JP2798546B2 - Cutting dies for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding apparatus for semiconductor devices, and more particularly to a mold for the molding apparatus.

[0002]

2. Description of the Related Art A conventional cutting die has a punch 1 and a die 2 as cutting blades as shown in FIG.

Next, the operation will be described. When the semiconductor device is cut, when the punch 1 comes into contact with the object 4 on the die 2, a shearing force acts to punch the object 4.

[0004] Thereafter, the punch 1 continues to descend to the bottom dead center 5 and stops, the punch 1 rises and returns to the original position, and a series of cutting operations ends.

[0005] The cutting debris 6 generated when cutting is generally discharged one by one as shown in FIG. 2 (B). However, the punch rises with the cutting debris attached, and the cutting debris is removed. In some cases, “cutting waste” may occur (FIG. 2C).

[0006] Since this cutting waste may cause a serious quality accident, as a preventive measure, a method of extending the punch stroke and projecting the bottom dead center from the tapered portion 7 (FIG. 3A), There is a method of shifting the tapered portion above the bottom dead center while keeping the bottom dead center as it is in the related art (FIG. 3B). Cutting debris has been removed by these measures.

[0007]

In the conventional cutting die shown in FIG. 3A, there is a disadvantage that the contact area between the punch and the die is large, so that the die is easily worn and the tool life is short.

In the case of FIG. 3B, the wear is small, but the strength of the die is reduced.

An object of the present invention is to provide a cutting waste phenomenon.
Without affecting the tool life, etc.
An object of the present invention is to provide a cutting die for a semiconductor device.

[0010]

In order to achieve the above object, a cutting die for a semiconductor device according to the present invention is a cutting die for a semiconductor device having a punch for processing an object to be cut. , With a structure divided along the axial direction,
In order to prevent the cutting waste from rising, it is possible to make a differential in the axial direction.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.
1 and 4 illustrate the problems of the prior art shown in FIG.
It shows a reference example devised for improvement.

The cutting die for a semiconductor device shown in FIG.
An object to be cut is set on the die 2 as shown in FIG.
Figure 1 (B) of the object to be cut 4 is lowered to the bottom dead center 5 punch 1 as shown in to punching by a die 2
It has become.

[0013] Then, as shown in FIG. 1 (B), the punch 1
Is descending to the bottom dead center 5, the eject pin 3 protrudes from the lower end of the punch 1, and the cutting waste 6 is dropped downward by the eject pin 3, thereby preventing the cutting waste from going up.

In the cutting die for a semiconductor device shown in FIG. 4, the number of eject pins 3 is increased, and a plurality of eject pins 3 protrude from the multi-pin ejector type punch 8 to prevent cutting dust from entering. Like that.

The cutting die for a semiconductor device shown in FIG. 6 is constituted as a high-pressure air-type punch 10 having a hole 10a at the center of the punch 10, and high-pressure air is injected from the hole 10a to cut off cutting dust. Try to prevent .

In a cutting die for a semiconductor device,
The elephant to be cut is very small.
The tips themselves tend to be very small and elongated.

Therefore, it is possible to prevent the cutting waste from rising.
The punch itself by reducing the size of the punch.
It must be capable of withstanding continuous use.
1. Improve the cutting die for semiconductor device shown in FIGS. 4, 4 and 6.
Need to be

Therefore, a semiconductor device according to an embodiment of the present invention
As shown in Fig. 5, a cutting die for punching
Punch 9 as a differential punch divided along the axial direction
After punching, the two punches 9, 9 are
To prevent cutting waste from rising
Things.

[0019]

As described above, according to the present invention, the punch is divided along the axial direction, for example, one punch is constituted as a differential punch in which the punch is divided into two right and left parts. Are made different from each other, it is possible to prevent the cutting waste from climbing up, and the tool life of the cutting fitting is not shortened. Further, according to the present invention, since the punch is divided in the axial direction and is not divided by adding a dividing mechanism to the punch, it is possible to reduce the size of the punch itself. It is possible to cope with the case of becoming elongated in the direction.

[Brief description of the drawings]

FIG. 1 is an improvement of the conventional example shown in FIG .
It is a figure which shows a metal mold | die , (A) is a state figure before operation | movement, (B) is a state figure after operation | movement.

FIG. 2 is a diagram showing a conventional example.

FIG. 3 is a diagram showing a conventional example.

FIG. 4 is an improved cutting example of a conventional semiconductor device shown in FIG .
It is a figure showing a metallic mold .

FIG. 5 is a view showing a cutting die for a semiconductor device according to one embodiment of the present invention.

FIG. 6 is an improvement of the conventional example shown in FIG .
It is a figure showing a metallic mold .

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Punch 2 Dice 3 Eject pin 4 Object to be cut 5 Bottom dead center 6 Cutting waste 7 Tapered part 8 Multi-pin eject type punch 9 Differential type punch 10 High pressure air type punch

Claims (1)

(57) [Claims] 1. A cutting die for a semiconductor device having a punch for processing an object to be cut, wherein the punch has a structure divided along an axial direction, and the punches are separated from each other in order to prevent cutting waste from rising. A cutting mold for a semiconductor device, characterized in that the cutting mold can be made differential in a direction.