenses. Surface polishing degree,
In particular, it has been made based on the finding that it is governed by the surface roughness.
【0010】一般にガラス基板は、切断後ラッピングお
よびポリッシングを行い、平滑表面を創出する。しかし
ながら、ラッピングやポリッシング工程で一旦生じた傷
は、ポリッシュが進んで見かけ上判別できなくなっても
潜傷という形態でガラス基板表面近傍に残っている。In general, a glass substrate is subjected to lapping and polishing after cutting to create a smooth surface. However, the scratch once generated in the lapping or polishing step remains in the form of a latent scratch near the surface of the glass substrate even if the polish advances so that it cannot be apparently determined.
【0011】ガラス基板表面付近に残った潜傷はガラス
エッチャントと接触すると、エッチャントが潜傷深部に
しみ込み、潜傷部がエッチングされる。これによって、
エッチング前には判別できなかった潜傷が顕在化され
る。When the latent scratch remaining near the surface of the glass substrate comes in contact with the glass etchant, the etchant penetrates into the deep scratch and the latent scratch is etched. by this,
Latent scratches that could not be determined before etching become apparent.
【0012】潜傷を有するガラス基板に耐食性保護膜を
形成し、例えばこの耐食性膜にレンズアレイの配列に対
応した微小開口を形成し、微小開口から等方的にエッチ
ングを行うことにより半球状の微小凹部を形成しようと
する場合、潜傷の顕在化が起こることにより、楕円球状
にエッチングが進んだり、特定方向にエッチングが速く
進むため、耐食性膜のガラス基板からの剥離が生じたり
することがある。A hemispherical surface is formed by forming a corrosion-resistant protective film on a glass substrate having latent scratches, for example, by forming a fine opening corresponding to the arrangement of the lens array in the corrosion-resistant film, and performing isotropic etching from the fine opening. When attempting to form minute recesses, latent scratches become apparent, and the etching proceeds in an elliptical sphere, or etching proceeds rapidly in a specific direction, so that the corrosion-resistant film may peel off from the glass substrate. is there.
【0013】図2に、ガラス基板の表面粗さ(Ra)
と、この基板に耐食性保護膜を形成しさらにこの耐食性
膜に微小開口を形成し、微小開口から等方的にエッチン
グを行ったときに形成される凹部を平面視したときの凹
部の輪郭形状の例を示す。なお、aは凹部の輪郭形状の
最短の径の長さ、bは最長の径の長さと定義し、測定し
た。また、図中の矢印はガラス基板表面の潜傷の方向を
示している。つまり、ガラス基板表面に潜傷があると、
その方向が特に優先的にエッチングされ、形成される凹
部が上述のようなラグビーボール状となることが確認さ
れた。FIG. 2 shows the surface roughness (Ra) of the glass substrate.
And forming a corrosion-resistant protective film on the substrate, forming a minute opening in the corrosion-resistant film, and forming a contour of the recess when the recess formed when isotropically etched from the minute opening is viewed in plan. Here is an example. In addition, a was defined as the length of the shortest diameter of the contour shape of the concave portion, and b was measured as the length of the longest diameter. Arrows in the figure indicate the directions of latent scratches on the glass substrate surface. In other words, if there is a latent scratch on the glass substrate surface,
The direction was particularly preferentially etched, and it was confirmed that the concave portion formed had a rugby ball shape as described above.
【0014】この関係のグラフを図3に示す。この例で
は、ガラス基板のRaが0.55nm以上となると、エ
ッチングにより形成される凹部の輪郭形状のb/aが
1.5以上となり、さらにその輪郭形状も乱れておりも
はや円形をなしているとはいえなくなっていることがわ
かる。一方、前記基板のRaが0.4nm未満である
と、前記b/aは1.1以下であり前記輪郭形状はほぼ
円形を保っているといえる。FIG. 3 is a graph showing this relationship. In this example, when Ra of the glass substrate is 0.55 nm or more, the contour shape b / a of the concave portion formed by etching becomes 1.5 or more, and the contour shape is also disturbed and is no longer circular. It can be seen that it is no longer possible. On the other hand, when the Ra of the substrate is less than 0.4 nm, the b / a is 1.1 or less, and it can be said that the contour shape is substantially circular.
【0015】さらに前記Raが0.24nm以下である
と、前記b/aはほとんど1であり、前記輪郭形状は完
全な円形をなしているといえる。Further, when the Ra is 0.24 nm or less, the b / a is almost 1, and it can be said that the contour shape is a perfect circle.
【0016】なおこのことは、エッチングにより形成さ
れる微小凹部に上述した潜傷が存在して起こることであ
り、全ての凹部が上述のラグビーボール状になるわけで
はない。ガラス基板のRaが大きい場合(例えば、Ra
>0.7nm)では、ほとんどの凹部が上述のラグビー
ボール状となるのだが、例えば0.4<Ra<0.5n
mの範囲では、ガラス基板表面の潜傷の存在確率の問題
となるので、ある凹部では良好な円形の輪郭形状を有し
ていても、別の凹部ではラグビーボール状になっている
ことがある。This is caused by the presence of the latent scratches in the minute recesses formed by etching, and not all the recesses have the above-mentioned rugby ball shape. When the Ra of the glass substrate is large (for example, Ra
> 0.7 nm), most of the recesses have the above-mentioned rugby ball shape. For example, 0.4 <Ra <0.5n
In the range of m, the probability of the existence of latent scratches on the surface of the glass substrate becomes a problem.Therefore, even if one concave portion has a good circular contour shape, another concave portion may have a rugby ball shape. .
【0017】なお、本発明における微小凹部は、1〜1
00μm程度の大きさ、特に20〜40μm程度のもの
をいう。凹部の大きさが大きいと、上述した潜傷や研磨
傷の顕在化による不均一エッチングが発生しても、その
影響が小さいためである。In the present invention, the minute recesses are 1 to 1
It means a size of about 00 μm, especially about 20 to 40 μm. This is because if the size of the concave portion is large, even if uneven etching occurs due to the appearance of the latent scratches and polishing scratches described above, the influence thereof is small.
【0018】本発明では、前記潜傷の顕在化による不均
一エッチングの発生および耐食性膜の剥離を抑制し、前
記微小凹部を平面視したときの輪郭形状が円形とするた
めに、耐食性膜を形成するガラス基板の表面粗さを、厳
密に中心線平均粗さRaで0.4nm以下に制御するこ
とを特徴としている。In the present invention, a corrosion-resistant film is formed in order to suppress the occurrence of non-uniform etching and the peeling of the corrosion-resistant film due to the manifestation of the latent scratch, and to make the contour of the minute concave portion circular when viewed from above. The surface roughness of the glass substrate to be formed is strictly controlled to a center line average roughness Ra of 0.4 nm or less.
【0019】ガラス基板表面の中心線平均粗さRaが
0.4nmを越える場合には、潜傷や研磨傷の顕在化に
よる不均一エッチングの発生および耐食性膜の剥離を生
じ易くなる。If the center line average roughness Ra of the surface of the glass substrate exceeds 0.4 nm, uneven etching due to the appearance of latent scratches and polishing scratches and peeling of the corrosion resistant film are likely to occur.
【0020】基本的には、耐食性膜を形成するガラス基
板の表面粗さは、小さいほど好ましいが、実際には、中
心線平均粗さRaを0.05nm未満にすることは技術
的に非常に難しく、またその生産性を確保することが難
しい。Basically, the smaller the surface roughness of the glass substrate on which the corrosion-resistant film is formed, the better. However, in practice, it is extremely difficult to make the center line average roughness Ra less than 0.05 nm. It is difficult and it is difficult to secure its productivity.
【0021】また、上述の問題点を達成した上で、技術
的・経済的な点を考慮すると、ガラス基板のRaは0.
1〜0.24nm程度が特に好ましい。Further, in consideration of technical and economical points after achieving the above-mentioned problems, Ra of the glass substrate is set to 0.1.
About 1 to 0.24 nm is particularly preferable.
【0022】その中心線平均粗さRaを0.4nm以下
に制御したガラス基板の表面は、以下の示す方法等によ
って創出することができる。 (1)従来の研磨方法の酸化セリウム等の砥粒を用いた
最終の研磨工程で、低加重、低速度条件下で研磨を緩や
かに行う (2)最終の研磨工程で粒径の小さな酸化セリウム砥粒
を用いて研磨を行う (3)コロイダルシリカ等の形状が球で比較的硬度の低
い砥粒を用いて研磨を行うThe surface of the glass substrate whose center line average roughness Ra is controlled to 0.4 nm or less can be created by the following method or the like. (1) In a final polishing step using abrasive grains such as cerium oxide in a conventional polishing method, polishing is performed gently under low load and low speed conditions. (2) Cerium oxide having a small particle size in the final polishing step Polishing using abrasive grains (3) Polishing using abrasive grains of colloidal silica or the like having a spherical shape and relatively low hardness
【0023】また、中心線平均粗さRaが0.4nmを
越える基板に対しては、塗膜熱分解法やゾルゲル法等に
よってガラス基板と同じ組成の皮膜をガラス基板表面に
形成し、これを焼結させ潜傷を埋めることによっても、
ガラス基板の表面粗さが改善でき、中心線平均粗さを
0.4nm以下にすることができる。また、イオン注入
法によって高エネルギーの荷電粒子をガラス基板に衝突
させ、局所的な高温を実現しガラスの粘性流動と焼結を
利用することによってもガラス基板の表面粗さが改善で
き、中心線平均粗さを0.4nm以下にすることができ
る。For a substrate having a center line average roughness Ra exceeding 0.4 nm, a film having the same composition as the glass substrate is formed on the surface of the glass substrate by a coating film thermal decomposition method, a sol-gel method, or the like. By sintering and filling the latent wound,
The surface roughness of the glass substrate can be improved, and the center line average roughness can be reduced to 0.4 nm or less. In addition, the surface roughness of the glass substrate can be improved by using high-energy charged particles to collide with the glass substrate by ion implantation to achieve local high temperature and use viscous flow and sintering of the glass. The average roughness can be 0.4 nm or less.
【0024】前記各種手法によってガラス基板表面を平
滑化することにより、ガラス基板の潜傷による不均一エ
ッチングの発生をなくすることが可能となる。さらに、
ガラス基板に所望のパターンを有する耐食性保護膜を形
成した場合には、この所望のパターンの微小開口から等
方的にエッチングを進行させることできる。この基板の
凹部に透明樹脂等を充填し平板型マイクロレンズを作製
すると、良好な微小レンズを形成することが可能にな
る。By smoothing the surface of the glass substrate by the various methods described above, it is possible to eliminate the occurrence of uneven etching due to latent scratches on the glass substrate. further,
When a corrosion-resistant protective film having a desired pattern is formed on a glass substrate, etching can proceed isotropically from the minute opening of the desired pattern. When a transparent resin or the like is filled in the concave portion of the substrate to produce a flat microlens, a favorable microlens can be formed.
【0025】本発明で用いるガラス基板としては、石英
ガラス、ソーダライムガラス、アルカリアルミノシリケ
ートガラス、アルカリボロシリケートガラス、多成分無
アルカリガラス、低膨張結晶化ガラスが挙げられる。Examples of the glass substrate used in the present invention include quartz glass, soda lime glass, alkali aluminosilicate glass, alkali borosilicate glass, multi-component alkali-free glass, and low expansion crystallized glass.
【0026】本発明で言うところのガラス基板の平滑性
は、従来フォトマスク研磨と称されている研磨レベルで
あり、このレベルのガラス基板の平滑性は、原子間力顕
微鏡等の高分解能を有する分析手法によって、評価する
ことが可能である。The smoothness of the glass substrate referred to in the present invention is a polishing level conventionally called photomask polishing, and the smoothness of the glass substrate at this level has a high resolution such as that of an atomic force microscope. It can be evaluated by an analysis method.
【0027】本発明で用いる耐食性保護膜材料は、用い
るエッチャントに対する耐性やフォトリソパターニング
の作業性および成膜コストによって、適当なものを選定
することができる。また形成する膜厚も目的に応じて任
意に選定することができ、組成の異なる膜材料を多層に
積層することもできる。As the corrosion-resistant protective film material used in the present invention, an appropriate material can be selected depending on the resistance to the etchant used, the workability of photolithographic patterning, and the film forming cost. The film thickness to be formed can be arbitrarily selected according to the purpose, and film materials having different compositions can be laminated in multiple layers.
【0028】例えば、耐食性保護膜材料として、クロ
ム、ニッケル、タンタル、シリコン、金等の金属および
その酸化物または窒化物が挙げられる。これら耐食性保
護膜は、スパッタリング法、蒸着法などによって形成す
ることができる。For example, examples of the corrosion-resistant protective film material include metals such as chromium, nickel, tantalum, silicon, and gold, and oxides or nitrides thereof. These corrosion-resistant protective films can be formed by a sputtering method, an evaporation method, or the like.
【0029】上述の耐食性膜付きガラス基板のエッチン
グを行う際の、エッチャント組成はエッチングを行うガ
ラス基板の組成によって選定される。例えば、石英ガラ
ス基板をエッチングする場合には、フッ化水素とドデシ
ルベンゼンスルホン酸ナトリウム等の界面活性剤を含有
する水溶液が、エッチャントとして用いることができ
る。また、ソーダライムガラス基板をエッチングする場
合には、フッ化水素に加えて硫酸等の鉱酸、酢酸等の有
機酸を加えることが多く、必要に応じてドデシルベンゼ
ンスルホン酸ナトリウム(以下、DBS)等の界面活性
剤が加えられてもよい。When etching the above-described glass substrate with a corrosion-resistant film, the etchant composition is selected according to the composition of the glass substrate to be etched. For example, when etching a quartz glass substrate, an aqueous solution containing hydrogen fluoride and a surfactant such as sodium dodecylbenzenesulfonate can be used as an etchant. Further, when etching a soda lime glass substrate, a mineral acid such as sulfuric acid and an organic acid such as acetic acid are often added in addition to hydrogen fluoride, and if necessary, sodium dodecylbenzenesulfonate (hereinafter, DBS) Surfactants such as may be added.
【0030】[0030]
【作用】本発明による微小凹部付き基板では、微小凹部
が形成するガラス基板表面との境界すなわち輪郭形状
は、平面視したときを完全な円形となっている。したが
って、この微小凹部に前記基板の屈折率と異なる樹脂等
を充填することで、良好な平板マイクロレンズが得られ
る。In the substrate with minute recesses according to the present invention, the boundary between the minute recesses and the surface of the glass substrate, that is, the contour shape is a perfect circle when viewed in plan. Therefore, a good flat microlens can be obtained by filling the minute concave portion with a resin or the like having a different refractive index from the substrate.
【0031】また、本発明の製造方法では、微小な不均
一エッチングの発生および開口を有する耐食性膜の剥離
を抑制するために、耐食性膜を形成するガラス基板の表
面粗さを、上述した種々の方法で厳密に中心線平均粗さ
Raで0.4nm以下に、より好ましくは0.1〜0.
24nmに制御している。このため、ガラス基板表面の
潜傷による不均一エッチングの発生をなくすることが可
能になる。Further, in the manufacturing method of the present invention, the surface roughness of the glass substrate on which the corrosion-resistant film is formed is controlled by the various methods described above in order to suppress the occurrence of minute uneven etching and the peeling of the corrosion-resistant film having openings. Strictly, the center line average roughness Ra is 0.4 nm or less by the method, more preferably 0.1 to 0.
It is controlled to 24 nm. For this reason, it is possible to eliminate the occurrence of uneven etching due to latent scratches on the glass substrate surface.
【0032】また、上述のガラス基板をさらにエッチン
グすることによって、微小凹部が稠密に配置されたガラ
ス基板を得ることができる。Further, by further etching the above-mentioned glass substrate, a glass substrate in which minute concave portions are densely arranged can be obtained.
【0033】[0033]
(実施例1)粒径の小さな酸化セリウム砥粒(1次粒子
平均粒径0.05μm、2次粒子平均粒径約0.5μ
m)を用いて、低加重(30gf/cm2)、 低速度
(50rpm)で石英ガラス基板の最終研磨を行った。
原子間力顕微鏡(デジタルインスツルメント(株)製:
NanoScope ,以下「AFM」と呼ぶ)により、研磨後の
ガラス基板の表面粗さを調べた結果、中心線平均粗さR
aは0.15nmになっていることが分かった。(Example 1) Cerium oxide abrasive grains having a small particle diameter (average particle diameter of primary particles: 0.05 μm, average particle diameter of secondary particles: about 0.5 μm)
m), the final polishing of the quartz glass substrate was performed at low load (30 gf / cm 2 ) and low speed (50 rpm).
Atomic force microscope (Digital Instruments Co., Ltd.):
As a result of examining the surface roughness of the polished glass substrate by NanoScope (hereinafter referred to as “AFM”), the center line average roughness R
a was found to be 0.15 nm.
【0034】本石英ガラス基板の表面にスパッタリング
法により、エッチャントに対する耐食性保護膜として、
CrOx/Cr/CrOxの3層膜を形成した。Cr膜の
ESCA分析の結果、トータル膜厚120nmの 40
Cr・60CrOx/75Cr・25CrOx/45Cr
・55CrOx(原子%)の3層構造になっていた。次
に、フォトレジストを塗布、露光、現像をおこなうフォ
トリソグラフィによって3層Cr膜に所定の凹部配列パ
ターンで小開口を形成した。形成した小開口配列は、六
方配列(x方向ピッチ50μm、y方向ピッチ40μ
m)であり、これにより六法配列の微小凹部アレイが得
られる。この開口の直径は、最終的に得ようとする凹部
の径よりも十分小さいことが望ましく、本実施例1では
前記小開口径を5μmとした。As a corrosion-resistant protective film against an etchant, the surface of the present quartz glass substrate was formed by sputtering.
A three-layer film of CrOx / Cr / CrOx was formed. As a result of ESCA analysis of the Cr film, 40
Cr ・ 60CrOx / 75Cr ・ 25CrOx / 45Cr
-It had a three-layer structure of 55CrOx (atomic%). Next, small openings were formed in the three-layer Cr film in a predetermined concave arrangement pattern by photolithography in which a photoresist was applied, exposed, and developed. The formed small aperture array has a hexagonal array (pitch 50 μm in x direction, pitch 40 μm in y direction).
m), whereby an array of minute recesses having a hexagonal arrangement is obtained. The diameter of the opening is desirably sufficiently smaller than the diameter of the concave portion to be finally obtained. In the first embodiment, the small opening diameter is set to 5 μm.
【0035】前記小開口を有するCr膜付き基板を、H
Fおよび界面活性剤としてDBSを含む水溶液に浸漬し
て、化学エッチングを行った。ここで、HFおよびDB
Sの濃度は、それぞれ10重量%および0.1重量%と
した。これにより、前記小開口を始点として石英ガラス
基板の表面がエッチングされた。前記耐食性保護膜を、
硝酸セリウムアンモニウムと過塩素酸を含む水溶液でエ
ッチングを行い、これを完全に除去した。The substrate with the Cr film having the small openings is
Chemical etching was performed by immersion in an aqueous solution containing F and DBS as a surfactant. Where HF and DB
The concentration of S was 10% by weight and 0.1% by weight, respectively. Thus, the surface of the quartz glass substrate was etched starting from the small opening. The corrosion-resistant protective film,
Etching was performed with an aqueous solution containing cerium ammonium nitrate and perchloric acid, and this was completely removed.
【0036】この基板を電子顕微鏡(SEM)観察した
結果、曲率半径約20μmの等方的な凹部がマスク開口
部に対応して得られていることが分かった(図1)。前
記半球状凹部をくまなく観察した結果、楕円球状欠陥等
の欠陥は、全く観察されなかった。図4(a)に形成さ
れた微小凹部のある一列の輪郭形状をトレースしたもの
を、(b)にその部分拡大断面図を示す。As a result of observation of this substrate by an electron microscope (SEM), it was found that an isotropic concave portion having a radius of curvature of about 20 μm was obtained corresponding to the mask opening (FIG. 1). As a result of observing the entire hemispherical concave portion, no defect such as an elliptical spherical defect was observed at all. FIG. 4 (a) shows a trace of a single row of contours having minute recesses, and FIG. 4 (b) shows a partially enlarged cross-sectional view thereof.
【0037】上述までの手順によって、それぞれが独立
しその輪郭形状が全て円形である微小凹部を有する基板
が得られた。By the above-described procedure, a substrate having minute concave portions, each of which is independent and whose contour is all circular, was obtained.
【0038】さらに、以下に前記微小凹部を前記基板全
面に稠密配列する場合について述べる。上記基板を、先
のエッチャントに再び浸漬して、基板表面全体をエッチ
ングした。この2段階エッチングにより、平面視でそれ
ぞれが同一の六角形をなし隣接する凹部同士が密接した
完全稠密配列となった。Further, a case where the minute concave portions are densely arranged on the entire surface of the substrate will be described below. The substrate was immersed again in the previous etchant to etch the entire substrate surface. The two-stage etching resulted in a completely dense arrangement in which each of the adjacent concave portions was in the same hexagonal shape in plan view and the adjacent concave portions were in close contact with each other.
【0039】前記2段階エッチングの処理後、凹部に石
英ガラス基板よりも屈折率の高いエポキシ系透明樹脂材
料を充填し、その上から別途石英基板を貼合せ、前記樹
脂を光硬化させた。これにより、無欠陥の石英製平板マ
イクロレンズを得ることができた(図5参照)。After the above-described two-step etching, the concave portion was filled with an epoxy-based transparent resin material having a higher refractive index than the quartz glass substrate, and a quartz substrate was separately bonded thereon, and the resin was light-cured. As a result, a quartz plate-shaped microlens having no defect was obtained (see FIG. 5).
【0040】(実施例2)コロイダルシリカ(平均粒径
0.05μm)を砥粒として用いて、実施例1と同じ条
件で石英ガラス基板の最終研磨を行った。AFM観察に
より、研磨後のガラス基板の中心線平均粗さRaは、
0.12nmになっていることが分かった。(Example 2) The final polishing of the quartz glass substrate was carried out under the same conditions as in Example 1 by using colloidal silica (average particle size: 0.05 µm) as abrasive grains. According to the AFM observation, the center line average roughness Ra of the polished glass substrate is:
It turned out to be 0.12 nm.
【0041】本石英ガラス基板の表面に、スパッタリン
グ法により、エッチャントに対する耐食性保護膜として
Cr膜を形成した。Cr膜のESCA分析の結果、トー
タル膜厚120nmの80Cr・20CrOx(原子
%)になっていた。次に、実施例1と同様に、前記耐食
性保護膜に小開口パターンを作製し、さらにエッチング
処理を行って、続いて前記耐食性保護膜を除去した。On the surface of the present quartz glass substrate, a Cr film was formed as a corrosion-resistant protective film against an etchant by a sputtering method. As a result of ESCA analysis of the Cr film, it was found to be 80Cr.20CrOx (atomic%) with a total film thickness of 120 nm. Next, in the same manner as in Example 1, a small opening pattern was formed in the corrosion-resistant protective film, an etching process was performed, and then the corrosion-resistant protective film was removed.
【0042】この基板を電子顕微鏡(SEM)観察した
結果、曲率半径約20μmの等方的な凹部がマスク開口
部に対応して得られていることが分かった。前記半球状
凹部をくまなく観察した結果、楕円球状欠陥等の欠陥
は、全く観察されなかった。As a result of observing the substrate with an electron microscope (SEM), it was found that an isotropic recess having a radius of curvature of about 20 μm was obtained corresponding to the mask opening. As a result of observing the entire hemispherical concave portion, no defect such as an elliptical spherical defect was observed at all.
【0043】次いで、先のエッチャントに再び浸漬し
て、基板表面全体をエッチングした。この2段階エッチ
ングにより、平面視でそれぞれが同一の六角形をなし隣
接する凹部同士が密接した完全稠密配列となった。Next, the substrate was immersed again in the etchant to etch the entire surface of the substrate. The two-stage etching resulted in a completely dense arrangement in which each of the adjacent concave portions was in the same hexagonal shape in plan view and the adjacent concave portions were in close contact with each other.
【0044】前記2段階エッチングの処理後、凹部に石
英ガラス基板よりも屈折率の高いエポキシ系透明樹脂材
料を充填し、その上から別途石英基板を貼合せ、前記樹
脂を光硬化させた。これにより、無欠陥の石英製平板マ
イクロレンズを得ることができた。After the two-step etching process, the concave portions were filled with an epoxy-based transparent resin material having a higher refractive index than that of the quartz glass substrate, and a quartz substrate was separately bonded thereon, and the resin was light-cured. As a result, a defect-free quartz flat plate microlens could be obtained.
【0045】(実施例3)テトラエトキシシラン(Si
(OC2H5)4) のエタノール溶液に、希塩酸(1重量
%)を加え、室温で1時間攪拌することにより、テトラ
エトキシシランの加水分解、縮重合反応を行った。ここ
で、テトラエトキシシランに対するエタノールと水のモ
ル比は、それぞれ5および6とした。この溶液を、塗膜
の膜厚を制御するためにエタノールでさらに希釈して、
ゾルゲルコーティング溶液とした。Example 3 Tetraethoxysilane (Si
Dilute hydrochloric acid (1% by weight) was added to an ethanol solution of (OC 2 H 5 ) 4 ), and the mixture was stirred at room temperature for 1 hour to carry out hydrolysis and condensation polymerization of tetraethoxysilane. Here, the molar ratio of ethanol and water to tetraethoxysilane was set to 5 and 6, respectively. This solution was further diluted with ethanol to control the thickness of the coating,
A sol-gel coating solution was used.
【0046】このコーティング溶液を用いて、通常の最
終研磨レベルの石英ガラス基板(Ra=0.6nm)
に、ディップコーティングを行った。室温で1時間乾燥
させた後、熱処理を850℃で5時間行うことにより、
ゾルゲルSiO2 膜の焼結を行った。焼結後、ゾルゲル
SiO2 膜の膜厚は200nmになっていた。AFMに
よる観察結果、焼成後のガラス基板のRaは約0.2n
mになっていることが分かった。Using this coating solution, a quartz glass substrate (Ra = 0.6 nm) at a normal final polishing level
Was subjected to dip coating. After drying at room temperature for 1 hour, heat treatment is performed at 850 ° C. for 5 hours,
The sol-gel SiO 2 film was sintered. After sintering, the thickness of the sol-gel SiO 2 film was 200 nm. As a result of observation by AFM, Ra of the fired glass substrate was about 0.2 n.
m.
【0047】本石英ガラス基板の表面に、スパッタリン
グ法により、エッチャントに対する耐食性保護膜として
Cr膜を形成した。このCr膜は実施例2と同様のもの
であった。次に、実施例1と同様に、前記耐食性保護膜
に小開口パターンを作製し、さらにエッチング処理を行
って、続いて前記耐食性保護膜を除去した。On the surface of the present quartz glass substrate, a Cr film was formed as a corrosion-resistant protective film against an etchant by a sputtering method. This Cr film was the same as in Example 2. Next, in the same manner as in Example 1, a small opening pattern was formed in the corrosion-resistant protective film, an etching process was performed, and then the corrosion-resistant protective film was removed.
【0048】この基板を電子顕微鏡(SEM)観察した
結果、曲率半径約20μmの等方的な凹部がマスク開口
部に対応して得られていることが分かった。前記半球状
凹部をくまなく観察した結果、楕円球状欠陥等の欠陥
は、全く観察されなかった。As a result of observing the substrate with an electron microscope (SEM), it was found that an isotropic recess having a radius of curvature of about 20 μm was obtained corresponding to the mask opening. As a result of observing the entire hemispherical concave portion, no defect such as an elliptical spherical defect was observed at all.
【0049】次いで、先のエッチャントに再び浸漬し
て、基板表面全体をエッチングした。この2段階エッチ
ングにより、平面視でそれぞれが同一の六角形をなし隣
接する凹部同士が密接した完全稠密配列となった。Next, the substrate was immersed again in the above etchant to etch the entire surface of the substrate. The two-stage etching resulted in a completely dense arrangement in which each of the adjacent concave portions was in the same hexagonal shape in plan view and the adjacent concave portions were in close contact with each other.
【0050】前記2段階エッチングの処理後、凹部に石
英ガラス基板よりも屈折率の高いエポキシ系透明樹脂材
料を充填し、その上から別途石英基板を貼合せ、前記樹
脂を光硬化させた。これにより、無欠陥の石英製平板マ
イクロレンズを得ることができた。After the two-step etching process, the concave portions were filled with an epoxy-based transparent resin material having a higher refractive index than that of the quartz glass substrate, and a quartz substrate was separately bonded thereon, and the resin was light-cured. As a result, a defect-free quartz flat plate microlens could be obtained.
【0051】(実施例4)粒径の小さな酸化セリウム砥
粒(1次粒子平均粒径0.05μm、2次粒子平均粒径
約0.5μm)を用いて、低加重(30gf/c
m2)、 低速度(50rpm)でソーダライムガラス基
板の最終研磨を行った。原子間力顕微鏡(AFM)によ
り、研磨後のガラス基板の表面粗さを調べた結果、中心
線平均粗さRaは0.20nmになっていることが分か
った。Example 4 Low-weight (30 gf / c) cerium oxide abrasive grains (average primary particle diameter: 0.05 μm, average secondary particle diameter: about 0.5 μm) were used.
m 2 ), the final polishing of the soda lime glass substrate was performed at a low speed (50 rpm). As a result of examining the surface roughness of the polished glass substrate by an atomic force microscope (AFM), it was found that the center line average roughness Ra was 0.20 nm.
【0052】本ソーダライムガラス基板の実施例1と同
じ条件で、CrOx/Cr/CrOxの3層膜を形成し
た。次に、実施例3と同様に、前記耐食性保護膜に小開
口パターンを作製し、さらにエッチング処理を行って、
続いて前記耐食性保護膜を除去した。A three-layer film of CrOx / Cr / CrOx was formed under the same conditions as in Example 1 of the present soda-lime glass substrate. Next, in the same manner as in Example 3, a small opening pattern was formed in the corrosion-resistant protective film, and an etching process was performed.
Subsequently, the corrosion-resistant protective film was removed.
【0053】この基板を電子顕微鏡(SEM)観察した
結果、曲率半径約20μmの等方的な凹部がマスク開口
部に対応して得られていることが分かった。前記半球状
凹部をくまなく観察した結果、楕円球状欠陥等の欠陥
は、全く観察されなかった。As a result of observation of this substrate by an electron microscope (SEM), it was found that an isotropic concave portion having a curvature radius of about 20 μm was obtained corresponding to the mask opening. As a result of observing the entire hemispherical concave portion, no defect such as an elliptical spherical defect was observed at all.
【0054】次いで、先のエッチャントに再び浸漬し
て、基板表面全体をエッチングした。この2段階エッチ
ングにより、平面視でそれぞれが同一の六角形をなし隣
接する凹部同士が密接した完全稠密配列となった。Next, the substrate was immersed again in the above etchant to etch the entire surface of the substrate. The two-stage etching resulted in a completely dense arrangement in which each of the adjacent concave portions was in the same hexagonal shape in plan view and the adjacent concave portions were in close contact with each other.
【0055】前記2段階エッチングの処理後、凹部にソ
ーダライムガラス基板よりも屈折率の高いエポキシ系透
明樹脂材料を充填し、その上から別途石英基板を貼合
せ、前記樹脂を光硬化させた。これにより、無欠陥のソ
ーダライムガラス製平板マイクロレンズを得ることがで
きた。After the two-step etching process, the concave portions were filled with an epoxy-based transparent resin material having a higher refractive index than that of the soda-lime glass substrate, and a quartz substrate was separately bonded thereon, and the resin was light-cured. As a result, a defect-free soda-lime glass flat microlens could be obtained.
【0056】(実施例5)コロイダルシリカ(平均粒径
0.05μm)を砥粒として用いて、実施例4と同じ条
件でソーダライムガラス基板の最終研磨を行った。AF
M観察により研磨後のガラス基板の中心線平均粗さRa
は0.14nmになっていることが分かった。Example 5 A soda lime glass substrate was finally polished under the same conditions as in Example 4 using colloidal silica (average particle size: 0.05 μm) as abrasive grains. AF
Observation of the center line average roughness Ra of the polished glass substrate by observation
Was found to be 0.14 nm.
【0057】本ソーダライムガラス基板の表面に、実施
例2と同一条件でCr膜を形成した。次に、実施例2と
同様に、前記耐食性保護膜に小開口パターンを作製し、
さらにエッチング処理を行って、続いて前記耐食性保護
膜を除去した。A Cr film was formed on the surface of the present soda lime glass substrate under the same conditions as in Example 2. Next, a small opening pattern was formed on the corrosion-resistant protective film in the same manner as in Example 2.
Further, an etching treatment was performed, and then the corrosion-resistant protective film was removed.
【0058】この基板を電子顕微鏡(SEM)観察した
結果、曲率半径約20μmの等方的な凹部がマスク開口
部に対応して得られていることが分かった。前記半球状
凹部をくまなく観察した結果、楕円球状欠陥等の欠陥
は、全く観察されなかった。As a result of observing the substrate with an electron microscope (SEM), it was found that an isotropic recess having a radius of curvature of about 20 μm was obtained corresponding to the mask opening. As a result of observing the entire hemispherical concave portion, no defect such as an elliptical spherical defect was observed at all.
【0059】次いで、先のエッチャントに再び浸漬し
て、基板表面全体をエッチングした。この2段階エッチ
ングにより、平面視でそれぞれが同一の六角形をなし隣
接する凹部同士が密接した完全稠密配列となった。Next, the substrate was immersed again in the above etchant to etch the entire surface of the substrate. The two-stage etching resulted in a completely dense arrangement in which each of the adjacent concave portions was in the same hexagonal shape in plan view and the adjacent concave portions were in close contact with each other.
【0060】前記2段階エッチングの処理後、凹部にソ
ーダライムガラス基板よりも屈折率の高いエポキシ系樹
脂材料を充填し、その上から別途石英基板を貼合せ、前
記樹脂を光硬化させた。これにより、無欠陥のソーダラ
イムガラス製平板マイクロレンズを得ることができた。After the two-step etching, the recess was filled with an epoxy resin material having a higher refractive index than that of the soda lime glass substrate, and a quartz substrate was separately bonded thereon, and the resin was light-cured. As a result, a defect-free soda-lime glass flat microlens could be obtained.
【0061】なお、上述した実施例1から実施例5で
は、いずれも微小凹部を六方配列した場合であったが、
目的に応じて微小凹部を四方配列し、上述の2段階エッ
チングの処理を行えば、平面視にてその輪郭形状が正方
形また長方形であり、前記基板表面に完全稠密に配列さ
れた微小凹部付きガラス基板が得られることは言うまで
もない。In each of the first to fifth embodiments described above, the minute concave portions are arranged hexagonally.
If the fine recesses are arranged in four directions according to the purpose and the above-described two-stage etching process is performed, the outline shape is square or rectangular in a plan view, and the glass with the fine recesses arranged on the substrate surface completely densely. Needless to say, a substrate is obtained.
【0062】またさらに、上述した実施例1から実施例
5では、前記マスク膜の微小開口はいずれも点開口(円
形)であったが、目的に応じて前記開口の形状を直線と
すると、この開口に応じて形成される凹部は、平面視に
てその輪郭形状が長円(小判状)とすることができる
(図6参照)。Further, in the above-described first to fifth embodiments, all of the fine openings of the mask film are point openings (circles). The contour of the concave portion formed according to the opening can be an ellipse (oval shape) in plan view (see FIG. 6).
【0063】また、上述した実施例1から実施例5にお
いては、上述した2段階エッチング処理により、基板表
面に完全稠密に配列された微小凹部付きガラス基板を得
ていたが、2段階目のエッチング処理時間によっては、
初期の基板表面を一部残した状態の微小凹部付きガラス
基板が得られることは言うまでもない。In the above-described first to fifth embodiments, the two-stage etching process described above obtains a glass substrate with minute recesses arranged on the substrate surface in a completely dense manner. Depending on the processing time,
Needless to say, a glass substrate with minute concave portions with a part of the initial substrate surface left can be obtained.
【0064】(比較例1)従来の研磨レベルの石英ガラ
ス基板(R=0.45nm)に対して、実施例1と同一
のCrOx/Cr/CrOxの3層膜形成とフォトリソパ
ターニングを行った。さらに前記小開口を有するCr膜
付き従来研磨の石英基板のエッチングを、実施例1と同
じ条件で行った。これにより、前記小開口を始点とし
て、石英ガラス基板の表面がエッチングされた。Comparative Example 1 The same three-layer film of CrOx / Cr / CrOx as in Example 1 and photolithographic patterning were performed on a quartz glass substrate (R = 0.45 nm) of a conventional polishing level. Further, the conventional polishing of the quartz substrate with the Cr film having the small opening was etched under the same conditions as in Example 1. Thus, the surface of the quartz glass substrate was etched starting from the small opening.
【0065】前記耐食性保護膜を除去した後、光学顕微
鏡と電子顕微鏡(SEM)による観察を行った。従来の
研磨レベルであるRaが0.45nm程度の石英ガラス
基板には、表面に潜傷が残存しており、エッチング工程
によってこれが顕在化し、等方的な半球状凹部が形成さ
れるはずが、研磨傷および潜傷の方向に対応して楕円球
状のいびつな開口になってしまった。この楕円球状凹部
に透明樹脂等を充填してレンズを形成しようとすると、
この楕円球状凹部ではレンズ欠陥になると判断された。
なお、図7(a)に形成された微小凹部のある一列の輪
郭形状をトレースしたものを、(b)にその部分拡大断
面図を示す。After removing the corrosion-resistant protective film, observation was performed with an optical microscope and an electron microscope (SEM). On a quartz glass substrate having a conventional polishing level of Ra of about 0.45 nm, latent scratches remain on the surface, which are evident by the etching process, and an isotropic hemispherical concave portion should be formed. An elliptical spherical distorted opening corresponding to the direction of the polishing scratch and the latent scratch was obtained. When trying to form a lens by filling this elliptical spherical recess with transparent resin or the like,
It was determined that this oval spherical concave portion would cause a lens defect.
FIG. 7 (a) shows a trace of a row of contours having minute recesses, and FIG. 7 (b) shows a partially enlarged sectional view thereof.
【0066】(比較例2)従来の研磨レベルのソーダラ
イムガラス基板(R=0.75nm)に対して、実施例
4と同一のCrOx/Cr/CrOxの3層膜形成とフォ
トリソパターニングを行った。さらに前記小開口を有す
るCr膜付き従来研磨のソーダライムガラス基板のエッ
チングを実施例4と同じ条件で行った。これにより、前
記小開口を始点として、ソーダライムガラス基板の表面
がエッチングされた。Comparative Example 2 The same three-layer CrOx / Cr / CrOx film as in Example 4 and photolithographic patterning were performed on a soda-lime glass substrate (R = 0.75 nm) of the conventional polishing level. . Further, etching of the conventional polished soda lime glass substrate with the Cr film having the small opening was performed under the same conditions as in Example 4. Thereby, the surface of the soda lime glass substrate was etched starting from the small opening.
【0067】耐食性保護膜を除去した後、光学顕微鏡と
電子顕微鏡(SEM)による観察を行った。従来の研磨
レベルであるRaが0.75nm程度のソーダライムガ
ラス基板には、表面に潜傷が残存しており、エッチング
工程によってこれが顕在化し、等方的な半球状凹部が形
成されるはずが、研磨傷および潜傷の方向に対応して楕
円球状のいびつな開口になってしまった。また、Cr膜
がエッチング処理の途中で剥離してしまい、微小凹部は
形成されていないところがあった。前記楕円球状凹部お
よびCr膜の剥離が生じた部分は、レンズ欠陥になるよ
うな欠陥になると判断された。After removing the corrosion-resistant protective film, observation was performed with an optical microscope and an electron microscope (SEM). A latent scratch on the surface of a soda lime glass substrate having a conventional polishing level of Ra of about 0.75 nm has been revealed by the etching process, and an isotropic hemispherical concave portion should be formed. In this case, the opening became an elliptical spherical irregular shape corresponding to the direction of the polishing scratch and the latent scratch. In addition, the Cr film was peeled off during the etching process, and there were places where minute concave portions were not formed. It was determined that the elliptical concave portion and the portion where the Cr film was peeled off became a defect that would cause a lens defect.
【0068】今回の実施例では、石英ガラス基板とソー
ダライムガラス基板の結果を示したが、多成分無アルカ
リガラスや低膨張結晶化ガラスにおいても、ガラス表面
粗さとエッチング特性の関係は、同じ傾向を示した。In this example, the results for the quartz glass substrate and the soda lime glass substrate were shown. However, the relationship between the glass surface roughness and the etching characteristics is the same for multi-component alkali-free glass and low expansion crystallized glass. showed that.
【0069】[0069]
【発明の効果】上述したような種々の方法によって、そ
の表面の中心線平均粗さRaで0.4nm以下に平滑化
したガラス基板をエッチング法によって微小凹部を形成
すると、ガラス基板の潜傷や研磨傷による不均一エッチ
ングの発生をなくすることが可能になる。According to the various methods described above, when a fine concave portion is formed on a glass substrate whose surface is smoothed to have a center line average roughness Ra of 0.4 nm or less by an etching method, latent scratches on the glass substrate can be obtained. It is possible to eliminate uneven etching caused by polishing scratches.
【0070】さらに、小開口を有する耐食性膜付きガラ
ス基板では、開口から等方的にエッチングが進行するよ
うになり、加えて耐食性膜の剥離を抑制することが可能
になる。この耐食性膜に、例えばマイクロレンズの配列
に対応した微小開口を形成すれば、平板型マイクロレン
ズアレイの半球状凹部を歩留りよく形成することが可能
になる。Further, in a glass substrate having a corrosion-resistant film having a small opening, etching progresses isotropically from the opening, and in addition, peeling of the corrosion-resistant film can be suppressed. If a minute opening corresponding to, for example, an arrangement of microlenses is formed in this corrosion resistant film, it becomes possible to form a hemispherical concave portion of a flat microlens array with a high yield.
【図1】本発明によるエッチングによる微小凹部を有す
るガラス基板を平面視したときの図。FIG. 1 is a plan view of a glass substrate having minute concave portions formed by etching according to the present invention.
【図2】ガラス基板のRaと微小凹部の輪郭形状との関
係を表す模式図。FIG. 2 is a schematic diagram illustrating a relationship between Ra of a glass substrate and a contour shape of a minute concave portion.
【図3】ガラス基板のRaと微小凹部の輪郭形状との関
係を表すグラフ。FIG. 3 is a graph showing a relationship between Ra of a glass substrate and a contour shape of a minute concave portion.
【図4】ガラス基板のRa=0.15nmのときの微小
凹部の輪郭形状および部分拡大断面を表す模式図。FIG. 4 is a schematic diagram illustrating a contour shape and a partially enlarged cross section of a minute concave portion when Ra = 0.15 nm of a glass substrate.
【図5】平板型マイクロレンズの断面図。FIG. 5 is a cross-sectional view of a flat microlens.
【図6】平面視でその輪郭形状が長円である微小凹部を
有するガラス基板。FIG. 6 is a view showing a glass substrate having a fine concave portion whose contour is an ellipse in plan view.
【図7】従来の研磨状態の悪い場合(Ra=0.45n
m)のガラス基板から得られた楕円球状(ラグビーボー
ル状)凹部の輪郭形状および部分拡大断面を表す模式
図。FIG. 7 shows a conventional case where the polishing state is poor (Ra = 0.45n)
m) is a schematic view showing the outline shape and a partially enlarged cross section of an elliptical spherical (rugby ball-shaped) concave portion obtained from the glass substrate of FIG.
【符号の説明】 1 ガラス基板, 2 エッチング部分, 3 微小凹部の輪郭形状, 4 透明樹脂,[Description of Signs] 1 glass substrate, 2 etched part, 3 contour shape of minute concave part, 4 transparent resin,
フロントページの続き (72)発明者 浜中 賢二郎 大阪府大阪市中央区道修町3丁目5番11 号 日本板硝子株式会社内 (56)参考文献 特開 平3−214121(JP,A) 特開 平7−49403(JP,A) 特開 平7−63904(JP,A) (58)調査した分野(Int.Cl.6,DB名) G02B 3/00 - 3/14Continuation of the front page (72) Inventor Kenjiro Hamanaka 3-5-1-11 Doshomachi, Chuo-ku, Osaka-shi, Osaka Inside Nippon Sheet Glass Co., Ltd. (56) References JP-A-3-214121 (JP, A) JP-A-7 -49403 (JP, A) JP-A-7-63904 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) G02B 3/00-3/14
Claims (9)
下のガラス基板表面に、エッチング法によって形成され
た微小凹部が多数個1次元または2次元に規則配列され
た平板マイクロレンズ用ガラス基板であって、前記の微
小凹部を平面視したときの輪郭形状がほぼ円形であり、
前記輪郭形状の長径と短径の比が、1.1以下であるこ
とを特徴とする微小凹部付きガラス基板。ただし、輪郭
形状の最も長い径を長径と、最も短い径を短径とする。1. A glass for a flat plate microlens in which a large number of fine concave portions formed by etching are regularly arranged one-dimensionally or two-dimensionally on a glass substrate surface having a center line average roughness Ra of 0.4 nm or less. A substrate, the contour shape of the minute concave portion when viewed in plan is substantially circular,
A ratio of the major axis to the minor axis of the contour shape is 1.1 or less, wherein the glass substrate with minute recesses is provided. However, the longest diameter of the contour shape is referred to as a long diameter, and the shortest diameter is referred to as a short diameter.
において、前記輪郭形状が円形である微小凹部付きガラ
ス基板。2. The glass substrate with minute recesses according to claim 1, wherein the contour is circular.
下のガラス基板表面に、エッチング法によって形成され
た微小凹部が多数個2次元に規則配列された平板マイク
ロレンズ用ガラス基板であって、 前記微小凹部はその断面形状が円弧からなり、平面視に
てほぼ稠密に配列されていることを特徴とする微小凹部
付きガラス基板。3. A glass substrate for a flat plate microlens in which a large number of minute concave portions formed by etching are regularly arranged two-dimensionally on a surface of a glass substrate having a center line average roughness Ra of 0.4 nm or less. The glass substrate with minute recesses, wherein the minute recesses have an arc-shaped cross section and are arranged almost densely in a plan view.
において、 前記微小凹部は完全稠密に配列され、前記輪郭形状は、
正方形,長方形,正六角形または六角形である微小凹部
付きガラス基板。4. The glass substrate with minute recesses according to claim 3, wherein the minute recesses are arranged in a completely dense manner, and the contour shape is:
A glass substrate with minute recesses that is square, rectangular, regular hexagonal, or hexagonal.
下のガラス基板表面に、エッチング法によって形成され
た微小凹部が多数個2次元に規則配列された平板マイク
ロレンズ用ガラス基板であって、 前記微小凹部は、小判形状をその長軸で回転させて得ら
れる立体の部分からなり、前記小判形状は平面視したと
きの輪郭形状が同一半径の2つの半円とそれを結ぶ直線
とからなることを特徴とする微小凹部付きガラス基板。5. A glass substrate for a flat microlens comprising a glass substrate having a center line average roughness Ra of 0.4 nm or less and a plurality of minute recesses formed by etching on a glass substrate surface. The minute recess is obtained by rotating the oval shape around its long axis.
The oval shape is a plan view
Two semicircles with the same radius and a straight line connecting them
Minute recesses glass substrate, characterized in that comprising a.
小凹部付きガラス基板の製造方法。 (イ)中心線平均粗さRaで、0.4nm以下に制御さ
れた平面ガラス基板上に耐食性膜を形成する工程、 (ロ)前記耐食性膜に所定の配列で小開口を形成する工
程、 (ハ)この基板をエッチャントに浸漬する工程、 (ニ)前記耐食性膜を除去する工程。6. A method for producing a glass substrate having minute concave portions, comprising the following steps: (A) a step of forming a corrosion-resistant film on a flat glass substrate having a center line average roughness Ra controlled to 0.4 nm or less; (b) a step of forming small openings in the corrosion-resistant film in a predetermined arrangement; C) a step of immersing the substrate in an etchant; and (d) a step of removing the corrosion-resistant film.
製造方法において、さらに以下の工程を含む微小凹部付
きガラス基板の製造方法。 (ホ)前記耐食性膜を除去した基板を、エッチャントに
浸漬する工程。7. The method for manufacturing a glass substrate with minute recesses according to claim 6, further comprising the following steps. (E) immersing the substrate from which the corrosion-resistant film has been removed in an etchant.
ス基板の製造方法において、前記ガラスは石英ガラスで
あり、前記耐食性膜は金属クロムおよびその酸化物また
は窒化物からなり、前記エッチャントはフッ酸系のエッ
チャントである微小凹部付きガラス基板の製造方法。8. The method for manufacturing a glass substrate with minute recesses according to claim 6, wherein said glass is quartz glass, said corrosion-resistant film is made of metal chromium and its oxide or nitride, and said etchant is a fluorine-containing material. A method for producing a glass substrate having minute concave portions, which is an acid-based etchant.
ス基板の前記凹部に、前記ガラス基板の屈折率と異なる
樹脂を充填し、レンズ作用を持たせたことを特徴とする
平板型マイクロレンズ。9. A flat plate type micro-plate according to claim 1, wherein the concave portion of the glass substrate with minute concave portions is filled with a resin having a refractive index different from that of the glass substrate to have a lens function. lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111639A JP2790076B2 (en) | 1994-12-15 | 1995-05-10 | Glass substrate with minute recess and method of manufacturing the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6-311429 | 1994-12-15 | ||
| JP31142994 | 1994-12-15 | ||
| JP7111639A JP2790076B2 (en) | 1994-12-15 | 1995-05-10 | Glass substrate with minute recess and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08220306A JPH08220306A (en) | 1996-08-30 |
| JP2790076B2 true JP2790076B2 (en) | 1998-08-27 |
Family
ID=26450984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7111639A Expired - Fee Related JP2790076B2 (en) | 1994-12-15 | 1995-05-10 | Glass substrate with minute recess and method of manufacturing the same |
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| Country | Link |
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| JP (1) | JP2790076B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3788800B2 (en) * | 2003-12-26 | 2006-06-21 | セイコーエプソン株式会社 | Etching method |
| WO2006075609A1 (en) * | 2005-01-12 | 2006-07-20 | Nippon Sheet Glass Co., Ltd. | Grooved glass substrate, micro chemical chip and process for producing them |
| JP4964523B2 (en) * | 2006-07-20 | 2012-07-04 | アルバック成膜株式会社 | Glass substrate processing method |
| KR20120086704A (en) * | 2009-10-26 | 2012-08-03 | 아사히 가라스 가부시키가이샤 | Glass substrate for display and method for manufacturing the glass substrate |
-
1995
- 1995-05-10 JP JP7111639A patent/JP2790076B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08220306A (en) | 1996-08-30 |
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