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JP2801916B2 - Defect inspection equipment - Google Patents
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JP2801916B2 - Defect inspection equipment - Google Patents

Defect inspection equipment

Info

Publication number
JP2801916B2
JP2801916B2 JP63248577A JP24857788A JP2801916B2 JP 2801916 B2 JP2801916 B2 JP 2801916B2 JP 63248577 A JP63248577 A JP 63248577A JP 24857788 A JP24857788 A JP 24857788A JP 2801916 B2 JP2801916 B2 JP 2801916B2
Authority
JP
Japan
Prior art keywords
sample
image
defect
camera
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63248577A
Other languages
Japanese (ja)
Other versions
JPH0293312A (en
Inventor
一生 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP63248577A priority Critical patent/JP2801916B2/en
Publication of JPH0293312A publication Critical patent/JPH0293312A/en
Application granted granted Critical
Publication of JP2801916B2 publication Critical patent/JP2801916B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、平滑表面の基板や同期パターンをもつ工業
製品の微小な欠陥を検査する欠陥検査装置に関する。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a defect inspection apparatus for inspecting minute defects of a substrate having a smooth surface or an industrial product having a synchronous pattern.

〔従来の技術〕[Conventional technology]

例えばフォトマスクブランク、写真乾板、ガラス基板
などのように表面が平滑な基板やCCDカラーフィルタ、
撮像管用メッシュ電極などのような工業製品の欠陥を検
出するものとしては、暗視野照明による方法や撮像装置
を用いる方法、回折現象を利用する方法などが知られて
いる。
For example, substrates with smooth surfaces such as photomask blanks, photographic plates, glass substrates, etc., and CCD color filters,
As methods for detecting defects of industrial products such as a mesh electrode for an image pickup tube, a method using dark field illumination, a method using an image pickup device, a method using a diffraction phenomenon, and the like are known.

暗視野照明による方法は、暗視野照明で欠陥を光学的
に強調することによって欠陥を検出するものであり、撮
像装置を用いる方法は、試料像を撮像し、この像から欠
陥を自動的に検出するものである。また、回折現象を利
用する方法は、周期パターンの欠陥をその回折現象を利
用して空間フィルター法などを用いて強調し検出する
(例えば特開昭61−256241号公報)ものである。
The dark-field illumination method detects defects by optically enhancing defects with dark-field illumination.The method using an imaging device captures a sample image and automatically detects defects from this image. Is what you do. In addition, a method utilizing the diffraction phenomenon is a method in which a defect of a periodic pattern is enhanced and detected by using a spatial filter method or the like utilizing the diffraction phenomenon (for example, Japanese Patent Application Laid-Open No. 61-256241).

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

しかしながら、撮像装置を用いる方法は、高い検査感
度で欠陥を自動的に検出しようとすると、微小な欠陥ま
で映像信号に現れるようにする必要がある。そのため、
極めて強力な照明光が必要になる。また、写真乾板(エ
マルジョン基板)のように感光性の基板の検査の場合に
は、限定された波長域(通常、赤〜赤外)と強度の照明
光にすることが必要になるため、充分な明るさが得られ
ず、欠陥が検出できないという問題が生じる。さらに
は、所定の検出感度が得られる条件でも、検出すべき最
小の欠陥と、大きな欠陥との明るさの比が大きいため、
小さい欠陥が検出できる条件では、大きな欠陥での光量
が過大となり撮像面で焼付などの問題を生じる。逆に、
焼付が起きないようにすると、このような条件では、微
小欠陥が検出できないなどの欠点がある。
However, in the method using an image pickup apparatus, even when a defect is to be automatically detected with high inspection sensitivity, it is necessary to cause even a minute defect to appear in a video signal. for that reason,
Extremely strong illumination light is required. Further, in the case of inspection of a photosensitive substrate such as a photographic dry plate (emulsion substrate), it is necessary to use illumination light having a limited wavelength range (usually red to infrared) and intensity, and High brightness cannot be obtained, and defects cannot be detected. Furthermore, even under the condition that a predetermined detection sensitivity can be obtained, since the brightness ratio between the smallest defect to be detected and the large defect is large,
Under the condition that a small defect can be detected, the light amount at a large defect becomes excessive, causing a problem such as image sticking on the imaging surface. vice versa,
If seizure does not occur, there are disadvantages such as the inability to detect minute defects under such conditions.

また、回折現象を利用した方法は、検出最小欠陥と、
大きな欠陥や周期パターン部の外周などの明るさの大き
い部分との比が大きく、上記の例と同様の問題がある。
さらに、照明光に平行度の高い光が必要となり、照明光
学系にピンホール板を用いている。そのため、出射光に
充分な強度が得られないという制約もある。そこで、強
い照明にするためにレーザ光を用いると、光学系各部の
反射光の影響で観察像にスペックルなどが発生し、微小
欠陥との識別が困難になる。
In addition, the method using the diffraction phenomenon has a
The ratio to a large defect such as a large defect or the outer periphery of the periodic pattern portion is large, and there is a problem similar to the above-described example.
Furthermore, light having high parallelism is required for the illumination light, and a pinhole plate is used for the illumination optical system. For this reason, there is a restriction that sufficient intensity cannot be obtained for the emitted light. Therefore, when laser light is used for strong illumination, speckles and the like occur in an observation image due to the influence of reflected light from various parts of the optical system, and it is difficult to identify a minute defect.

本発明は、上記の課題を解決するものであって、欠陥
の大小にかかわりなく安定した感度で欠陥を検出できる
欠陥検査装置を提供することを目的とするものである。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems, and an object of the present invention is to provide a defect inspection apparatus that can detect a defect with stable sensitivity regardless of the size of the defect.

〔課題を解決するための手段〕[Means for solving the problem]

そのために本発明は、光学的に平滑表面の被検査試料
の欠陥を強調した試料像により欠陥を検出する欠陥検出
装置に於いて、光源及び該光源の特定の波長域をカット
するフィルタを有し該フィルタを通して試料を斜めから
照明する照明手段と、試料の光学像を撮像する冷却型の
CCDカメラと、照明手段で斜めから照明された試料から
の散乱光により該試料の欠陥を強調した光学像をカメラ
に結像する光学系と、試料を2次元移動する移動手段
と、カメラで撮像した画像データと移動情報を取り込み
試料の欠陥を検出する画像処理手段とを備えたことを特
徴としている。
For this purpose, the present invention provides a defect detection apparatus for detecting a defect based on a sample image in which a defect of an inspected sample having an optically smooth surface is emphasized, comprising a light source and a filter for cutting a specific wavelength range of the light source. Illuminating means for illuminating the sample obliquely through the filter, and a cooling type for capturing an optical image of the sample
A CCD camera, an optical system for forming an optical image in which a defect of the sample is emphasized by scattered light from the sample illuminated by the illumination means on the camera, a moving means for two-dimensionally moving the sample, and an image captured by the camera Image processing means for taking in the image data and the movement information thus obtained and detecting a defect of the sample.

〔作用〕[Action]

本発明の欠陥検査装置では、光源及び該光源の特定の
波長域をカットするフィルタを有し該フィルタを通して
試料を斜めから照明する照明手段と、試料の光学像を撮
像する冷却型のCCDカメラと、照明手段で斜めから照明
された試料からの散乱光により該試料の欠陥を強調した
光学像をカメラに結像する光学系と、試料を2次元移動
する移動手段と、カメラで撮像した画像データと移動情
報を取り込み試料の欠陥を検出する画像処理手段とを備
えるので、正反射した光がカメラに入射せず、試料表面
のキズや異物付着等からの散乱光による像をカメラで撮
像することができ、欠陥部を強調した像が得られる。
The defect inspection apparatus of the present invention includes a light source and a filter that cuts a specific wavelength range of the light source, an illuminating unit that illuminates the sample obliquely through the filter, and a cooled CCD camera that captures an optical image of the sample. An optical system for forming, on a camera, an optical image in which a defect of the sample is emphasized by scattered light from the sample obliquely illuminated by the illumination unit, a moving unit for two-dimensionally moving the sample, and image data captured by the camera And the image processing means to capture the movement information and detect the defect of the sample, so that the specularly reflected light does not enter the camera, and the camera captures an image due to scattered light from scratches on the sample surface or adhesion of foreign matter. And an image in which the defect is emphasized is obtained.

〔実施例〕〔Example〕

以下、図面を参照しつつ本発明の実施例について説明
する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第1図は大型の写真乾板の欠陥検査に適用した本発明
の1実施例を示す図であり、1は反射鏡、2はランプ、
3はフィルタ、4は被検査基板、5はレンズ、6はカメ
ラ、7は画像処理部、8は制御部、9はXY移動機構を示
す。
FIG. 1 is a view showing one embodiment of the present invention applied to defect inspection of a large photographic plate, wherein 1 is a reflecting mirror, 2 is a lamp,
Reference numeral 3 denotes a filter, 4 denotes a substrate to be inspected, 5 denotes a lens, 6 denotes a camera, 7 denotes an image processing unit, 8 denotes a control unit, and 9 denotes an XY moving mechanism.

第1図において、反射鏡1は、ランプ2の放射光をフ
ィルタ3の方向へ集光するものであり、フィルタ3は、
光源の特定の波長域をカットするものであり、ランプ2
の放射光の内、例えば感光性の基板に対しては感光波長
をカットするものである。カメラ6は、CCD撮像素子を
電子冷却素子によって冷却し、長時間露光による撮像を
可能にしたものであり、XY移動機構9によって逐次移動
してレンズ5による被検査基板4の光学像が数分余りで
取り込まれる。画像処理部7は、カメラ5からの映像信
号を取り込んでA/D変換して演算し、周囲に対して明る
さが異なる部分を欠陥として検出処理するものである。
In FIG. 1, a reflecting mirror 1 focuses the light emitted from a lamp 2 in the direction of a filter 3, and the filter 3
This is to cut off a specific wavelength range of the light source.
Out of the emitted light, for example, for a photosensitive substrate, the photosensitive wavelength is cut. The camera 6 cools the CCD image pickup device by an electronic cooling device to enable imaging by long-time exposure. The camera 6 is sequentially moved by the XY moving mechanism 9 and the optical image of the substrate 4 to be inspected by the lens 5 is several minutes. Captured in the remainder. The image processing unit 7 captures a video signal from the camera 5, performs A / D conversion, performs an arithmetic operation, and detects a portion having a different brightness from the surroundings as a defect.

上記のようにランプ2の放射光を反射鏡1で集光し、
フィルタ3を通して被検査基板4の表面に照射すること
により、被検査基板4が感光性の基板である場合に、感
光波長をカットして照射光を感光しない程度の強度にす
るとともに、照射角度を斜めにして、図示の如く被検査
基板4の表面で正反射した光がカメラ6に入射しないよ
うにしている。したがって、被検査基板4の表面にギス
や異物付着があると、この部分で光が散乱し、この散乱
光の一部がレンズ5を通してカメラ6に入射し像を結ぶ
ことになる。そこで、この像を画像処理部7で処理し周
囲の明るさとの対比によって欠陥を検出することができ
る。
As described above, the radiated light of the lamp 2 is collected by the reflecting mirror 1,
By irradiating the surface of the substrate 4 to be inspected through the filter 3, when the substrate 4 to be inspected is a photosensitive substrate, the photosensitive wavelength is cut so that the irradiation light is not exposed to light and the irradiation angle is reduced. The light is specularly reflected from the surface of the substrate 4 to be inspected so as not to enter the camera 6 as shown. Therefore, if there is a grease or foreign matter on the surface of the substrate 4 to be inspected, light is scattered at this portion, and a part of the scattered light enters the camera 6 through the lens 5 to form an image. Thus, the image can be processed by the image processing unit 7 and a defect can be detected by comparing with the surrounding brightness.

この場合、欠陥のない平滑表面と欠陥部では、レンズ
5を通してカメラ6に入射する明るさが全く異なるが、
欠陥の大小による明るさの差は、従来のように大きくは
ない。したがって、欠陥の大小にかかわりなく安定した
検出感度で欠陥を検出することができる。しかも、フィ
ルタ3を通して感光波長をカットし照射光を感光しない
程度の強度に落としても、CCD撮像素子を電子冷却素子
によって冷却した冷却型のCCDカメラ6を用い、長時間
露光による撮像を可能にしているので、十分な露光時間
を費やして高感度の画像を取り込むことができる。
In this case, the brightness incident on the camera 6 through the lens 5 is completely different between the defect-free smooth surface and the defect portion.
The difference in brightness depending on the size of the defect is not so large as in the conventional case. Therefore, the defect can be detected with a stable detection sensitivity regardless of the size of the defect. In addition, even if the photosensitive wavelength is cut through the filter 3 and the intensity is lowered to such a degree that the irradiated light is not exposed, it is possible to use the cooled CCD camera 6 in which the CCD image pickup device is cooled by the electronic cooling device, and perform imaging by long-time exposure. Therefore, a high-sensitivity image can be captured by spending a sufficient exposure time.

〔発明の効果〕〔The invention's effect〕

以上の説明から明らかなように、本発明によれば、被
検査試料を斜めから照明したときの散乱光で撮像した画
像データの演算処理による欠陥を検出するので、数秒の
露光時間で順次、撮像、検出と移動を繰り返すと、撮像
素子の画素数に対して、検出領域が大きい場合でも、高
解像度で撮像が出来る。しかも、感光性の基板に対して
はフィルタにより感光波長をカットすることができ、高
感度で、映像信号のダイナミックレンジが大きいため、
大きい欠陥による焼付などを起こさずに、微小な欠陥に
よる微弱な光まで検出する事ができる。
As is apparent from the above description, according to the present invention, defects are detected by the arithmetic processing of the image data captured by the scattered light when the sample to be inspected is illuminated obliquely. By repeating detection and movement, high-resolution imaging can be performed even when the detection area is large with respect to the number of pixels of the image sensor. In addition, since the photosensitive wavelength can be cut by a filter for photosensitive substrates, the sensitivity is high, and the dynamic range of video signals is large.
Even weak light due to minute defects can be detected without causing burning due to large defects.

【図面の簡単な説明】[Brief description of the drawings]

第1図は大型の写真乾板の欠陥検査に適用した本発明の
1実施例を示す図である。 1……反射鏡、2……ランプ、3……フィルタ、4……
被検査基板、5……レンズ、6……カメラ、7……画像
処理部、8……制御部、9……XY移動機構。
FIG. 1 is a diagram showing one embodiment of the present invention applied to defect inspection of a large photographic dry plate. 1 ... reflecting mirror, 2 ... lamp, 3 ... filter, 4 ...
Substrate to be inspected, 5: lens, 6: camera, 7: image processing unit, 8: control unit, 9: XY moving mechanism.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】光学的に平滑表面の被検査試料の欠陥を強
調した試料像により欠陥を検出する欠陥検出装置に於い
て、 光源及び該光源の特定の波長域をカットするフィルタを
有し該フィルタを通して試料を斜めから照明する照明手
段と、 試料の光学像を撮像する冷却型のCCDカメラと、 照明手段で斜めから照明された試料からの散乱光により
該試料の欠陥を強調した光学像をカメラに結像する光学
系と、 試料を2次元移動する移動手段と、 カメラで撮像した画像データと移動情報を取り込み試料
の欠陥を検出する画像処理手段と を備えたことを特徴とする欠陥検査装置。
1. A defect detection apparatus for detecting a defect based on a sample image in which a defect of a sample to be inspected having an optically smooth surface is emphasized, comprising a light source and a filter for cutting a specific wavelength range of the light source. Illumination means for illuminating the sample obliquely through the filter, a cooled CCD camera for capturing an optical image of the sample, and an optical image in which defects in the sample are emphasized by scattered light from the sample illuminated obliquely by the illumination means A defect inspection system comprising: an optical system that forms an image on a camera; a moving unit that moves the sample two-dimensionally; and an image processing unit that detects image defects obtained by capturing image data and movement information captured by the camera. apparatus.
JP63248577A 1988-09-29 1988-09-29 Defect inspection equipment Expired - Fee Related JP2801916B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63248577A JP2801916B2 (en) 1988-09-29 1988-09-29 Defect inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63248577A JP2801916B2 (en) 1988-09-29 1988-09-29 Defect inspection equipment

Publications (2)

Publication Number Publication Date
JPH0293312A JPH0293312A (en) 1990-04-04
JP2801916B2 true JP2801916B2 (en) 1998-09-21

Family

ID=17180200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63248577A Expired - Fee Related JP2801916B2 (en) 1988-09-29 1988-09-29 Defect inspection equipment

Country Status (1)

Country Link
JP (1) JP2801916B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007121269A (en) * 2005-09-30 2007-05-17 Hoya Corp Defect inspection apparatus, defect inspection method, photomask manufacturing method, pattern transferring method and semiconductor wafer manufacturing method
JP5040227B2 (en) * 2006-09-11 2012-10-03 大日本印刷株式会社 Color filter inspection apparatus and color filter inspection method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60135809A (en) * 1983-12-26 1985-07-19 Tokyo Optical Co Ltd Flaw detection apparatus
JPS6157837A (en) * 1984-08-30 1986-03-24 Toshiba Corp Inspecting device for outer appearance
JPH0794974B2 (en) * 1986-05-13 1995-10-11 大日本印刷株式会社 Inspection method for shed mask
GB2196219A (en) * 1986-10-11 1988-04-20 Astromed Ltd Imaging of light-opaque specimens by transmission of radiation therethrough

Also Published As

Publication number Publication date
JPH0293312A (en) 1990-04-04

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