JP2793553B2 - Package for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for a semiconductor device, and more particularly to a package for a semiconductor device on which a semiconductor element is mounted and which has a multilayer ceramic capacitor.

[0002]

2. Description of the Related Art Conventionally, such a semiconductor device package includes an electric wiring board on which a multilayer ceramic capacitor is mounted, and a metal plate on which a semiconductor element is mounted, and this metal plate is used for heat dissipation of the semiconductor element. . For example, with the recent increase in speed and power consumption of semiconductor devices, multilayer ceramic capacitors are mounted for the purpose of reducing ground bounce noise, or metal plates are used for the purpose of efficiently dissipating heat generated by semiconductor devices. The number of packages used is increasing.

FIGS. 3 (a) and 3 (b) are a top view of a semiconductor device package and an AA 'cross-sectional view thereof for explaining one example of the prior art. As shown in FIGS. 3A and 3B, such a package includes an electric wiring board 1,
A metal plate 4a on which the semiconductor element 9 is mounted and which is fixed to the electric wiring board 1; The electrical wiring board 1 has an opening 2 formed in the center, and a plurality of external terminals 3 for electrical connection are led out from the lower surface. In addition, the semiconductor element 9 fixed to the metal plate 4a is arranged so as to be located in the opening 2, and the power supply terminal 8a and the ground terminal 8b are provided at positions (four places) surrounding the semiconductor element 9 on the upper surface. The ceramic capacitor 7 is mounted. on the other hand,
The metal plate 4 a forms an element mounting portion 6 for fixing the semiconductor element 9 at the center, and is fixed to the upper surface of the electric wiring board 1. For this reason, the upper surface of the opening of the electric wiring board 1 is closed by the metal plate 4 a, and the semiconductor element 9 is arranged in the opening 2.

Further, after the semiconductor element 9 is bonded and connected to a pad (not shown) of the wiring board 1 by a thin metal wire 10, the lower surface of the opening of the electric wiring board 1 is blocked by a metal cap 11 or the like to protect it from the outside. I do. The electrical connection between the semiconductor element 9 and an external circuit is made by the external terminal 3 described above. The multilayer ceramic capacitor 7 is generally mounted in a state of being electrically connected to a power supply terminal 8a and a ground terminal 8b provided on the upper surface of the electric wiring board 1 outside the mounting portion of the metal plate 4a.

In a semiconductor device package having such a structure, the multilayer ceramic capacitor 7 and the metal plate 4a are generally mounted on the upper surface of an electric wiring board 1 made of a ceramic substrate or a plastic substrate.
That is, the multilayer ceramic capacitor 7 for reducing the ground bounce noise, which is a potential fluctuation between the power supply line and the ground line, is more effective as the mounting position thereof is closer to the semiconductor element 9. In particular, for products in which ground bounce noise is important, the dimensions of the metal plate 4a mounted inside the mounting portion of the multilayer ceramic capacitor 7 are designed to be as small as possible.

[0006]

The above-described conventional package for a semiconductor device has a structure in which a multilayer ceramic capacitor is mounted outside a metal plate mounted on an upper surface of an electric wiring board. The closer the mounting position is to the semiconductor element, the smaller the mounting area of the metal plate becomes. Therefore, the more the emphasis is placed on reducing ground bounce noise, the more disadvantageously the heat dissipation characteristic of the semiconductor element against heat generation during operation is significantly impaired.

An object of the present invention is to provide a package for a semiconductor device in which such a multilayer ceramic capacitor is arranged near a semiconductor element to reduce ground bounce noise and at the same time does not hinder heat radiation characteristics.

[0008]

According to the present invention, there is provided a package for a semiconductor device, wherein an opening is formed in the center and a plurality of external terminals for electrical connection are led out from a lower surface; A metal plate fixed to an upper surface of a wiring board and having an element mounting portion formed so as to close the upper surface side of the opening of the electrical wiring substrate; and an element mounting portion of the metal plate positioned in the opening. A fixed ceramic element, and a multilayer ceramic capacitor mounted on the upper surface of the electrical wiring board and at a position surrounding the semiconductor element, wherein the metal plate on the upper surface of the electrical wiring board is It is configured to extend to the outside.

In the semiconductor device package according to the present invention, the metal plate has an opening formed around the multilayer ceramic capacitor provided on the electric wiring board,
It is formed so as to cover most of the upper surface of the electric wiring board.

Further, in the semiconductor device package according to the present invention, the metal plate has a concave portion formed in the vicinity of the multilayer ceramic capacitor provided on the electric wiring board,
It is formed so as to cover most of the remaining portion of the upper surface of the electric wiring board.

[0011]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a top view and a sectional view taken along the line AA 'of a semiconductor device package, respectively, for explaining an embodiment of the present invention. FIG. 1 (a),
As shown in FIG. 1B, the semiconductor device package according to the present embodiment has an electric wiring board 1 in which an opening 2 is formed in the center and a plurality of external terminals 3 for electric connection are led out from the lower surface.
A metal plate 4 on which an element mounting portion 6 is formed so as to be fixed to the upper surface of the electric wiring substrate 1 and close the upper surface side of the opening 2 of the electric wiring substrate 1, and is located in the opening 2. Semiconductor element 9 fixed to element mounting portion 6 of metal plate 4
And a multilayer ceramic capacitor 7 mounted on the upper surface of the electric wiring substrate 1 and at a position surrounding the semiconductor element 9. The metal plate 4 on the upper surface of the electric wiring substrate 1 extends outside the multilayer ceramic capacitor 7. Extending. In particular, the metal plate 4 forms an opening 5 around the multilayer ceramic capacitor 7 provided on the electric wiring board 1 so as to cover almost the upper surface of the electric wiring board 1. In addition,
A power supply terminal 8a and a ground terminal 8b connected to both ends of the multilayer ceramic capacitor 7, and a thin metal wire 10 and a protective metal cap 11 connected to the semiconductor element 9,
This is the same as the conventional example of FIG.

Also in the present embodiment, the opening 2 is provided at the center.
The upper surface of the opening of the electric wiring board 1 in which is formed is closed by the metal plate 4, and the semiconductor element 9 is mounted on the metal plate 4 in the opening 2. Further, the lower surface of the opening of the electric wiring board 1 is shielded from the outside by blocking the semiconductor element 9 with a metal cap 11 or the like.

The present embodiment is different from the conventional example in that the metal plate 4 fixed to the upper surface of the opening 2 of the electric wiring board 1 forms the opening 5 for enabling the mounting of the multilayer ceramic capacitor 7. The structure is such that the multilayer ceramic capacitor 7 can be mounted closer to the semiconductor element 9 irrespective of the size of the metal plate 4. Further, the metal plate 4 also covers the electrical wiring board 1 outside the mounting position of the multilayer ceramic capacitor 7, thereby enhancing the heat radiation effect of the heat generated by the semiconductor element 9.

As described above, the package for a semiconductor device according to the present embodiment has the multilayer ceramic capacitor 7 mounted on the metal plate 4 attached for the purpose of efficiently radiating heat generated during operation of the semiconductor element 9 to the outside. Opening 5 is formed, and the multilayer ceramic capacitor 7 is formed.
By employing a structure in which the electric wiring board 1 outside the mounting portion can be fixed by the metal plate 4, even when the mounting position of the multilayer ceramic capacitor 7 is near the semiconductor element 9, the mounting area of the metal plate 4 is almost zero. Has no effect.

FIG. 2 is a top view of a semiconductor device package for explaining another embodiment of the present invention. As shown in FIG. 2, the semiconductor device package according to the present embodiment is different from the above-described embodiment in that the shape of the metal plate 4 is changed. That is, the metal plate 4 forms the recess 12 in the vicinity of the multilayer ceramic capacitor 7 provided on the electric wiring board 1 so as to cover most of the remaining portion of the upper surface of the electric wiring board 1. Also in this case, the upper surface of the opening of the electric wiring board 1 having the opening 2 formed in the center is closed by the metal plate 4, and the semiconductor element 9 is fixed to the metal plate 4 in the opening 2. The lower surface of the opening of the electric wiring board 1 is shielded and protected from the outside by a metal cap or the like.

In short, the metal plate 4 fixed to the upper surface of the opening of the electric wiring board 1 in this embodiment
2 to form a multilayer ceramic capacitor 7
The structure extends to the four corners (corners) of the electric wiring board 1 outside the mounting position of the multilayer ceramic capacitor 7 while avoiding the mounting portion of the multilayer ceramic capacitor 7.

[0018]

As described above, the semiconductor device package of the present invention not only covers the upper surface of the semiconductor element but also covers the semiconductor plate with respect to the metal plate mounted on the electric wiring board having the opening. By avoiding the mounting portion of the multilayer ceramic capacitor arranged around the element and extending to the outside of the mounting position of the multilayer ceramic capacitor on the electric wiring board, regardless of the size of the metal plate,
Since the multilayer ceramic capacitor can be mounted in the vicinity of the semiconductor element, there is an effect that the ground bounce noise can be efficiently reduced without obstructing the heat radiation characteristics to the element.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a top surface and a cross section of a semiconductor device package for describing an embodiment of the present invention;

FIG. 2 is a top view of a semiconductor device package for explaining another embodiment of the present invention.

FIG. 3 is a diagram illustrating a top surface and a cross section of a semiconductor device package for explaining an example of the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrical wiring board 2 Opening 3 External terminal 4 Metal plate 5 Opening 6 Element mounting part 7 Multilayer ceramic capacitor 8a Power supply terminal 8b Ground terminal 9 Semiconductor element 10 Fine metal wire 11 Metal cap 12 Concave part

Claims (3)

(57) [Claims] An electric wiring board having an opening formed in the center and a plurality of external terminals for electrical connection leading out from a lower surface, and an electric wiring board fixed to an upper surface of the electric wiring board. A metal plate on which an element mounting portion is formed so as to close an upper surface side of the opening, a semiconductor element fixed to the element mounting portion of the metal plate located in the opening, and an electric wiring board. A multilayer ceramic capacitor mounted on the upper surface and at a position surrounding the semiconductor element, wherein the metal plate on the upper surface of the electrical wiring board extends to the outside of the multilayer ceramic capacitor. Equipment package. 2. The electric circuit board according to claim 1, wherein the metal plate has an opening formed around the multilayer ceramic capacitor provided on the electric wiring board, and covers most of the upper surface of the electric wiring board. Package for semiconductor devices. 3. A method according to claim 1, wherein the metal plate has a recess formed near the multilayer ceramic capacitor provided on the electrical wiring board, and covers most of a remaining portion of the upper surface of the electrical wiring board. Item 2. A package for a semiconductor device according to Item 1.