JP2817742B2 - IC package for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] Regarding an IC package for a high frequency semiconductor device, a concave portion for mounting a semiconductor element is formed for the purpose of enabling sufficient impedance matching of an inner lead for connecting a terminating resistor. For a semiconductor device provided with a large number of inner leads around the concave portion
In the IC package, a groove is provided between adjacent inner leads, and a wall of a portion of the groove that contacts the inner lead is formed to be inclined, and the inner lead is formed to protrude from the inclined portion.

[Industrial applications]

The present invention relates to an IC package for a high frequency semiconductor device.

[Conventional technology]

Conventionally, in an ECL logic and an ECL gate array using a high frequency, it is necessary to perform impedance matching in order to prevent malfunction due to signal reflection, and thus a terminating resistor (generally 50Ω) is provided. In order to attach this terminating resistor, in the ECL logic, as shown in FIG. 4 (b), a folded pattern 2a is formed by connecting two inner lead ends in the IC package 1, and the inner lead Is used as a signal line, and the other is connected to a ground or the like via a terminating resistor (not shown) on a substrate on which the semiconductor package is mounted. The inner lead folded pattern 2a is connected to the terminal electrode 4 of the chip 3 by a bonding wire 5 like the other inner leads 2. Also
In the ECL gate array, since the folded pattern portion of the inner lead is located at a different position depending on the type, preparing individual packages is disadvantageous in terms of economy and management. For this reason, as shown in FIG. 4 (c), the package is shared and the inner lead corresponding to the folded pattern is formed.
2b and 2c are connected by a bonding wire 6.

[Problems to be solved by the invention]

In the case of performing the above-described conventional impedance matching, in the method shown in FIG. 4 (b), the connection between the inner leads 2b and 2c, which is a folded pattern, is performed by a bonding wire, so that the impedance becomes large.
There is a problem that impedance matching is insufficient.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described conventional problems, and has as its object to provide an IC package that allows sufficient impedance matching of an inner lead for connecting a terminating resistor.

[Means for solving the problem]

In order to achieve the above object, in a semiconductor device IC package according to the present invention, a concave portion 1a for mounting a semiconductor element is formed, and a large number of inner leads 2 are provided around the concave portion. A groove 7 is provided between adjacent inner leads 2, and a wall of a portion of the groove 7 that is in contact with the inner lead is formed so as to be inclined, and the inner lead 2 is formed to protrude from the inclined portion. . The groove 7 between the required inner leads 2b, 2c is filled with a brazing material 8, and the inner leads 2b, 2c are electrically connected.

(Operation)

By filling the groove 7 provided between the adjacent inner leads 2b and 2c with the brazing material 8, an electrical connection having an impedance smaller than that of the bonding wire can be performed, thereby achieving a sufficient impedance matching.

〔Example〕

1A and 1B are diagrams showing an embodiment of the present invention, in which FIG. 1A is a cross-sectional view, FIG. 1B is a view as viewed in the direction of the arrow Z in FIG.
FIG. 3D is an enlarged sectional view taken along line dd of FIG.

In FIG. 1, reference numeral 1 denotes a ceramic or plastic IC package for a semiconductor device, and a concave portion 1a for mounting a semiconductor element is formed in the package 1 as shown in FIG. In addition, many inner leads 2
Is provided. As shown in FIGS. 2B to 2D, a groove 7 having an inclined side wall is formed between the adjacent inner leads 2 near the tip of the inner lead. On the slope of the portion of the groove 7 that contacts the inner lead 2,
Both sides of the inner lead 2 are formed so as to protrude as shown in FIGS.

The embodiment thus formed is shown in FIG.
As shown in (b), the required distance between the inner leads 2b and 2c is A
The inner leads 2b and 2c are filled with a brazing material 8 such as a u / Sn alloy.
A package having an inner lead in a folded pattern by electrically connecting the spaces can be formed.

By filling the required inner leads with the brazing material as described above, it is possible to cope with a semiconductor device in which the folded pattern position differs depending on the type.

FIG. 3 is a view showing a semiconductor device using a package in which the above-mentioned folded pattern is formed.

In FIG. 1, reference numeral 1 denotes a package, and a groove 7 is filled in advance with a brazing material 8 and electrically connected between required inner leads 2b and 2c for connecting a terminating resistor. After the semiconductor element 3 is mounted on the package 1, the inner leads 2
b and 2c are connected to the terminal electrodes 4 of the semiconductor element 3 by the bonding wires 5 like the other inner leads 2.

In the semiconductor device configured as described above, since the inner leads 2b and 2c for connecting the terminating resistors are connected by the brazing material 8, the impedance value is smaller than that in the case of the connection using the conventional bonding wire. Therefore, impedance matching can be sufficiently performed.

〔The invention's effect〕

As described above, according to the present invention, a groove is provided between the inner leads, and a necessary groove between the inner leads is filled with a brazing material such as Au / Su so that the impedance between the inner leads is impedance-matched. It can be used as an IC package, and can be applied to a plurality of products having different termination resistor connection positions.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram for explaining a method of using the embodiment of the present invention, and FIG. 3 is a diagram showing an IC package for a semiconductor device according to an embodiment of the present invention. FIG. 4 is a diagram showing a main part of a semiconductor device, and FIG. 4 is a diagram showing a conventional semiconductor device. In the figure, 1 is a package, 2, 2b, 2c are inner leads, 3 is a semiconductor element, 4 is a terminal electrode, 5 is a bonding wire, 7 is a groove, and 8 is a brazing material.

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/12 H01L 23/50

Claims (2)

(57) [Claims] An IC package for a semiconductor device in which a recess (1a) for mounting a semiconductor element is formed and a plurality of inner leads (2) are provided around the recess, between adjacent inner leads (2). A groove (7) is provided, and a wall of a portion of the groove (7) in contact with the inner lead (2) is formed to be inclined, and the inner lead (2) is formed to protrude from the inclined portion. Characteristic package for semiconductor devices. 2. The semiconductor device IC package according to claim 1, wherein said groove (7) between required inner leads (2b, 2c) is filled with a brazing material (8).
c) An IC package for a semiconductor device, wherein the IC packages are electrically connected to each other.