JP2836035B2 - Electrical connection - Google Patents

Description

BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention is, facing the electrode unit及
Between the conductive particles between the non-electrode portions facing each other.
A gas insulating material is formed, and the facing electrode portion is
The present invention relates to an electrical connection formed by conductive particles . [0002] As a conventional anisotropic conductive material for electrical connection,
For example, as shown in FIG. 4A, there is a film formed by dispersing conductive fine particles 1 such as metal or low-melting solder in a dispersion medium made of an insulating material 2 and forming a film. As shown in the drawing, when two substrates 5 to which electrodes 4 having a predetermined pattern are adhered are connected to each other, the above-described anisotropic conductive material is sandwiched by the substrates 5 with the electrodes 4 inside. When the whole is pressurized and heated, the insulating film is melted and extruded from between the opposing electrodes 4, the electrodes 4 are electrically connected by the conductive fine particles 1, and the substrates 5 are extruded from each other. Connected by film 2, FIG.
As shown in (b), two substrates are connected by an anisotropic conductive material. However, in the conventional anisotropic conductive material,
Because it is difficult to uniformly disperse conductive particles having a particle size of several μm order or less in a film, it is suitable for connection of high-resolution (10 / mm or more) multi-contact electrodes for IC mounting and the like. It could not be used (in the related art, the limit is 5 lines / mm (line space = 100 μm)). For example, to obtain a resolution of 20 lines / mm, the electrode pitch is 25 μm. For this reason, it is necessary to uniformly disperse the conductive particles having a particle size of several μm order or less uniformly in the film. According to the conventional technique, the collection of the conductive particles as shown in FIG. As a result, problems such as short-circuiting between adjacent electrodes due to mixing of large-diameter particles and occurrence of an insulation state due to no intervening conductive particles as shown in FIG. 1C occurred, and sufficient reliability could not be obtained. In addition, since the conventional anisotropic conductive film is in the form of a sheet or a tape, it is complicated such as (cutting) → (temporary attachment) → (temporary adhesion) → (separator peeling) → (circuit positioning) → (full adhesion). Since such a process requires a complicated process, it leads to a prolonged connection time, a reduced yield, and the like, which leads to an increase in cost. [0004] Further, as an anisotropic conductive material, Japanese Unexamined Patent Publication No. Sho 6 (1994) published after filing the original application of the present application.
Japanese Patent Application Laid-Open No. 2-40183 discloses a technique in which conductive particles are coated with a resin insoluble in an adhesive.
This anisotropic conductive material is obtained by mixing solder metal particles into a compounded resin composed of an epoxy resin and aminoethylpiperazine, curing the mixture, and then pulverizing the particles with a pulverizer, dispersing the particles in an adhesive, and forming a connection sheet. The connection sheet is placed on the electrode so as to overlap with the electrode, and the coating is broken by the pressing force to secure the electrical connection. However, in this technique, a mass obtained by blending a large amount of conductive particles with an electrically insulating resin is finely pulverized by a pulverizer, and the insulating resin remaining on and adhered to the surface of the conductive particles after the pulverization process is performed. Is used as an insulating coating of conductive particles, so that the surface of the conductive particles is often exposed during the pulverization process. When such particles are located adjacent to each other, not only conduction in the direction of the opposing electrode, but also undesired particles In the adjacent direction. If the particles are arranged for the purpose of bonding between different adjacent electrodes, there is a problem that a short circuit occurs between the adjacent electrodes. For this reason, it is difficult to increase the arrangement density of the anisotropic conductive particles, and as a result, there is a problem in actually using for the electrical connection between the electrodes arranged at high density. In addition, the particle shape obtained by pulverization has a wide particle size distribution regardless of the shape of the conductive particles, and furthermore, because of the non-uniform shape, it is difficult to arrange at high density and uniform density, After all there is a problem in practical use. As materials relating to anisotropic conductive materials, “Electronic Technology”, 1984, Vol. 26, No. 7,
Contents described on page 7, "Nikkei Electronics" 1984
The contents are described in the July 16, 2016 issue, page 102. Japanese Patent Application Laid-Open No. 62-35410 published after the filing of the original application of the present application discloses an anisotropic conductive material for electrical connection using a chop in which conductive fibers are coated with a coating resin. It is disclosed that the conductive fiber has a predetermined diameter, and that the anisotropic conductive fiber is formed on a film while applying a shearing force. However, in this technique, since conductive fibers are used, when the orientation of the conductive fibers is not taken into consideration, there is a possibility that conduction may occur between adjacent electrodes. Was needed. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide an electrical connector capable of reliably connecting electrodes such as ICs arranged at high density. SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a method of forming an electrode between a facing electrode portion and a facing non-electrode portion.
Conductive particles of almost the same size are arranged in a single layer
On the other hand, between the facing electrode portion and the facing non-electrode portion.
An electrically insulating material is formed between the conductive particles.
The facing electrode portion is electrically connected by the conductive particles.
This is an electrical connection body . In addition, the present invention
Is the electrical connection body, wherein the electrical insulating material is
Is a film formed by coating the conductive particles.
You. Further, the present invention provides the electrically insulating material,
This is a film material formed by binding conductive particles . Note that the microencapsulated film in the present specification refers to a film formed so as to cover the entire core material by a microencapsulation method. In the process of the electrical connection of the present invention, heat and pressure are applied in a state in which anisotropic conductive particles are arranged between the electrodes, as described in JP-A-62-40183. Then, the electrically insulating material near the electrodes is removed from the surface of the conductive particles, and electrical connection is made between the electrodes via the conductive particles. In the electrical connection according to the present invention, the conductors having substantially the same particle size are used.
While the conductive particles are arranged in a single layer, the conductive particles face each other.
Insulation between the rotating electrode and the facing non-electrode
Substance is formed, and the facing electrode portion is formed into conductive particles.
More electrically conductive, and the electrically insulating material becomes conductive
It is composed as a coating of conductive particles.
The gas insulating material is a film material coated with conductive particles.
Therefore, the surface is almost equal with a coating of uniform thickness
The conductive particles have a particle size, and the particle size and the shape of the particles are uniform. For this reason, when particles are arranged on the electrode, the anisotropic conductive particles are arranged with high density and uniform density. In addition, since the electrical connection body of the present invention similarly uses conductive particles having a uniform shape and a uniform diameter, the conductive particles are dispersed in the film material at high density and uniform density. And, in the present invention, in order to have an electrically insulating film on the entire surface of the conductive particles,
Even if the particles are adjacent to each other, since an electrically insulating film always exists in the adjacent portion, the occurrence of a short circuit between the adjacent electrodes is prevented. Hereinafter, the anisotropically conductive particles for electrical connection and the anisotropically conductive material for electrical connection according to the present invention will be described in detail. FIG. 1 shows an embodiment of the present invention, and the same parts as those in FIG. 4 are denoted by the same reference numerals, and therefore, the duplicate description is omitted. Screen printing or spraying anisotropically conductive microcapsules (anisotropically conductive particles) 10, which are encapsulated by being encapsulated in a covering shell with an insulating substance 12 and microencapsulated, on a substrate 5 on which the electrodes 4 are provided. Forming an anisotropic conductive microcapsule layer that is closely arranged with the other substrate provided with another opposing electrode, and then heat-pressed to form an anisotropic conductive material that connects the electrodes. is there. Here, as shown in FIG. 2, an anisotropic conductive microcapsule (anisotropic conductive particles) 10 is composed of a core material (conductive particles) 11 and a single layer or multiple layers covering the core material 11. Film material (electrically insulating microencapsulated film)
12, the core material being enclosed by the coating material. As the core substance 11, gold, platinum, silver, copper,
Metals and metal compounds such as iron, nickel, aluminum, and chromium (ITO, solder, and the like), conductive inorganics and inorganic compounds such as conductive carbon, and conductive organic compounds such as organometallic compounds can be used. The coating material 12 may be a heat-insulating polymer such as phenol resin, urea resin, melamine resin, allyl resin, furan resin, polyester, epoxy resin, silicone resin, polyimide resin, polyurethane, or Teflon resin. Curable polymer, polyethylene, polypropylene, polybutylene, polymethyl methacrylate, polystyrene, acrylonitrile-styrene resin, styrene-butadiene resin, acrylonitrile-styrene-butadiene resin,
Vinyl resin, polyamide resin, polyester resin, polycarbonate, polyacetal, ionomer resin, polyether sulfone, poly (phenyl oxide), poly (phenylene sulfide), polysulfone, polyurethane, fluororesin (PTFE, PCTFE, polyvinylidene fluoride) ) And organic-inorganic compounds such as fibrous resins (ethyl cellulose, cellulose acetate, cellulose propionate, cellulose nitrate, etc.). The core material 11 is formed of such a film forming material 12.
Microencapsulation as a method of containing
Methods (eg, interfacial polymerization, in situ polymerization, curing in liquid coating, etc.) , as well as physical and mechanical manufacturing methods (eg, spray drying, air suspension coating, vacuum evaporation coating, electrostatic coating) Coalescence method, melting dispersion cooling method, inorganic encapsulation method) ,
Alternatively, it is performed by a physicochemical production method (for example, a coacervation method, an interfacial precipitation method, etc.). The coating material 12 for encapsulating and microencapsulating the core material 11 not only functions as an insulating material but also reduces the film thickness coated on the surface of the core material 11 by applying heat and pressure. 5 has a function of adhering the electrodes 4 formed on each other. Film substance 1
2 is used for insulation, adhesion, and slip (by appropriately adjusting the slip between the anisotropic conductive microcapsules, it becomes easy to form a single layer when applied to the lower substrate) by multiplexing. Functions can be divided to improve reliability. Next, the formation of an anisotropic conductive material will be described with reference to FIGS. 1 (a) and 1 (b), taking connection of a substrate as an example. The anisotropic conductive microcapsules 10 as prepared in FIG.
μm (a value determined from the requirement of a resolution of 20 lines / mm), and this is applied to a predetermined portion of the lower electrode substrate 5 by screen printing or spraying (shown in FIG. 1A). Next, after aligning the upper electrode substrate 5 (or a flexible connector, an IC electrode pad, etc.), they are heat-pressed to reduce the thickness of the electric insulating film material 12 so that the electrode between the two substrates is formed as shown in FIG. ). As shown in FIG. 1B, when an electrical connection is made using the anisotropic conductive material according to the present invention, the anisotropic conductive material 10 having a uniform particle size exists uniformly on the substrate 5 and each Since the conductive material is covered with the insulating material, an insulating layer is always formed between the conductive fine particles, and an electrical short-circuit phenomenon does not occur between the conductive fine particles. Therefore, the conventional problem as shown in FIG. 5 does not occur. Therefore, both the reliability and the resolution can be improved. Note that the resolution is as follows:
Arbitrary values can be obtained by adjusting the particle diameter and the film thickness of the coating substance 12. Conventionally, when forming an anisotropic conductive film, an insulating film material and conductive particles are directly kneaded and then shaped into a sheet or a tape . Similarly, in the present invention, as shown in FIG. 3, the conductive particles are microencapsulated to form anisotropic conductive microcapsules 10, which are formed into a sheet-shaped or tape-shaped anisotropic conductive microcapsule 10 by a roller 15 (or a heat roller or the like). Conductive films can be manufactured. As described above, the electrical connection of the present invention is
According to the continuum , since an electrically insulating microencapsulated film is provided on the entire surface of the conductive particles, even if the anisotropic conductive particles aggregate between adjacent electrodes, the conductive particles between adjacent anisotropic conductive particles are not removed. Since short-circuiting does not occur and the anisotropic conductive particles are arranged at high density and uniform density, it is possible to reliably electrically connect the electrodes arranged at high density.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing one embodiment of the present invention. FIG. 2 is a cross-sectional view of the microencapsulated anisotropic conductive particles according to the present invention. FIG. 3 is a diagram illustrating the production of an anisotropic conductive film according to the present invention. FIG. 4 is a diagram illustrating connection of electrodes using a conventional anisotropic conductive material. FIG. 5 is an explanatory view showing occurrence of a connection trouble due to a conventional material. [Description of Signs] 4 electrodes, 5 substrates, 10 anisotropic conductive microcapsules, 11 core materials, 12 coating materials.

Claims (1)

(57) [Claims] Nearly between the facing electrode part and the facing non-electrode part
While conductive particles of uniform size are arranged in a single layer,
Between the facing electrode portion and the facing non-electrode portion.
An electrically insulating material is formed between the conductive particles, and
That the conductive electrode part conducts by the conductive particles
Connection. 2. The electrically insulating material covers the conductive particles.
The electrical connection according to claim 1, wherein the electrical connection is a film formed by: 3. The electrically insulating substance binds the conductive particles.
The electrical connector according to claim 1, wherein the electrical connector is a film material.