JP2790368B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP2790368B2 JP2790368B2 JP2261642A JP26164290A JP2790368B2 JP 2790368 B2 JP2790368 B2 JP 2790368B2 JP 2261642 A JP2261642 A JP 2261642A JP 26164290 A JP26164290 A JP 26164290A JP 2790368 B2 JP2790368 B2 JP 2790368B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- printed
- printed circuit
- wiring board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、母材から分割される分割基板を備えたプリ
ント配線基板に関するものである。Description: TECHNICAL FIELD The present invention relates to a printed wiring board provided with a divided substrate that is divided from a base material.
従来、電子部品の半田付けは、プリント配線基板をコ
ンベア上に載置、搬送することにより行っていた。その
ため、プリント配線基板の引っ掛かり等のトラブルが発
生し、母材が破損するのを防ぐ必要があり、第５図に示
すような板取りを行っていた。しかし、第５図に示す構
成では、プリント配線基板28を母材29から切り離すとき
に角部である三角形部分30を破損することが多かった。Conventionally, soldering of electronic components has been performed by placing and transporting a printed wiring board on a conveyor. For this reason, it is necessary to prevent a trouble such as catching of the printed wiring board and damage of the base material. However, in the configuration shown in FIG. 5, when the printed wiring board 28 is cut off from the base material 29, the triangular portion 30 which is a corner is often damaged.
このような破損を防ぐため、第６図に示すように、プ
リント配線基板31を母材32から板取りする場合、所定位
置以外の部分の母材32が破損するのを防ぐため、次のよ
うな構成のものが提案されている。即ち、切欠き孔33,3
7と、長割り孔35と、直線状割り孔群34,36を１例で設け
て母材32から切り離し可能に結合され、前記直線状割り
孔群34の１列が母材32のコーナ部をほぼ方形に切り離し
可能とする切り離し基準線に対して、母材32のコーナー
部をほぼ三角形に分離する方向に傾斜するよう隣接する
切欠き孔33を屈曲させる。そして、プリント配線基板31
を母材32から折り曲げることにより、母材32を損傷する
ことなくプリント配線基板31を板取りすることができる
（実公平２−31791号公報）。In order to prevent such damage, as shown in FIG. 6, when removing the printed wiring board 31 from the base material 32, in order to prevent the base material 32 other than the predetermined position from being damaged, the following is performed. Such a configuration is proposed. That is, the notch holes 33, 3
7, a long slot 35, and a group of straight slots 34, 36 are provided as an example and are detachably coupled to the base material 32. One row of the straight slots 34 is formed at a corner portion of the base material 32. The notch 33 adjacent to the base material 32 is bent so as to incline in a direction of separating the corner portion of the base material 32 into a substantially triangular shape with respect to a separation reference line that allows the base material 32 to be cut into a substantially square shape. Then, the printed wiring board 31
Is bent from the base material 32, the printed wiring board 31 can be removed without damaging the base material 32 (Japanese Utility Model Publication No. 2-31791).
ところが、母材からプリント配線基板を板取りしたと
き母材側には三角形状の切欠き部が形成されるととも
に、板取りされたプリント配線基板には三角形状の突出
した部分が形成され、いずれも歪んだ形状となり、これ
が設計上の大きな制約となり、障害となるという問題点
があった。However, when the printed wiring board is removed from the base material, a triangular cutout is formed on the base material side, and a triangular protruding portion is formed on the printed wiring board. Also has a distorted shape, which is a great constraint on design and poses a problem of hindrance.
本発明の目的は、母材の隅部にて互いに交差する２辺
で同母材から分割される分割基板を安定して支持するこ
とができるとともに、その分割基板を母材から同母材に
損傷を与えることなく簡単に分割することができるプリ
ント配線基板を提供することにある。An object of the present invention is to be able to stably support a divided substrate divided from the same base material at two sides crossing each other at a corner of the base material, and to convert the divided substrate from the base material to the same base material. An object of the present invention is to provide a printed wiring board that can be easily divided without causing damage.
上記問題点を解決するため、本発明では母材の隅部に
て互いに交差する２辺で同母材から分割される分割基板
を備えたプリント配線基板において、前記分割基板を前
記２辺にそれぞれ設けた１箇所の支持部によって母材に
支持し、前記両支持部のうち一方の支持部を他方の支持
部を設けた辺に近接した位置に設けたことをその要旨と
する。In order to solve the above problems, in the present invention, in a printed wiring board having a divided board divided from the same base material at two sides intersecting each other at a corner of the base material, the divided substrates are respectively placed on the two sides. The gist is that the base material is supported by the provided one support portion, and one of the two support portions is provided at a position close to the side on which the other support portion is provided.
上記構成を採用したことにより、母材の隅部にて互い
に交差する２辺で同母材から分割される分割基板は、そ
の２辺にそれぞれ設けた１箇所の支持部によって母材に
支持されている。このため、一辺のみに支持部を設ける
場合に比べて分割基板を安定して支持することができ
る。しかも、母材から分割基板を分割する際には、母材
に損傷を与えることなく簡単に分割することができる。By adopting the above configuration, the divided substrates divided from the base material at two sides intersecting each other at the corners of the base material are supported by the base material by one support portion provided on each of the two sides. ing. For this reason, the divided substrate can be stably supported as compared with the case where the supporting portion is provided only on one side. In addition, when the divided substrate is divided from the base material, the division can be easily performed without damaging the base material.
以下に本発明を具体化した実施例を第１〜４図に基づ
いて説明する。An embodiment of the present invention will be described below with reference to FIGS.
（第１実施例） 第１図は、本実施例のプリント配線基板を示す要部平
面図である。第１図に示すように、本実施例のプリント
配線基板は分割基板としてのプリント基板１とプリント
基板2,3とが相互に結合されており、全体として矩形状
の母材Ａを形成している。なお、前記プリント基板1,2,
3は、本実施例においてはいずれも配線がなされてお
り、プリント配線基板としての役割を果たすものである
が、プリント基板1,2に関しては配線がなされていない
ものであってもかまわない。First Embodiment FIG. 1 is a plan view of a principal part showing a printed wiring board of the present embodiment. As shown in FIG. 1, the printed wiring board according to the present embodiment has a printed board 1 as a divided board and printed boards 2 and 3 joined to each other to form a base material A having a rectangular shape as a whole. I have. The printed circuit boards 1, 2,
Reference numeral 3 denotes a wiring in this embodiment, which serves as a printed wiring board. However, the printed boards 1 and 2 may not be wired.
前記プリント基板1,2は、個々に矩形状をなしてお
り、かつ、もう一つのプリント基板３に比べて面積は小
さい。そしてこれらプリント基板1,2は、相互に隣接し
合って母材Ａの一隅部を形成している。Each of the printed boards 1 and 2 has a rectangular shape, and has a smaller area than the other printed board 3. The printed boards 1 and 2 are adjacent to each other to form one corner of the base material A.
前記プリント基板１と２、１と３、２と３の各々の境
界部は金型打抜加工によって切欠き孔4,5,10、長孔８も
しくは複数の割り孔6,9のいずれか又はこれらの組み合
わせが形成されることにより、相互に切り離し可能に連
結されている。Each of the boundaries between the printed circuit boards 1 and 2, 1 and 3, 2 and 3 is formed by notching holes 4, 5, 10, notches 4, 5, or a plurality of slits 6, 9 or By forming these combinations, they are mutually detachably connected.
すなわち、プリント基板１と２の境界部には、上端部
から下方へ直線状に延びる切欠き孔４が形成され、外境
界部は架橋部７によって連結されている。また、プリン
ト基板１と３の境界部には、左端部から右方へ直線状に
延びる切欠き孔５と３つの丸孔からなる割り孔６とが形
成され、該境界部は複数の割り孔６周辺の部材によって
連結されている。従って、本実施例では架橋部７及び割
り孔６周辺の部材が支持部となっている。さらに、プリ
ント基板２と３の境界部には、上端部から下方へ直線状
に延びる切欠き孔10と直角部8aを有するＬ字状の長孔８
と３つの丸孔からなる割り孔９とが形成され、該境界部
は複数の割り孔９周辺の部材によって連結されている。That is, a cutout hole 4 extending linearly downward from the upper end is formed at the boundary between the printed boards 1 and 2, and the outer boundary is connected by the bridge portion 7. At the boundary between the printed circuit boards 1 and 3, there are formed a cutout hole 5 extending linearly from the left end to the right and a split hole 6 composed of three round holes. 6 are connected by peripheral members. Therefore, in the present embodiment, the members around the bridging portion 7 and the split hole 6 are the supporting portions. Further, at the boundary between the printed circuit boards 2 and 3, an L-shaped elongated hole 8 having a cutout hole 10 and a right angle portion 8a linearly extending downward from the upper end.
And a split hole 9 composed of three round holes are formed, and the boundary portion is connected by members around the plurality of split holes 9.
上述の構成からなるプリント配線基板の母材Ａは通
常、コンベヤ上に載置され、搬送され、電子部品の半田
付けが行われる、いわゆる半田付工程に供せられる。The base material A of the printed wiring board having the above-described configuration is usually placed on a conveyor, transported, and subjected to a so-called soldering step in which electronic components are soldered.
次に、前記半田付工程を経た母材Ａからプリント基板
1,2を板取りする際の操作について第１〜３図に基づい
て説明する。Next, from the base material A having undergone the soldering process,
The operation for removing the plates 1 and 2 will be described with reference to FIGS.
まず第１図に示す状態において、プリント基板１を把
持し、プリント基板１と３の境界線、すなわち、切欠き
孔５と複数の割り孔６とにより形成される線を折り曲げ
線として折り曲げる。すると、前記割り孔６周辺の部材
及びプリント基板１と２の結合箇所であった架橋部７が
個々の境界線に沿って割れ、略矩形状のプリント基板１
が板取りされると同時に、第２図に示すように母材Ａの
残りの部材であるプリント基板２及び３が割り孔９周辺
の部材により結合したものとして残る。First, in the state shown in FIG. 1, the printed circuit board 1 is gripped, and the boundary between the printed circuit boards 1 and 3, that is, the line formed by the cutout hole 5 and the plurality of split holes 6 is bent as a bending line. Then, the members around the slit 6 and the bridging portion 7 which was the connecting portion of the printed boards 1 and 2 are broken along the respective boundary lines, and the substantially rectangular printed board 1 is cut.
At the same time, the printed circuit boards 2 and 3, which are the remaining members of the base material A, are left joined by members around the split hole 9 as shown in FIG.
引き続いて、第２図に示す状態においてプリント基板
２を把持し、プリント基板２と３の境界線、すなわち、
長孔８と割り孔９と切欠き孔10とにより形成される線を
折り曲げ線として折り曲げる。すると、前記割り孔９周
辺の部材が境界線に沿って割れ、前記同様、略矩形状の
プリント基板２が板取りされると同時に、第３図に示す
ように一隅部が矩形状に板取りされたプリント基板３が
得られる。Subsequently, the printed circuit board 2 is gripped in the state shown in FIG. 2, and the boundary between the printed circuit boards 2 and 3, namely,
A line formed by the long hole 8, the split hole 9, and the notch hole 10 is bent as a bending line. Then, the members around the split hole 9 are broken along the boundary line, and the substantially rectangular printed circuit board 2 is cut out as described above, and at the same time, as shown in FIG. The printed circuit board 3 obtained is obtained.
本実施例における、これら一連の板取り操作において
は、各プリント基板1,2,3が、切欠き孔4,5,10と、長孔
８と、割り孔6,9とがそれらの組合せが形成されること
により母材Ａを形成しており、各プリント基板1,2を２
段階で、順次各一方向ずつに折曲げることにより容易に
板取りすることができるとともに、所定箇所以外の部分
の母材Ａが破損・損傷するおそれがない。In this series of board removal operations in the present embodiment, each of the printed circuit boards 1, 2, 3 has a combination of the notch holes 4, 5, 10, the long holes 8, and the split holes 6, 9, respectively. The base material A is formed by being formed, and each printed circuit board 1 and 2 is
At this stage, the sheet metal can be easily removed by sequentially bending the sheet in each one direction, and there is no possibility that the base material A other than the predetermined part is damaged or damaged.
また、母材Ａは矩形状で整然としているため、半田付
工程等において引っ掛かり等のトラブルが発生すること
もなく、作業を円滑に行うことができる。Further, since the base material A is rectangular and orderly, the work can be performed smoothly without causing troubles such as catching in the soldering step or the like.
さらに、板取りして得られた各プリント基板1,2,3
は、それら周辺部の端縁が、従来のように三角形状の切
欠き部や突設した部分を形成することなく、矩形状のプ
リント基板1,2,3を得ることができるという効果を奏す
る。Furthermore, each printed circuit board 1,2,3
Has an effect that the rectangular printed circuit boards 1, 2, and 3 can be obtained without forming the triangular cutout or the protruding portion as in the related art. .
（第２実施例） 次に、本発明の第２実施例を第４図に基づいて説明す
る。Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG.
第４図は、本実施例のプリント配線基板を示す要部平
面図である。第４図に示すように、本実施例のプリント
配線基板は、分割基板としてのプリント基板11とプリン
ト基板12,13が３段階で順次折曲げられることによって
板取りされる矩形状の母材Ｂを形成している。FIG. 4 is a main part plan view showing the printed wiring board of the present embodiment. As shown in FIG. 4, the printed wiring board of the present embodiment has a rectangular base material B which is formed by successively bending a printed board 11 as a divided board and printed boards 12, 13 in three stages. Is formed.
すなわち、第４図に示す母材Ｂは、小さい矩形のプリ
ント基板11〜13と、前記プリント基板11〜13が一隅部に
おいて板取りされた形状のプリント基板14とからなるも
のである。That is, the base material B shown in FIG. 4 comprises small rectangular printed boards 11 to 13 and a printed board 14 in which the printed boards 11 to 13 are cut off at one corner.
まず、母材Ｂの隅部にあるプリント基板11とその下側
にあるプリント基板12との境界部には、左端部から右方
へ直線状に延びる切欠き孔15が形成され、該境界部は架
橋部18によって連結されている。さらに、プリント基板
11とその右側にあるプリント基板13との境界部には、上
端部から下方へ直線状に延びる切欠き孔16と３つの丸孔
からなる割り孔17と後述する長孔19とが形成され、該境
界部は複数の割り孔17周辺の部材によって連結されてい
る。従って、本実施例では架橋部18及び割り孔17周辺の
部材が支持部となっている。First, at the boundary between the printed circuit board 11 at the corner of the base material B and the printed circuit board 12 therebelow, a cutout hole 15 extending linearly from the left end to the right is formed. Are connected by a bridge 18. In addition, printed circuit boards
At the boundary between the printed circuit board 11 and the printed circuit board 13 on the right side thereof, a cutout hole 16 extending linearly downward from the upper end, a split hole 17 composed of three round holes, and an elongated hole 19 described later are formed, The boundaries are connected by members around the plurality of split holes 17. Therefore, in the present embodiment, the members around the bridging portion 18 and the split hole 17 are the supporting portions.
また、前記プリント基板12とその下側にあるプリント
基板14との境界部には左端部から右方へ直線状に延びる
切欠き孔21と４つの丸孔からなる割り孔20と長孔19とが
形成され、該境界部は複数の割り孔20周辺の部材によっ
て連結されている。そして、プリント基板13とその右側
及び下側にあるプリント基板13との境界部には、上端部
から下方へ直線状に延びる切欠き孔23と４つの丸孔から
なる割り孔22と長孔19とが形成され、該境界部は複数の
割り孔22周辺の部材によって連結されている。なお、前
記長孔19は、プリント基板11と13、12と13、12と14、13
と14の境界部に、第４図に示すような略Ｌ字状に形成さ
れている。At the boundary between the printed circuit board 12 and the printed circuit board 14 thereunder, a cutout hole 21 extending linearly rightward from the left end, a split hole 20 composed of four round holes, and a long hole 19 are provided. Are formed, and the boundaries are connected by members around the plurality of split holes 20. At the boundary between the printed circuit board 13 and the printed circuit board 13 on the right and lower sides thereof, a cutout hole 23 extending linearly downward from the upper end, a split hole 22 composed of four round holes, and a slot 19 are provided. Are formed, and the boundaries are connected by members around the plurality of split holes 22. The elongated holes 19 are printed circuit boards 11 and 13, 12 and 13, 12 and 14, 13
At the boundary between the two, a substantially L-shape is formed as shown in FIG.
このように構成された各プリント基板11〜14からなる
母材Ｂは、前述の第１実施例と同様、半田付工程に供さ
れた後、板取りされる。The base material B composed of the printed boards 11 to 14 configured as described above is subjected to a soldering process and then stripped, similarly to the first embodiment.
まず第１に、プリント基板11を把持し、プリント基板
11と13の境界線を折曲げ線として折曲げる。すると、プ
リント基板11と13の結合個所であった割り孔17周辺の部
材が境界線に沿って割れるとともに、プリント基板11と
12の結合個所であった架橋部18も割れ、プリント基板11
が板取りされる。First, the printed circuit board 11 is gripped and
Bend the border between 11 and 13 as a fold line. Then, the members around the split hole 17, which was the connecting point of the printed boards 11 and 13, are broken along the boundary line, and
The bridging part 18 which was the connecting point of 12 also cracked, and the printed circuit board 11
Is stripped.
引き続いて、プリント基板12を把持し、プリント基板
12と14の境界線を折曲げ線として折曲げる。すると、プ
リント基板12と14の結合個所であった割り孔20周辺の部
材が境界線に沿って割れ、プリント基板12が板取りされ
る。Subsequently, the user holds the printed circuit board 12 and
Bend the boundary between 12 and 14 as a fold line. Then, the members around the split hole 20, which are the connecting points of the printed boards 12 and 14, are broken along the boundary line, and the printed board 12 is removed.
続いて、プリント基板13を把持し、プリント基板13と
14の境界線を折曲げ線として折曲げる。すると、プリン
ト基板13と14の結合個所であった割り孔22周辺の部材が
境界線に沿って割れ、プリント基板13が板取りされると
同時に、一隅部が矩形状に板取りされたプリント基板14
が得られる。Subsequently, the printed circuit board 13 is gripped, and the printed circuit board 13 is
Fold 14 boundary lines as bending lines. Then, the member around the split hole 22 which was the connecting point of the printed boards 13 and 14 was broken along the boundary line, and the printed board 13 was cut off at the same time as the printed board 13 with one corner cut off in a rectangular shape. 14
Is obtained.
本実施例における、各プリント基板11〜14からなる母
材Ｂは、前記構成を有しているので、第１実施例に挙げ
た効果と同様の効果を奏するとともに、板取りされる部
材の面積が大きい場合においては、プリント基板14の角
部を損傷することなく、プリント基板11〜13を板取りす
ることができる点で本実施例の効果がより一層発揮され
るものである。In the present embodiment, the base material B composed of each of the printed boards 11 to 14 has the above-described configuration, so that the same effects as the effects described in the first embodiment can be obtained, and the area of the member to be cut out. In the case where is large, the effect of the present embodiment is further exhibited in that the printed boards 11 to 13 can be removed without damaging the corners of the printed board 14.
なお、本発明のプリント基板は、上記実施例に限定さ
れるものではなく、発明の趣旨を逸脱しない範囲で例え
ば次のようにして構成することもできる。It should be noted that the printed circuit board of the present invention is not limited to the above embodiment, and may be configured as follows, for example, without departing from the spirit of the invention.
（１）前記各実施例において、プリント基板1,2を２段
階で、また、プリント基板11,12,13を３段階で順次折曲
げられることによって、板取りされる母材A,Bを採用し
たが、４段階以上で折曲げられるような構成とした母材
を用いてもよい。(1) In each of the above-described embodiments, the base materials A and B to be cut are adopted by sequentially bending the printed circuit boards 1 and 2 in two steps and the printed circuit boards 11, 12, and 13 in three steps. However, a base material configured to be bent in four or more steps may be used.
（２）各プリント基板間の境界部は、前記実施例以外の
組合せからなるもの、例えば割り孔と長孔との組合せだ
けからなるもの等であってもよい。(2) The boundary between the printed circuit boards may be formed of a combination other than the above-described embodiment, for example, may be formed of only a combination of a split hole and a long hole.
（３）各プリント基板の形状は、前記実施例においては
全て矩形状のものを用いたが、例えば、プリント基板が
配線されていないもの、いわゆるダミーである場合など
においては、前記形状は必ずしも矩形状である場合はな
く、三角形等の形状であってもよい。(3) In the above-described embodiment, the shape of each printed circuit board is all rectangular. For example, when the printed circuit board is not wired, that is, when it is a so-called dummy, the shape is not necessarily rectangular. The shape is not limited to a shape, and may be a shape such as a triangle.
（４）前記各実施例においては、割り孔6,9,17,20,22は
いずれも丸孔であったが、割り孔の形状は特に限定され
るものではなく、例えば楕円形状、菱形状であってもよ
い。また前記割り孔の数も特に限定されるものではな
く、1,2個であっても４個以上であってもよい。(4) In each of the above embodiments, the split holes 6, 9, 17, 20, and 22 were all round holes. However, the shape of the split holes is not particularly limited. It may be. Also, the number of the split holes is not particularly limited, and may be one or two or four or more.
（５）前記各孔の幅や各孔間の間隔は目的とするプリン
ト配線基板の形状、大きさ、材質に応じて適宜設定され
る。(5) The width of each hole and the interval between the holes are appropriately set according to the shape, size, and material of the target printed wiring board.
以上詳述したように本発明のプリント配線基板によれ
ば、母材の隅部にて互いに交差する２辺で同母材から分
割される分割基板を安定して支持することができるとと
もに、その分割基板を母材から同母材に損傷を与えるこ
となく簡単に分割することができるAs described above in detail, according to the printed wiring board of the present invention, it is possible to stably support the divided substrate divided from the same base material at two sides intersecting each other at the corners of the base material, and Divided substrates can be easily separated from the base material without damaging the base material
第１図は本発明の第１実施例のプリント配線基板を示す
要部平面図、第2,3図は本発明のプリント配線基板（母
材）のプリント基板が板取りされた状態を示す要部平面
図、第４図は本発明の第２実施例のプリント配線基板を
示す要部平面図、第5,6図は従来のプリント配線基板を
示す要部平面図である。 1,11……分割基板としてのプリント基板、7,18……支持
部としての架橋部、A,B……母材。FIG. 1 is a plan view of an essential part showing a printed wiring board according to a first embodiment of the present invention, and FIGS. 2 and 3 are essential parts showing a state in which the printed circuit board of the printed wiring board (base material) of the present invention has been removed. FIG. 4 is a main part plan view showing a printed wiring board of a second embodiment of the present invention, and FIGS. 5 and 6 are main part plan views showing a conventional printed wiring board. 1,11: Printed circuit board as divided board, 7,18 ... Bridged part as support part, A, B ... Base material.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 昭54−164870（ＪＰ，Ｕ) 実開 昭60−49658（ＪＰ，Ｕ) 実開 昭61−34764（ＪＰ，Ｕ) 実開 昭58−153469（ＪＰ，Ｕ) 実開 昭57−200054（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/02──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model Sho 54-164870 (JP, U) Japanese Utility Model Sho 60-49658 (JP, U) Japanese Utility Model Sho 61-34764 (JP, U) Japanese Utility Model Sho 58- 153469 (JP, U) Japanese Utility Model Showa 57-200054 (JP, U) (58) Field surveyed (Int. Cl. 6 , DB name) H05K 1/02
Claims (1)
材から分割される分割基板を備えたプリント配線基板に
おいて、 前記分割基板を前記２辺にそれぞれ設けた１箇所の支持
部によって母材に支持し、前記両支持部のうち一方の支
持部を他方の支持部を設けた辺に近接した位置に設けた
プリント配線基板。1. A printed wiring board provided with a divided board divided from the same base material at two sides intersecting each other at a corner of the base material, wherein the divided board is provided at each of the two sides. A printed wiring board supported by a base material by a portion, wherein one of the two support portions is provided at a position close to a side on which the other support portion is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2261642A JP2790368B2 (en) | 1990-09-28 | 1990-09-28 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2261642A JP2790368B2 (en) | 1990-09-28 | 1990-09-28 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04137785A JPH04137785A (en) | 1992-05-12 |
| JP2790368B2 true JP2790368B2 (en) | 1998-08-27 |
Family
ID=17364735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2261642A Expired - Fee Related JP2790368B2 (en) | 1990-09-28 | 1990-09-28 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2790368B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010167536A (en) * | 2009-01-23 | 2010-08-05 | Seiko Epson Corp | Actuator and actuator connected body |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200054U (en) * | 1981-06-15 | 1982-12-20 | ||
| JPS58153469U (en) * | 1982-04-07 | 1983-10-14 | 株式会社東芝 | Printed board |
| JPS6049658U (en) * | 1983-09-14 | 1985-04-08 | 三洋電機株式会社 | Printed board |
| JPS6134764U (en) * | 1984-07-31 | 1986-03-03 | 三洋電機株式会社 | Printed board |
-
1990
- 1990-09-28 JP JP2261642A patent/JP2790368B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04137785A (en) | 1992-05-12 |
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