JP2803699B2 - IC chip mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip mounting structure. More specifically, the present invention relates to an IC chip mounting technique used when an IC chip is directly mounted on a panel substrate of a flat panel display device such as a plasma display or a liquid crystal display.

[0002] As the functions of ICs have been expanded, the number of terminals and the pitch of terminals have been increasingly reduced. For this reason, a connection method between an IC pad terminal and a wiring board has been adopted as a connection method for multiple terminals and fine pitch terminals by TAB (tape automated bonding) or the like. However, even this method cannot satisfy the requirements for connection to complicated and various wiring boards. Therefore, multi-terminal, fine-pitch ICs
There is a demand for a mounting method that enables electrical connection to a chip and a variety of complicated wiring boards.

[0003]

2. Description of the Related Art A mounting structure of a flat display panel will be described below as an example. 2. Description of the Related Art A mounting technology (such as a COG method) for directly mounting a driver IC chip of a flat panel display panel on an end face of a panel substrate is being developed as a method for realizing miniaturization and cost reduction of a display unit. In the method developed up to now, the IC chip 1 is mounted on the panel substrate 2 as shown in FIG. 4A with respect to the matrix display electrodes formed on the panel substrate and the control signal wiring and the power supply wiring. The IC chip 1 is placed face-up and electrically connected by wire bonding from an IC pad electrode terminal with a wire 3, or the IC chip 1 is placed face-down on a panel substrate 2 as shown in FIG. Place,
A method of directly connecting with a bump 4 formed on an IC pad electrode terminal in advance has been considered. In any case, all the electrical wiring is formed on the panel substrate,
The mounting form is such that these are connected to the IC pad electrode terminals.

[0004]

In the above conventional wiring method, there are a plurality of signal lines and power supply lines on the panel substrate, and it is necessary to supply these in parallel to the IC chip. It is inevitable to adopt a multi-layered wiring configuration. In the manufacturing process of the panel substrate, this crossover multilayer wiring is, for example, a two-layer wiring,
After forming the lowermost wiring, a complicated process of forming an insulating layer in a cross portion of the wiring and forming a next wiring layer thereon is required. Obviously, if the number of wiring layers increases, the process becomes more complicated. As a result, compared to a structure without a conventional IC chip, the cost increases due to an increase in the number of processes and a decrease in yield, resulting in lower cost. The problem that the conversion cannot be achieved occurs.

Therefore, as a method of avoiding the above-mentioned multilayer wiring on the panel substrate, the IC chip is directly mounted on the panel substrate, but only the wiring layer is manufactured on a separate substrate, and this wiring substrate is heated to the end of the panel substrate. A method of connecting by crimping or the like is also considered, but since the number of connection terminals increases, cost reduction,
There is no merit of high reliability.

Further, a conventional direct mounting method (COG method)
Therefore, an area for mounting an IC chip and a wiring area for providing a control signal and a power supply wiring to the IC chip are required in an end portion of the panel substrate.
There is a problem that the area of the entire mounting area, that is, the area of the "frame" portion other than the display portion becomes large, and the advantage of miniaturization is reduced by half.

The present invention makes it possible to make an electrical connection to an IC chip having many fine pad terminals and a complicated and diverse wiring board, and to reduce the mounting area including the IC chip and the wiring portion. An attempt is made to realize an IC chip mounting structure capable of achieving high reliability.

[0008]

According to the present invention, there is provided an IC chip mounting structure comprising: an IC chip;
IC with a plurality of wiring boards for making a typical connection
Wherein the plurality of wiring boards are mounted on the IC.
From the first substrate on which the chip is mounted and the flexible substrate
A second substrate, wherein the second substrate comprises the IC chip.
Notches or holes corresponding to the first
The notch or the IC chip mounted on the substrate
Affixed on the first substrate so that the holes fit.
The terminals on the first and second substrates are connected to the pair of IC chips.
Characterized that you become respectively connected to the terminal response.

In addition, a plurality of display electrode terminals
The panel substrate of the display panel having, and said display electrode terminals
An IC chip having an electrically connected IC chip.
Wiring having a control signal line or a power supply line, which is a mounting structure
A substrate is stuck on the panel, and the IC chip
Is mounted on the panel substrate or the wiring substrate, and
A display electrode terminal on the panel substrate and a control signal on the wiring substrate.
No. line or power line terminal is connected to the corresponding terminal of the IC chip.
It is characterized by being connected to each other. By adopting this configuration, the fine I / O having many pad terminals
It is possible to obtain an IC chip mounting structure which enables electrical connection to the C chip and various and various wiring substrates, and enables a mounting area including the IC chip and the wiring portion to be reduced in size and highly reliable.

[0010]

According to the present invention, as shown in FIG. 1, a plurality of pad electrodes 13 of the same chip and a plurality of different wiring substrates 10, 1 are provided.
By connecting the plurality of terminals 14 on one, a plurality of wiring boards can be connected via the IC chip 12.

[0011]

FIG. 1 is a diagram showing a first embodiment of the present invention. In this embodiment, an IC chip 12 is connected by wire bonding to a first wiring board 10 and a second wiring board 11 arranged at a position different in height from the first wiring board 10. FIG. 3A shows an IC chip 12 directly mounted on a first wiring board 10, and FIG. 2B shows an IC chip mounted on a second wiring board 11 mounted on the first wiring board 10. 12 are mounted, and all are IC chips 1
2 between the pad electrode 13 and the terminal 14 of the wiring board.
5 are connected.

The present embodiment thus constructed can connect an IC chip having a large number of terminals at a high density to a plurality of wiring boards, and further exerts effects as in the following application examples. be able to.

FIGS. 2A and 2B are views showing an application of the first embodiment described with reference to FIG. 1A, wherein FIG. 2A is a plan view, FIG. 2B is an enlarged view of a portion B in FIG. (c) is an enlarged view of a portion C in (a). This application example is a module substrate for driving a flat display panel such as a liquid crystal display device or a PDP. A driver IC chip 12 and a second wiring substrate are provided on a first wiring substrate 10 as shown in FIG. And a flexible substrate 16 as a module.

The first wiring board 10 includes a driver I
A power supply to be input to C12 and a signal wiring pattern 17 are formed. The flexible substrate 16 has a driver IC
A large number of electrode wirings 18 and terminals 19 for connecting the output of the chip 12 to the panel electrode terminals are formed. A notch 20 and a hole 21 for arranging the IC chip 12 are provided below the flexible substrate 16, and various connection wiring terminals 22 to the IC chip 12 are provided. Then, the flexible substrate 16 is attached to the surface of the wiring substrate 10. At this time, the position where the IC chip 12 is die-bonded on the wiring substrate 10 and the notch 2
It is pasted so that 0 and hole 21 match.

After the attachment, the IC chip 1
2 on the wiring board 10 by die bonding,
The input pad electrodes 23 and the power supply pad terminals of the chip 12 and the corresponding terminals of the wiring board 10 are wire-bonded with wires 24, and the output pad terminals 25 of the IC chip 12 and the corresponding terminals 22 of the flexible board 16 are connected with wires 26. Wire bonding. After the above wire bonding, a moisture-proof protective resin is applied to the vicinity of the IC chip, and finally, the external connection cable 27 and other components (resistance,
(Capacitors, etc.).

In this application example configured as described above, a flexible substrate requiring flexibility is usually very expensive when it is multilayered, but according to the present method, a single-layer substrate that is inexpensive is used. Can be used. Signals and power supply wiring required for multilayer wiring are formed on a low-priced substrate (such as a glass epoxy substrate), and by using this, it is possible to reduce the cost of the entire module. FIG.
Connection of a driver IC chip by wire bonding and a flexible substrate 1 as in a conventional module substrate shown in FIG.
Since the number of connection points (locations) is reduced as compared with the method in which connection by thermocompression bonding is performed separately, reliability is also improved.

FIGS. 3A and 3B show another application example of the first embodiment described with reference to FIG. 1B. FIG. 3A is a perspective view, and FIG.
FIG. 4 is a cross-sectional view taken along line bb in FIG. This application example is an example in which the first embodiment is applied to a flat panel display panel, and a single-layer or multi-layer wiring board 29 is arranged and adhered on an end face of a panel substrate 28 as shown in FIG. A panel driving driver IC chip 12 is mounted on the
The pad electrodes 23 and 25 of the IC chip 12 are electrically connected to the wiring terminals 14 and the panel display electrode terminals 30 of the wiring board 29.

The wiring board 29 is formed of a single-layer or multi-layer board using an ordinary insulating material such as glass epoxy, polyester or polyimide, and a control signal to the plurality of driver IC chips 12 and a wiring 31 for power supply are provided. It has been subjected. The connection terminals 14 are formed on the input pad electrodes 23 of the IC chip 12.
Then, the wiring substrate 29 is mounted and adhered to a predetermined position on the end surface of the panel substrate 28, and the driver chip 12 is mounted on the wiring substrate 29 and die-bonded, and then the input pad electrode 23 of the driver IC chip 12 is formed. And the control signal line or power supply line terminal 14 on the wiring board 29
The connection is made by wire bonding using, for example.
Further, the display electrode terminal 30 on the panel substrate and the driver IC
Similarly, the output pad electrodes 25 of the chip 12 are connected by wire bonding so that the display electrodes can be driven. After this connection, the surface of the IC chip and the electrical connection are protected from the surrounding environment by applying an insulating resin or the like.

According to the application example configured as described above,
Since the manufacturing process of the panel display section and the manufacturing process of the complicated wiring portion to the driver IC can be completely separated,
After manufacturing each of them, it is possible to perform a process of inspecting and merging the non-defective products, thereby increasing the overall manufacturing yield, and thus achieving a low price. In addition, an IC chip is mounted on a wiring board on which control signals and power supply wiring are provided, and the panel display terminals and the electrode pads of the IC chip are directly connected by wire wiring. Area) can be made extremely small. Furthermore, the number of connection terminals between the three elements of the panel, the wiring board, and the driver IC chip is minimized, and the number of connection steps for the entire unit can be reduced, so that cost reduction can be realized and reliability can be improved.

[0020]

According to the present invention, when used in a liquid crystal display panel or the like, the manufacturing process of the panel display section and the manufacturing process of the complicated wiring portion to the driver IC can be completely separated. After manufacturing, the process of inspecting and merging those non-defective products becomes possible, so that the overall manufacturing yield can be increased, and thus the cost can be reduced.

In addition, an IC chip is mounted on a wiring board on which control signals and power supply wiring are provided, and a panel display terminal and an electrode pad of the IC chip are directly connected by wire wiring. (Frame)
Can be made extremely small. Further, the number of connection terminals between the three elements of the panel, the wiring board, and the driver IC chip is minimized, and the number of connection steps of the entire unit can be reduced, so that cost reduction can be realized and reliability can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing an application example of the first embodiment of the present invention;
(A) is a plan view, (b) is an enlarged view of a part B in (a),
(C) is an enlarged view of a portion C in (a).

FIGS. 3A and 3B are diagrams showing another application example of the first embodiment of the present invention, wherein FIG. 3A is a perspective view, and FIG. 3B is a cross-sectional view taken along line bb of FIG.

FIG. 4 is a diagram showing a mounting structure of a conventional IC chip.

FIG. 5 is a view showing a conventional module substrate for driving a flat display panel.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... 1st wiring board 11 ... 2nd wiring board 12 ... IC chip 13 ... Pad electrode of IC chip 14 ... Wiring terminal 15, 24, 26 ... Wire 16 ... Flexible board 17 ... Power supply / signal wiring pattern 18 ... Electrode Wiring 19 ... Electrode Wiring Terminal 20 ... Notch 21 ... Hole 22 ... Connection Wiring Terminal 23 ... Input Pad Electrode 25 ... Output Pad Electrode 27 ... External Connection Cable 28 ... Panel Board 29 ... Wiring Board 30 ... Panel Display Electrode Terminal 31 ... Wiring 32 ... gold wire

Claims (2)

(57) [Claims] 1. A mounting structure of an IC chip comprising an IC chip and a plurality of wiring boards for making electrical connection with the IC chip, wherein the plurality of wiring boards mount the IC chip. And a second substrate made of a flexible substrate, the second substrate having a notch or a hole corresponding to the IC chip, and mounted on the first substrate. The I
C so that the notch or hole fits into the C chip.
Wherein the terminals on the first and second substrates are respectively connected to corresponding terminals of the IC chip.
Chip mounting structure. 2. An IC chip mounting structure comprising: a panel substrate of a display panel having a plurality of display electrode terminals; and an IC chip electrically connected to the display electrode terminals, the control signal line or a power supply. A wiring board having wires is attached on the panel; the IC chip is mounted on the panel board or the wiring board; display electrode terminals on the panel board; and control signals on the wiring board. A wire or power supply line terminal is connected to a corresponding terminal of the IC chip, respectively.