JP2825101B2 - Wafer frame moving device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to an apparatus for moving a wafer frame, wherein an object is to move the wafer frame in a predetermined posture so as to eliminate generation of dust. At least one first fulcrum member engaged with the lower surface of the first position of the first frame, and a second fulcrum member movably engaged with the upper surface of the annular portion of the wafer frame at the second position from the upper side to the lower side. And a supporting means movable to support the first fulcrum member and the second fulcrum member.

[Industrial applications]

The present invention relates to a wafer frame moving device in which a silicon wafer or the like is attached via a tape.

Recently, integrated circuit components (ICs) have been miniaturized and highly integrated, and at the same time, the entry of small dust has affected the quality of products.
For this reason, in the manufacturing process of integrated circuit components, utmost care has been taken to prevent dust.

In general, a semiconductor manufacturing process includes a pre-process for performing processes such as etching and impurity diffusion, and a post-process for performing processes such as dicing and bonding. Conventionally, measures for preventing dust from being mixed have been completely performed, particularly in the preceding process. Recently, measures for preventing dust from being mixed have been required even in the post-process.

A wafer frame is used for processing in a post-process of the silicon wafer after the process in the pre-process is completed. The wafer frame is an annular plate-shaped frame, and the inside of the annular portion is an opening. An adhesive tape is attached to the entire surface of the wafer frame, and the silicon wafer is attached to the adhesive surface of the adhesive tape that appears at the opening in the annular portion of the wafer frame. With the silicon wafer mounted on the wafer frame in this manner, it is carried to, for example, dicing or other processing. Further, since it is inefficient to process one silicon wafer at a time in the subsequent process, a plurality of wafer frames (and silicon wafers) are loaded on a frame carrier, and a plurality of silicon wafers are processed for each frame carrier. It has become. This frame carrier resembles a box that holds a wafer frame with a silicon wafer in a drawer shape.The front and bottom of the box are open, and parallel grooves are provided on both sides. The outer edge of the frame can be drawn in and out along the groove.

When a plurality of wafer frames (and silicon wafers) are loaded in the frame carrier in this way, it is necessary to pull out one wafer frame from the plurality of wafer frames, for example, for sampling inspection. .

[Conventional technology]

Conventionally, a moving device as shown in FIG. 5 or FIG. 6 has been used to pull out a wafer frame from a frame carrier. 5 and 6, the frame carrier 1 has a groove 2, and a wafer frame 3 on which a silicon wafer is mounted is inserted into each groove 2.
The width of the groove 2 in the height direction is slightly larger than the width of the wafer frame 3, and the wafer frame 3 rests on the bottom of the groove 2.

In the case of the moving device shown in FIG. 5, a gripper 7 having upper and lower claws 6a and 6b connected by a pivot pin 5 is used. The gripper 7 is moved from the front of the frame carrier 1 toward the front edge of the wafer frame 3 in the direction indicated by the arrow a, and the upper claw 6a is moved to the lower claw 6b at a position slightly passing through the front edge of the wafer frame 3. To grip the wafer frame 3 between them, and then the gripper 7 is moved in the direction opposite to the arrow a, so that the wafer frame 3
Pull out.

In the case of the moving device shown in FIG. 6, a belt conveyor 9 is arranged below the open bottom of the frame carrier 1.
The frame carrier 1 can be gradually lowered in a downward direction indicated by an arrow b by supporting means (not shown). With this lowering operation, the wafer frame 3 rides on the belt conveyor 9 and moves the belt conveyor 9 to, for example, an arrow c. The wafer frame 3 is moved by driving in the direction of.

[Problems to be solved by the invention]

As described above, the wafer frame 3 is an annular plate-shaped frame, and the silicon wafer is attached to the adhesive tape at the opening in the annular portion. In the conventional moving apparatus shown in FIG. 6, the belt conveyor 9 comes into contact with the silicon wafer together with the wafer frame 3 and rubs the wafer frame 3 and the silicon wafer to generate a dust. Further, the conventional moving device shown in FIG. 6 can only take out the wafer frame 3 from the lower wafer frame 3 to the upper wafer frame 3 in order. Can not be taken out.

The conventional moving device shown in FIG. 5 has a problem that the wafer frame 3 cannot be taken out in parallel with the groove 2 of the frame carrier 1. That is, since the distance between the upper and lower wafer frames 3 is relatively small, the dimensions of the upper and lower claws 6a and 6b of the gripper 7 are also restricted, and the gripper 7
Cannot be inserted deeply into the frame carrier 1,
The gripper 7 grips only the front edge of the wafer frame 3 viewed in the moving direction (arrow a). Since the wafer frame 3 is made of stainless steel and is quite heavy, if only the front edge of the wafer frame 3 is gripped, the wafer frame 3
The rear part of the hangs. It is difficult to insert the gripper 7 deep into the frame carrier 1. In this way, when the wafer frame 3 is pulled out in an inclined state as shown in FIG. 5, the rear portion of the wafer frame 3 rubs against the bottom of the groove 2 of the frame carrier 1, and dust is generated. Was the cause. In particular, when the wafer frame 3 is made of stainless steel and the frame carrier 1 is made of aluminum, the frame carrier 1 is easily shaved, and fine chips may adhere to the silicon wafer.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus for moving a wafer frame in which the wafer frame can be moved in a predetermined posture so as to eliminate generation of dust.

[Means for solving the problem]

An apparatus for moving a wafer frame according to the present invention is a wafer frame moving apparatus that attaches a wafer to a tape attached to an annular plate-shaped wafer frame at an opening in an annular portion of the wafer frame, At least one first fulcrum member engaged with the lower surface of the annular portion of the wafer frame at the first position, and movable from above to below on the upper surface of the annular portion of the wafer frame at the second position. A second fulcrum member engaged with the first fulcrum member and a supporting means movable to support the first fulcrum member and the second fulcrum member, wherein the first position is deeper than the second position. It is characterized by being provided on the side.

(Operation)

In the above configuration, the first fulcrum member and the second fulcrum member are different in the first position and the second position when viewed from a line extending from the outer edge to the inner side of the annular portion of the wafer frame. Engages. When viewed from the whole of the wafer frame, the first position and the second position are the first fulcrum member and the second fulcrum member.
Is located at a position deviated to the front edge side with respect to the insertion direction of the fulcrum member, but the first position is located on the inner side of the second position. Accordingly, when the first fulcrum member is engaged with the lower surface of the wafer frame at the first position, the front portion of the wafer frame is lifted from the first position and the rear portion hangs down. When the second fulcrum member is engaged with the upper surface of the wafer frame while moving downward from above at the second position before the first position, the wafer frame pivots about the first fulcrum member as a fulcrum. Then, the rear portion is lifted to take a predetermined posture. As a result, the wafer frame and the wafer attached thereto can be moved without rubbing against other members.

〔Example〕

1 and 2 show an apparatus for moving a wafer frame according to an embodiment of the present invention, and FIG. 3 shows a frame carrier for loading the wafer frame.

1 to 3, a wafer frame 10 is an annular plate frame having a circular or rounded square shape, and an adhesive tape 12 corresponding to the outer shape of the wafer frame 10 is attached to the wafer frame 10. A silicon wafer 14 is placed at the center of the sheet. The silicon wafer 14 is fixed by the adhesive force of the adhesive tape 12. For example, the silicon wafer 14 can be subjected to a dicing process together with the wafer frame 10, and in this case, the adhesive tape is used at the original position without the cut silicon chips being separated.
It is kept at 12. The wafer frame 10 includes reference slits 10a and 10b that engage with positioning pins (not shown) in a dicing process or the like.

In FIG. 3, the frame carrier 16 has two side plates 1.
8 and 20 are connected by a plurality of cross rods 22. A plurality of parallel grooves 24 are provided on the inner surface of each of the side plates 18 and 20, and the opposing side edges of the wafer frame 10 are inserted into the grooves 24 on both sides. The size of the wafer frame 10 is 212 mm in diameter (or one side) and 1.2 mm in thickness. On the other hand, the pitch between the grooves 24 is 4.76 mm, and the gap between the upper and lower wafer frames 10 when supported by the frame carrier 16 is 3.56 mm. This is because, for example, when the wafer frame 10 is gripped by a nail, the thickness of the nail is 3.56.
mm or less (if the vertical movement of the claw is much smaller than that), it is difficult to insert the claw deep into the frame carrier 16 so that it engages with the front edge of the frame carrier 16 That means you have to. The cross section of each groove 24 is substantially V-shaped, the bottom is horizontal, and the width of the V opening, which is the maximum opening, is 3 mm. Accordingly, the maximum allowable lifting amount of the wafer frame 10 in each groove 24 is 1.8 mm (it becomes even smaller at the portion where V is tightly fitted). Therefore, when moving the wafer frame 10 supported by the frame carrier 16, it is substantially difficult to grasp the wafer frame 10 and lift it upward to some extent, and then move in the horizontal direction.

1 and 2, the apparatus for moving the wafer frame 10 according to the present invention is suitable for taking out the wafer frame 10 at an arbitrary position from the frame carrier 16. This moving device has a support plate 32 attached to a support arm 30, and connects the support arm 30 to a driving source such as an air cylinder (not shown). From the outer edge to the inner side (arrow A) or vice versa. The support plate 32 has a width substantially equal to the diameter (or one side) of the wafer frame 10.

On the support plate 32, three fulcrum members 34, 36, 38 are attached in the direction of movement A. Two outer fulcrum members 34 and 36 are located near each end of the support plate 32, respectively, and a central fulcrum member 38 is attached to the center of the support plate 32. When this moving device is used to remove the wafer frame 10 from the frame carrier 16 in FIG. 3, the outer fulcrum members 34, 3
6 engages with the rounded portion of the annular portion of the wafer frame 10 at a position slightly inward of the side plates 18 and 20 of the frame carrier 16, and the central fulcrum member 38
To be engaged with the front central portion of the annular portion. The outer fulcrum members 34 and 36 are longer than the central fulcrum member 38, and the outer fulcrum members 34 and 36 are engaged with the wafer frame 10 at a position deeper than the central fulcrum member 38. become. The outer fulcrum members 34 and 36 are the wafer frame 1
The outer fulcrum members 34 and 36 and the central fulcrum member 3 are configured to engage with the rounded portion of the
8 can be engaged with the front edge of the wafer frame 10 without being inserted deeply between the upper and lower wafer frames 10.

Further, the outer fulcrum members 34 and 36 are
And the center fulcrum member 38 is attached to the wafer frame.
It is designed to engage with the upper surface of 10. The support plate 32 is provided with a hole 40 penetrating in the front-rear direction. The central fulcrum member 38 is disposed through the hole 40, and a fixing portion 32 fixed to the support plate 32 is provided at a rear portion thereof.
It is pivotally connected to a by a pivot pin 42. A drive means 44 such as an air cylinder or a solenoid actuator is attached to the support plate 32, and an operating portion of the drive means 44 is engaged with a central fulcrum member 38. Usually, the central fulcrum member 38 is attached to the support plate 32. To a raised position at a small angle to the wafer frame 10
The center fulcrum member 38 is moved downward from above by a predetermined stroke.

Further, the support plate 32 is provided with a stopper 46 at a position below the center fulcrum member 38.
Is the same position as the support plate 32 and the wafer frame 10
To be engaged with the lower surface of the. The outer fulcrum members 34 and 36 are each made of a round bar, and are attached to the support plate 32 so that the position in the length direction can be adjusted. By forming the outer fulcrum members 34 and 36 with round bars, the strength when supporting the considerably heavy wafer frame 10 is provided. The central fulcrum member 38 and the stopper 46 are made of a plate material. The round bar forming the outer fulcrum members 34, 36 has an upper half that is flattened from the step surfaces 34a, 36a at the tip end, and has a tapered taper on the lower surface. Step surface
34a and 36a are inclined corresponding to the roundness of the annular portion of the wafer frame 10.

Next, referring to FIG. 4A to FIG.
The operation of taking out the wafer frame 10 from the frame carrier 16 shown in the figure will be described.

As shown in FIG. 4A, the outer fulcrum members 34 and 36 and the central fulcrum member 38
Is inserted into. As shown in FIG. 4B, the positions where the outer fulcrum members 34 and 36 engage with the lower surface of the wafer frame 10 and the central fulcrum member 38 engages with the upper surface of the wafer frame 10 (see FIG. 2). Position shown). At this time, the central fulcrum member 38 is in the raised position and does not substantially contact the wafer frame 10, and the outer fulcrum members 34, 36
Raises the front part of the wafer frame 10 slightly and makes the rear part inclined to the bottom of the groove 24.

As shown in FIG. 4C, the driving means 44 is actuated to move the central fulcrum member 38 from above to below by a predetermined stroke. Then, the central fulcrum member 38 is engaged with the upper surface of the wafer frame 10 while moving downward from above,
The wafer frame 10 turns around the outer fulcrum members 34 and 36 as a fulcrum, and the rear portion is lifted to take a predetermined posture parallel to the groove 24. Then, the outer fulcrum members 34 and 36 and the central fulcrum member 38 can be moved in the direction opposite to the arrow A to take out the wafer frame 10 from the frame carrier 16 and carry it to a desired position. Therefore, the wafer frame 10 and the silicon wafer 14 attached thereto
Can be moved without substantially rubbing the groove 24,
In addition, any wafer frame of the frame carrier 16
10 can be taken out arbitrarily. When the stopper 46 facing the center fulcrum member 38 is provided, the wafer frame 10 is sandwiched between the center fulcrum member 38 and the stopper 46, and the wafer frame 10 takes a predetermined posture. It is possible to move while reliably maintaining the state.

〔The invention's effect〕

As described above, according to the present invention, at least one first fulcrum member engaged with the lower surface of the first position of the annular portion of the wafer frame, and the second position of the annular portion of the wafer frame. A second fulcrum member movably engaged with the upper surface of the first fulcrum member from above to below, and support means movable to support the first fulcrum member and the second fulcrum member. Since the position is provided on the inner side with respect to the second position, the wafer frame is pivoted with the first fulcrum member as a fulcrum, and the rear portion is lifted to take a predetermined posture. And thus can be moved without rubbing against other members.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a moving device and a wafer frame according to an embodiment of the present invention, FIG. 2 is a perspective view similar to FIG. 1 showing a position where the wafer frame is gripped by the moving device, and FIG. FIGS. 4A to 4C are perspective views showing a frame carrier, FIGS. 4A to 4C are explanatory views for explaining the operation of the apparatus shown in FIG. 1, FIG. 5 is a view showing a conventional moving apparatus, and FIG. FIG. 10 ... wafer frame, 12 ... tape, 14 ... silicon wafer, 16 ... frame carrier, 24 ... groove, 32 ... support plate, 34, 36 ... outer fulcrum member, 38 ... center A fulcrum member, 44 ... driving means, 46 ... stopper.

Claims (4)

(57) [Claims] An apparatus for moving a wafer frame, wherein a wafer (14) is attached to a tape (12) attached to an annular plate-like wafer frame (10) at an opening in an annular portion of the wafer frame. And at least one first fulcrum member (34, 36) engaging with a lower surface of the annular portion of the wafer frame at a first position, and an upper surface of the annular portion of the wafer frame at a second position. A second fulcrum member (38) movably engaged with the first fulcrum member and the second fulcrum member from above to below;
2) The apparatus for moving a wafer frame, wherein the first position is provided on the inner side of the second position. 2. The wafer according to claim 1, wherein said supporting means is provided so as to be movable from an outer edge of said annular portion of said wafer frame to an inner side or from the inner side to an outer edge substantially in parallel with said wafer frame. Frame moving device. 3. The support means has substantially the same width as the wafer frame, the second fulcrum member is mounted at a central portion of the support means, and the at least one first fulcrum member is respectively mounted on the support means. Two first ones located near each end of the support means
And the two first fulcrum members are the second fulcrum members.
The wafer frame moving device according to claim 2, wherein the wafer frame moving device is located at a position extending beyond the fulcrum member. 4. The wafer according to claim 1, wherein a third fulcrum member for supporting the lower surface of the wafer frame at the second position in opposition to the second fulcrum member is provided on the support means. Frame moving device.