JP2842406B2 - Press-fit pin grid array - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin grid grid used in an information processing apparatus such as a personal computer.
Regarding an array (hereinafter simply referred to as “PGA”),
In particular, the present invention relates to a press-fit PGA in which all or some of a plurality of leads arranged in a row are formed by press-fit pins.

[0002]

2. Description of the Related Art With the recent high integration of LSI chips and the miniaturization and high performance of electronic devices, it is possible to increase the number of terminals by arranging a plurality of pins in a grid or a matrix. PGA having a high density has been put to practical use as a package of a semiconductor device.

FIG. 6 is a sectional view showing a conventional general PGA mounting structure. As shown in FIG.
Is a PGA 110 having a plurality of leads 111 arranged on one side.
And a printed circuit board 120 on which the PGA 110 is mounted,
And arranged on the four outer sides of the PGA 110,
0 and an insulating mount 130 interposed between the printed circuit board 120 and the printed circuit board 120.

A conventional PGA having such a structure is as follows.
A plurality of leads 111 are soldered while penetrating through holes (not shown) of the printed circuit board 120, and four sides of the PGA 110 are supported and mounted on the printed circuit board 120 by the mount 130. According to such a conventional PGA, vibrations, shocks, and the like applied to the printed circuit board 120 and the like are not applied to the mount 130.
Thus, the PGA 110 could be reliably mounted on the printed circuit board 120 while preventing the lead 111 from breaking and the soldered portion from breaking.

However, in such a conventional PGA, P
The GA lead was fixed directly to the through hole of the printed circuit board by soldering, so the PGA once mounted
It was difficult to remove. For this reason, especially in an evaluation that requires repeated mounting and removal on a printed circuit board, PGA cannot be soldered and mounted, and an accurate evaluation cannot be performed in the same state as the completed state. Was.

Further, since a large number of leads are soldered to a printed circuit board, there is also a problem that the mounting operation is troublesome and the cost is increased. Further, when the leads are directly soldered to the through holes of the printed circuit board, the PGA gold-plated leads and the solder are connected by different kinds of metals, which causes a problem that the contact reliability is reduced.

In order to solve such a problem, a PGA as shown in FIG. 7 has been proposed. The PGA shown in FIG.
11 is inserted into a PGA socket 230 previously soldered and mounted in a through hole 221 of the printed circuit board 220, so that the PGA 210 is
It was designed to be able to be inserted and removed on top.

As a result, in the PGA shown in FIG. 7, even after the PGA 210 is once mounted on the printed circuit board 220, the PGA 210 can be easily removed, and operations such as evaluation can be easily performed. It was possible to do this very easily and reliably. In the figure, reference numeral 221a denotes a plated portion of the through hole 221 .

[0009]

However, in such a PGA, the PGA socket formed separately beforehand must be directly soldered to the printed circuit board when mounting the PGA, so that the number of parts and the mounting work are increased. In addition, there has been a problem that the cost increases and the reliability decreases due to an increase in the number of contact points.

Further, since the PGA socket needs to be mounted on the printed circuit board by soldering before the PGA is mounted, it is necessary to retrofit the PGA on the printed circuit board for some reason such as a design change. In such a case, it is extremely difficult to additionally mount the PGA socket, and there has been a problem that the number of steps and the like are greatly increased.

The present invention has been proposed in order to solve such problems of the prior art, and simply and reliably mounts PGA on a printed circuit board without using a special means such as a PGA socket. with a freely also insertion from the printed circuit board of PGA, and also it can maintain high contact reliability PGA and the printed circuit board, especially
The press-fit pin press-fit start time in multiple stages
Accordingly , an object of the present invention is to provide a press-fit PGA for reducing the initial insertion force of the lead .

[0012]

In order to achieve the above object, the press-fit PGA according to the first aspect of the present invention is arranged in a row.
Comprising a plurality of leads, pressed all or part of the plurality of leads configured by a press-fit pin comprising a shank and a press fit portion, the through-hole leads consisting of the press-fit pin is formed on the printed circuit board flop implemented on the printed circuit board by being
In the less-fit PGA, all or a part of the plurality of leads is constituted by two or more types of press-fit pins having the same overall lead length and different lengths from the shaft tip to the press-fit portion. I have.

According to the press-fit PGA of the present invention having such a configuration, due to the use of press-fit pin PGA lead, without using special means for PGA socket or the like, and removably to PGA It can be mounted on a printed circuit board. Then, since the lead of the PGA can be directly inserted into the through hole of the printed board, high contact reliability between the PGA and the printed board can be maintained while the PGA is configured to be detachable from the printed board.

[0014] In particular, in the PGA of the present invention, a plurality of leads
The length from the tip of the shaft to the press-fit
And two or more press-fit pins.
Distance from the tip of the shaft to the press-fit part
So that PGA is printed on the printed circuit board.
Press-fitting of press-fit parts into through holes when mounting
Multi-stage starting time to reduce initial insertion force
Is possible, making it easier to mount PGA on a printed circuit board.
It can be easy.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a press-fit P of the present invention will be described.
One embodiment of the GA will be described with reference to the drawings.
FIG. 1 shows a press-fit PGA as a premise of the present invention .
A to overall perspective view, FIG. 2 is an enlarged perspective view of a circle portion shown in FIG. FIG. 3 is a partially enlarged front view showing a mounting state of the press-fit PGA in FIG.
FIG. 4 shows one embodiment of the press-fit PGA of the present invention.
Der partially sectional enlarged front view showing a mounting state of facilities form
You.

[0016] First, as shown in FIGS. 1 to 3, of the present invention
The press-fit PGA as a premise is a PGA 10 in which a plurality of leads 11 are arranged in a row on one surface, and the plurality of leads 11 are constituted by press-fit pins.
You.

A lead 1 comprising this press-fit pin
1 is a multiple lead having the same overall lead length as shown in FIG.
A number of leads 11 are arranged in a row. Each of the leads 11 has a shaft portion 11a and a press-fit formed in a hollow shape in which a center portion of the shaft portion 11a swells outward and can be repeatedly pressed inward. It consists of a part 11b.

[0018] Then, as shown in FIG. 3, by leads 11 consisting of the press-fit pin is press-fitted into the through-hole 21 formed on the printed circuit board 20, the plated portion of the press-fit portion 11b is through-hole 21 2
1a, the PGA 10 is mounted on the printed circuit board 20.

[0019] Here, as the material of the press-fit pin, repeated elastic deformation of the press-fit portion 11b is used to the resilient metal, such as phosphor bronze, beryllium copper is preferred. In the present embodiment, the press-fit pin is formed in a hollow bulging shape as shown in FIGS. 2 and 3, but the bulging shape that can be pressed inward is formed in the through hole 21. There is no particular limitation as long as it is in a press-fit state.

[0020] Incidentally, Puresufi shown in the FIGS. 1-3
In the PGA , all of the plurality of leads 11 are formed by press-fit pins.
It is also possible to configure only 1 with a press-fit pin.

[0021] Next, the operation of the press-fit PGA having such a configuration. As shown in FIG. 3A, first, the tip of the shaft 11 a of the lead 11 of the press-fit pin of the PGA 10 is aligned with the through hole 21 of the printed circuit board 20.

Next, as shown in FIG. 3 (b), PGA1
0 is gradually lowered, and the lead 11 made of a press-fit pin is inserted into the through hole 21. And
As shown in FIG. 3C, when the press-fit portion 11b of the lead 11 is press-fitted into the through-hole 21 and is pressed against the plated portion 12a on the inner wall of the through-hole 21, the mounting on the printed circuit board 20 is completed. .

[0023] Thus, according to the press-fit PGA
For example, it can be mounted on the printed circuit board 20 without using soldering or a PGA socket or the like, and can be freely removed from the printed circuit board 20 even after mounting by simply pulling out the lead 11 from the through hole 21.

[0024] It should be noted that, in the case removal of the implementation after the PGA is not required, press-fit portion 11 of the pre-lead 11
b is formed to have a large diameter to increase the press-fitting into the through-hole 21 so that the PGA 10 can be mounted more firmly. Conversely, when it is necessary to repeatedly remove the PGA, the press-fit portion 11b Is formed to have a small diameter, so that press-fitting to the through-hole can be weakened, and insertion and removal can be facilitated.

[0025] Puresufu which is a premise of this manner, the present invention
Since the press-fit pin is used for the lead 11 of the PGA 10, the PGA can be inserted and removed freely without using a special means such as a conventional PGA socket.
A10 can be mounted on the printed circuit board 20 and the leads 11 of the PGA 10 can be directly connected to the printed circuit board 20.
Of the PG
While A10 is configured to be detachable from the printed circuit board 20, P10
High contact reliability between the GA 10 and the printed circuit board 20 can be maintained .

[0026] Then, as shown in FIG. 4, the present embodiment
The press-fit PGA is the press-fit PGA shown in FIGS.
A plurality of leads 11 in Itto PGA, overall lead
And two press-fit pins having the same length and different lengths from the tip of the shaft portion 11a to the press-fit portion 11b.

[0027] As described above, the press-fit PGA
Normally, the press-fit pins that constitute the leads 11 all use the same press-fit pins.
As shown in FIG. 4 , the less-fit PGA comprises a lead 11 composed of two types of press-fit pins,
The distance from the leading end of a to the press-fit portion 11b is shifted.

[0028] Thus, in a press-fit portion 11b press-fitting start timing two steps of the through-hole 21 for mounting the PGA10 the printed circuit board 20, it is possible to reduce the initial insertion force, PGA10 print Mounting on the substrate 20 can be made easier.

[0029] Here, in the present embodiment, the leads 11 are constituted by two kinds of press-fit pin, it is also possible to configure a three or more press-fit pin it. By doing so, the through hole 21
The press-fit start time of the press-fit part 11b for two or more stages
Multi-stage.

[0030] It should be noted that, as a press-fit PGA according to the present invention
In addition to the above-described embodiment, there is also an embodiment shown in FIG.
You. FIG. 5 shows a press fitting according to another embodiment of the present invention.
FIG. 4 is an enlarged front view, partly in cross section, showing a mounted state of the PGA .

The press-fit PGA in FIG.
4 is a modified example of the press-fit PGA shown in FIG.
1b.

[0032] and, in the through-hole 21 of the printed circuit board 20, the small diameter of the press-fit section 1 of the lead 11
The plating portion 21a is formed thick so that 1b is inserted in a press-fit state.

In the above-described press-fit PGA, a press-fit pin having a width capable of being pressed into the through hole 21 is used for the lead 11, but in such a case, the thickness of the plated portion 21a of the through hole is reduced. Because of the decrease, there is a possibility that the plating portion 21a of the through hole 21 may be peeled or damaged during repeated insertion and removal of the PGA 10.

In this regard, the press-fit PGA shown in FIG.
Then, the plating portion 21a of the through hole 21 is formed thicker, the press-fit portion 11b is made smaller in diameter, and the press-fit of the lead 11 is reduced, so that the insertion and removal of the PGA 10 can be performed more easily. The plating portion 21a of the through hole 21 is not damaged or the like by repeating the insertion and removal of the through hole. This is particularly effective when performing an evaluation that requires repeated insertion and removal of the PGA 10.

In the PGA shown in FIG. 5, all of the leads 11 are constituted by press-fit pins having a small-diameter press-fit portion 11b. About Figure 1
4 to 4. It may be constituted by a press-fit pin having a normal diameter shown in FIG.

The lead 11 having the small-diameter press-fit portion 11b shown in FIG. 5 is also shown in FIG.
In this embodiment, it is also possible to use two or more types of press-fit pins having different lengths from the tip of the shaft portion 11a to the press-fit portion 11b.

[0037]

As described above, according to the press-fit PGA of the present invention, the PGA can be easily and reliably mounted on the printed circuit board without using any special means such as a PGA socket, and the PGA can be transferred from the printed circuit board. It can be freely inserted and removed, and can maintain high contact reliability between the PGA and the printed circuit board .
By setting the press-fitting start time in multiple stages,
It is possible to reduce the insertion force.

[Brief description of the drawings]

FIG. 1 shows a press-fit PGA as a premise of the present invention .
It is to overall perspective view.

FIG. 2 is an enlarged perspective view of a circle shown in FIG.

FIG. 3 is a partially enlarged front view showing a mounting state of the press-fit PGA shown in FIG . 1 ;

FIG. 4 is a partially enlarged front view showing a mounted state in one embodiment of the press-fit PGA of the present invention.

FIG. 5 shows a press-fit PGA according to another embodiment of the present invention .
3 is an enlarged partial cross-sectional front view showing a mounting state in FIG.

FIG. 6 is a cross-sectional view showing a conventional general PGA mounting structure.

FIG. 7 is an enlarged sectional view showing a main part of another conventional PGA mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 PGA 11 Lead 11a Shaft part 11b Press fit part 20 Printed circuit board 21 Through hole 21a Plating part

Claims (1)

(57) [Claims] A plurality of leads arranged in a row , wherein all or some of the plurality of leads are constituted by a press-fit pin comprising a shaft portion and a press-fit portion; Press-fit pin grid grid mounted on the printed circuit board by being pressed into the through hole formed in
In a ray, all or a part of the plurality of leads is the length of the entire lead.
And a press-fit pin grid array comprising two or more types of press-fit pins having the same length and different lengths from the tip of the shaft portion to the press-fit portion.