JP2844259B2 - Manufacturing method of flat electronic components - Google Patents

Description

The present invention relates to a method of manufacturing a flat electronic component capable of high-density surface mounting.

[Conventional technology]

2. Description of the Related Art Conventionally, a flat electronic component is known in which a lead wire is connected to an electrode of an electronic component and taken out in a lateral direction, and a part of the electronic component and the lead wire is subjected to resin molding.

However, in conventional molded electronic components, since the lead wires extend in the horizontal direction, when surface-mounted on a printed circuit board, the surface mounting area is increased by an amount corresponding to the horizontal extension of the lead wires, and the high density There is a problem that it is difficult to mount the device on a surface.

[Problems to be solved by the invention]

The present invention relates to a manufacturing method capable of providing a flat electronic component capable of high-density surface mounting.

[Means for solving the problem]

A through hole is provided in the insulating substrate, an electronic component having a primary electrode bonded to its two terminals is mounted on an electronic component holding portion in the hole, and the electrode extraction conductor formed on the surface of the insulating substrate is connected to the two terminals. This problem is solved by adopting a structure connected to a primary electrode, and the present invention is a manufacturing method for providing an electronic component having the above structure, and will be described in detail below.

〔Example〕

 The manufacturing process of the present invention will be described below with reference to the drawings.

An insulative substrate is prepared by punching holes on the front and back sides of a dividable alumina ceramic substrate 1 sheet having slits 2 formed vertically and horizontally by using a mold or the like. The shape of the hole 3 is formed in a shape corresponding to the outer shape of the electronic component, for example, a rectangular or round shape, and a step portion 4 serving as an electronic component holding portion is provided. (First
Next, Pb-Sn is added to the Fe-Ni sheet, which serves as one primary electrode, at the step 4 of the hole 3 of the alumina-ceramic substrate 1.
The first electrode chip 5 plated with, for example, is placed and held on the step portion 4 by vacuum suction, the diode chip D is placed on the first electrode chip 5, and the other is placed on the diode D. Pb- on Fe-Ni sheet to be primary electrode
The second electrode chip 6 plated with Sn or the like is mounted.
(FIG. 2) Next, in the above state, the alumina-ceramic substrate 1 was removed.
Heating is performed at 250 to 300 ° C. in a heater block 7 or an oven furnace (not shown) to melt the Pb—Sn plated on the two electrode chips, and solder the back surface 8 and the bump side 9 of the diode chip. (FIG. 3) Next, the diode chip in the soldered state is held on the step portion 4 by vacuum suction from a lower hole, and a thick film screen is formed on the surface of the second electrode chip 6 and the alumina ceramic substrate 1. By printing, a first electrode extraction conductor 10 and a conductor 11 serving as a base for a plating step for forming a secondary electrode described later are formed by applying a low-temperature drying silver paste,
Heat and dry in an oven at 80 ° C. (FIG. 4) Next, the insulator protective film 12 is placed on the first electrode extraction conductor.
A portion of 10 and on the alumina ceramic substrate 1 are screen-printed using a glass paste material for low-temperature drying, and heated to 150 to 180 ° C. in an oven furnace to be dried. (FIG. 4) Next, the silver paste is buried in the hole 13 having a small diameter forming the stepped portion 4 and, at the same time, the silver paste is applied on the alumina ceramic substrate by thick-film screen printing, and the buried conductor for taking out the electrode is formed. 14 and the second electrode lead-out conductor 15 are formed, heated to 150 to 180 ° C. in an oven furnace and dried.
At this time, the conductor 16 serving as the base of the secondary electrode is formed at the same time as described above. (FIG. 5) Next, the insulating protection film 17 is placed on the second electrode lead-out conductor 15.
Is applied by screen printing using a glass paste material for low-temperature drying on a part of the
Heat in oven furnace to 150-180 ° C and dry. (Fifth
Next, the alumina-ceramic substrate 1 is divided into strips from the slits, and the electrodes 18 and 19 on the end faces are applied to the end faces by printing or dipping using the same silver paste material as the electrode extraction conductors. Heat in oven furnace to 150-180 ° C and dry. (FIG. 6) Next, the strip-shaped alumina-ceramic substrate thus divided is further divided from the slit portion, and the chip-shaped one is formed with U-shaped secondary electrodes 20 and 21 by barrel plating or the like. . (FIG. 7) A flat electronic component that can solve the above-mentioned problems can be manufactured through the above steps. However, after that, the characteristics are measured and checked, and marking is performed to indicate the direction of the characteristics.

〔The invention's effect〕

The manufacturing method of the present invention makes it possible to manufacture a flat electronic component capable of high-density surface mounting, and furthermore, it is possible to form an insulating protective film with a glass paste for low-temperature drying. Since heating is not performed at a high temperature, breakage of electronic components due to high-temperature heating can be avoided, and the production yield can be improved.

[Brief description of the drawings]

1 to 7 are views for explaining the steps of the manufacturing method of the present invention. DESCRIPTION OF SYMBOLS 1 ... Insulating substrate, 2 ... Slit, 3 ... Hole, 4 ... Step part, 5, 6 ... Primary electrode chip, D ... Diode chip, 7 ... Heater block, 10, 15 ... Electrode Take-out conductor, 14 ... embedded conductor, 12, 17 ... insulating protective film, 1
8, 19 ... End face electrode, 20, 21 ... Secondary electrode

Claims (2)

(57) [Claims] 1. A method for manufacturing a flat electronic component comprising the following steps. A step of preparing an insulating substrate having a slit that can be divided vertically and horizontally, on each substrate portion of the insulating substrate surrounded by the slit,
Forming a hole that penetrates the front and back to hold an electronic component; mounting a solder-plated first primary electrode chip to be one of the primary electrodes in the hole that can hold the electronic component; Holding by suction, placing an electronic component on the first primary electrode chip, and placing a solder-plated second primary electrode chip thereon as the other primary electrode; A step of heating the insulating substrate, dissolving the solder plated on the electrode chip, and soldering the electrode chip to a terminal of the electronic component; and vacuuming the electronic component to which the electrode chip is soldered to the electronic component holding portion. Holding and applying a low-temperature drying conductive paste for forming a first electrode lead-out conductor to the surface of the second primary electrode chip and the surface of the insulating substrate by pressure film screen printing, and heating and drying the paste. Electrode extraction low temperature drying glass paste was applied by screen printing a conductor, drying by heating, when embedded in the first primary electrode tip side of the hole at the same time,
A step of applying a conductive paste for low-temperature drying for forming a second electrode lead-out conductor on the surface of the insulating substrate and heating and drying; applying a glass paste for low-temperature drying to the second electrode lead-out conductor by screen printing and drying by heating; A step of dividing the insulating substrate into strips from the slit portion, a step of applying a conductive paste for forming an end face electrode to an end surface of the insulating substrate divided into strips, and a step of drying by heating; A step of further dividing the chip from the slit portion and forming the chip-shaped electronic component; a step of plating a secondary electrode on each of the electrode extraction conductors and the end electrodes; 2. The method according to claim 1, wherein the holding portion capable of holding the electronic component has a shape having a step portion.