JP2809066B2 - Semiconductor device mounting apparatus and mount collet used therein - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device (die bonder) used in a die bonding step of a semiconductor chip and a mount collet used for the same.

[0002]

2. Description of the Related Art The present invention relates to a mounting apparatus (die bonder) for mounting a fragile semiconductor chip on a substrate by using a vacuum suction force in a die bonding step in a semiconductor manufacturing process.
The present invention relates to a structure of a mount collet provided in the mounting device, which is a jig for sucking a semiconductor chip.

First, an example of a fragile semiconductor chip to be processed will be described with reference to FIG. The figure shows an infrared detector 1
(A) is a perspective view as viewed obliquely from above, and (b) is an AA cross-sectional view. In the figure, a heat insulating film 3 is formed on the surface of a semiconductor substrate 2 having a substantially square plate shape, and four thermistors 4 for sensing infrared rays are mounted on the heat insulating film 3. In addition, a wiring portion 5 for electrically connecting each thermistor 4 and an electrode pad 6 for connecting to an external circuit are formed on the heat insulating film 3. The semiconductor substrate portion below the thermistor 4 has been removed, and a substantially truncated pyramid-shaped gap 2a has been formed. As described above, by forming the thermistor 4 on the heat insulating film 3 on the gap 2a, the temperature of the thermistor 4 increased by receiving infrared rays.
Is hardly escaped by conduction, and the sensitivity of infrared detection can be increased.

Next, an example of a die bonder as a mounting device is shown in FIG. However, only the main part of the die bonder relating to the present invention is shown, and other parts are omitted. In the figure, 7 is a rectangular parallelepiped mounting base, 8 is a substantially disk-shaped centering stage fixed on the mounting base 7, and 9 is a centering stage 8.
A centering pin having a 7-shaped tip is used to move and position the infrared detecting element 1 conveyed above, and is configured to be movable in the horizontal direction. Reference numeral 10 denotes a holder, which includes a centering stage 8 and a chip mount device 12 described later.
, And can be moved up and down. Reference numeral 11 denotes a mount collet attached to the tip of the holder 10, which is a jig for sucking the infrared detecting element 1 by vacuum pressure. The infrared detecting element 1 is horizontally moved to a predetermined position on a centering stage 8 by a centering pin 9 for positioning. After that, the infrared detecting element 1 is attracted by the vacuum attraction force generated at the tip of the mount collet 11 and transported from the centering stage 8 onto the substrate 14 (stem) arranged on the transport stage 13 of the chip mount device 12. Is done.

The chip mount device 12 is a device for mounting a semiconductor chip (infrared ray detecting element 1) on a substrate (stem) 14 via a die bond paste, and includes a transport stage 13, its peripheral structure, a portion for supplying the die bond paste, and the like. However, the configuration around the transfer stage 13 will be described, and description of the other parts will be omitted. A long carrier film 15 is fixed on the transport stage 13, and a substrate 14 (stem) is arranged on the carrier film 15 at regular intervals in the longitudinal direction. After the die bond paste is supplied onto the substrate 14, the infrared detecting element 1 is transported by the holder 10 onto the die bond paste. Thereafter, a heating process is performed to complete the mounting of the infrared detecting element 1 on the substrate 14.

FIG. 5 shows an example of the tip shape of the mount collet 11. (A) is a bottom view showing the end face structure of the tip,
(B) is a vertical sectional view showing the internal structure. Further, a flat plate-shaped object indicated by a dotted line indicates a state where the semiconductor chip (infrared ray detecting element 1) is attracted to the mount collet 11. As shown in the figure, a suction port 11b recessed into a substantially quadrangular pyramid is formed on the end end face of the cylindrical main body 11a. Further, a through hole 11c communicating with the suction port 11b is formed inside the mount collet 11,
The other opening of the through hole 11c is connected to an air pipe connected to a vacuum pump or the like. When a vacuum suction force is generated in the suction port 11b of the mount collet 11 by a vacuum pump or the like, the infrared detecting element 1 suctions the mount collet 11 in a state where the side of the upper peripheral edge is in contact with the side surface of the suction port 11b. Is done. The infrared detecting element 1 adsorbed to the mount collet 11 is mounted on a substrate 14 (stem) via a die bond paste, as shown in FIG.

FIG. 6 shows a case where the die bonding paste 16 is applied to the substrate 14 when the infrared detecting element 1 shown in FIG.
Shows the supply position of. (A) shows the die bond paste 16
FIG. 2B is a side view of the substrate 14 to which the substrate 14 is supplied. In (a), a portion indicated by a substantially rectangular dotted line is a mounting position 17 of the infrared detecting element 1, and the die bond paste 16 is supplied to approximately four central portions of the outer periphery of the mounting position 17.

FIG. 7 shows a state in which the infrared detecting element 1 is arranged on the die bond paste 16 supplied as shown in FIG. (A) is a plan view of the substrate 14 and (b) is a substrate 1
FIG. 4 is a cross-sectional view showing a state where the infrared detection element 1 adsorbed to the mount collet 11 is mounted on the mount collet 4 via a die bond paste 16. As shown in (a), the supply position of the die bond paste 16 is below the electrode pad 6 of the infrared detecting element 1. This is because the electrode pad 6
Because pressure is applied during wire bonding,
This is because it is necessary to support the portion of the electrode pad 6 to prevent chip breakage, and to fix the ultrasonic energy applied to the electrode pad 6 so as not to diffuse. The reason why the die bond paste 16 is not supplied to the entire surface of the mounting position 17 of the infrared detecting element 1 is that the gap 2 a
This is to prevent the die bond paste 16 from creeping up and dissipating the heat of the thermistor to lower the sensitivity.

[0009]

However, since the thermal insulating film 2 formed on the infrared detecting element 1 is a fragile thin film, there is a problem that the thermal insulating film 2 is susceptible to external stress and easily broken. For this reason, it is difficult to mount the chip of the infrared detecting element 1 on the substrate 14 using a die bonder of a method of sucking a semiconductor chip by a vacuum suction force, and each chip is handled by using tweezers or the like. .

The supply of the die bond paste 16 onto the substrate 14 is performed, for example, by attaching the die bond paste 16 to the tip of a transfer pin (not shown) and transferring the paste to the surface of the substrate 14. If the pins are inclined, the die bond paste is not uniformly supplied to the four supply positions, and the supply amount of the die bond paste 16 differs depending on the supply positions, as shown in FIG. Even if the coating amount is slightly reduced, the effect on the performance is small, and it is unlikely to cause a defect. However, if it is applied excessively, as shown in FIG.
Die bond paste 1 through the gap between
6 crawls up and adheres to the surface of the infrared detecting element 1.
Since the electrode pad 6 is formed on the surface of the infrared detecting element 1, if the die bond paste 16 adheres to the electrode pad 6, the wire bond property is hindered. Further, in an actual manufacturing process, a die bond appearance defect may be a defective product.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to be used for die bonding of a fragile semiconductor chip, and for locally applied die bond paste to crawl onto the surface of the semiconductor chip. It is an object of the present invention to provide a mounting device for a semiconductor device capable of preventing the occurrence of the problem and a structure of a mount collet used in the mounting device.

[0012]

According to a first aspect of the present invention, there is provided a semiconductor device mounting apparatus, wherein a semiconductor chip is sucked by a vacuum pressure generated at a tip of a mount collet which is a suction jig. In a semiconductor device mounting apparatus for mounting the semiconductor chip on a die bond paste locally supplied to the semiconductor chip mounting position,
Having a cylindrical main body, the tip of the mount collet,
The suction port is formed by recessing into a substantially quadrangular pyramid shape, and a concave portion reaching from the inner surface of the suction port to the outer surface of the mount collet at a portion of the peripheral portion of the suction port above the application position of the die bond paste. It is characterized by having been formed.

According to a second aspect of the present invention, in the mount collet, a suction port recessed into a substantially quadrangular pyramid is formed at a tip end portion of the cylindrical main body, and the die bond paste is supplied to a peripheral portion of the suction port. A concave portion extending from the inner surface of the suction port to the outer surface of the mount collet is formed in a portion above the position.

[0014]

As shown in FIG. 1, a suction port 11b recessed in a substantially quadrangular pyramid shape is formed at the tip of a mount collet 11 having a cylindrical main body 11a. Since a concave portion extending from the inner surface of the suction port 11b to the outer surface of the mount collet 11 is formed at a position above the application position of the die bond paste 16 locally disposed on the substrate 14, above the application position of the die bond paste 16, Since the mount collet 11 is not in contact with the infrared detection element 1, the die bond paste 16 does not crawl onto the surface of the infrared detection element 1 as described above.

Since the concave portion 11d serves as an air leak area, the vacuum pressure applied to the infrared detecting element 1 does not suddenly increase as soon as the mount collet 11 sucks the infrared detecting element 1. So, that is,
Infrared detector 1 at the tip of mount collet 11
The change in vacuum pressure before and after suction is smaller than when no leak area is provided, and the vacuum suction force applied to the infrared detecting element 1 can be easily adjusted. The infrared detecting element 1 is not damaged.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A mounting device (die bonder) according to the present invention is:
The structure of the mount collet that sucks the semiconductor chip with a vacuum suction force is characteristic, and the other structure is the same as the structure of the die bonder, a part of which is shown in FIG. .

FIG. 2 shows a mount collet 1 according to the present invention.
1 shows an embodiment. In the drawings, (a) is a bottom view showing the tip structure of the mount collet 11, and (b) is a vertical sectional view showing the internal structure of the mount collet 11. As shown in the drawing, a suction port 11b recessed into a substantially quadrangular pyramid is formed at the tip of the mount collet 11 having the cylindrical main body 11a, and is connected to the suction port 11b inside the mount collet 11. A through hole 11c is formed. The shape of the opening surface of the suction port 11b is
b is formed in a shape similar to the outer shape of the infrared detecting element 1 so that the infrared detecting element 1 can be adsorbed on the side surface of the b.
The size is formed larger than the outer shape of the infrared detecting element 1.

The other opening of the through hole 11c is connected to a vacuum pump through an air pipe (not shown), and the mount collet 1 is connected through the air pipe and the through hole 11c.
The first suction port 11b is configured to generate a vacuum suction force. Further, a concave portion 11d extending from the inner surface of the suction port 11b to the outer surface of the mount collet 11 is formed at the center of the four bottom sides of the suction port 11b. As will be described later, the concave portion 11d is formed so that air leaks through the concave portion 11d even when the infrared detecting element 1 is sucked in order to have a function as a leak area.

Mount collet 1 constructed as described above
1 shows a state in which the infrared detecting element 1 is mounted on a substrate 14 using a cross-sectional view of FIG. As shown in the figure, since the mount collet 11 has a recess 11d,
Even when the infrared detection element 1 is adsorbed, the infrared detection element 1 and the mount collet 11 are not in contact with each other above the application position of the die bond paste 16. No creeping-up of the die bond paste 16 on the surface of No. 1 occurred.

Further, even when the infrared detecting element 1 is sucked, air flows through the concave collet 11d through the mount collet 1.
By adsorbing the infrared detecting element 1, the vacuum suction force does not suddenly increase as soon as the infrared detecting element 1 is adsorbed, and the infrared detecting element 1 is adsorbed without applying excessive stress. Can be. The vacuum suction force is determined by the suction port 11
It can also be adjusted by changing the shape of b and the concave portions 11d and the number of the concave portions 11d.

By forming a die bonder using the mount collet as described above, a die bond of a fragile semiconductor chip can be performed by diverting a die bonder used in general IC manufacturing, so that a great rationalization is achieved. Can be achieved.

The shape of the tip of the mount collet is
The present invention is not limited to the embodiment, and may be changed according to the shape of the semiconductor chip. As a fragile semiconductor chip,
In the above embodiment, the infrared detecting element having the thin film is shown. However, the piezo element pressure sensor having the thin film structure, the vulnerable by using the micro-machining technology such as the acceleration detecting element having the cantilever structure formed on the semiconductor substrate, is weak. It can also be applied to three-dimensional microfabricated elements.

[0023]

As described above, according to the mount collet and the semiconductor device mounting apparatus using the same according to the present invention, the conventional mounting apparatus can be used without damaging the fragile semiconductor chip. The mounting can be performed, and the occurrence of defects due to the locally supplied die bond paste crawling up on the semiconductor chip can be prevented.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a state where an infrared detecting element is mounted on a substrate using a mount collet according to the present invention.

FIG. 2 is a view showing one embodiment of a mount collet according to the present invention, wherein (a) is a bottom view and (b) is a vertical sectional view.

3A and 3B are views showing an infrared detecting element to be mounted on the mounting apparatus according to the present invention, wherein FIG. 3A is a perspective view and FIG.
It is sectional drawing.

FIG. 4 is a perspective view showing a main part of the mounting apparatus according to the present invention.

FIG. 5 is a view showing an example of a conventional mount collet;
(A) is a bottom view and (b) is a vertical sectional view.

FIG. 6 is a view showing a state in which a die bond paste is normally applied on a substrate (stem).
(B) is a side view.

FIG. 7 is a diagram showing a state in which an infrared detecting element is mounted on a substrate (stem) via a normally applied die bond paste, (a) is a plan view of the substrate (stem),
(B) is a sectional view.

FIGS. 8A and 8B are diagrams showing a state in which a die bond paste is not evenly applied on a substrate (stem). FIG. 8A is a plan view of the substrate (stem), and FIG. 8B is a side view.

FIG. 9 is a diagram showing a state in which an infrared detecting element is mounted on a substrate (stem) via a die bond paste that is not uniformly applied, (a) is a plan view of the substrate (stem),
(B) is a sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Infrared detection element 2 Substrate 2a Air gap part 3 Thermal insulating film 4 Thermistor 5 Wiring part 6 Electrode pad 11 Mount collet 11a Cylindrical main body part 11b Suction port 11c Through hole 11d Depression 14 Substrate (stem) 16 Die bond paste

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/52 H01L 21/301 H01L 21/68

Claims (2)

(57) [Claims] 1. A semiconductor chip is sucked by a vacuum pressure generated at a tip of a mount collet, which is a suction jig, and the semiconductor chip is placed on a die bond paste locally supplied to the semiconductor chip mounting position on a substrate. In the mounting device of the semiconductor device to be mounted, the tip of the mount collet having a cylindrical main body portion is formed into a substantially quadrangular pyramid to form a suction port, and a peripheral portion of the suction port is formed of the die bond paste. A mounting device for a semiconductor device, wherein a concave portion extending from an inner surface of the suction port to an outer surface of the mount collet is formed in a portion above an application position. 2. A substantially square pyramid-shaped suction port is formed at a tip portion of the cylindrical main body, and a portion of the periphery of the suction port above a supply position of the die bond paste is provided. 2. A mount collet used in a semiconductor device mounting apparatus according to claim 1, wherein a concave portion extending from an inner surface of said suction port to an outer surface of said mount collet is formed.