JP2837545B2 - Masking soldering method and masking soldering device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering an electric component having a terminal member or an electric wire projecting from a main body portion by dipping the terminal member or the electric wire in molten solder. And a soldering apparatus suitable for performing the above method.

[0002]

2. Description of the Related Art The technique of immersing components to be soldered in molten solder is widely used for electric components (including electronic components).

[0003] As a recent technique relating to this type of soldering, Japanese Patent Publication No. 63-55774, "Method of Manufacturing Flyback Transformer" is known.

[0004]

The above-mentioned prior art has a practical effect as described in the publication and contributes to the improvement of the transformer manufacturing technique. However, there is still room for improvement in the following problems. There is.

A. Since the masking jig is always in contact with the molten solder, even if the masking jig is made of, for example, stainless steel, corrosion occurs on the contact surface.

If the corrosion progresses, the masking jig becomes unusable, and corrosion products are mixed into the molten solder to lower the quality.

B. Since the masking jig is floating above the molten solder, the molten solder enters the through hole
Not only can the molten solder have its surface tension
When the pin terminal is inserted into the through hole,
The paddle is pushed down by the pin terminals and the mask
A gap is created below the jig, and solder is
Can not be attached .

[0008]

C. With operation, solder scum (such as oxide) adheres to the inner surface of the through hole, but it is not easy to remove it. Even when the solder pin is pierced from above the through-hole with a cleaning pin-like device, the solder scum rises and returns to the inside of the through-hole because the specific gravity is smaller than that of the molten solder.

The present invention has been made in view of the above circumstances, and there is no danger that the corrosion of the masking jig will proceed at an early stage. It is an object of the present invention to provide a masking soldering method which can be easily cleaned and a masking soldering apparatus suitable for implementing the masking soldering method.

[0011]

The basic principle of the present invention created to achieve the above object is as follows.

[0012] In contrast to the masking jig in the prior art, which is a member floating on the molten solder, in the present invention, the masking jig is driven up and down to slightly push down or pull up into the molten solder. Separated from molten solder.

As a specific method based on the above-mentioned principle, the method according to the present invention is a method of immersing the terminal member or the electric wire under the liquid level of the molten solder in the electric component having the terminal member or the electric wire projecting from the main body. In the soldering method, a mask having a through hole through which the terminal member or the electric wire can be inserted is used, and the mask is pressed against the liquid surface of the molten solder to raise the molten solder upward through the through hole. Before or after this, or at the same time, a terminal member or an electric wire is inserted into the through hole and brought into contact with the molten solder, then pulled up, and the mask is raised to raise the liquid of the molten solder .
It is characterized in that it is separated upward from the surface .

An apparatus according to the present invention configured to carry out the above-described method of the present invention comprises a mask having a through-hole through which the terminal member or the electric wire can be inserted , and a vertical direction supporting the above-mentioned mask. And presses the mask under the liquid level of the molten solder, or raises the mask above the liquid level of the molten solder.
And a drive mechanism that separates the
The pin that supports the pin
A cleaning mechanism, wherein the mask is
In a state where the terminal member is pressed under the surface, the terminal member
Or mask after inserting electric wire and contacting with molten solder
Is raised, and the cleaning machine is
It is characterized in that the structure is operated .

[0015]

When the above-described method of the present invention is performed using the masking soldering apparatus having the above-described structure, the mask is not always in contact with the molten solder, but is pulled up every cycle and separated from the molten solder. The rate of progress of corrosion is suppressed.

Further, in such a state that it is pulled up and separated from the molten solder, the cleaning is easy.

Further, when the mask is slightly pushed into the molten solder, a part of the molten solder enters the through-hole and rises above the upper entrance of the through-hole. Because of this,
If a terminal member or the like is inserted into the through hole in the
The molten solder escapes downward or to the side by being restrained by the wall of the through hole
In contact with the terminal member without being able to
Reliable soldering quality can be obtained by reliably attaching the molten solder .

[0018]

Next, an example of implementing the method of the present invention using the apparatus of the present invention will be described.

FIG. 1 is an explanatory view schematically illustrating the steps of the method of the present invention.

As shown in FIG. 2A, the coil bobbin 8
, Three pin terminals 8a, 8b, 8c protrude downward.

The mask 9 has three through holes 9a, 9b, 9c corresponding to the three pin terminals, and is held above the liquid level of the molten solder A.

When the mask 9 is pushed under the liquid surface of the molten solder A as shown in FIG. 3B, a part of the molten solder flows into the through holes 9a, 9b and 9c. It rises slightly further from the upper entrance of the through hole.

In this state, the three pin terminals 8a, 8b, 8c are respectively inserted into the through holes 9a, 9b, 9 as shown in FIG.
c, the molten solder becomes three pin terminals 8a,
It contacts even the roots (upper ends in the figure) of 8b and 8c.

FIG. 2 is an explanatory view of an embodiment different from FIG. 1A is the same as that of the embodiment of FIG. 1, but in the embodiment of FIG. 2B, the pin terminals 8a to 8c are formed through the through holes 9a on the liquid surface of the molten solder A as shown in FIG. To 9c, and directly push it into the molten solder as shown in FIG. In the state shown in FIG. 2C, the embodiment shown in FIG. 1 is similar to the embodiment shown in FIG.

FIG. 3 shows a further different embodiment. This embodiment is an example in which the method of the present invention is applied to a case where a bulging portion 6a is provided on a coil bobbin 6 from which a pin terminal 6b is projected.

FIG. 3A shows the state before the start of the work, as in FIGS. 1 and 2 described above.

The mask 3 is located above the liquid level of the molten solder A, and the coil bobbin 6 is supported above the mask 3.

The bulging portion 6a of the coil bobbin 6 and the mask 3
And the pin terminal 6b of the coil bobbin 6 and the through hole 3d of the mask 3 are also vertically opposed.

As shown in FIG. 3B, the mask 3 is lowered and slightly pushed into the molten solder A. Thereby, a part of the molten solder flows into the through-hole 3d, and further rises from the upper entrance of the through-hole 3d.

When the coil bobbin 6 is lowered, as shown in FIG. 3C, the bulging portion 6a of the coil bobbin 6 enters the concave portion 3c of the mask 3, so that the lowering movement of the coil bobbin 6 is not hindered. Since it is isolated from the molten solder A, there is no possibility of being affected by the heat.

Further, since the pin terminals 6b are inserted into the molten solder rising in the through holes 3d, the pin terminals 6b are reliably brought into contact with the molten solder to the root (upper end in the figure), and high quality soldering is performed. Done.

When the soldering step shown in FIG.
The state is restored to the state shown in FIG. In this state, since the mask 3 is separated from the molten solder A, the progress of corrosion of the mask 3 is suppressed.

Further, in the state shown in FIG.
Is kept in the air while being separated from the molten solder A, so that the cleaning of the through-hole 3d of the mask 3 (removal of solder residue) is easy.

FIG. 4 is a sectional view of an example of a masking soldering apparatus configured to carry out the method of the present invention. Since FIG. 4 is schematically drawn for easy understanding of the structure, it does not necessarily represent the actual form of the device of the embodiment.

Reference numeral 1 denotes a solder tank, which is horizontally supported by columns 2 and stores molten solder A.

Reference numeral 3 denotes a mask formed by applying the present invention. The mask 3 is provided with a peripheral wall 3b around a bottom plate 3a.
Horizontally supported by

The support frame 4 is guided vertically by the support columns 2 and is vertically reciprocated by the vertical cylinder 5. The mask 3 is moved up and down with the up and down movement of the support frame 4.

In this embodiment, reference numeral 6 denotes a coil bobbin for a workpiece, which is gripped by a chuck device (not shown) and driven up and down. This coil bobbin has pin terminals 6
b a a structure was allowed protruding downward, and the bulging portion 6a of the downward is made form <br/> the body portion of the coil bobbin 6.

The bottom plate 3a of the mask 3 is formed with a concave portion 3c that fits loosely with the bulging portion 6a of the coil bobbin 6.

However, when the coil bobbin having no bulging portion 6a is to be worked, the concave portion 3c need not be provided.

Further, the pin terminal 6 is provided on the bottom plate 3a.
There is provided a through hole 3d that fits loosely with b.

Reference numeral 7 denotes a cleaning mechanism,
A plurality of cleaning pins arranged so as to be fitted in a plurality of through holes 3d provided in the horizontal cylinder 7b are driven by the horizontal cylinder 7b right and left in the drawing.

In the present embodiment, the horizontal cylinder of the cleaning mechanism 7 shown in FIG.
a is made to face just above the through hole 3d of the mask. When the vertical cylinder 5 is extended and the mask 3 is raised, the cleaning pins 7a are inserted into the through holes 3d to perform cleaning.

Since the mask 3 in the present invention is provided with vertical driving means (in this example, the vertical cylinder 5),
Cleaning can be performed even if the cleaning pin 7a of the cleaning mechanism 7 is not necessarily driven up and down.

[0045]

According to masking soldering method of the present invention, as described according to the present invention above, it is possible to reduce the corrosion of the mask member, moreover, surely melted to the root source soldering object member projecting from the body portion it is possible to perform soldering reliable by adhering the solder.

Further, according to the masking soldering apparatus of the present invention, the above-described invention method can be easily carried out, and its effect can be sufficiently exhibited.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a process in an embodiment of the method of the present invention.

FIG. 2 is a process explanatory view of an embodiment different from the above in the method of the present invention.

FIG. 3 is a process explanatory view of still another embodiment.

FIG. 4 is a schematic view showing one embodiment of the apparatus according to the present invention.

[Explanation of symbols]

 Reference Signs List 1 solder tank 2 mask 3c recess 3d through hole 6 coil bobbin 6a bulging portion 6b pin terminal 7 cleaning mechanism 8 coil bobbin 8a pin terminal 8b pin terminal 8c pin terminal 9 mask 9a through hole 9b through hole 9c through hole

Continuation of front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B23K 1/08 B23K 1/20

Claims (2)

(57) [Claims] 1. A method of soldering an electric component having a terminal member or an electric wire projecting from a main body portion, wherein the terminal member or the electric wire is immersed below the liquid level of the molten solder. Using a mask with holes, the mask is pressed against the liquid surface of the molten solder to cause the molten solder to rise upward through the through-holes, and before or after this, or simultaneously, into the above-described through-holes. A masking soldering method, comprising inserting a terminal member or an electric wire to contact the molten solder, and then raising the mask so as to be separated from a liquid surface of the molten solder. 2. A soldering device for immersing a terminal member or an electric wire under a liquid level of molten solder of an electric component having a terminal member or an electric wire protruding from a main body, wherein the terminal member or the electric wire can be inserted therethrough. A mask with holes, supporting the above mask and driving vertically,
Pressing the mask under the liquid level of the molten solder,
Drive mechanism to separate the solder above the liquid level of the molten solder
And the pin-shaped member inserted through the through hole of the mask is directed downward.
And a cleaning mechanism that supports vertically.
The mask is pressed under the liquid level of the molten solder.
Insert a terminal member or electric wire into the through hole
After contacting the rice field, raise the mask and
Wherein the cleaning mechanism is configured to operate .