JP2836918B2 - Adhesive coating device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for applying an adhesive which is used when a minute electronic component is mounted on an electronic circuit board.

[Prior Art] In recent years, electronic components have been further miniaturized and electronic circuit boards have been mounted at high density, and accordingly, an adhesive coating apparatus has been required to apply the adhesive quantitatively and accurately.

Hereinafter, an example of the above-mentioned adhesive application device will be described with reference to the drawings.

FIG. 4 is an overall schematic perspective view of a conventional adhesive application device. In FIG. 4, 26 holds a printed circuit board 27,
And a table part that can be positioned arbitrarily, 28 is an application nozzle part that applies an adhesive, and 30 is a table part that holds the printed circuit board 27
A loader unit 31 transports the printed board 27 to the unloader unit 31 that unloads the printed circuit board 27 from the table unit 26.

The operation of the adhesive application device configured as described above will be described.

The printed circuit board 27 is carried into the table unit 26 from the loader unit 30, and is positioned by the table unit 26 according to a program. At the position where the positioning is performed, the application nozzle unit 28 moves up and down to apply a fixed amount of adhesive on the printed circuit board 27. At this time, when a long time has elapsed since the last application, the application nozzle unit 28 may be clogged, or the first point or the first few points may be excessively applied. That is, it has been difficult to stably discharge a fixed amount of the adhesive from the beginning. Therefore, during actual application,
In order to prevent undercoating, before the actual coating operation is performed, throw away and apply
Had to do. Thereafter, the actual coating operation is performed according to the program, and after completion, the printed board 27 is carried out by the unloader 31.

[Problems to be Solved by the Invention] However, with the recent high-density mounting, the quality of printed circuit boards has become higher, such as finer patterns and multi-layer boards, and the cost of manufacturing printed circuit boards has risen. The extra space inside is disappearing. As a result, it is becoming difficult to perform a throwing operation on a printed circuit board as in the related art.

In addition, the printed circuit board differs in material, thickness, etc. depending on the purpose of use, but it has a roughly green system color,
On the other hand, the adhesive has a reddish color tone, and it is difficult to clearly determine and confirm the discarded applied portion on the printed board by visual observation or image processing. As a result, there is a problem that there are many mistakes in that the throw-out application portion and the adhesive application amount are wrong.

In addition, when performing throw-away coating on a printed circuit board,
In the meantime, the adhesive application device has a problem that the work efficiency is poor because the loading / unloading operation of the printed circuit board cannot be performed.

The present invention solves the above-mentioned conventional problems by allowing the application of a blanket ejection to a place other than the printed circuit board so that the adhesive can be stably applied at the time of mounting, An object of the present invention is to provide an adhesive applying apparatus which facilitates a work of confirming a hit applying section and an applied amount, and can maintain good working efficiency of the adhesive applying apparatus.

[Means for Solving the Problems] In order to achieve the above object, the adhesive application apparatus of the present invention includes at least a table section that can hold a printed board and can be positioned at an arbitrary position, and an adhesive application nozzle section. An apparatus for applying an adhesive for fixing an electronic component on a printed circuit board, the apparatus further comprising a throw-off application tape section having a mechanism for feeding the table section with a tape.

In the above-mentioned apparatus, the throw-away coating tape section has a mechanism for elevating and lowering, the upper limit is located at the same height as the substrate, and the lower limit is located at least at a height at which the substrate can pass, and the printing on the table section is performed. It is preferable that the adhesive is thrown away from the adhesive application nozzle portion while the substrate is being conveyed, and that when the new substrate passes through the position of the throw-away coating tape portion, the throw-away coating tape portion descends.

[Operation] According to the configuration of the present invention, since the throw-away coating is performed not on the printed board but on a dedicated throw-off coating tape, there is no need to provide an extra space on the printed board. Manufacturing costs can be reduced. Further, the adhesive can be stably applied at the time of mounting.

Further, according to the preferred configuration of the present invention, since the throw-away coating tape portion has a tape feed mechanism, it is possible to continuously perform throw-away coating, and has the lifting mechanism, It does not hinder the transfer operation of the printed circuit board.

Furthermore, according to the preferred configuration of the present invention, while the printed circuit board on the table section is being conveyed, there is provided a means for throwing away the adhesive from the adhesive application nozzle section onto the application tape section and throwing it away. , Glue throw-off application,
Since the loading and unloading operations of the printed circuit board can be performed simultaneously in parallel, the work efficiency can be improved.

[Embodiment] An adhesive application device according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view of an adhesive application device according to the present embodiment.

In FIG. 1, reference numeral 1 denotes a table which can hold the printed circuit board 2 and can be positioned at an arbitrary position, 3 denotes an application nozzle having an adhesive application nozzle, 4 denotes a tape application tape, and 5 denotes a printed circuit board. A loader unit 6 that carries in the table unit 1 and an unloader unit 6 that carries out the printed circuit board 2 from the table unit 1.

FIG. 2 is a side view of the table unit 1 of the adhesive application device. The table unit 1 is formed on a frame 7 and is positioned at an arbitrary position in the Y direction.
And an X table 9 positioned at an arbitrary position in the X direction. On the X table 9, a shaft 11 fixed to the X table 9 and a frame 10 guided by a sliding bearing 12 are vertically movable. Here, the cam surface 21 of the frame 10
And the roller follower 13 are in contact with each other, and the frame 10 is moved up and down by moving an air cylinder 14 fixed to the X table 9. The discarding application tape 15 is wound on a reel 18 via a roller 17 from a reel 16 installed on the frame 10, and the reel 18 is rotated by a motor 19 via a belt 20 to form the discarding tape 15. Feeding and winding.

The operation of the adhesive coating apparatus configured as described above will be described below with reference to FIGS.

FIG. 3 is a schematic plan view of the adhesive application device of the present invention as viewed from above. In FIG. 3, the printed circuit board 23 is on standby in the loader unit 5, and in this state, the air cylinder
The frame 10 is raised by the extension of 14 and the roller follower 13 pressing the cam surface 21, and the tape surface 22 of the throw-away coating tape 15 is flush with the printed circuit board 2. On the tape surface 22, the coating nozzle portion 3 performs a throw-off coating operation, and then is wound up by the reel 18 by the rotation of the motor 19, and the tape is fed. This is repeated once or several times until the discard application is completed. Then frame 10 descends,
The printed circuit board 23 is carried into the table unit 1 from the loader unit 5. Printed circuit board 24 held on table 1
Is actually applied according to the program. The printed circuit board 24 after the actual application is carried out by the unloader unit 6. This is the printed circuit board 25.

Here, the adhesive application apparatus of the present embodiment performs the discard application while the printed circuit board 24 on the table unit 1 is being conveyed onto the unloader unit 6, and the printed circuit board waiting in the loader unit 5 after completion. 23 is carried in.

According to the present embodiment, the tape for dispensing and coating applied on the table is moved up and the coating head is displaced and driven at the same height as the printed circuit board. Is fed by a feed mechanism, and after the end of the throwing-out application, the actual application is performed, and then the throwing-out application tape portion descends to carry in / out the printed circuit board.

As described above, in the adhesive application apparatus of the present embodiment, a table section that holds a printed board and can be positioned at an arbitrary position, an application nozzle section having an adhesive application nozzle, and an elevating operation on the table section. Since it is composed of a tape for dispensing application having a tape feed mechanism, an extra space is provided on the printed circuit board in order to perform the disposal and application on a dedicated tape for dispensing rather than on the printed circuit board. There is no necessity and there is an advantage that the cost of manufacturing a printed circuit board can be reduced. Also,
Since the throw-away coating tape section has a tape feed mechanism, it is possible to continuously perform throw-away coating,
With the lifting mechanism, there is an effect that the transfer operation of the printed circuit board is not hindered.

Generally, the adhesive for fixing electronic components has a red system in many cases, and using a discard coating tape in a white system has an effect of increasing the contrast and facilitating confirmation by visual observation or image processing recognition.

In the adhesive application apparatus of the present embodiment, since the throw-out application operation is performed during the transfer of the printed circuit board, the application operation of the entire apparatus is fast and the work efficiency is high.

[Effects of the Invention] As described above, according to the present invention, since the throw-away coating is performed not on the printed board but on the dedicated throw-off coating tape, there is no need to provide an extra space on the printed board. An excellent effect that the cost of manufacturing a printed circuit board can be reduced can be achieved. Further, when mounting the components on the printed circuit board, the adhesive can be stably applied.

Further, according to the preferred configuration of the present invention, since the throw-away coating tape portion has a tape feed mechanism, it is possible to continuously perform throw-away coating, and has the lifting mechanism, There is an effect that the transfer operation of the printed circuit board is not hindered.

Furthermore, according to the preferred configuration of the present invention, while the printed circuit board on the table section is being conveyed, there is provided a means for throwing away the adhesive from the adhesive application nozzle section onto the application tape section and throwing it away. , Glue throw-off application,
Since the loading and unloading operations of the printed circuit board can be performed simultaneously in parallel, there is an effect that the working efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of an adhesive application apparatus according to one embodiment of the present invention, FIG. 2 is a side view of a table section in FIG. 1, FIG. 3 is a schematic plan view of FIG. 1 is a schematic perspective view of a conventional adhesive coating device. DESCRIPTION OF SYMBOLS 1 ... Table part, 2 ... Printed circuit board, 3 ... Application nozzle part, 4 ... Discard application tape part, 5 ... Loader part, 6 ... Unloader part, 7 ... Frame, 8 ...
Y table, 9 ... X table, 10 ... frame, 11 ...
... Shaft, 12 ... Sliding bearing, 13 ... Roller follower,
14 …… Air cylinder, 15 …… Punching tape, 16
... reel, 17 ... roller, 18 ... reel, 19 ... motor, 20 ... belt, 21 ... cam surface, 22 ... tape surface,
23,24,25 …… Printed circuit board, 26 …… Table part, 27 ……
Printed circuit board, 28: Application nozzle section, 29: Discard application, 30: Loader section, 31: Unloader section.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/32-3/34

Claims (2)

(57) [Claims] 1. An apparatus for applying an adhesive for fixing an electronic component on a printed circuit board, the apparatus including at least a table section which can hold the printed circuit board and can be positioned at an arbitrary position, and an adhesive applying nozzle section. An adhesive application device, comprising a throw-away application tape portion having a mechanism for feeding the tape to the table portion. 2. The disposing and applying tape portion has a mechanism for elevating and lowering. The upper limit is located at the same height as the substrate, and the lower limit is located at least at a height at which the substrate can pass. While the substrate is being conveyed, the adhesive is thrown away from the adhesive application nozzle portion, and when a new substrate passes through the position of the application tape portion, the application tape portion descends. The adhesive application device according to claim 1.