JP2813053B2 - Carrier type taping correction method for surface mount components - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a carrier type taping correction method for a surface mount component used in an electric circuit such as a micro television, a video camera, a tuner, and a car phone.

(Prior art) In general, carrier tapes such as a square hole punch carrier tape and an embossed carrier tape for mounting surface mount components to be surface mounted on a printed circuit board, etc., have a plurality of surface mount components in the tape body. Mounting holes are formed along the length direction at predetermined intervals, and a feed hole is formed at an intermediate position of the mounting holes adjacent to each other with respect to the length direction of the tape body. Then, in each mounting hole of the tape body, the surface mount components are stored with the terminals arranged in an appropriate direction with the mounting suction surface on the upper surface, respectively, and the top cover tape is applied on the upper surface of the tape body. By covering the mounting holes, the surface-mounted component is mounted on the carrier tape to form a carrier-type taping of the surface-mounted component.

And, for example, when the mounting suction surface of the surface mount component is not on the upper surface, when the terminal direction of the surface mount component is in the opposite direction, when other surface mount components are incorrectly mounted, or If the surface mount component is missing from part of the carrier tape, remove the top cover tape attached to the upper surface of the tape body entirely from the tape body, and remove the surface mount component mounted in the wrong direction. So-called mounting, which is properly stored or re-stored in the mounting hole, and the top cover tape is re-applied from above to the upper surface of the tape body to cover each mounting hole and correct the mounting of the surface mount component to the carrier tape. A carrier-type taping correction method for correcting the mounting of the surface mount component by re-working has been adopted.

(Problems to be Solved by the Invention) However, since the number of surface-mounted components mounted in an improper direction is usually extremely small as compared with the number of surface-mounted components mounted properly on the carrier tape, the above-described conventional technique is not sufficient. The carrier-type taping correction method does not require correction, so even the top cover tape that covers the mounting holes of the surface-mounted components that are mounted in the so-called proper state is peeled off from the tape body and the carrier tape mounting work for the surface-mounted components This requires a lot of work because the number of steps required for correction increases, and the top cover tape is wasted, which increases the cost of mounting surface-mounted components to the carrier tape. Is a problem.

Further, for example, as described in JP-A-63-14, when a surface-mounted component is mounted in an incorrect direction on a carrier tape, when correcting the mounting of the surface-mounted component, the tape body is After punching and removing by cutting a cutting line along the inner periphery of the mounting hole, a portion corresponding to the mounting hole in which the surface mount component is mounted in the incorrect direction in the top cover tape applied to the upper surface of the top cover tape,
It is said that the surface mount component facing the wrong direction is stored again, and finally the opening formed in the top cover tape is closed with an auxiliary piece to correct the mounting of the surface mount component on the carrier tape. Methods are known.

However, the method described in JP-A-63-14 includes a step of punching out and removing a part of the top cover tape. By punching out a part of the top cover tape, punched pieces of the top cover tape are generated. Therefore, there is a problem that it takes time and effort to remove the punched pieces. For example, a punched piece generated by partially punching the top cover tape may enter a mounting hole in which a surface-mounted component oriented in an incorrect direction is accommodated. Since it is necessary to remove the punched pieces that have entered by suctioning them, it is particularly troublesome.

SUMMARY OF THE INVENTION An object of the present invention is to provide a low-cost and simple method for correcting carrier-type taping of a surface-mounted component.

(Means for Solving the Problems) The carrier-type taping method for a surface-mounted component according to the present invention is characterized in that a plurality of mounting portions for accommodating the surface-mounted component are formed at predetermined gaps along a length direction and a plurality of mounting portions are provided. A tape main body in which feed holes are formed at predetermined intervals along the length direction, and a top cover tape that covers the mounting portions in which the surface mount components are accommodated by being attached to the upper surface of the tape main body. In the carrier-type taping of a surface-mounted component having a carrier tape configured as described above, the carrier-type taping corresponds to a mounting portion in which a surface-mounted component is stored in an incorrect direction among the mounting portions in which the surface-mounted component is stored. Then, a cut line is cut through the top cover tape while leaving a part, and an opening piece that can be opened and closed is formed in a portion of the top cover tape corresponding to the mounting portion. With the mouth piece part open, take out the surface mount component housed in the incorrect direction from the mounting part, store it again in this mounting part, and use this opening piece part as an auxiliary piece with the opening piece part closed. To cover.

(Function) In the method for correcting carrier-type taping of a surface-mounted component according to the present invention, cutting is performed while leaving a part of the top cover tape corresponding to the mounting portion in which the surface-mounted component that is incorrectly mounted on the carrier tape is stored. An opening piece which can be opened and closed is formed at a portion corresponding to the mounting portion of the top cover tape by cutting the line, and the surface mounting component is taken out from the mounting portion with the opening piece opened, and the mounting portion is removed. The top cover tape is completely peeled off from the tape body by correcting the mounting of the surface mount components on the carrier tape by covering this opening piece with the auxiliary piece while the opening piece is closed. A top that covers an improperly oriented surface-mounted component or a stored mounting part without re-mounting the surface-mounted component to the carrier tape. An opening piece that can be opened and closed is formed by cutting a cutting line leaving a part of the cover tape, and this opening piece is opened and closed to correct the mounting of the surface mount component to the carrier tape, so that it enters the mounting section. Such punched pieces of the top cover tape are not generated, and no trouble is required for removing the punched pieces.

(Embodiment) A method of correcting a carrier type taping of a surface mount component according to an embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a carrier tape, which is a tape main body 2 made of, for example, a synthetic resin.
And a top cover tape 3 made of a synthetic resin and attached to the upper surface of the tape body 2.

The tape main body 2 has, on one side in the width direction of the tape main body 2, a plurality of recessed concave portions which can appropriately accommodate a tantalum capacitor 4 as an electrolytic capacitor having, for example, a conductive terminal portion having a polarity as a surface mount component. Mounting holes 5 as mounting portions are formed at predetermined intervals in the longitudinal direction of the tape main body 2. At the other end of the tape body 2 in the width direction, a circular feed hole 6 is formed at a substantially central position of each of the mounting holes 5 adjacent to each other so as to penetrate the upper and lower surfaces. I have.

The top cover tape 3 is applied to the tape main body 2 by pressing, for example, by heat from above the opening upper portion 7 of the mounting hole 5 formed in the tape main body 2 to cover the upper opening 7 of the mounting hole 5. However, the tantalum capacitor 4 stored in the mounting hole 5 is prevented from dropping out of the mounting hole 5. Further, the top cover tape 3 is peeled off from the tape body 2 with an appropriate peeling strength at the time of mounting, and the tantalum capacitor 4 is taken out from the mounting hole 5.

Therefore, the tantalum capacitor 4 is accommodated in the mounting hole 5 of the tape main body 2 in an appropriate state with the conductive terminals positioned on both sides from the upper opening 7 with the mounting suction surface 8 as the upper surface, and the top cover tape 3 is placed from above. The carrier type taping 9 of the tantalum capacitor 4 is formed by being pressure-bonded to the tape body 2 to cover the upper opening 7 of the mounting hole 5 and to be mounted on the carrier tape 1.

 Next, the operation of the present embodiment will be described.

When attaching the tantalum capacitor 4 to the carrier tape 1, for example, when the mounting suction surface of the tantalum capacitor 4 is on the lower surface, when the terminal direction of the tantalum capacitor 4 is reversed, or when the tantalum capacitor 4 The capacitor 4 may be missing.

For example, as shown in FIG.
Is mounted upside down in the mounting hole 5 of the tape body 2, and when the tantalum capacitor 4 is mounted in a state where the mounting suction surface of the tantalum capacitor 4 faces upward and the tantalum capacitor 4 faces in a wrong direction, the wrong direction is set. The mounting of the facing tantalum capacitor 4 to the carrier tape 1 must be corrected.

In correcting the mounting of the tantalum capacitor 4, first, a cutter (not shown) or the like is used to cover a portion of the top cover tape 3 covering the mounting hole 5 in which the tantalum capacitor 4 mounted in the wrong direction is stored. The opening piece 10 that can be opened and closed as shown in FIG. 3 is formed.

That is, a gap of a size corresponding to the tantalum capacitor 4 is provided along the length direction of the top cover tape 3 and a cut line having a length corresponding to the tantalum capacitor 4 is formed.
The vertical cutting lines 10a, 10a are cut and formed, and each vertical cutting line 10a is cut along the width direction of the top cover tape 3.
An opening piece 10 that can be opened and closed is formed in the top cover tape 3 by cutting and forming one horizontal cutting line as a cutting line by connecting the ends of a and 10a.

Next, after the formed opening piece 10 is opened, the tantalum capacitor 4 facing the wrong direction is once taken out from the mounting hole 5. Then, after the taken out tantalum capacitor 4 is turned upside down, it is stored in the original mounting hole 5 in an appropriate state.

Finally, after the opening piece 10 is closed, the opening piece 10 is covered with the auxiliary piece 11, as shown in FIG.

That is, the auxiliary piece 11 having a larger overall size than the opening piece 10, a width larger than the width of the mounting hole 5 and smaller than the width of the top cover tape 3, and one side of which is an adhesive surface, is used. Cover 10 from above.

In this way, the tantalum capacitor 4 mounted in the wrong direction on the carrier tape 1 is properly mounted on the carrier tape 1 with its mounting state corrected.

According to the above-described carrier-type taping correction method, even the top cover tape 3 covering the mounting hole 5 for accommodating the so-called properly mounted tantalum capacitor 4 that does not require correction is peeled off from the tape body 2 and the tantalum capacitor 4 is removed. The tantalum capacitor 4 mounted in the wrong direction can be selected and the mounting of the tantalum capacitor 4 on the carrier tape 1 can be corrected without performing the mounting operation again.

In addition, since the mounting of the tantalum capacitor 4 is corrected without peeling off the top cover tape 3 covering the mounting hole 5 for accommodating the corresponding tantalum capacitor 4, the correction can be easily performed without any trouble. Further, since the mounting of the tantalum capacitor 4 can be corrected without peeling off the top cover tape 3 from the tape body 2 at all, the peeling strength of the top cover tape 3 from the tape body 2 is unchanged, and the top cover tape 3 is wasted. No need to use it.
Further, the mounting of the tantalum capacitor 4 on the carrier tape 1 can be modified without affecting the reliability of the mounting of the tantalum capacitor 4 at all.

An opening piece that can be opened and closed by cutting the vertical and horizontal cutting lines 10a, 10a, and 10b except for a part of the top cover tape 3 at a portion corresponding to the mounting hole 5 in which the tantalum capacitor 4 facing the wrong direction is stored. A portion 10 is formed, and the opening piece 10 is opened and closed to correct the attachment of the tantalum capacitor 4 to the carrier tape 1. Therefore, no punched piece of the top cover tape 3 is generated, and the punched piece removal processing is performed. There is no need for trouble. Further, for example,
There is no danger that a punched piece generated by partially punching out the top cover tape 3 may enter the mounting hole 5, and a suction device or the like is required. Nor.

Therefore, the cost required for properly mounting the tantalum capacitor 4 to the carrier tape 1 can be greatly reduced, and the tantalum capacitor 4 mounted in the wrong direction can be easily corrected.

In the above embodiment, the tantalum capacitor 4 has been described as a surface mount component. However, the present invention is not limited to this. Applicable to

In the operation of the above embodiment, the tantalum capacitor 4
Has been described as an example in which the tantalum capacitor 4 is mounted with the mounting suction surface of the tantalum capacitor 4 facing upward, but the tantalum capacitor 4 is missing in a part of the carrier tape 1, for example. If you have
It is sufficient to simply house another separately prepared tantalum capacitor 4 in its mounting hole 5. Also, when correcting the missing state of the tantalum capacitor 4, there is no possibility that a punched piece generated by partially punching the top cover tape 3 enters the mounting hole 5, and the punched piece is inserted by using a suction device or the like. There is no need to remove the punched piece by suction, and the punched piece can be easily corrected using the openable opening piece 10.

(Effects of the Invention) According to the present invention, when a surface mounting component is improperly mounted on a carrier tape, the entire top cover tape is peeled off from the tape main body and the mounting operation of the surface mounting component onto the carrier tape is performed. Without performing the process again, an opening piece that can be opened and closed is formed by cutting a cutting line while leaving a part of the top cover tape in a portion corresponding to the mounting portion in which the surface-mounted component in the incorrect direction is stored. Since the opening piece is opened and closed, the mounting of the surface mount component on the carrier tape is corrected, so there is no punched piece of the top cover tape that enters the mounting part, and it may take time to remove this punched piece. In addition, the correction of the surface mounting component in the wrong direction can be easily performed at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view of a carrier-type taping modified by a carrier-type taping modification method for a surface-mounted component according to an embodiment of the present invention, and FIGS. 2 to 4 illustrate the carrier-type taping modification method in the same order as above. FIG. DESCRIPTION OF SYMBOLS 1 ... Carrier tape, 2 ... Tape body, 3 ... Top cover tape, 4 ... Tantalum capacitor as a surface mount component, 5 ... Mounting hole as a mounting portion, 6 ... Sending hole, 9 ... Carrier Taping, 10 ... Opening piece, 10
a ... vertical cutting line as cutting line, 10b ... horizontal cutting line as cutting line, 11 ... auxiliary piece.

Claims (1)

(57) [Claims] A plurality of mounting portions for accommodating a surface mount component are formed at predetermined intervals along a length direction, and a plurality of feed holes are formed at predetermined intervals along a length direction. Carrier type taping of a surface mount component provided with a carrier tape comprising a tape body and a top cover tape covering the mounting portion in which the surface mount component is accommodated and is attached to the upper surface of the tape body. The cutting line is cut in the top cover tape, leaving a part in the top cover tape corresponding to the mounting part in which the surface mount component is stored in the wrong direction among the mounting parts in which the surface mount component is stored. An opening piece that can be opened and closed is formed in a portion of the top cover tape corresponding to the mounting section, and a surface member stored in the incorrect direction from the mounting section with the opening piece opened. Remove the device again accommodated in the mounting portion, the carrier type taping method of correcting the surface mounting component, characterized in that the opening piece portion is closed the opening piece portion is covered with the auxiliary piece.