JP2803511B2 - Connection method between microstrip line and active device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a microstrip line to an active element device.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view showing a conventional connection method, and FIG. 7 is a sectional view thereof. In the figure, 1 is a microwave circuit board made of a dielectric, and 2 is the microwave circuit board 1
A microstrip line formed on the device, 3 is an active device device such as a transistor, 4 is an external lead of the active device device 3, and 5 is a ribbon-shaped metal for connecting the microstrip line 2 and the external lead 4. Is a piece.

In general, since an active element device 3 such as a power transistor has a low impedance, in order to achieve impedance matching with the microstrip line 2,
The microstrip line 2 to be connected is wide. For impedance matching, it is necessary to perform joining at the pattern end of the microstrip line 2. Therefore, the conventional connection method is performed according to the following procedure. B. At an end of the microstrip line 2 and under the external lead 4 of the active element device as shown in FIG. (For example, a central portion) of the ribbon-shaped metal piece 5 is welded or pressure-bonded. A gold ribbon having a thickness of 0.025 mm is often used. B. Attach the active element device 3 to a predetermined position by screwing or the like (FIG. 6). C. The part of the ribbon-shaped metal piece 5 previously fixed that is not fixed to the microstrip line 2 is replaced with the active element device 3.
And welded or crimped in the same manner as above (FIG. 7).

[0004]

In the connection method as described above, after the ribbon-shaped metal piece 5 is fixed on the microstrip line 2 in advance, the active element device 3 is attached to a predetermined position, and the outside of the active element device 3 is set. Since the ribbon-shaped metal piece 5 is fixedly connected to the lead 4 for connection, the number of steps is large, and since the ribbon-shaped metal piece 5 is wound around the external lead 4, an operation error is likely to occur. 3 had to be removed, so there was a problem that the working time was further increased. In addition, since the ribbon-shaped metal pieces are connected so as to wrap the external leads, there is also a problem that damage to the ribbon-shaped metal pieces is difficult to recognize from the external appearance. On the other hand, in terms of man-hours, there is a method of realizing connection by bonding the microstrip line 2 and the external lead 4 of the active element device 3 directly without using a ribbon-shaped metal piece, for example, using solder. There are drawbacks such as the joint part being damaged due to the thermal stress caused by the difference in the expansion coefficient and causing poor conduction.

The present invention has been made to solve such a problem, and has as its object to reduce the manufacturing time without impairing the microwave characteristics and reliability.

[0006]

In the method of connecting the present invention the microstrip line and the active element device Means for Solving the Problems], after mounting an active element device in a predetermined position, Li
The end of the bon-shaped metal piece is patterned into a microstrip line.
This is a bonding method performed by fixing a ribbon-shaped metal piece to the microstrip line and the lead portion of the active element device in alignment with the end .

[0007]

According to the connection between the microstrip line and the active element device by the above-described method, since the microstrip line is connected along the pattern end of the microstrip line, electrical characteristics can be secured. In addition, since the ribbon-shaped metal piece is fixed to the external lead and the microstrip line after the active element device has been previously attached to the predetermined position, the fixing operation can be performed in one batch (that is, in one fixing device).
In addition, since the entire ribbon-shaped metal piece can be viewed after the connection, visual confirmation becomes easy.

[0008]

[Embodiment 1] FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view thereof. In the figure, 1
Is a microwave circuit board, 2 is a microstrip line formed on the microwave circuit board 1, 3 is an active device (power transistor), 4 is an external lead of the power transistor 3, and 5 is a microstrip line 2. And a ribbon-shaped metal piece (gold ribbon) for connecting the external lead 4 to the external lead 4.

The connection method in this embodiment is performed in the following procedure. B. The active element device 3 is attached to a predetermined position by means such as screwing. B. The ribbon-shaped metal piece 5 is thermocompression-bonded to the external lead 4 of the active element device 3 using a resistance welding machine. C. The portion of the ribbon-shaped metal piece 5 that has not been thermocompression-bonded is thermocompression-bonded onto the microstrip line 2 with the edge of the ribbon-shaped metal piece aligned with the pattern end.

In the present embodiment, since the ribbon-shaped metal pieces 5 are connected along the pattern ends of the microstrip line 2, impedance matching can be achieved, so that electrical characteristics can be ensured and variations among operators are less likely to occur. Also, since the ribbon-shaped metal piece can be seen over the whole, visual observation is also facilitated. The connection can be performed in one batch, and the connected ribbon-shaped metal pieces can be seen over the whole, so that the inspection and confirmation become easy, so that there is an effect that the number of work steps can be reduced.

Embodiment 2 FIG. The connection with a low-impedance active element device has been described above. However, when the microstrip line to be connected is not large in pattern width with respect to the width of the external lead such as a normal 50Ω transmission line, the external lead is used. May be cut out and a ribbon-shaped metal piece may be thermocompression-bonded. FIG.
Is a perspective view showing this. 1 to 5 described earlier
Is the same as

Embodiment 3 FIG. In the second embodiment, the external lead is cut out on only one side, but it goes without saying that both sides may be cut out as shown in FIG.
The electric characteristics are further improved as compared with the case where only one side is cut.

Embodiment 4 FIG. The thermocompression bonding in the first to third embodiments is applicable to a ceramic substrate such as alumina. However, when a ribbon-shaped metal piece is thermocompression-bonded using a resistance welder on an organic dielectric substrate, the material of the organic dielectric substrate softens when the temperature required for bonding the ribbon-shaped metal piece is reached. Inconveniences such as depression of the entire dielectric portion and peeling of the pattern in severe cases are caused. Therefore, a solder layer may be provided in advance at the position where the ribbon-shaped metal piece (gold ribbon) on the pattern of the microstrip line is fixed, and the connection is made at the melting point of the solder material. FIG. 5 is a sectional view showing this. In FIG. 1, reference numeral 1 denotes an organic dielectric microwave circuit board using a fluorine resin,
Is the same as Reference numeral 6 denotes a solder layer formed on the microstrip line.

[0014]

According to the connection method as described above, since the ribbon-shaped metal pieces are connected along the pattern end of the microstrip line, impedance matching can be achieved, so that the electrical characteristics are stable and the connection can be performed only once. Therefore, the number of working steps can be reduced, and the connected ribbon-shaped metal pieces can be viewed over the whole, so that the inspection and confirmation become easy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a method for connecting a microstrip line and an active element device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing the connection method of FIG. 1 in the present invention.

FIG. 3 is a perspective view showing another embodiment of the present invention.

FIG. 4 is a perspective view showing still another embodiment of the present invention.

FIG. 5 is a perspective view showing still another embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional connection method between a microstrip line and an active element device.

FIG. 7 is a sectional view showing a conventional connection method.

FIG. 8 is a perspective view showing one process of a conventional connection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Microwave circuit board 2 Microstrip line 3 Active element device 4 External lead 5 Ribbon-shaped metal piece 6 Solder layer

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A 2-72004 (JP, U) JP-A 64-40904 (JP, U) Onodera, et al., “Current State of Microwave IC Manufacturing Technology”, Mitsubishi Electric Technical Report, Vol. 46, NO. 11, 1972, PP. 1232-1238 (page 1235, right column, description from line 6 to bottom line 4). (58) Field surveyed (Int.Cl. ⁶ , DB name) H01P 5/02 603 H01P 1/04 H01P 3/08 H01P 11/00

Claims (2)

(57) [Claims] 1. A method for connecting a microstrip line formed on a dielectric microwave circuit board to an active element device connected to the microstrip line, comprising the steps of: My end of the ribbon-like metal piece of ribbon-shaped metal piece on the external lead and the microstrip line of the active element device
A method of connecting a microstrip line to an active element device, wherein the microstrip line is fixed to a pattern end of a cross trip line . 2. The microstrip line according to claim 1, wherein a ribbon-shaped metal piece is fixed on a solder layer formed on a microstrip line formed on an organic dielectric microwave circuit board. Connection method with active element device.