JP2802198B2 - Semiconductor component position correction device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an IC for a frame.
The present invention relates to a semiconductor component position correction device that is mounted as a part of a bonding device that mounts a chip, that is, a semiconductor component, and bonds a pad (electrode) of the IC chip to a lead provided on the frame.

[0002]

2. Description of the Related Art Conventionally, as a bonding apparatus provided with such a semiconductor position correcting apparatus, there is a bonding apparatus (not shown) equipped with a die bonding apparatus, a curing apparatus, and a wire bonding apparatus in a line. Since each of these devices is well known, only the following description will be given.

[0003] First, the die bonding apparatus stores a large number of IC chips 201 obtained by cutting a disc-shaped wafer, and uses, for example, a thermosetting adhesive or the like to form a lead frame as shown in FIG. The IC chip 201 is sequentially mounted at a predetermined position on L＼F, and is sent out to a subsequent curing device. As is clear from FIGS. 14 and 15, an island 202 is provided at the above-mentioned predetermined position of the lead frame L # F.
The C chip 201 is mounted on the island 202.

On the other hand, the curing device receives the lead frame L リ ー ド F sent from the die bonding device, heats it to solidify the adhesive, and sends it out to a wire bonding device arranged at a subsequent stage. Then, the wire bonding apparatus receives the lead frame L # F, and as shown in FIGS. 14 and 15, on the bonding stage 203, the lead 204 formed on the lead frame L # F and the lead The pad 201a of the IC chip 201 mounted on the frame is connected to a wire 2 made of gold, aluminum, or the like.
05 is used for bonding.

The above-described semiconductor component position correcting apparatus is provided in the above-described die bonding apparatus.

That is, the above-mentioned die bonding apparatus comprises:
As described above, one by one of the IC chips 201 stored in a large number is sequentially selected and held, and this is held in the lead frame L #.
A semiconductor component supply device is provided which is transported and mounted on the island 202 of F. More specifically, the semiconductor component supply device has a suction unit (described below) for vacuum-sucking the IC chip 201, and sucks, holds, and transports the IC chip 201 by the suction unit.

The semiconductor component position correcting device is disposed near the semiconductor component supply device, and is provided for the suction portion.
This is for correcting the position of the C chip 201. Specifically,
For example, it is configured as shown in FIG. As shown in the figure, the semiconductor component position correcting device includes a flat base portion 212 that carries an IC chip 201 that is sucked and held by a suction portion 210 provided in the semiconductor component supply device, The IC chip 2 is disposed on the base portion 212 so as to sandwich the IC chip 201 by two in a direction orthogonal to each other, and is movable in the direction.
01 and the IC chip 201 by moving each of the engaging members 213 to 216.
And moving means (not shown) for moving closer to and away from the camera. Further, stoppers 218 and 219 are provided which abut against the two engaging members 213 and 216 and stop the two engaging members at predetermined positions.

[0008] The semiconductor component position correcting apparatus having the above-described structure operates as follows.

First, when the IC chip 201 is sucked and held by the suction unit 210 and brought on the base unit 212,
The four engagement members 213 to 216 are moved as indicated by the arrow S. Then, the two engagement members 213 and 21
6 stops at predetermined positions by contacting the stoppers 218 and 219, respectively. Thereafter, the other two engaging members 214 and 21
5 engages with the IC chip 201 and presses against the stopped engaging members 213 and 216. Thus,
The position of the IC chip 201 with respect to the suction unit 210 is corrected.

When the position of the IC chip 201 is corrected as described above, each of the engaging members 213 to 216 is moved by the arrow S.
And moves away from the IC chip 201. After that, the IC chip 201 is transported by the suction unit 210 onto the island 202 of the lead frame L＼F and mounted. Thus, by performing the position correction of the IC chip 201, the mounting accuracy of the IC chip 201 with respect to the island 202 is improved.

[0011]

However, in such a conventional device for correcting the position of a semiconductor component, if the type of the IC chip to be handled is changed, the I / O chip may be changed.
It is necessary to replace or adjust the engaging members 213 to 216 for engaging with the C chip and correcting the position thereof so as to correspond to the external dimensions or shape of the newly handled IC chip. There is a disadvantage that a great deal of labor and time must be spent.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and provides a semiconductor component position correcting apparatus which can quickly and easily deal with various IC chips, that is, semiconductor components. It is an object.

[0013]

SUMMARY OF THE INVENTION The present invention relates to a semiconductor component.
And store at least one of them in the suction section.
Equipped with a semiconductor component supply device that can be transported
Half for correcting the position of the semiconductor component with respect to the suction unit
An apparatus for correcting the position of a conductive part, comprising: a base portion;
The components are arranged on the base portion so as to sandwich the component, and
Are independently movable and engage the semiconductor component
A plurality of engaging members, and moving means for moving the engaging members;
Comprising, the moving means, operation means capable of operation control,
A cam rotated by the operating means, and a cam of the cam
A cam follower contacting the surface, and the cam follower
Biasing means for biasing the cam surface in contact with the cam surface.
The engaging members independently press the semiconductor component.
Thus, the position correction is performed .

[0014]

Next, a bonding apparatus according to the present invention will be described with reference to the accompanying drawings. Note that the bonding apparatus performs bonding using a wire (described later), but the present invention is also applicable to tape bonding and the like.

FIG. 1 is a plan view of the bonding apparatus 1. As is clear from the figure, the bonding apparatus 1 has a bonding stage 5, a frame supply means 7, a semiconductor component supply apparatus 9, A semiconductor component position correcting device 11 and a bonding means 13 are provided. Hereinafter, each of these means and devices will be described in detail in order.

Prior to the description of the first bonding stage 5, a lead frame to be subjected to a bonding operation by the bonding apparatus and an IC chip as a semiconductor component will be described.

As shown in FIG. 2, the lead frame L
A plurality of rectangular openings 16 (illustrated by virtual lines) are arranged at equal pitches in the longitudinal direction in #F. As is apparent from FIGS. 3 and 4, these openings 16 are defined by being surrounded by a large number of leads 17 formed in the lead frame L # F.
That is, a lead frame different from the so-called island-attached lead frame L # F shown in FIGS. 13 and 14 is used as the lead frame L # F. Therefore, the opening 16 is sufficient as long as the IC chip 19 is loosely inserted into the range defined by the lead frame 17 as shown in FIG. In FIG. 4, the leads 17 are provided so as to define substantially the entire circumference of the opening 16, but only a part thereof is shown, and the other leads are not shown.

On the other hand, as shown in FIGS. 3 and 4, the IC chip 19 is formed in a rectangular plate shape so as to correspond to the opening 16 of the lead frame L # F. (A) of pads (electrodes) 19a corresponding to
(Shown in FIG. 4). At the time of bonding, as shown in FIG. 3 and FIG.
7 and the pad 19a are connected using a wire 21 made of gold or aluminum or the like.

The above-described bonding stage 5 is used for performing the above-mentioned bonding operation using the bonding stage as a stage. As is apparent from FIG. 5, the bonding stage 5 has a flat supporting surface 5a, Among them, the IC chip to be bonded and a plurality of IC chips before and after the IC chip
The portion on which the C chip is mounted is supported on the supporting surface 5a. As shown in FIG. 3, the bonding stage 5 of the IC chip 19 is also loosely inserted into the opening 16 of the lead frame L # F during bonding.
Placed directly on top. As shown in FIG. 3, a hole 5b for vacuum suction is formed in the bonding stage 5, whereby the IC chip 19 is suction-fixed.
Further, a heating means (not shown) for heating the lead frame L # F to a predetermined temperature by a heater cartridge or the like is provided. The above-described bonding operation is performed at the bonding position 23 shown in FIG.

As shown in FIG. 3, a pressing means 25 is provided near the bonding stage 5 for pressing and fixing the lead frame L＼F toward the bonding stage 5 during the above-mentioned bonding operation. I have. As shown in the drawing, the pressing means is provided so as to be swingable in the direction indicated by arrow B, and has a free end which presses the lead frame L＼F at one end thereof. A connected intermediate member 25b, and a cam follower 2 attached to the other end of the intermediate member 25b.
5c, a cam 25d engaged with the cam follower, and a motor 25e for rotating the cam 25d.

Next, the frame supply means 7 shown in FIG.
Will be described. The frame supply means 7 accommodates a large number of the lead frames L # F described above and sequentially supplies them to the bonding stage 5.

As shown in FIG. 1, the frame supply means 7
A loader / unloader 31 that accommodates and accommodates the lead frames L # F that are arranged and supplied sequentially and receives and accommodates the lead frames L # F that have been bonded.
And the load frame / unloader 31
Guide mechanism 3 that guides between and bonding stage 5
2 and a transport means (not shown) for transporting the lead frame L $ F between the loader / unloader 31 and the bonding stage 5. As is apparent from FIG. 5, the guide mechanism 32 is composed of two guide rails 32a and 32b, and these guide rails slide and hold the left and right end portions of the lead frame L # F to guide.

The configuration of the loader / unloader 31 is described in Japanese Utility Model Application No. 1-10838 filed by the present applicant.
No. 2 (Japanese Utility Model Laid-Open No. 3-48225) and the like, and the description thereof is omitted here.

Next, the semiconductor component supply device 9 shown in FIG. 1 will be described in detail. The semiconductor component supply device 9 stores a large number of IC chips 19 (shown in FIGS. 1, 3 and 4), and sucks and holds each one of the IC chips 19, as shown in FIG. The wafer is conveyed so as to be located in the opening 16 of F and is placed on the bonding stage 5.

As shown in FIG. 1, the semiconductor component supply device 9 includes a stocker 76 for storing IC chips 19 and moving them in a horizontal plane, and one IC chip 19 stored on the stocker 76. A push-up means 77 for pushing up the IC chip 19
To hold the opening 16 of the lead frame L # F.
And a conveying means 78 for conveying the inside.

As shown in FIG.
Is a base 81 fixed on the gantry 2 (shown in FIG. 1).
And a first table 82 provided on the base 81 so as to be able to reciprocate in the front-rear direction (arrow Y direction and the opposite direction), and a left and right direction (arrow X direction and the opposite direction) on the first table 82. And a second table 83 provided to be reciprocally movable. On the base 81,
A male screw 85 is provided so as to extend in the direction in which the first table 82 should move, and the male screw 85 is screwed into a nut (not shown) fixed to the first table 82. A motor 86 for applying a torque to the male screw 85 is provided. That is, the first table 82 reciprocates by the forward and reverse rotation of the motor 86.

An external thread 88 is provided on the first table 82 so as to extend in the direction in which the second table 83 is to be moved, and a nut fixed to the second table 83 (see FIG. (Not shown). A motor 89 for rotating the male screw 88 is provided, and the second table 83 reciprocates by the forward and reverse rotation of the motor 89.

On the second table 83, a circular rotary table 90 is provided. A belt wheel 91 is provided on the second table 83 near the rotary table 90, and a belt 92 is wound around the belt wheel 91 and the rotary table 90. Further, two rollers 93 are provided so as to be engaged with the belt 92, whereby a required tension is applied to the belt 92. A motor 94 for applying torque to the belt wheel 91 is provided, and the rotary table 90 is driven to rotate by the motor 94 rotating forward and backward.

A sheet 95 made of, for example, resin is stretched on the turntable 90, and is fixed to the turntable 90 at a peripheral portion thereof by a press ring 96. As is particularly clear from FIG. 7, a large number of IC chips 19 are adhered on the sheet 95. These IC chips 19 are obtained by cutting a circular wafer (not shown) in another process.

The rotary table 90 is provided with three male screws 98 at an equal pitch and parallel to each other, and these male screws 98 are screwed to the above-mentioned holding ring 96. These male screws 98 are synchronously driven to rotate by a motor 99 via torque transmitting means (not shown).
Thus, the press ring 96 is attached to and detached from the turntable 90. With the holding ring 96 detached from the turntable 90, a sheet 95 to which the IC chip 19 has been previously attached is attached to the turntable 90,
Or exchange.

On the other hand, as for the push-up means 77, as shown in FIG. 6, an air cylinder 101 mounted on the gantry 2 (shown in FIG. 1) so that its output shaft projects upward.
And a support plate 102 attached to the output shaft of the air cylinder 101. As shown in FIG. 10, a substantially cylindrical needle guide 104 is fixedly provided at the upper end of the support plate 102, and a plurality of push-up needles 105 are provided at the upper end of the needle guide 104 so as to be freely retractable. Is provided.

As shown in FIG. 6, the above support plate 1
A cam 107 is rotatably provided on the side of 02, and a motor 108 for driving the cam 107 to rotate is attached. A cam follower 109 that engages with the cam 107 is provided.
Is linked to the cam follower 109. That is, as the motor 108 rotates forward and backward, the push-up needle 105 performs the retracting operation.

Next, a description will be given of the transfer means 78 for sucking and holding the IC chip 19 on the stocker 76 and transferring it to the bonding stage 5.

As shown in FIG. 8, the conveying means 78
A base 111 fixed on the gantry 2 (shown in FIG. 1);
A first table 1 provided on the base 111 so as to be reciprocally movable in a front-rear direction (arrow Y direction and the opposite direction).
12 and a second table 113 mounted on the first table 112 so as to be able to reciprocate in the left-right direction (the direction of the arrow X and the opposite direction). Base 111
On the upper side, a male screw 115 is provided so as to extend in the direction in which the first table 112 is to be moved. ing. Further, a motor 116 for applying a torque to the male screw 115 is provided. That is, when the motor 116 rotates forward and backward,
The first table 112 reciprocates.

The male screw 1 is placed on the first table 112 so that the second table 113 extends in the moving direction.
18 is screwed into a nut (not shown) fixed to the second table 117. A motor 119 for rotating and driving the male screw 118 is provided.
The forward and reverse rotation of the motor 119 causes the second table 1 to rotate.
13 performs a reciprocating operation.

On the above-mentioned second table 113, an arm member 121 formed in an L-shape is provided so as to be able to reciprocate up and down (in the direction of arrow Z and in the direction opposite thereto). A male screw 122 is provided on the second table 113 so that the arm member 121 extends in a direction in which the arm member 121 is to be moved.
And is screwed to a nut (not shown) fixed to the nut. Further, a motor 123 for applying a torque to the male screw 122 is provided.

As shown in FIG. 7, a collet 125, ie, a suction portion, is directed downward at the distal end of the arm member 121.
In addition, it is movably mounted within a predetermined range in the vertical direction (the direction of the arrow Z and the direction opposite thereto). The collet 125 vacuum-adsorbs and holds the IC chip 19 by a negative pressure applied through a plug 126 shown in FIG.

The stocker 76 having the above-described structure, the push-up means 7
7 and the conveying means 78 operate as follows based on a drive signal from a control means (not shown). In addition, a semiconductor component position correcting device 11 and a bonding unit
This control means is also responsible for the operation control of.

First, regarding the stocker 76, each motor 8
6, 89 and 94 are appropriately rotated so that a desired one of a large number of IC chips 19 stuck on the sheet 95 is oriented in a predetermined direction. Is positioned directly above. Following or simultaneously with this, each motor 11
6, 119 and 123 are appropriately rotated, whereby the collet 125 is moved in the three-dimensional direction, positioned just above the selected IC chip 19, and brought into contact with the IC chip 19. Thereafter, the push-up means 77
The air cylinder 101 is caused to protrude, and as shown in FIG. However, at this time, the push-up needle 105 is in a state of being embedded in the needle guide 104. In this state, the motor 108 of the projecting means 77 is
Is operated, the push-up needle 105 protrudes as shown in FIG. 7, passes through the sheet 95, pushes up the IC chip 19, peels off the sheet 95, and pushes up toward the collet 125. At this time, the sheet 95 is sucked by the vacuum suction means provided on the needle guide 104, and does not float with the push-up needle 105 being pushed up.

On the other hand, a negative pressure is applied to the collet 125, and the collet 125 sucks the IC chip 19 pushed up. However,
The collet 125 is at a position lowered with respect to the arm member 121 before the start of the push-up operation, and is pushed up together with the IC chip 19 sucked and held by the push-up force of the push-up needle 105. That is, the IC chip 19
Is peeled off from the sheet 95 while being sandwiched between the push-up needle 105 and the collet 125, and does not fall off due to lateral displacement during pushing up. Thus IC chip 1
25 is sucked and held by the collet 125.

Next, each of the motors 116, 1
The IC chips 19 sucked by the collet 125 are conveyed to the semiconductor component position correcting device 11 shown in FIG. Then, the IC chip 1 with respect to the collet 125 is
Nine positions are corrected (details will be described later). Thereafter, the motors 116, 119 and 123 of the conveying means 78 are operated again, and the IC chip 19 is mounted on the bonding stage 5 as shown in FIGS. It is mounted on the bonding stage 5 so as to be loosely inserted into the opening 16 of FIG.
Thereafter, bonding is performed by the bonding means 13 (described in detail later) shown in FIG.

Next, I with respect to the above-mentioned collet 125
The semiconductor component position correcting device 11 for correcting the position of the C chip 19 will be described in detail.

As shown in FIGS. 9 to 12, the semiconductor component position correcting device 11 has a frame 131 as a base. The frame 131 is formed by assembling a plurality of steel plates or the like with each other so as to have a substantially rectangular parallelepiped shape as a whole, and is fixed on the gantry 2 (shown in FIG. 1). The above-mentioned frame 131 has an upper surface plate 131a, and FIG.
As is apparent from FIG. 1, four engaging members 133 having the same shape and the same size are arranged on the upper surface plate 131a, and four supporting mechanisms 1 for movably supporting each of the engaging members 133 are provided.
35 are provided. As is apparent from FIG. 9, each of the engaging members 133 is formed in a flat plate shape so that its planar shape is substantially trapezoidal, and the IC chips 19 formed in a rectangular shape are orthogonal to each other. Engage so as to sandwich them two by two from the direction. Then, the IC chip 19 sucked and held by the collet 125 included in the conveying means 78 described above is engaged from all sides and shifted toward a proper position, and the IC chip 19 with respect to the collet 125 is appropriately shifted. Correct the position of. That is,
The engaging members 133 press the semiconductor components independently.
To correct the position of the IC chip 19.

As apparent from FIGS. 9 and 11, when the position is corrected by the four engagement members 133, the IC chip 19 is provided on the upper plate 131a via the block 137. It is carried by the carrying plate 138. Then, the vacuum suction is performed by the negative pressure supplied through the holes 139 formed in the block 137 and the support plate 138. However, this negative pressure is set to a strength that does not hinder position correction.

Each of the support mechanisms 135 movably supporting each of the four engaging members 133 has the same structure, and is configured as follows. However, as described above, since these four support mechanisms 135 have the same structure, in order to avoid complication of the drawing, one of the support mechanisms is denoted by the reference numeral of each of its constituent members.

As shown in FIGS. 9 to 11, the support mechanism 135 includes a guide rail 135a fixed on the upper plate 131a so as to extend in a direction in which the engagement member 133 is to be moved, and a guide rail 135a. A slider 135b slidably mounted on a rail 135a;
The engagement member 13 is fastened to the upper surface of the engagement member 13 by bolts.
3 comprises a movable plate 135c fixed to the tip.

A substantially L-shaped intermediate member 141 is attached to the lower surface of one end of the movable plate 135c at the upper end thereof in a hanging state. This intermediate member 14
1 is an oblong opening 13 formed in the upper surface plate 131a.
1b, extends below the upper surface plate 131a,
A roller 143 is attached to the lower end by a support shaft 142.

Operation controllable on the lower surface side of the upper plate 131a
A pulse motor 145 as an important operating means is arranged and fixed to the frame 131. A substantially circular cam 14 is provided on the output shaft 145a of the pulse motor 145.
The rollers 143 are in contact with a cam surface 146a formed on the outer periphery of the cam 146 as a cam follower. As shown in FIGS. 11 and 12, the upper plate 131a and the intermediate member 141 are each provided with a pin 1
31d and 141b are implanted, and a coil spring 148 that performs a tensile action is hung on both pins. That is, the coil spring 148 is
Roller 43 in the direction of contact with the cam surface.
Act as biasing means.

[0049] Then, four engaging members 133, the pressing force applied from the cam 146 is rotated by the pulse motor 145, the biasing force applied from the coil spring 148, spaced and the IC chip 19 They are brought closer. In this way, by using the cam 146, the four engagement members 133 can be driven by the single pulse motor 145.

As shown in FIGS. 9 and 10, a stopper 1 is provided on the upper plate 131a via a block 150.
51 is provided, and the tip of a screw 152 attached to the intermediate plate 135c carrying the engaging member 133 can contact the stopper 151. Thus, the movement of the engaging members 133 in the directions approaching each other is regulated at the predetermined position.

As shown in FIGS. 10 and 11, the output shaft 145a of the pulse motor 145 also protrudes from the lower end thereof, and a circular detection plate 154 is fitted to the protruding portion. . And this detection plate 1
An optical sensor 155 composed of a photocoupler including a light emitting element (not shown) and a light receiving element (not shown) sandwiching the outer periphery of 54 from above and below is provided, and is attached to the frame 131. The detection plate 154 and the optical sensor 155 are for detecting the origin position of the rotation of the cam 146, and the irradiation light emitted from the light emitting element is formed in a hole (not shown) formed on the outer periphery of the detection plate 154. ), The detection signal is issued when the light reaches the light receiving element.

The support mechanism 135 described above and the intermediate member 14
1, roller 143, pulse motor 145, cam 1
Moving means for independently moving each of the four engaging members 133 to and away from the IC chip 19 on the carrier plate 138 by the use of the coil springs 46, the coil springs 148, and related peripheral members. Is configured.

The semiconductor component position correcting device 1 having the above-described configuration.
1 operates as follows.

First, the IC chip 19 is sucked and held by the collet 125 (see FIGS. 7 and 8) provided in the transfer means 78 of the semiconductor component supply device 9 described above, and the carrier plate 138 surrounded by the engaging members 133 is held. Prior to being brought up, the pulse motor 145 is positively rotated by a predetermined angle. Therefore, the four engaging members 133 are positioned so as to be separated from each other via the cam 146 against the urging force of the coil spring 148. In this state,
The IC chip 19 is placed on the support plate 138 and is vacuum-sucked. Then, the pulse motor 145 is rotated in the reverse direction, and each engagement member 133 is
8 engages with each of the four sides of the IC chip 19, and presses the IC chip 19 to shift the IC chip 19 toward a normal position to correct the position. Thereafter, the pulse motor 145 is rotated forward again, and each engagement member 133
It is separated from the C chip 19. In this state, the above collet 1
The IC chip 25 sucks and holds the IC chip 19 and transports the IC chip 19 onto the subsequent bonding stage 5.

The configuration and operation of the semiconductor component position correcting device 11 have been described above. As described above, in the semiconductor component position correcting apparatus 11, the four engaging members 133 that are engaged with the IC chip 19 to perform the position correction are respectively movable, and move the respective engaging members. Moving means (such as a pulse motor 145 and a cam 146) move these engaging members independently of each other, and the operating means of the moving means is a pulse motor 145 whose operation can be controlled. With this configuration, each of the engaging members 133 can be freely moved to an arbitrary position and stopped, so that a variety of shapes and sizes of IC chips can be handled. Can be dealt with.

Further, in this embodiment, the pulse motor 145 is used as the operation means capable of controlling the operation as described above, but a linear motor or the like may be used. Further, in this embodiment, four engagement members 133 are provided to engage with the IC chip 19 and correct the position thereof. However, the number of the engagement members 133 may be two, three, or five as necessary. The operating mode can be changed while increasing or decreasing. Further, the semiconductor component position correcting device 11 of the present embodiment
The present invention is also applicable to a die bonding apparatus provided in a conventional bonding apparatus.

By providing the above-described semiconductor component position correcting device 11, the position of the IC chip 19 in the plane of the IC chip 19 with respect to the collet 125 is corrected.
The transporting means 78 itself including 25 does not need to have a rotary table for correcting the rotational angle position of the collet 125, and the apparatus is downsized.

Next, the bonding means 13 shown in FIG.
The bonding means 13 is described in Japanese Patent Application No. 2-11510 filed by the present applicant.
No. 2 (Japanese Patent Application Laid-Open No. Hei 4-12544), the details thereof are omitted here.

[0059]

As described above, in the semiconductor component position correcting apparatus according to the present invention, a plurality of engaging members for correcting the position of the semiconductor component by engaging with the semiconductor component are respectively movable. A moving means for moving each of the engaging members independently moves these engaging members, and an operating means of the moving means can be operated and controlled. With such a configuration, each engaging member can be freely moved to an arbitrary position and stopped individually, and therefore, a variety of shapes and sizes of semiconductor components can be handled by one unit, and various types of semiconductor components can be used. There is an effect that it is possible to cope quickly and easily.

[Brief description of the drawings]

FIG. 1 is a plan view of a bonding apparatus according to the present invention.

FIG. 2 is a plan view of a lead frame to be handled by the bonding apparatus shown in FIG. 1;

FIG. 3 is a longitudinal sectional view showing a state where the lead frame and the IC chip shown in FIG. 2 are mounted on a bonding stage.

FIG. 4 is an enlarged view of a portion A in FIG. 2;

FIG. 5 is a perspective view of a guide mechanism and a pressing unit included in the bonding apparatus shown in FIG. 1;

FIG. 6 is a perspective view of a stocker and a push-up means provided in the bonding apparatus shown in FIG. 1;

FIG. 7 is an enlarged view of a part of the stocker and the push-up means shown in FIG. 6;

FIG. 8 is a perspective view including a partial cross section of a conveying means provided in the bonding apparatus shown in FIG. 1;

FIG. 9 is a plan view of a semiconductor component position correcting device provided in the bonding device shown in FIG. 1;

FIG. 10 is a view on arrow HH of FIG. 9;

FIG. 11 is a sectional view taken along the line II of FIG. 9;

FIG. 12 is a view taken in the direction of arrows JJ in FIG. 10;

FIG. 13 is a plan view of a lead frame handled by a conventional bonding apparatus.

FIG. 14 is an enlarged view of a portion Q in FIG. 13;

FIG. 15 is a sectional view taken along the line RR in FIG. 14;

FIG. 16 is a perspective view of a main part of a conventional semiconductor component position correcting device.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 bonding apparatus 2 gantry 5 bonding stage 7 frame supply means 9 semiconductor component supply apparatus 11 semiconductor component position correction apparatus 13 bonding means 16 opening 17 lead 19 IC chip (semiconductor component) 21 wire 23 bonding position 25 pressing means 31 loader / unloader 32 Guide mechanism 76 Stocker 77 Push-up means 78 Transport means 86, 89, 94, 99, 108, 116, 119, 1
23 Motor 90 Rotary Table 95 Sheet 101 Air Cylinder 105 Protruding Needle 125 Collet (Suction Unit) 131 Frame (Base Unit) 133 Engaging Member 135 Support Mechanism 145 Pulse Motor 146 Cam 148 Coil Spring

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60 301 H01L 21/52

Claims (1)

(57) [Claims] Claims: 1. A method for storing semiconductor components, comprising :
Semiconductor parts that can be conveyed by suction
Provided with a feeding device, the half of the suction unit
A semiconductor component position correction device that corrects the position of conductor parts.
I, and the base portion, the semiconductor component is disposed on the base portion on to sandwich the, or
Each independently movable, said semiconductor component
A plurality of engaging members for engaging in, and a moving means for moving the engaging member, the moving means comprises a hydraulic controllable actuating means, the actuating
Abuts on a cam rotating by means and the cam surface of said cam
A cam follower, and the cam follower on the cam surface.
Biasing means for biasing in a contact direction, wherein the engaging members independently press the semiconductor component.
And performing the position correction.
Place.