JP2828051B2 - Wire bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus, and more particularly, to preventing the occurrence of product failure due to mismatch between the type of wire and the type of semiconductor product to be bonded and improving the reliability of the semiconductor product. Along with
The present invention relates to a wire bonding apparatus that reduces work load and work time associated with a change in the type of wire and improves productivity.

[0002]

2. Description of the Related Art Generally, in a process of assembling a semiconductor product, wire bonding for connecting a connection electrode of a semiconductor chip and an external lead terminal of a package with a bonding wire is performed. For example, as shown in FIG. 7, a conventional wire bonding apparatus used in this wire bonding includes an XY table 4 movable in two orthogonal horizontal axes, and a bond head 5 provided on the XY table 4.
And a hollow tool 6 held by the bond head 5 so as to be able to move up and down in the direction of the arrow. Then, a wire 1 having a diameter of about 20 to 30 μm, which is made of a material such as gold or copper to which a small amount of an additive such as beryllium is added, is led out from the tip of the tool 6 and is connected to the electrode pad 8 on the semiconductor chip 7 and the outside. Wiring between the lead terminals 9 is performed by a connection technique such as a thermocompression bonding method or an ultrasonic compression bonding method.

[0003] A wire 1 is wound around a spool 2. The spool 2 is rotated by a wire feeder 3 provided above the bond head 5, whereby
The wire 1 is paid out to the tip of the tool 6.

There are various types of wires 1 depending on differences in wire diameter, material, processing method, and the like. Wires suitable for characteristics required from the layout of the semiconductor chip 7 and the external lead terminals 9 that differ depending on the type of semiconductor product. 1 is appropriately selected and used.

For example, as shown in FIG. 8 (A), for a product type in which the distance between wirings is large and each wiring is adjacent to each other, a thick wire having a characteristic that horizontal bending is unlikely to occur after wiring is used. A wire 1a made of a hard material is selected, while a wire 1b having a small wire diameter and an inexpensive type is selected for a kind as shown in FIG. Different types of wires are used.

When the type of the wire 1 is changed in accordance with the type change of the semiconductor product, replacement is performed for each spool 2 around which the wire 1 is wound. For example, as shown in FIG. 9, the operator first reads the display contents of the label 11 attached to the case 10 accommodating the spool 2 and replaces the type of the wire 1 described in the display contents, as shown in FIG. Is confirmed to conform to the type of the semiconductor product, the spool 2 is taken out of the case 10 and the spool 2 is attached to the wire feeder 3.

In Japanese Patent Application Laid-Open No. 63-69242, a spool support for mounting a plurality of spools, a wire detecting device for detecting the presence or absence of a wire supplied from the spool, and no wire being detected by the wire detecting device. A wire bonding apparatus is disclosed that includes a spool exchange table that automatically switches to a spool mounted as a spare when it is detected, and a wire guide that guides a wire to a tool. Since this wire bonding apparatus can automatically perform a spool exchange operation, the exchange time can be reduced.

[0008]

As shown in FIG. 9, in a conventional spool replacement operation, an operator reads the display content of a label 11 attached to a case 10, and the display content of the label 11 is changed to the type of semiconductor product. It is necessary to judge whether or not the wire conforms to the above. Therefore, it is easy for an operator to erroneously select a wire of a type inappropriate for the kind of the semiconductor product, and as a result, there is a possibility of causing a product defect. For example, as shown in FIG. 8C, when a wire 1c having a small wire diameter that is difficult to maintain the linearity is erroneously selected for a type in which the distance between the wires is large and the wires are adjacent to each other. This causes the occurrence of product defects such as short-circuit due to contact between the wires 1c after wiring.

In the wire bonding apparatus disclosed in Japanese Patent Application Laid-Open No. 63-69242, the operation of replacing the spool is automatically performed. However, when a different type of wire is used as appropriate, the operator must confirm the operation. As a result, a product defect may occur due to an incompatibility between the type of wire and the semiconductor product.

In order to prevent the above problems, it is necessary to carefully check the compatibility between the type of wire and the type of semiconductor product. However, even if the wire is observed with the naked eye, it is difficult to determine a difference in material such as an additive type or a difference in wire diameter of about 20 to 30 μm. In addition, the confirmation work requires specialized knowledge that serves as a criterion, and even if this knowledge is supplemented by a document such as a prepared comparison table,
In recent years, where the frequency of changing the type of wire is increasing along with the production of small-quantity, high-mix products of semiconductor products, the burden on the operator for the confirmation work is large, and the operator requires a great deal of labor and time. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and prevents the occurrence of product failure due to mismatch between the type of wire and the type of semiconductor product to be bonded, thereby improving the reliability of the semiconductor product. In addition, an object of the present invention is to provide a wire bonding apparatus that reduces the work load and work time involved in changing the type of wire and improves productivity.

[0012]

According to the present invention, there is provided a wire bonding apparatus comprising: a spool on which a wire is wound; a wire sending mechanism for sending the wire from the spool; and information provided on the spool and recording information about the wire. A medium, information reading means provided in the wire sending mechanism for reading information recorded on the information medium, storage means for storing information on a semiconductor product to be bonded, and reading from the information medium by the information reading means. Control means for comparing the obtained information on the wire with the information on the semiconductor product stored in the storage means and determining whether or not the wire is compatible.

According to the present invention, the spool is attached to the wire sending mechanism, the information reading means provided in the wire sending mechanism reads information on the wire recorded on the information medium provided on the spool, and the read information is read. The control means automatically determines whether or not is compatible with the information on the semiconductor product stored in the storage means. Therefore, the operator can easily correct the determination error regarding the compatibility, so that it is possible to prevent the occurrence of product failure due to the mismatch between the type of the wire and the type of the semiconductor product to be bonded.

Further, the operator can easily confirm the type of the wire and the like simply by attaching the spool to the wire feeding mechanism, so that the work load and the work time involved in changing the type of the wire can be reduced.

The information medium is, for example, a bar code or a magnetic tape.

When the control means determines that the information on the wire read from the information medium by the information reading means and the information on the semiconductor product stored in the storage means do not match, a warning means for issuing a warning is provided. Thus, the operator can easily detect and correct a determination error regarding suitability.

The spool has a cylindrical body around which the wire is wound around the outer circumference, the wire feeding mechanism includes a holding arm rotatably attached to the inner surface of the body of the spool, and the information reading means includes a spool. Is preferably provided at a position facing the information medium when the is held by the holding arm.

[0018] The information transmitting means may be provided in the wire sending mechanism and may have information writing means for writing information relating to the wire use history and the like to the information medium.

[0019]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a configuration diagram schematically illustrating a wire bonding apparatus according to a first embodiment of the present invention, and FIG. 2 is a detailed configuration of a wire feeder and a spool in the wire bonding apparatus according to the first embodiment of the present invention. FIG.

As shown in FIG. 1, a wire bonding apparatus A according to a first embodiment of the present invention includes a main body 16 having a leg 16a, a spool 2 around which the wire 1 is wound, and a wire 1 sent out from the spool 2. A XY table 4 movable in two orthogonal horizontal axis directions;
A bond head 5 provided on the Y table 4, a hollow tool 6 held by the bond head 5 so as to be able to move up and down,
Having.

The wire 1 is made of a material obtained by adding a trace amount of an additive such as beryllium to a metal such as gold or copper.
The spool 2 is made of a thin metal wire of about 30 μm.
It is wound about 5000 m.

As shown in FIG. 2, the spool 2 has a cylindrical body 2b in which a through hole 2a is formed and in which the wire 1 is wound outside, and a side plate 2c attached to an end of the body 2b. Have. On the side plate 2c of the spool 2,
A barcode label 12 on which information indicating the type of the wire 1 is described is attached.

The wire feeder 3 has two holding arms 1 for detachably holding the inner surface of the through hole 2a of the spool 2.
3, a disk-shaped back plate 14 made of a transparent resin material attached to the base end of the holding arm 13 and rotating the spool 2 together with the holding arm 13, and a bar code formed by transmitting and receiving a laser beam transmitted through the back plate 14. A bar code reader 15 that reads a pattern signal of the label 12 and converts it into information is provided. The barcode reader 15 is provided at a position facing the barcode label 12 when the spool 2 is held by the holding arm 13.

The wire bonding apparatus A of the present invention further has a control mechanism 17 provided inside the main body 16 for managing the wire bonding operation. This control mechanism 1
Reference numeral 7 denotes a RAM 19 which stores the type information of the semiconductor product which is the current product to be bonded and which can be rewritten to another type information at the time of type change, and a tool 6 which stores the type information according to the type information stored in the RAM 19. It comprises a CPU 18 for controlling a moving position, a pressing force and the like. Note that the product type information includes information on the connection type such as the product type name, wiring position coordinates, and pressure of the semiconductor product, as well as information on the type of wire conforming to the product type. At the top of the main body 16, a television monitor 20 for displaying type information and a warning when bonding is abnormal is provided.

Next, the wire bonding apparatus A of the present invention
1 will be described with reference to FIGS. When the type of the wire 1 is changed in accordance with the type change of the semiconductor product, first, an operator sets the spool 2 around which the wire 1 is wound.
Is attached to the wire feeder 3.

After this operation, the CPU 18 of the control mechanism 17
Drives the wire feeder 3 while detecting the presence or absence of a barcode signal with the barcode reader 15 to rotate the spool 2, and the position of the barcode label 12 attached to the spool 2 is set to the front of the barcode reader 15. Moving.

Next, the CPU 18 reads information on the type of the wire 1 written on the bar code label 12 using the bar code reader 15 and matches the type of the wire included in the type information of the semiconductor product stored in the RAM 19. Is compared with information on the type of wire 1 to be changed.

As a result of the comparison, if it is determined that there is a difference between the information on the types of the wires 1, the CPU 18 displays a warning on the television monitor 20 to urge the operator to change the type of the wires 1. The operator replaces with another spool 2 based on the display on the television monitor 20.

If it is determined that the information on the types of both wires 1 match, the wire bonding operation is performed as usual. That is, the spool 2 is rotated by the wire feeder 3, whereby the wire 1 is paid out to the tip of the tool 6. And the wire 1 is
It is led out from the tip of the tool 6, and is wired between the electrode pads on the semiconductor chip and the external lead terminals by a connection technique such as a thermocompression bonding method or an ultrasonic compression bonding method.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a configuration diagram schematically showing a wire bonding apparatus according to a second embodiment of the present invention. FIG. 5 is a detailed configuration of a wire feeder and a spool in the wire bonding apparatus according to the second embodiment of the present invention. FIG.

As shown in FIG. 5, in the wire bonding apparatus B according to the second embodiment of the present invention, information indicating the type and usage history of the wire 1 is stored on the inner surface of the body 2b of the spool 2 around which the wire 1 is wound. The described magnetic tape 21 is attached. The wire feeder 3 that feeds out the wire 1 by rotating the spool 2 has a spool 2.
Holding arm 13 having a function of detachably holding the
A back plate 14 for rotating the spool 2 together with the holding arm 13 is provided, and a magnetic head 22 for inputting and outputting information to and from the magnetic tape 21 is provided at a position where the rotation of the back plate 14 and the holding arm 13 is not hindered. Fixed.

Further, as shown in FIG. 4, in the wire bonding apparatus B of the present invention, a control mechanism 17 provided inside the main body 16 for managing the wire bonding operation.
Is a RAM 19 which stores the type information of the semiconductor product which is the current bonding target type and which can be rewritten to another type information when the type is exchanged, and the moving position of the tool 6 according to the type information stored in the RAM 19. It comprises a CPU 18 for controlling pressure and pressure, and a clock timer 23 having a clock function and transmitting a time signal. It should be noted that the type information includes information on the type of wire suitable for the type.

On the upper part of the main body 16, a television monitor 20 for displaying type information, warnings and the like is provided.

Next, the wire bonding apparatus B of the present invention
Will be described with reference to FIGS. In the wire bonding apparatus B of the present invention, each time the wire 1 is used for the bonding operation, the CPU 18 of the control mechanism 17 controls the magnetic head 22 and attaches a signal on the use date and time from the clock timer 23 to the spool 2. The information is written on the magnetic tape 21 as information on the usage history of the wire 1.

When the type of the wire is changed in accordance with the type change of the semiconductor product, the wire bonding apparatus A of the present invention is used.
After the worker attaches the spool 2 to the wire feeder 3, the CPU 18 of the control mechanism 17
A comparison is made between the information on the type of wire conforming to the product type included in the product type information of the semiconductor product stored in M19 and the information on the type of wire 1 read from the magnetic tape 21 using the magnetic head 22. As a result, when it is determined that there is a difference between the two wire types, a warning is displayed on the television monitor 20 to prompt the user to change the type of the wire 1.

In the bonding apparatus B of the present invention,
At the same time as the operation of determining the suitability of the type of the wire 1,
The CPU 18 uses the magnetic head 22 to read information about the usage history of the wire 1 written on the magnetic tape 21 and displays the information on the television monitor 20.

The operator can easily and reliably manage the usage history of the wire 1 by checking the display on the television monitor 20. As a result, even when wires made of a material such as copper, which is liable to cause a product failure such as wiring non-adhesion due to oxidation when used for a long period of time, sufficient management can be performed, thereby improving the reliability of semiconductor products. Can be done.

[0038]

According to the present invention, a spool is attached to a wire sending mechanism, and information about a wire recorded on an information medium provided on the spool is read by information reading means provided in the wire sending mechanism, and the reading is performed. The control means automatically determines whether or not the information matches the information on the semiconductor product stored in the storage means. Therefore, the operator can easily correct the determination error regarding the compatibility, so that it is possible to prevent the occurrence of product failure due to the mismatch between the type of the wire and the type of the semiconductor product to be bonded. As a result, the reliability of the semiconductor product can be improved.

Further, since the operator can easily confirm the type of the wire and the like simply by attaching the spool to the wire feeding mechanism, the work load and the work time involved in changing the type of the wire can be reduced. As a result, work efficiency is improved, and productivity of the wire bonding apparatus can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram schematically showing a wire bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a detailed configuration of a wire feeder and a spool in the wire bonding apparatus according to the first embodiment of the present invention.

FIG. 3 is a flowchart showing an operation of the wire bonding apparatus according to the first embodiment of the present invention.

FIG. 4 is a configuration diagram schematically showing a wire bonding apparatus according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing a detailed configuration of a wire feeder and a spool in a wire bonding apparatus according to a second embodiment of the present invention.

FIG. 6 is a flowchart showing an operation of the wire bonding apparatus according to the second embodiment of the present invention.

FIG. 7 is a perspective view showing a conventional wire bonding apparatus.

FIG. 8 is a plan view showing an example of a method of selecting a wire type for a type of a semiconductor product.

FIG. 9 is a flowchart showing an operation of replacing a wire in a conventional wire bonding apparatus.

[Description of References] A: Wire bonding apparatus according to a first embodiment of the present invention B: Wire bonding apparatus according to a second embodiment of the present invention 1: Wire 2: Spool 3: Wire feeder (wire feeding mechanism) 4: XY table 5: Bond head 6: Tool 7: Semiconductor chip 8: Electrode pad 9: External lead terminal 10: Case 11: Label 12: Bar code label (information medium) 13: Holding arm 14: Back plate 15: Bar code reader (information 16: body 17: control mechanism (control means) 18: CPU 19: RAM (storage means) 20: television monitor 21: magnetic tape (information medium) 22: magnetic head (information reading means) 23: clock timer

Claims (6)

(57) [Claims] 1. A spool on which a wire is wound, a wire sending mechanism for sending the wire from the spool, an information medium provided on the spool and recording information on the wire, and a spool provided on the wire sending mechanism. Information reading means for reading information recorded on the information medium, storage means for storing information on a semiconductor product to be bonded, information on wires read from the information medium by the information reading means and stored in the storage means A wire bonding apparatus comprising: control means for comparing the information on the semiconductor product and determining whether or not the semiconductor product is compatible. 2. The wire bonding apparatus according to claim 1, wherein the information medium is a bar code. 3. The wire bonding apparatus according to claim 1, wherein said information medium is a magnetic tape. 4. A warning is issued when the control unit determines that the information on the wire read from the information medium by the information reading unit and the information on the semiconductor product stored in the storage unit do not match. 4. The method according to claim 1, further comprising a warning unit.
The wire bonding apparatus according to any one of the first to third aspects. 5. The spool includes a cylindrical body around which a wire is wound around an outer periphery, and the wire feeding mechanism includes a holding arm rotatably attached to an inside surface of the body of the spool. The wire bonding apparatus according to any one of claims 1 to 4, wherein the information reading unit is provided at a position facing the information medium when the spool is held by the holding arm. . 6. The information processing apparatus according to claim 1, further comprising an information writing unit provided in said wire sending mechanism and for writing information on a wire to said information medium.
The wire bonding apparatus according to any one of the first to third aspects.