JP2799393B2 - Component positioning tray and chip mounting method using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a technology for accurately positioning and storing components, and more particularly, to correcting a mounted component by a predetermined angle in a process of assembling a small component such as a semiconductor device. When rotating horizontally,
The present invention relates to a technique that is effective for reducing the rotational deviation.

[Conventional technology]

In assembling a semiconductor device, there is a step of using a chip mount device, and here, it is required to accurately position the semiconductor chip. That is, when using the chip mounting device, first, the semiconductor chip is stored in the concave portion of the positioning tray having a plurality of concave portions whose mounting portions are accurately processed, and the semiconductor chip is positioned. After that, the semiconductor chip is taken out from the concave portion using the chip mounting device, and the semiconductor chip is mounted on the chip mounting portion. However, since the rotation correction of the chip mounting device is, for example, within 5 mm, the semiconductor chip on the tray side is used. High precision is required for the processing of the mounting part.

The technology relating to such a tray for positioning components is described in, for example, "Floorware Catalog", published by Dainippon Shoji Co., Ltd., p.114, 1987.

By the way, the present inventor studied a horizontal rotation deviation (hereinafter referred to as θ rotation) due to a limit of processing accuracy of the component positioning tray.

The following is a technique studied by the present inventors, and the outline is as follows.

That is, as shown in FIG. 7 (a plan view) and FIG. 8 (a cross-sectional view taken along the line AA in FIG. 7), the tray 1 which has been conventionally used has a component 2 (here, a semiconductor chip) mounted thereon. The part to be cut is dug down to the external dimensions of the component 2 by milling. Since this processing is performed using an end mill having a certain diameter, the corner portion has a corner radius (R) 3 equivalent to the mill radius, and the width of the part 2 plus a margin 4 is equal to the width of the guide wall 5. And

FIG. 9 and FIG. 10 are a plan view and a cross-sectional view taken along line BB of another conventional component positioning tray.

In this example, the radius (R) is removed from the corner of the component 2 so that the margin can be reduced. That is, the corner-removing holes 6 are formed by using an end mill or a drill having a diameter equal to or larger than the diameter of the corner radius 3, and the corner radius 3 is scraped off.

FIG. 11 and FIG. 12 are a plan view and a cross-sectional view taken along CC, respectively, showing another conventional component positioning tray.

In this configuration, the corner radius 3 that leads to the formation of a margin is not formed, and one side guide 9 or 10 is provided for each side of the component 2. In this processing method,
Processing using a milling machine is possible, and the end mill processing with a small diameter can be eliminated. Therefore, the processing cost can be minimized.

In a tray handling small components such as a semiconductor chip, it is difficult to achieve the required accuracy unless machining is performed by cutting.

[Problems to be solved by the invention]

However, the present inventor has found the following problems in the component positioning tray as described above.

That is, in the configuration of FIGS. 7 and 8, since the corner radius 3 and the margin 4 are present, when the size of the component 2 is reduced, the influence of the corner radius 3 and the margin 4 appears greatly, and There is a disadvantage that the rattling increases,
In order to remedy this drawback, it is necessary to take measures such as reducing the size of the end mill or processing only the corners with a small-diameter end mill, which increases the number of steps.

Further, in the configurations shown in FIGS. 9 and 10, although there is an advantage that rattling can be reduced even if the component size is reduced, a step of finishing the corner radius diameter and cutting off is required.

Further, in FIGS. 11 and 12, although there is no corner radius, the machining is easy, but there is no guide corresponding to the component corner, and the rattling due to the rotation of the component increases. As described above, in the conventional tray, it was difficult to eliminate the θ rotation deviation by a simple configuration.

Therefore, an object of the present invention is to provide a technique capable of minimizing the θ rotation deviation without increasing the number of processing steps and costs.

The above objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[Means for solving the problem]

The outline of a typical invention disclosed in the present application will be briefly described as follows.

That is, the component positioning tray of the present invention is provided along the first side of the rectangular component and has a first guide shorter than the first side and a second guide crossing the first side of the component. And a second guide provided along the side of the first guide, and the positioning of the component is performed by the first guide and the second guide. The second guide extends horizontally of the first guide. It is formed to cross the line.

Further, the chip mounting method of the present invention includes a step of storing a semiconductor chip which is a rectangular component in the concave portion of the component positioning tray having a plurality of concave portions, and a step of storing the semiconductor chip from the concave portion of the component positioning tray. Removing, and mounting the semiconductor chip on a chip mounting portion, wherein each of the recesses of the component positioning tray has a tray base portion for supporting the rectangular component; Two first guides which are provided to face each other along the opposing first sides and are shorter than the first sides; and two opposing second sides intersecting the first sides of the semiconductor chip. A pair of second guides are formed by a pair of second guides provided so as to face each other, and the pair of second guides facing each other are formed by the first guides facing each other. Either or provided so as to exceed the horizontal extension line of both, by the first and second guide upon accommodating the semiconductor chip in the recess in which to position the semiconductor chip.

[Action]

According to the above-described means, the first guide provided along the first side of the rectangular component is shorter than the first side, and the second guide crosses the horizontal extension of the first guide. Formed, the substantially entire length of the two opposing sides of the component is the first
And the second guide is in contact with the component, and its rotation diameter becomes the diagonal length of the component, and the corner radius does not exist at the component corner, so that the margin can be reduced. Therefore, the processing can be facilitated and the θ rotation deviation can be minimized.

Further, the first guide provided along the first side of the semiconductor chip is shorter than the first side of the semiconductor chip, and the second guide is formed so as to exceed the horizontal extension of the first guide. Accordingly, when the semiconductor chip is positioned by the first and second guides, the rotational diameter of the semiconductor chip becomes its diagonal length, and since the corner radius does not exist in the component corner portion, the margin in the concave portion can be reduced. it can. Thereby, θ of the semiconductor chip is
Rotational deviation can be minimized.

As a result, it is possible to position the semiconductor chip with high accuracy by the first and second guides, thereby improving the accuracy in mounting the semiconductor chip.

[Embodiment 1] Figs. 1 and 2 are a plan view and a cross-sectional view taken along the line DD, respectively, showing an embodiment of a component positioning tray 7 according to the present invention.

In this embodiment, a rectangular component 2 (here, a semiconductor chip) is used.
And two second guides, that is, corner guides 8, for positioning and regulating two sides (opposite second sides) of the component 2 between the mounting areas are provided along the two sides of the component 2, respectively. The component 2 is orthogonal to the corner guide 8.
The two first guides, that is, the side guides 9 for positioning and regulating the other two sides (the opposing first sides) are respectively provided along the other two sides of the component 2.

The formation of the corner portion guide 8 is performed by horizontally moving an end mill along both sides to form a groove. On the other hand, the side guide 9 horizontally moves an end mill along both sides thereof to machine a groove. The side guide 9 is used only for restricting the movement of the component 2. Therefore, its length may be arbitrary. The depth of each groove may be greater than the depth necessary to regulate the movement of the component 2. Both ends of the side guide 9 are removed when the corner part guide 8 is processed. Further, a concave portion is formed between the side guides 9 by meandering the end mill.

Thereby, the concave portion is formed by the tray base portion 7 a supporting the component 2, the corner portion guide 8, and the side guide 9.

By the above processing, the corner portion of the component 2 is restricted from rotating by the corner portion guide 8 projecting from a horizontal extension line inside the side guide 9, and the side guide 9 serves as a stopper for preventing the movement of the component 2. Function.

Therefore, it is possible to prevent the θ rotation deviation only by using the corner portion guide 8 without providing a corner radius at the corner portion, and it is possible to reduce the number of control points of the processing accuracy.

The gap between the opposing corner portion guides 8 and the side guides 9 may be the maximum size of the component 2 + the handling margin, so that the θ rotation deviation can be minimized. Also,
Since the side guide 9 can be set to an arbitrary length, a large diameter end mill can be used, and even if the number of processing steps is reduced, the θ rotation deviation amount does not increase.

Second Embodiment FIGS. 3 and 4 are a plan view and a cross-sectional view taken along the line EE of a second embodiment of the present invention.

In this embodiment, the rectangular part 2 (semiconductor chip) in the above embodiment has a configuration in which a portion facing the center of each side is removed.

By dividing the end mill in this manner, the end mill can be moved to the entire width of the tray 7 at a stroke. That is, the degree of freedom of the connection processing by the end mill can be improved. In this case, the effect of restricting the θ rotation deviation is not different from that of the embodiment.

Third Embodiment FIGS. 5 and 6 are a plan view and a cross-sectional view taken along the line FF, respectively, showing a third embodiment of the present invention.

This embodiment is characterized in that a side guide 10 corresponding to the side guide 9 of the above embodiment is cross-connected to a corner portion guide 8, and corner radiuses 11 are provided at both ends of the side guide 10. The corner radius 11 is formed at a position where the corner portion 11 bites into the side guide 10 from the outer surface of the rectangular component 2 (semiconductor chip). That is, the corner radius 11 is formed by providing an offset 12 corresponding to the radius of the corner radius 11.

Although the invention made by the present invention has been specifically described based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments and can be variously modified without departing from the gist thereof.

For example, in the above-described embodiment, the example in which the component 2 is a square has been described, but the component 2 may be a rectangle. In this case, it is desirable to provide a corner portion guide 8 on the long side.

In addition, tray materials include metals, plastics, etc.
Various materials can be used. For example, in the case of injection molding, since there is no need to design a clearance allowance at the corner radius portion, the pocket size can be reduced, and as a result, the θ rotation deviation can be reduced.

In the above description, the case where the invention made by the present inventor is mainly applied to the semiconductor manufacturing related field of its application has been described. However, the present invention is not limited to this. It is applicable for everything that needs to be done.

〔The invention's effect〕

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

That is, in the first and second guides provided along each side of the rectangular component, the first guide is formed shorter than the first side of the component, and the second guide is a horizontal extension of the first guide. , The processing can be performed easily without additional processing of the corner radius portion and without using a small-diameter mill, and the θ rotation deviation can be minimized.

Also, the first guide is formed shorter than the first side of the semiconductor chip, and the second guide is formed so as to extend beyond the horizontal extension of the first guide. When positioning, the θ rotation deviation of the semiconductor chip can be minimized.

As a result, it is possible to position the semiconductor chip with high precision by the first guide and the second guide, thereby improving the precision in mounting the semiconductor chip.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a component positioning tray according to the present invention, FIG. 2 is a cross-sectional view of the embodiment of FIG. 1 taken along the line D-D, and FIG. 3 is a second embodiment of the present invention. FIG. 4 is a cross-sectional view of the embodiment of FIG. 3 taken along the line EE, FIG. 5 is a plan view of the third embodiment of the present invention, and FIG. FIG. 7 is a plan view showing a first example of a conventional component positioning tray, FIG. 8 is a cross-sectional view taken along line AA of FIG. 7, and FIG. 9 is a conventional component positioning tray. FIG. 10 is a plan view showing a second example of the tray, FIG. 10 is a sectional view taken along the line BB of FIG. 9, FIG. 11 is a plan view showing a third example of the conventional component positioning tray, and FIG. FIG. 11 is a sectional view taken along the line CC in FIG. 11. 1 ... tray, 2 ... parts, 3 ... corner radius, 4 ...
... room, 5 ... guide wall, 6 ... corner removal hole, 7
…… Tray for component positioning, 7a …… Tray base, 8
…… Corner guide, 9,10 …… Side guide, 11… Corner radius, 12 …… Offset.

──────────────────────────────────────────────────の Continuation of the front page (72) Inventor Masayuki Kawashima 5-20-1, Josuihonmachi, Kodaira-shi, Tokyo Hitachi Ultra LSE Engineering Co., Ltd. (56) References JP-A-3 JP-A-208350 (JP, A) JP-A-58-97839 (JP, A) JP-A-54-13264 (JP, A) JP-A-3-175648 (JP, A) Japanese Utility Model Laid-Open No. 61-5711 (JP, U) (58) Fields surveyed (Int.Cl. ⁶ , DB name) H01L 21/60 311 H01L 21/52 B65G 1/00-1/48

Claims (2)

(57) [Claims] 1. A first guide provided along a first side of a rectangular component and shorter than the first side, and a second guide intersecting the first side of the component. A component positioning tray for positioning the component by the first guide and the second guide, the second guide including a horizontal extension line of the first guide. A component positioning tray characterized by being formed so as to exceed the tray. 2. A step of accommodating a semiconductor chip which is a rectangular component in the concave portion of the component positioning tray having a plurality of concave portions, a step of taking out the semiconductor chip from the concave portion of the component positioning tray, Mounting the semiconductor chip on the chip mounting portion, wherein the concave portion of each of the component positioning trays opposes the tray base portion supporting the rectangular component and the semiconductor chip. Two first guides provided to face each other along the first side and shorter than the first side, and along the second sides facing the first side of the semiconductor chip, respectively. And a pair of second guides opposed to each other are formed by a second guide provided opposite to the first guide. Or provided so as to exceed the horizontal extension line of both chip mounting method characterized by positioning said semiconductor chip by said first and second guide upon accommodating the semiconductor chip in the recess.