JP2808726B2 - Electronic component mounting method - Google Patents
Electronic component mounting methodInfo
- Publication number
- JP2808726B2 JP2808726B2 JP1249543A JP24954389A JP2808726B2 JP 2808726 B2 JP2808726 B2 JP 2808726B2 JP 1249543 A JP1249543 A JP 1249543A JP 24954389 A JP24954389 A JP 24954389A JP 2808726 B2 JP2808726 B2 JP 2808726B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- suction nozzle
- substrate
- distance
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims description 27
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品の自動実装を行う実装機の電子部
品実装方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for a mounting machine that automatically mounts electronic components.
従来の技術 以下、特願昭63−213061号明細書で示す従来の実装機
動作について図面により説明する。第４図は実装機の要
部斜視図である。第４図において、１は実装する電子部
品である。２は吸着ノズルで、電子部品を真空吸着し実
装する際、上下動作を行う。３は制御部、４は電子部品
供給部、５は基板である。まず、吸着ノズル２がＺ方向
上限へ上昇した状態で、電子部品供給部４の電子部品上
へXY方向に移動する。次に吸着ノズル２はＺ方向下限へ
一定ストローク値だけ下降し電子部品１に接した後、真
空吸着し電子部品１を吸着したままＺ方向上限へ上昇
し、基板５上の部品実装位置へ移動する。予め、制御部
３に記憶している電子部品１の厚みデータより吸着ノズ
ルの最適下降ストローク値を算出し吸着ノズルはＺ方向
へ下降し真空吸着を止めＺ方向上限へ上昇し電子部品１
は、基板５上の目的の位置へ実装されるものであった。2. Description of the Related Art The operation of a conventional mounting machine disclosed in Japanese Patent Application No. 63-213061 will be described below with reference to the drawings. FIG. 4 is a perspective view of a main part of the mounting machine. In FIG. 4, reference numeral 1 denotes an electronic component to be mounted. Reference numeral 2 denotes a suction nozzle, which performs up and down operations when mounting electronic components by vacuum suction. Reference numeral 3 denotes a control unit, 4 denotes an electronic component supply unit, and 5 denotes a substrate. First, with the suction nozzle 2 raised to the upper limit in the Z direction, the suction nozzle 2 moves in the XY direction onto the electronic component of the electronic component supply unit 4. Next, the suction nozzle 2 descends by a certain stroke value to the lower limit in the Z direction and comes into contact with the electronic component 1, and then moves upward to the upper limit in the Z direction while holding the electronic component 1 by vacuum suction and moves to the component mounting position on the board 5. I do. The optimal lowering stroke value of the suction nozzle is calculated from the thickness data of the electronic component 1 stored in the control unit 3 in advance, and the suction nozzle descends in the Z direction, stops the vacuum suction, and rises to the upper limit in the Z direction.
Was mounted on a target position on the substrate 5.
発明が解決しようとする課題 しかしながら上記のような実装方法では、実装しよう
とする基板の厚さの変化、基板のそりなどによって吸着
ノズルから基板までの距離が一定でないとき、同一圧力
で部品を実装できないという問題点があった。However, in the mounting method as described above, when the distance from the suction nozzle to the substrate is not constant due to a change in the thickness of the substrate to be mounted, warpage of the substrate, etc., the components are mounted at the same pressure. There was a problem that it was not possible.
課題を解決するための手段 上記問題点を解決する本発明の技術的な手段は、実装
しようとする基板から電子部品を吸着しているノズルま
での距離を測距センサーにより測定し実装時の吸着ノズ
ルの最適下降ストローク値を算出して実装する方法であ
り、電子部品を吸着ノズルにより供給部から吸着し、基
板の所定位置へ電子部品を実装する方法であって、電子
部品の厚みを記憶する工程と、電子部品を供給し、上下
動作可能な前記吸着ノズルにより電子部品を吸着する工
程と、電子部品を吸着後、前記供給部から実装する基板
上へ電子部品を移動させる工程と、前記基板への移動
後、基板から吸着ノズルまでの距離を測定する工程と、
前記基板から吸着ノズルまでの距離と電子部品の厚みか
ら吸着ノズルの最適下降ストローク値を算出する工程
と、前記最適下降ストローク値により、電子部品を基板
へ実装する工程からなることを特徴とした電子部品実装
方法である。Means for Solving the Problems The technical means of the present invention for solving the above problems is to measure the distance from the substrate to be mounted to the nozzle that is sucking the electronic component by a distance measuring sensor, and to detect the suction at the time of mounting. This is a method of calculating and mounting an optimal descending stroke value of a nozzle, a method of mounting an electronic component at a predetermined position on a substrate by sucking an electronic component from a supply unit by a suction nozzle, and storing the thickness of the electronic component. A step of supplying an electronic component and sucking the electronic component by the vertically movable suction nozzle; a step of moving the electronic component from the supply unit onto a board to be mounted after sucking the electronic component; After moving to the step of measuring the distance from the substrate to the suction nozzle,
A step of calculating an optimal lowering stroke value of the suction nozzle from the distance from the substrate to the suction nozzle and the thickness of the electronic component, and a step of mounting an electronic component on the substrate by the optimum lowering stroke value. This is the component mounting method.
作用 この技術的手段による作用は次のようになる。すなわ
ち、基板の厚さの変化、基板のそりなどによって吸着ノ
ズルから基板までの距離が一定でないときでも影響をう
けず同一圧力で安定した実装が可能となる。Operation The operation of this technical means is as follows. That is, even when the distance from the suction nozzle to the substrate is not constant due to a change in the thickness of the substrate, warpage of the substrate, or the like, stable mounting can be performed at the same pressure without being affected.
実 施 例 以下、本発明の一実施例について、図面を参照して説
明する。第１図は、本発明を示すフローチャートであ
り、電子部品の厚みを制御部へ記憶させる第１工程
（６）と、電子部品を供給する第２工程（７）と、上下
動作可能な吸着ノズルにより電子部品を吸着する第３工
程（８）と、電子部品を吸着後、供給部から実装する基
板上へ移動させる第４工程（９）と、吸着ノズルから基
板までの距離を測定する第５工程（10）と、前記第１工
程と第５工程より得られたデータから吸着ノズルの最適
下降ストローク値を算出する第６工程（11）と、最適下
降ストローク値により、電子部品を基板へ実装する第７
工程（12）とからなる。第２図は、本発明を実現するた
めの制御構成であり、記憶装置13と演算装置14と吸着ノ
ズル２及び測距センサー15で構成される。第３図は電子
部品実装時の最適吸着ノズル下降ストローク値の算出を
説明するための図である。５は電子部品を実装する基板
で２は吸着ノズルで、１は電子部品である。Ｌは基板５
から上限時の吸着ノズルまでの距離、ａは電子部品１の
厚みである。Ｌ−ａが吸着ノズル２から基板５までの距
離となり、さらに一定適性圧力を加えるためｘだけ吸着
ノズル５を下げる。すなわち、Ｌ−ａ＋ｘが吸着ノズル
上限位置からの最適下降ストローク値になる。従来、電
子部品の厚みａの値は記憶部によって記憶され、Ｌの値
はメカ機構により一定であるという前提のもとに、下降
ストローク値を決定しており、基板と吸着ノズル間の距
離Ｌが一定でない場合は、ノズル先端に組み込まれてい
るスプリング機構により、逃げざるを得なかった。本実
施例では図３で示すように、測距センサー15を導入しノ
ズルの先端位置から基板までの距離Ｌを測定後、演算部
により最適下降ストローク値を算出している。又、従
来、吸着ノズルの下降ストロークは一定のため、吸着ノ
ズルの高さを合わせるメカ調整も精度良く行う必要があ
ったが、この実施例では、各実装機間にばらつきがあっ
ても一定圧力の安定した実装が出来るようになった。他
にＸの値を変えることにより実装圧力を任意にコントロ
ールすることができる。この実施例はXYロボット方式の
実装機によるものだがロータリーヘッド方式による実装
機においても測距センサーをロータリーヘッド近傍の非
回転部に取り付けることにより容易に応用することがで
きる。Embodiment An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a flowchart showing the present invention, in which a first step (6) for storing the thickness of an electronic component in a control unit, a second step (7) for supplying the electronic component, and a suction nozzle capable of moving up and down. A third step (8) of sucking the electronic component, a fourth step (9) of moving the electronic component from the supply unit onto the board to be mounted, and a fifth step of measuring the distance from the suction nozzle to the board. A step (10), a sixth step (11) of calculating an optimum descending stroke value of the suction nozzle from the data obtained from the first step and the fifth step, and mounting the electronic component on the substrate by the optimal descending stroke value The seventh
Step (12). FIG. 2 shows a control configuration for realizing the present invention, which comprises a storage device 13, a calculation device 14, a suction nozzle 2 and a distance measuring sensor 15. FIG. 3 is a diagram for explaining calculation of an optimal suction nozzle descending stroke value when mounting electronic components. 5 is a substrate on which electronic components are mounted, 2 is a suction nozzle, and 1 is an electronic component. L is the substrate 5
And the distance from the suction nozzle to the upper limit, a is the thickness of the electronic component 1. La is the distance from the suction nozzle 2 to the substrate 5, and the suction nozzle 5 is lowered by x to apply a constant appropriate pressure. That is, La-x is the optimum descending stroke value from the suction nozzle upper limit position. Conventionally, the value of the thickness a of the electronic component is stored in the storage unit, and the descending stroke value is determined on the assumption that the value of L is constant by a mechanical mechanism, and the distance L between the substrate and the suction nozzle is determined. When was not constant, a spring mechanism incorporated at the tip of the nozzle had to escape. In this embodiment, as shown in FIG. 3, after the distance measuring sensor 15 is introduced and the distance L from the tip of the nozzle to the substrate is measured, the optimum descending stroke value is calculated by the calculation unit. Conventionally, since the downward stroke of the suction nozzle is constant, it has been necessary to accurately perform mechanical adjustment to adjust the height of the suction nozzle. Can now be implemented in a stable manner. In addition, the mounting pressure can be arbitrarily controlled by changing the value of X. Although this embodiment is based on the mounting machine of the XY robot system, it can be easily applied to the mounting machine of the rotary head system by attaching the distance measuring sensor to a non-rotating portion near the rotary head.
発明の効果 このように本発明の電子部品実装方法によれば、吸着
ノズルと基板間距離を測定し、吸着ノズルの最適下降ス
トローク値を算出することにより、基板の厚さの変化、
基板のそりなどによって吸着ノズルから基板までの距離
が変化したときでも影響をうけず同一圧力で安定した実
装が可能となる。As described above, according to the electronic component mounting method of the present invention, by measuring the distance between the suction nozzle and the substrate and calculating the optimal descending stroke value of the suction nozzle, the change in the thickness of the substrate,
Even when the distance from the suction nozzle to the substrate changes due to the warpage of the substrate, stable mounting can be performed at the same pressure without being affected.
第１図は本発明の一実施例における電子部品実装方法の
制御的流れを示すフローチャート、第２図はブロック構
成図、第３図は電子部品実装時の吸着ノズル下降ストロ
ーク値の算出説明図、第４図は従来の実装機の要部斜視
図である。 ２……吸着ノズル、13……記憶装置、14……演算装置、
15……測距センサー。FIG. 1 is a flowchart showing a control flow of an electronic component mounting method according to an embodiment of the present invention, FIG. 2 is a block diagram, FIG. FIG. 4 is a perspective view of a main part of a conventional mounting machine. 2 ... suction nozzle, 13 ... storage device, 14 ... arithmetic device,
15 ... Distance sensor.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河井 誠 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平１−186000（ＪＰ，Ａ) 特開 平１−67998（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/04────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Makoto Kawai 1006 Kazuma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A-1-186000 (JP, A) JP-A-1- 67998 (JP, A) (58) Field surveyed (Int. Cl. 6 , DB name) H05K 13/04
Claims (3)
着し、基板の所定位置へ電子部品を実装する方法であっ
て、電子部品の厚みを記憶する工程と、電子部品を供給
し、上下動作可能な前記吸着ノズルにより電子部品を吸
着する工程と、電子部品を吸着後、前記供給部から実装
する基板上へ電子部品を移動させる工程と、前記基板へ
の移動後、基板から吸着ノズルまでの距離を測定する工
程と、前記基板から吸着ノズルまでの距離と電子部品の
厚みから吸着ノズルの最適下降ストローク値を算出する
工程と、前記最適下降ストローク値により、電子部品を
基板へ実装する工程からなる電子部品実装方法。1. A method for mounting an electronic component at a predetermined position on a substrate by sucking the electronic component from a supply unit by a suction nozzle, comprising: storing the thickness of the electronic component; A step of sucking an electronic component by the suction nozzle, a step of moving the electronic component from the supply unit to a board to be mounted after the suction of the electronic component, and a step of moving the electronic component from the board to the suction nozzle after moving to the board. Measuring the distance, calculating the optimum descending stroke value of the suction nozzle from the distance from the substrate to the suction nozzle and the thickness of the electronic component, and mounting the electronic component on the substrate by the optimum descending stroke value. Electronic component mounting method.
品厚みをａ、一定適正圧力を得る距離をＸとし、最適下
降ストローク値として、Ｌ−ａ＋Ｘの値を用いることを
特徴とする特許請求の範囲第１項記載の電子部品実装方
法。2. The method according to claim 1, wherein the distance between the substrate and the suction nozzle is L, the thickness of the electronic component is a, the distance for obtaining a constant appropriate pressure is X, and the value of La-X is used as the optimum descending stroke value. The electronic component mounting method according to claim 1.
記載の電子部品実装方法。3. The electronic component mounting method according to claim 2, wherein X is set arbitrarily.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1249543A JP2808726B2 (en) | 1989-09-26 | 1989-09-26 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1249543A JP2808726B2 (en) | 1989-09-26 | 1989-09-26 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03110896A JPH03110896A (en) | 1991-05-10 |
| JP2808726B2 true JP2808726B2 (en) | 1998-10-08 |
Family
ID=17194555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1249543A Expired - Fee Related JP2808726B2 (en) | 1989-09-26 | 1989-09-26 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2808726B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2554431B2 (en) * | 1992-11-05 | 1996-11-13 | ヤマハ発動機株式会社 | Mounting device component suction state detection device |
| DE10145167C2 (en) * | 2001-09-13 | 2003-07-24 | Siemens Dematic Ag | Optical distance switch and placement head, placement machine and method for placing substrates with components using the optical distance switch |
| DE10202290A1 (en) * | 2002-01-22 | 2003-07-31 | Siemens Ag | Assembly head and assembly process for assembling substrates with components |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6467998A (en) * | 1987-09-09 | 1989-03-14 | Hitachi Ltd | Press fitting pin connector hitting device |
| JPH01186000A (en) * | 1988-01-20 | 1989-07-25 | Mansei Kogyo Kk | Electronic component mounting device |
-
1989
- 1989-09-26 JP JP1249543A patent/JP2808726B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03110896A (en) | 1991-05-10 |
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