JP2819282B2 - Semiconductor package and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semi-conductor package, more particularly, to a plurality of semiconductor packages leads shaped plate which is buried in the resin molding.

[0002]

2. Description of the Related Art Conventionally, in a QFP (Quad Flat Package) semiconductor package, as shown in FIG. 4, a plurality of lead frames 1 each having an inner lead 1a and an out lead 1b are surrounded by the lead frame 1. A paddle 2 disposed at a central portion, a semiconductor chip 3 adhered on the paddle 2, a plurality of electrodes provided on the upper surface of the semiconductor chip 3, and metal wires connecting the inner leads 1a, respectively. 4 and a resin molded body 5 for molding the inner lead 1 a, the paddle 2, the semiconductor chip 3 and the metal wire 4.

In such a conventional method of manufacturing a QFP semiconductor package, (1) lead frame 1
And (2) bonding the semiconductor chip 3 on the paddle 2, and (3) bonding the semiconductor chip 3 to the paddle 2.
A step of the electrode and that is provided and the inner lead 1a of the lead frame 1 are bonded by a metal wire - 4 on the upper surface, (4) the inner lead 1a, paddle 2, the semiconductor chip 3 and the metal wire over 4, sealed by a resin (5) trimming the molded body 5 (tr
iming) and forming steps;
Was sequentially applied.

[0004]

However, in such a conventional QFP semiconductor package and a method of manufacturing the same, in the resin molding process, there is a possibility that the position of the paddle may be distorted due to the pressure during the operation and defective products may be generated. There was an inconvenience that there was. In addition, since the outlead is formed outside the molded body, there is a possibility that the lead may be bent due to an external impact, and the alignment when mounting such an outlead on a printed circuit board may be reduced. There was an inconvenience that it was difficult and extremely complicated.

Furthermore, after the semiconductor package is mounted on the printed circuit board, in the process of supplying power and operating the semiconductor chip, even if the temperature of the semiconductor package rises, the high-temperature heat is quickly released to the outside. However, there is also an inconvenience that an operation error may occur.
The present invention, such view of the conventional problems, can be conveniently mounted on a printed circuit board, to provide an inexpensive semi-conductor package to quickly dissipate heat generated during operation to the outside Aim.

[0006]

A solution for the] Therefore, in the invention according to claim 1, the package body made of tree butter, is embedded in the said package body, the upper and lower surfaces of the package body
A plurality of leads whose surfaces are exposed at the outer peripheral edge, a plate-shaped metallic heat-emitting portion embedded through the central portion of the package main body, and a predetermined central portion at the center of the upper surface of the package main body. A groove formed to have a depth, a semiconductor chip adhered to the surface of the heat emitting portion in the groove, and a plurality of electrodes provided on the upper surface of the semiconductor chip and a metal for connecting each of the leads. A semiconductor package includes a wire, and an epoxy molding compound that seals the semiconductor chip, each lead, and the metal wire disposed in the groove.

In such a configuration, the positional relationship between the metallic heat emitting portion on which the semiconductor chip is mounted and the leads is always kept constant, and the heat generated during operation is also quickly transmitted via the metallic heat emitting portion. Dissipated. Also, a plurality of leads are
Embedded in the package body,
The surface is exposed on both the upper and lower surfaces and the outer edge.
Signal input and output from any exposed part
Wear. Such a semiconductor package includes a prismatic metallic heat emitting member and a plurality of columnar lead members disposed substantially in parallel around the metallic heat emitting member, as in the invention according to claim 6 . A first step of forming an integrated columnar package material by solidifying with resin so that the side portions of the lead members are exposed; cutting the formed columnar package material to a predetermined thickness to form a metallic heat emitting portion; A second step of forming a package body in which a plurality of leads are embedded, a third step of cutting a predetermined portion of the cut upper surface of the package body upper surface to form a groove having a predetermined depth, and exposing the groove in the groove. Metal
Bonding the semiconductor chip to the sexual heat emitting portion upper surface, and a fourth step of connecting a plurality of electrodes and the lead and the respective metal wires provided on the semiconductor chip upper surface, said semiconductor chip, the leads, and the metallic wire If it is manufactured by sequentially performing the fifth step of sealing with an epoxy molding compound, mass production is easy.

According to the second aspect of the present invention, the strength of the upper surface of the semiconductor package can be improved by covering the upper surface of the package body with a lid and sealing the groove . In this case, as in the invention according to claim 3,
If the thickness is smaller than the thickness of the package body, heat can be easily dissipated from the upper surface of the semiconductor package. The semiconductor package using such a lid is, as in the invention according to claim 7 , a prismatic metallic heat emitting member and a plurality of metal heat emitting members arranged substantially in parallel around the metallic heat emitting member. A first step of solidifying the columnar lead member with a resin so that the side portions of the lead member are exposed to form an integrated columnar package material; and cutting the formed columnar package material to a predetermined thickness. A second step of forming a package body in which a metallic heat emitting portion and a plurality of leads are embedded, and a third step of forming a groove having a predetermined depth by cutting a predetermined central portion of the cut upper surface of the package body. And, a semiconductor chip is bonded to the upper surface of the metallic heat emitting portion exposed in the groove,
By sequentially performing a fourth step of connecting a plurality of electrodes provided on the upper surface of the semiconductor chip and each lead by a metal wire, and a fifth step of covering the upper surface of the package body with a lid and sealing the groove. Can be manufactured.

At this time, if the lid is formed by cutting the columnar package material to a predetermined thickness as in the invention according to claim 8 , the lid can cover the upper surface of the package body without excess or shortage. Can be easily and inexpensively manufactured. The shape of the package body is arbitrary, but if it is a rectangular plate as in the invention according to claim 4 or a disk as in the invention according to claim 5, it is provided on the upper surface of the semiconductor chip. Further, high-density connection between the plurality of electrodes and each lead by a metal wire is facilitated.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. In the semi-conductor package according to the present invention, as shown in FIG. 3, is embedded with the package body 11a made of resin (e.g., epoxy resin), the interior of the package body 11a, the package body 1
A plurality of leads 12 whose surfaces are exposed on both upper and lower surfaces and an outer peripheral edge of 1a; a plate-like metallic heat emitting portion 13 buried by penetrating a central portion of the package main body 11a; A groove 14 formed at a predetermined position with a predetermined depth, and the metal in the groove 14
A semiconductor chip 15 adhered to the surface of the conductive heat emitting portion 13;
A metal wire 16 for connecting a plurality of electrodes provided on the upper surface of the semiconductor chip 15 to the respective leads 12, and a semiconductor chip 15, each lead 12 and the metal wire 16 disposed in the groove 14 are sealed. And an epoxy molding compound 17 .

In the semiconductor package having such a configuration,
Since the heat generated during the operation is also quickly dissipated through the metallic heat emitting portion 13, a rise in the temperature inside the package can be suppressed. The lead 12 is the package body 1
Since it is buried inside 1a, it is not deformed by an external impact or the like. Further, since the leads 12 are exposed on the upper and lower surfaces and the outer peripheral edges of the side surfaces of the package body 11a, signals can be input / output from any of these, and the leads 12 can be mounted in various forms on a printed circuit board or the like. can do.

As shown in FIG. 3, instead of the epoxy molding compound 17, a lid 11 covering the groove 14 on the upper surface of the package body 11a.
b can also be used by bonding. With this configuration, the strength of the upper surface of the semiconductor package is improved, and higher durability can be obtained. Next, a method of manufacturing a semiconductor package having the above-described configuration according to the present invention will be described.

First, as shown in FIG.
A plurality of columnar lead members 9 having a width (1 to 2 mm), a width W, and a length L are arranged substantially in parallel around a prismatic metallic heat emitting member 8, and these are arranged on the side of the columnar lead member 9. The columnar package material 10 is formed integrally with a resin so that the portions are exposed. Here, the columnar lead member 9 and the metallic heat emitting member 8 are formed of a conductive metal such as Cu or Al.

Thereafter, the molded columnar package material 1
0 is sequentially cut so as to have a predetermined thickness, and FIG.
As shown in (1), the package body 11a in which the metallic heat emitting portion 13 and the plurality of leads 12 are respectively buried is formed. Next, as shown in FIG. 1C, a groove 14 is formed by polishing or polishing the central portion of the upper surface of the package body 11a so as to have a predetermined size and a predetermined depth.

Thereafter, as shown in FIG. 1D, a semiconductor chip 15 is bonded to the upper surface of the metallic heat emitting portion 13 exposed at the center of the groove 14, and the upper surface of the semiconductor chip 15 and the upper surface of each lead 12 are bonded. Are connected by a metal wire 16 respectively. Then, as shown in FIG. 2, the semiconductor chips 15 disposed in the groove 14, the upper surface of each lead 12 and the metal follower <br/> ear over 16 sealed by epoxy molding compound 17, the present invention Of the semiconductor package according to the above is terminated.

In this manner, semiconductor packages of uniform quality can be mass-produced at low cost. Also, at the time of sealing with the epoxy molding compound 17,
The pressure does not cause the positions of the semiconductor chip 15 and the metallic heat emitting portion 13 to shift, and the positional relationship between the metallic heat emitting portion 13 on which the semiconductor chip 15 is mounted and the lead 12 is always kept constant. In the manufacturing process, the metal wire 16
Disconnection is unlikely to occur.

In the manufacturing method described above, instead of the sealing step using the epoxy molding compound 17,
You may make it seal with a plate-shaped lid. For example, as shown in FIG. 3, the columnar package material 10 is cut to a predetermined thickness to form a lid 11b, and the semiconductor chip 1
5. The top surface of the package body 11a may be covered with a lid 11b and sealed so as to seal the grooves 14 in which the leads 12 and the metal wires 16 are provided. In this way, it is possible to easily and inexpensively manufacture a package that can cover the upper surface of the package body 11a without excess or shortage.
The lead provided on the outer edge of the lid 11b is electrically connected to the lead 12 of the package body 11a.
(b) Signals can be input and output also from the upper surface, and the degree of freedom of the mounting method on a printed circuit board or the like is expanded.

The lid 11b is attached to the package body 11
When formed to a thickness that is not problematic in strength than a, heat dissipation during operation can be promoted. Although the shape of the package body is not particularly limited, if the shape is a rectangular plate or a disk, the space between the electrode formed on the upper surface of the rectangular plate-shaped semiconductor chip and the lead embedded in the peripheral portion of the package body is provided. Suitable for performing high density wire bonding.

Further, in the above-described example, the columnar package material 10 is manufactured in a rectangular parallelepiped. However, by manufacturing the columnar package material 10 into a columnar shape or a desired shape as needed, a package having an intended shape can be easily mass-produced. it can. Alternatively, the package may be formed of an insulating material such as ceramic instead of resin.

[0020]

As described above, according to the first aspect of the present invention, there is an effect that a lead is hardly deformed by external force or the like, and a semiconductor package having high durability can be obtained. In addition, the surface of multiple leads
Exposed on both upper and lower surfaces and outer edge of body package body
Signal input and output from any of these
It gives a wide degree of freedom to the mounting method on printed circuit boards, etc.
There is an effect that can be. In addition, since heat during operation can be efficiently dissipated from the semiconductor package, an operation error can be prevented as much as possible.

Further, according to the second aspect of the invention, there is an effect that the strength of the upper surface of the semiconductor package can be improved and higher durability can be obtained. Claim 3
According to the invention, heat dissipation from the upper surface of the semiconductor package can be promoted by forming the lid thin. Claims 4 and 5
According to the invention, there is an effect that a plurality of electrodes provided on a semi-conductor chip top surface, high density connection by metal wires between the leads provided on the peripheral portion of the package body is facilitated .

[0022] Also, the invention according to claim 6 and claim 7, since the manufacturing process is facilitated very simple and mass production, there is an effect that cost increase productivity becomes inexpensive. In addition, there is also an effect that the breaking of the metal wire hardly occurs in the manufacturing process, and the yield is improved.

According to the eighth aspect of the present invention, there is an effect that a lid that covers the package body without excess or shortage can be manufactured at low cost and easily. In addition, there is an effect that signals can be input and output also from leads provided on the peripheral portion of the lid.

[Brief description of the drawings]

[1] (A) ~ (D) step view illustrating a semi-conductor package and a manufacturing method thereof according to the present invention

Perspective view illustrating the embodiment of a semi-conductor package according to the present invention; FIG

Figure 3 is a perspective view illustrating another embodiment of a semi-conductor package according to the present invention

FIG. 4 is a cross-sectional view illustrating the structure of a conventional QFP semiconductor package.

[Explanation of symbols]

8 metallic heat dissipation member 9 columnar lead member 10 columnar packaging material 11a package body 11b lid 12 leads 13 metal heat sink 14 groove 15 semiconductor chip 16 metal wires

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/34-23/473 H01L 23/28-23/30 H01L 21/56 H01L 23/12

Claims (8)

(57) [Claims] [Claim 1] A tree fat made of the package body (11a), embedded in the interior of the package body (11a), said path
A plurality of leads (12) having exposed surfaces on both upper and lower surfaces and an outer peripheral edge of the package body (11a); and a plate-like metal buried through a central portion of the package body (11a). A heat release portion (13), a groove (14) formed at a predetermined position in the center of the upper surface of the package body (11a) with a predetermined depth, and the metal heat release portion ( 13) a semiconductor chip (15) adhered to the surface, a metal wire (16) for connecting a plurality of electrodes provided on the upper surface of the semiconductor chip (15) with the leads (12), respectively; 14), the semiconductor chip (1)
5) Epoxy molding compound (17) for sealing each lead (12) and metal wire (16)
And a semiconductor package comprising: Wherein the tree fat made of the package body (11a), embedded in the interior of the package body (11a), said path
A plurality of leads (12) having exposed surfaces on both upper and lower surfaces and an outer peripheral edge of the package body (11a); and a plate-like metal buried through a central portion of the package body (11a). A heat release portion (13), a groove (14) formed at a predetermined position in the center of the upper surface of the package body (11a) with a predetermined depth, and the metal heat release portion ( 13) a semiconductor chip (15) adhered to the surface, a metal wire (16) for connecting a plurality of electrodes provided on the upper surface of the semiconductor chip (15) to the leads (12), respectively; (11a) The groove (1 ) covering the upper surface
4) A semiconductor package comprising: a lid (11b ) for sealing; 3. The semiconductor package according to claim 2, wherein said lid body (11b) is formed thinner than a thickness of said package body (11a). 4. The semiconductor package according to claim 1, wherein said package body has a rectangular plate shape. 5. The semiconductor package according to claim 1, wherein said package body has a disk shape. 6. A prismatic metallic heat emitting member (8) and a plurality of columnar lead members (9) disposed substantially in parallel around the metallic heat emitting member (8). (1) a first step of forming an integrated columnar package material (10) by solidifying with resin so that the side portions are exposed; and cutting the formed columnar package material (10) to a predetermined thickness. A second step of forming a package body (11a) in which the metallic heat emitting portion (13) and the plurality of leads (12) are embedded, and cutting a predetermined portion at the center of the upper surface of the cut and formed package body (11a). A third step of forming a groove (14) having a predetermined depth; and bonding a semiconductor chip (15) to an upper surface of the metallic heat emitting portion (13) exposed in the groove (14). A plurality of electrodes and each lead (1
And 4) connecting each of them with a metal wire (16).
And a fifth step of sealing the semiconductor chip (15), each lead (12), and the metal wire (16) with an epoxy molding compound (17). 7. A lead-shaped metal heat-dissipating member (8) and a plurality of columnar lead members (9) disposed substantially in parallel around the metallic heat-dissipating member (8). (1) a first step of forming an integrated columnar package material (10) by solidifying with resin so that the side portions are exposed; and cutting the formed columnar package material (10) to a predetermined thickness. A second step of forming a package body (11a) in which the metallic heat emitting portion (13) and the plurality of leads (12) are embedded; A third step of forming a groove (14) having a predetermined depth; and bonding a semiconductor chip (15) to an upper surface of the metallic heat emitting portion (13) exposed in the groove (14). A plurality of electrodes and each lead (1
And 4) connecting each of them with a metal wire (16).
And a fifth step of covering the upper surface of the package body (11a) with a lid (11b) and sealing the groove (14). Wherein said lid (11b) is claim is formed by cutting the columnar packaging material (10) to a predetermined thickness 7
5. The method for manufacturing a semiconductor package according to claim 1.