JP2844150B2 - Ceramic jig for manufacturing or assembling electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION This invention, electronic components, especially Sera
The present invention relates to a jig used for manufacturing or assembling a mick package or a temperature measuring instrument, or a jig used for firing such a jig.

[0002]

2. Description of the Related Art Conventionally, in an operation for manufacturing or assembling an electronic component, for example, a flat package or a pin grid array package as shown in FIGS.
The ceramic package is assembled using a jig (5). However, since the material of the conventional jig (5) is mainly made of carbon, when fixing the input / output terminals such as the lead frame (2) and the pins (6) to the ceramic package body (1) and brazing it, Ceramic package such as package body and input / output terminals such as lead frame
Parts constituting the contacts on carbon, could not avoid being contaminated. Also, as a jig for fixing a temperature measuring instrument used when manufacturing an automobile part, a jig mainly made of carbon has been conventionally used, but contamination by carbon powder and short-circuit due to adhesion of carbon powder occur. And so on. Furthermore, the firing jig for assembling and fixing the above-mentioned semiconductors, electronic components, temperature measuring instruments, etc. and firing the fixing jig was also made of a carbon material, which was also contaminated by carbon or scattered carbon powder. However, they often adhere to various parts and cause serious defects such as short circuits.

Recently, semiconductors and electronic parts , especially semiconductor integrated circuits
The roads have been used as important components in various industrial fields due to high integration, and failure of electronic components may cause a serious accident. Conventional jigs mainly made of carbon for manufacturing and assembling electronic components have problems such as shortage of components due to contamination by carbon powder or carbon adhesion when the ceramic package body , lead frame, etc. come into contact with the carbon jig. There was a problem inviting. In order to solve such a problem, a method of preventing the surface by carbon curing or coating with SiC has been adopted. However, this method has a practical problem because the process is complicated and the cost is increased. At the same time, the process became longer and did not meet the needs of the user. In addition, the thickness of the coating is unstable, and the coating is treated after the carbon jig is processed. For manufacturing and assembling ceramic packages such as side-blaze packages
The field of manufacturing jigs has a great many problems to be solved.

[0004]

SUMMARY OF THE INVENTION The present invention relates to a conventional
The present invention has been made to solve various problems and disadvantages caused by jigs used for manufacturing and assembling electronic components.

[0005]

In order to solve the above problems SUMMARY OF THE INVENTION, means that the present invention taken is a jig used when attaching Oite wax manufacture or assembling of electronic components,
It is characterized in that boron nitride is contained in an amount of 3 to 80% by weight.

[0006] Also, jig, when attached Oite wax manufacture or assembling of the ceramic package, and positioning the components constituting the ceramic package or fixed to
Characterized in that it is a tool for that.

[0007] When the content of boron nitride is 3% or less, the material becomes extremely hard, so that the free-cutting ability is reduced and precision machining becomes difficult, the machining cost is greatly increased, the thermal conductivity is reduced, and the thermal shock resistance is reduced. As a result , it becomes unsuitable as a jig for manufacturing and assembling semiconductors and electronic components that require thermal shock resistance. If the boron nitride content is 80% or more, the material cost is high and the cost is high, so that it cannot be practically used.
Since boron nitride has a small coefficient of thermal expansion, there is a problem that the coefficient of thermal expansion is not compatible with a ceramic package which is usually made of Al ₂ O ₃ . Other compositions to be added to boron nitride include commonly known ceramic raw materials, for example, Al ₂
O ₃ , SiO ₂ , Si ₃ N ₄ , MgO, AlN, TiO
₂ , CaO is conceivable, but C is excluded .

[0008] When the content of boron nitride is 3% or less, it becomes extremely hard, so that the free-cutting ability is reduced and precision machining becomes difficult, the machining cost is greatly increased, the thermal conductivity is reduced, and the thermal shock resistance is reduced. Since it becomes worse, it becomes unsuitable as a jig for manufacturing and assembling semiconductors and electronic components that require thermal shock resistance. If the content of boron nitride is 80% or more, the material cost is high and the cost is high, so that it cannot be practically used. In addition, since boron nitride has a small coefficient of thermal expansion, a ceramic package usually made of Al ₂ O ₃ is required. There is a problem in that the thermal expansion coefficient of the rubber does not match. Other compositions to be added to boron nitride include commonly known ceramic raw materials, for example, Al ₂ O
₃ , SiO ₂ , Si ₃ N _{4 and the} like.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail.

3%, 40%, 80% by weight of boron nitride
90%, 55%, 16% by weight of Al ₂ O ₃ and 7%, 5%, 4% of other ceramic raw materials were added thereto, and the mixture was pulverized and mixed.
By molding and firing into a predetermined shape, a ceramic jig for positioning a lead frame of a flat package and a pin grid array package was obtained. This is compared with conventional carbon 10
The effect was examined in comparison with a 0% jig, and the results are as shown in the following table.

[0011]

[Table 1]

As is clear from the table, the ceramic jig of the present invention did not show any occurrence of defects such as blisters and short-circuits, and had the same thermal shock resistance and workability as the carbon jig.

Similarly, a jig for fixing a measuring instrument used when manufacturing an automobile part is manufactured, and the temperature measuring instrument is fixed with the jig. Needless to say, there was no short-circuit caused by the adhesion of carbon powder, and very good fixation could be achieved.

Further, when jigs for firing the above various ceramic jigs are manufactured according to the present invention and fired, it is possible to prevent the occurrence of a defect caused by carbon powder contamination, scattering or adhesion of carbon powder. Was completed.

[Brief description of the drawings]

1 is a state explanatory view showing a method of assembling a flat package. FIG. 2 is a sectional view taken along the line AA of FIG.

[Explanation of symbols]

(1) Ceramic package (2) Lead frame (5) Jig (6) Pin

──────────────────────────────────────────────────続 き Continuing on the front page (73) Patent holder 999999999 Japan Special Ceramics Co., Ltd. No. 10 Nissin Reflatec Co., Ltd. (72) Kazumasa Sahara 2-chome, Nishimachi, Hikoshimada, Shimonoseki City, Yamaguchi Prefecture Inside 30 Dix Industrial Co., Ltd., 2453, Town (72) Inventor Yoji Kato 962-1 Saruzume, Tomicho, Mizunami-shi, Gifu Pref. References JP-A-61-104644 (JP, A) JP-A-4-92447 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/00 C04B 35/00

Claims (4)

(57) [Claims] [Claim 1] Oitero in manufacturing or assembling of electronic components
Cormorant A jig for use when attaching, ceramics jig, characterized in that the boron nitride is contained 3-80% in weight%. 2. A jig, that when put Oite wax manufacture or assembling of the ceramic package, a jig <br/> for by or fixed positioning of parts constituting the ceramic package The ceramic jig according to claim 1, wherein: 3. The ceramic jig according to claim 1, wherein the jig is a jig for fixing a temperature measuring instrument. 4. A ceramic jig for firing a jig for positioning or fixing an electronic component, wherein the ceramic jig contains 3 to 80% by weight of boron nitride.