JP2845014B2 - Minority carrier recombination lifetime measurement device - Google Patents
Minority carrier recombination lifetime measurement deviceInfo
- Publication number
- JP2845014B2 JP2845014B2 JP6440192A JP6440192A JP2845014B2 JP 2845014 B2 JP2845014 B2 JP 2845014B2 JP 6440192 A JP6440192 A JP 6440192A JP 6440192 A JP6440192 A JP 6440192A JP 2845014 B2 JP2845014 B2 JP 2845014B2
- Authority
- JP
- Japan
- Prior art keywords
- minority carrier
- silicon substrate
- recombination lifetime
- carrier recombination
- minority
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005215 recombination Methods 0.000 title claims description 40
- 230000006798 recombination Effects 0.000 title claims description 40
- 238000005259 measurement Methods 0.000 title claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 54
- 229910052710 silicon Inorganic materials 0.000 claims description 54
- 239000010703 silicon Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 54
- 239000013078 crystal Substances 0.000 claims description 11
- 239000000969 carrier Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000011109 contamination Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【産業上の利用分野】本発明は半導体結晶基板の少数担
体再結合寿命測定装置に関し、特にシリコン結晶基板で
の少数担体再結合寿命を測定する装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring the minority carrier recombination lifetime of a semiconductor crystal substrate, and more particularly to an apparatus for measuring the minority carrier recombination lifetime of a silicon crystal substrate.
【0002】[0002]
【従来の技術】シリコン基板内に金属原子が拡散する
と、この金属原子がシリコンの禁制帯中に深い準位を形
成し担体の捕獲中心となるので、少数担体再結合寿命が
著しく劣化する。従って、少数担体再結合寿命は深い準
位の密度、すなわちシリコン基板内に拡散した金属原子
の濃度と相関関係があり、この関係を利用することによ
って、所望外の金属原子のシリコン基板中への拡散(金
属汚染)の度合をモニターすることが可能である。少数
担体再結合寿命測定装置(以後、測定装置と記す)はこ
のような原理を用いて、シリコン基板内の金属汚染をモ
ニターする目的などによく用いられる。2. Description of the Related Art When a metal atom diffuses into a silicon substrate, the metal atom forms a deep level in the forbidden band of silicon and becomes a trapping center of carriers, so that the minority carrier recombination life is significantly deteriorated. Therefore, the minority carrier recombination lifetime is correlated with the density of deep levels, that is, the concentration of metal atoms diffused in the silicon substrate, and by utilizing this relationship, undesired metal atoms can be introduced into the silicon substrate. It is possible to monitor the degree of diffusion (metal contamination). A minority carrier recombination lifetime measuring device (hereinafter, referred to as a measuring device) is often used for the purpose of monitoring metal contamination in a silicon substrate by using such a principle.
【0003】図6に従来の測定装置の構成を示す。図6
を参照すると、この測定装置は基本的には、マイクロ波
を発生するマイクロ波発生部1,マイクロ波の往来を制
御するサーキュレータ2,シリコン基板3から反射され
たマイクロ波を検出する反射マイクロ波検出部4,検出
された反射マイクロ波を増幅する増幅部5,レーザ光線
を発生するレーザダイオード6,レーザ光線からレーザ
パルスを発生するパルス発生部7,増幅された反射マイ
クロ波とレーザパルスの信号とから反射マイクロ波強度
の減衰波形を出力するオシロスコープ8,シリコン基板
3を固定する真空吸着台9および吸着用ロータリーポン
プ10よりなっている。FIG. 6 shows a configuration of a conventional measuring apparatus. FIG.
Referring to FIG. 1, the measuring apparatus basically includes a microwave generating unit 1 for generating microwaves, a circulator 2 for controlling the flow of microwaves, and a reflected microwave detection for detecting microwaves reflected from the silicon substrate 3. Unit 4, an amplifying unit for amplifying the detected reflected microwave 5, a laser diode for generating a laser beam 6, a pulse generating unit 7 for generating a laser pulse from the laser beam, a signal of the amplified reflected microwave and a laser pulse. The oscilloscope 8 comprises an oscilloscope 8 for outputting an attenuation waveform of the reflected microwave intensity from the base, a vacuum suction table 9 for fixing the silicon substrate 3, and a suction rotary pump 10.
【0004】パルス発生部7からのレーザパルスによっ
てシリコン基板3中に生成された少数担体はシリコン基
板3中を拡散し、シリコン基板内部および表裏面で再結
合する。一方、反射マイクロ波の反射強度は少数担体の
濃度に比例するので、オシロスコープ8に表示される反
射マイクロ波の減衰曲線から、反射マイクロ波強度が最
大値の1/e(eは、自然対数の底)に減衰する時間を
求めることによって少数担体再結合寿命を知ることがで
きる。減衰波形の例を図3中に曲線Bで示す。図3を参
照すると、この減衰曲線には2つの傾きが観測される。
初期の急峻な傾きは表面再結合の効果を表わし、後半の
緩やかな傾きはシリコン基板内再結合および表裏面再結
合の効果を示している。The minority carriers generated in the silicon substrate 3 by the laser pulse from the pulse generator 7 diffuse in the silicon substrate 3 and recombine inside the silicon substrate and inside and outside of the silicon substrate. On the other hand, since the reflection intensity of the reflected microwave is proportional to the concentration of the minority carrier, from the attenuation curve of the reflected microwave displayed on the oscilloscope 8, the reflected microwave intensity is 1 / e of the maximum value (e is the natural logarithm). The minority carrier recombination lifetime can be determined by determining the time of decay to the bottom. An example of the attenuation waveform is shown by a curve B in FIG. Referring to FIG. 3, two slopes are observed in the attenuation curve.
The initial steep slope indicates the effect of surface recombination, and the gentle slope in the latter half indicates the effect of recombination in the silicon substrate and front and back surface recombination.
【0005】[0005]
【発明が解決しようとする課題】上述した少数担体再結
合寿命に影響する要因には、金属汚染だけでなく表面準
位による表面再結合がある。ところが、図6に示した従
来の測定装置では両者を分離することが難しいので、表
面再結合に起因する少数担体再結合寿命の変化から金属
汚染のレベルを正確に評価することができない。Factors affecting the minority carrier recombination lifetime described above include not only metal contamination but also surface recombination due to surface levels. However, since it is difficult to separate the two using the conventional measuring device shown in FIG. 6, the level of metal contamination cannot be accurately evaluated from the change in the minority carrier recombination lifetime due to surface recombination.
【0006】又、少数担体がシリコン基板内部から表裏
面にかけて広く拡散し再結合するので、汚染物質の拡散
深さと少数担体再結合寿命との関係を得ることが不可能
であった。つまり、従来の測定装置では、深さ方向に亘
る金属汚染のレベルをモニタすることができないという
問題点もある。Also, since the minority carriers diffuse widely from the inside of the silicon substrate to the front and back surfaces and recombine, it is impossible to obtain a relationship between the diffusion depth of the contaminant and the minority carrier recombination lifetime. That is, the conventional measuring device has a problem that the level of metal contamination in the depth direction cannot be monitored.
【0007】[0007]
【課題を解決するための手段】本発明の少数担体再結合
寿命測定装置は、シリコン結晶基板の一方の面からレー
ザパルスを照射し少数担体を発生させ、このシリコン結
晶基板の一方の面から入射したマイクロ波の反射波の強
度の時間的変化から少数担体の再結合寿命を求める型の
少数担体再結合寿命測定装置であって、少なくとも、前
述のシリコン結晶基板を他方の面で支持する、絶縁物で
被覆された電極と、このシリコン結晶基板のレーザパル
スおよびマイクロ波の入射面に接触する、透明絶縁物で
被覆された透明電極と、前記シリコン結晶基板の両方の
面から内部に空乏層を生じさせるための電源とを備え、
前記電源の電圧が可変であることを特徴としている。A minority carrier recombination lifetime measuring apparatus according to the present invention irradiates a laser pulse from one surface of a silicon crystal substrate to generate minority carriers, and enters the laser beam from one surface of the silicon crystal substrate. A minority carrier recombination lifetime measuring device of the type that determines the recombination lifetime of minority carriers from the temporal change in the intensity of reflected microwaves, wherein at least the silicon crystal substrate is supported on the other surface, the insulation An electrode coated with a material, a transparent electrode coated with a transparent insulator, which is in contact with the laser pulse and microwave incident surface of the silicon crystal substrate, and a depletion layer formed inside from both surfaces of the silicon crystal substrate. Power supply to cause
The voltage of the power supply is variable .
【0008】[0008]
【実施例】次に、本発明の好適な実施例について、図面
を用いて説明する。始めに、本発明の理解を容易にする
ために、参考例について述べる。図1は、本発明の参考
例の構成を示す図である。又、図2は、図1におけるシ
リコン基板と電極部分とを拡大して模式的に示し、併せ
て、シリコン基板内に形成される空乏層,電荷の配列,
小数担体の再結合の様子を示す(これらについては簡単
のため、シリコン基板の裏面側についてのみ示す)図で
ある。本発明では、図2に示すように、シリコン基板3
表面および裏面に、絶縁物11A,11Bで被覆された
電極12A,12Bを用いて電圧を加えることによっ
て、シリコン基板3の表裏面に空乏層13を生じさせ
る。これにより、少数担体(図2中では電子で示す)1
4のシリコン基板3表裏面への拡散を防ぎ、表面再結合
による少数担体再結合寿命の変化をなくす。そして、後
に述べる実施例のように、電源15に可変電源を用いて
シリコン基板3に対する印加電圧を変えることにより空
乏層13の厚さを変化させ、これによって深さ方向に亘
る金属汚染レベルのモニターを可能とする。尚、シリコ
ン基板3の表面側の絶縁物11Aおよび電極12Aは、
この面からレーザパルス16を入射するので、透明なも
のとしておく。Next, a preferred embodiment of the present invention will be described with reference to the drawings. First, to facilitate understanding of the invention
Therefore, a reference example will be described. FIG. 1 is a reference of the present invention.
It is a figure showing composition of an example . FIG. 2 schematically shows, in an enlarged manner, the silicon substrate and the electrode portion in FIG. 1, and also shows a depletion layer formed in the silicon substrate, an arrangement of electric charges, and the like.
FIG. 9 is a diagram showing a state of reconnection of the minority carriers (these are shown only on the back surface side of the silicon substrate for simplicity). In the present invention, as shown in FIG.
By applying a voltage to the front and back surfaces using the electrodes 12A and 12B coated with the insulators 11A and 11B, a depletion layer 13 is formed on the front and back surfaces of the silicon substrate 3. Thereby, the minority carrier (indicated by an electron in FIG. 2) 1
4 is prevented from diffusing to the front and back surfaces of the silicon substrate 3, and the minority carrier recombination lifetime due to surface recombination is not changed. And later
As described in the embodiment described above, the thickness of the depletion layer 13 is changed by changing the voltage applied to the silicon substrate 3 by using a variable power supply as the power supply 15, thereby enabling monitoring of the metal contamination level in the depth direction. And The insulator 11A and the electrode 12A on the front side of the silicon substrate 3 are:
Since the laser pulse 16 is incident from this surface, it is made transparent.
【0009】図1および図2を参照すると、本参考例で
は、電源15を用いて、透明絶縁物11Aに被覆された
透明電極12Aおよび絶縁物11Bに被覆された電極1
2Bとシリコン基板3との間に、シリコン基板3に空乏
層13を生じさせるような電圧を印加しておく。パルス
発生部7とレーザダイオード6とによって発生されたレ
ーザパルス16がシリコン基板3に照射されると、シリ
コン基板3中に少数担体14が発生する。この少数担体
14は拡散の後再結合するが、空乏層13の生じている
シリコン基板表裏面には拡散せず、表裏面で再結合する
ことはない。マイクロ波発生部1で発生しサーキュレー
タ2を通してシリコン基板3で反射したマイクロ波の強
度は少数担体の濃度に比例するから、少数担体14の減
衰の様子は、反射マイクロ波検出部4と増幅部5とを経
て時間の関数としてオシロスコープ8に出力される。こ
のようにして出力される減衰波形より得られる少数担体
再結合寿命は、少数担体がシリコン基板表裏面で再結合
しないので、見かけの少数担体再結合寿命ではなく真の
シリコン基板中少数担体再結合寿命である。オシロスコ
ープ8の出力波形の例を図3中に曲線Aで示す。図3に
おいて、本参考例に用いたシリコン基板は、従来の技術
による観測例に用いられたシリコン基板と同一であり、
本来、両者の示す少数担体再結合寿命は一致するはずで
ある。ところが、従来の技術による観測例では、波形の
初期の急峻な傾きには表面再結合の影響が、そして後半
の緩やかな傾きには表裏面再結合の影響が見られ、本参
考例での少数担体再結合寿命である160マイクロ秒に
比較し、70マイクロ秒と見掛け上は著しく劣化してい
るように観測される。Referring to FIG. 1 and FIG. 2, in this embodiment , a transparent electrode 12A covered with a transparent insulator 11A and an electrode 1 covered with an insulator 11B are used by using a power source 15.
A voltage that causes the depletion layer 13 to be generated in the silicon substrate 3 is applied between 2B and the silicon substrate 3. When the silicon substrate 3 is irradiated with the laser pulse 16 generated by the pulse generator 7 and the laser diode 6, a minority carrier 14 is generated in the silicon substrate 3. The minority carriers 14 recombine after diffusion, but do not diffuse to the front and back surfaces of the silicon substrate where the depletion layer 13 is formed, and do not recombine on the front and back surfaces. Since the intensity of the microwave generated by the microwave generation unit 1 and reflected by the silicon substrate 3 through the circulator 2 is proportional to the concentration of the minority carrier, the state of attenuation of the minority carrier 14 is determined by the reflected microwave detection unit 4 and the amplification unit 5. And is output to the oscilloscope 8 as a function of time. The minority carrier recombination lifetime obtained from the attenuation waveform output in this manner is not an apparent minority carrier recombination lifetime but a minority carrier recombination in a true silicon substrate because minority carriers do not recombine on the front and back surfaces of the silicon substrate. Life is long. An example of the output waveform of the oscilloscope 8 is shown by a curve A in FIG. In FIG. 3, the silicon substrate used in this reference example is the same as the silicon substrate used in the observation example according to the conventional technique,
Originally, the minority carrier recombination lifetimes shown by the two should match. However, in the observation example according to the prior art, the influence of surface recombination is the initial steep slope of the waveform, and the gentle slope in the second half of observed effect of front and back surfaces recombination, the ginseng
Compared to the minority carrier recombination lifetime of 160 microseconds in the example , it is observed to be 70 microseconds, which is apparently significantly degraded.
【0010】次に、本発明の一実施例について説明す
る。図4は、本発明の一実施例の構成を示す図である。
図4を参照すると、本実施例では、電源を電圧可変の電
源17にすることにより、シリコン基板3に印加する電
圧値を変え空乏層の厚さを変化させながら少数担体再結
合寿命を計測している。このことにより、シリコン基板
中のアクセプタ濃度またはドナー濃度が1×1015cm
-3程度の場合、1マイクロメートル程度までの範囲で深
さ方向の分析が可能である。シリコン基板中のアクセプ
タ濃度またはドナー濃度を更に低くすれば、より深部に
亘って分析が可能になる。図5に本実施例による観測結
果の一例を示す。使用したシリコン基板の濃度は、1×
1015cm-3である。印加電圧を大きくするに従って少
数担体再結合寿命が長くなり、最初50マイクロ秒であ
ったのが200マイクロ秒にまで長くなり、飽和した。
よって、このシリコン基板には、1マイクロメートルま
での深さ範囲で表面付近に、再結合寿命を著しく劣化さ
せる汚染物質が高濃度で存在すると予想される。実際、
SIMS(Scondary Ion Mass Sp
ectroscopy;二次イオン質量分析)の結果か
ら、このシリコン基板表面付近には鉄(Fe)原子が存
在することが確認された。Next, an embodiment of the present invention will be described. FIG. 4 is a diagram showing the configuration of one embodiment of the present invention .
Referring to FIG. 4, in this embodiment, the minority carrier recombination lifetime is measured by changing the voltage applied to the silicon substrate 3 and changing the thickness of the depletion layer by changing the power supply to the variable power supply 17. ing. As a result, the acceptor concentration or the donor concentration in the silicon substrate becomes 1 × 10 15 cm.
In the case of about -3 , analysis in the depth direction is possible up to about 1 micrometer. If the acceptor concentration or the donor concentration in the silicon substrate is further reduced, the analysis can be performed in a deeper part. FIG. 5 shows an example of the observation result according to the present embodiment. The concentration of the silicon substrate used is 1 ×
10 15 cm -3 . As the applied voltage was increased, the minority carrier recombination lifetime was prolonged. From 50 microseconds at the beginning to 200 microseconds, the carrier was saturated.
Therefore, it is expected that the silicon substrate has a high concentration of contaminants near the surface in a depth range of up to 1 micrometer, which significantly deteriorate the recombination lifetime. In fact,
SIMS (Secondary Ion Mass Sp
As a result of electron scopy (secondary ion mass spectrometry), it was confirmed that iron (Fe) atoms were present near the surface of the silicon substrate.
【0011】[0011]
【発明の効果】以上説明したように、本発明では、シリ
コン基板に、絶縁物で被覆された電極と透明絶縁物で被
覆された透明電極とを介して電圧を加えることにより、
シリコン基板中に空乏層を生じさせ、少数担体のシリコ
ン基板表面での再結合を防いでいるので、シリコン基板
の表裏面での再結合の影響を受けない、真のシリコン基
板中小数担体再結合寿命を測定することができる。As described above, according to the present invention, a voltage is applied to a silicon substrate through an electrode covered with an insulator and a transparent electrode covered with a transparent insulator.
Since a depletion layer is created in the silicon substrate to prevent recombination of minority carriers on the surface of the silicon substrate, recombination on the true silicon substrate is not affected by recombination on the front and back surfaces of the silicon substrate. Lifetime can be measured.
【0012】そして、電極に加える電圧を変化させて空
乏層の厚さを変えながら少数担体再結合寿命を測定する
ことにより、深さ方向の測定が可能である。 Then , by measuring the minority carrier recombination lifetime while changing the thickness of the depletion layer by changing the voltage applied to the electrode, the measurement in the depth direction is possible.
【図1】本発明の参考例の構成を示す図である。FIG. 1 is a diagram showing a configuration of a reference example of the present invention.
【図2】本発明の作用を説明するために、図1に示す構
成中のシリコン基板と電極部分とを拡大して示す模式的
断面図である。FIG. 2 is a schematic cross-sectional view showing, on an enlarged scale, a silicon substrate and electrode portions in the configuration shown in FIG. 1 to explain the operation of the present invention.
【図3】本発明の参考例における反射マイクロ波強度の
観測波形の一例を示す図である。FIG. 3 is a diagram showing an example of an observed waveform of reflected microwave intensity in a reference example of the present invention.
【図4】本発明の一実施例の構成を示す図である。FIG. 4 is a diagram showing a configuration of one embodiment of the present invention .
【図5】本発明の実施例において、シリコン基板中深さ
と少数担体再結合寿命との関係の一例を示す図である。In the embodiment of Figure 5 the present invention, showing an example of the relationship between the silicon substrate in the depth and minority carrier recombination lifetime.
【図6】従来の少数担体再結合寿命測定装置の構成を示
す図である。FIG. 6 is a diagram showing a configuration of a conventional minority carrier recombination lifetime measuring device.
1 マイクロ波発生部 2 サーキュレータ 3 シリコン基板 4 反射マイクロ波検出部 5 増幅部 6 レーザダイオード 7 パルス発生部 8 オシロスコープ 9 真空吸着台 10 ロータリーポンプ 11A,11B 絶縁物 12A,12B 電極 13 空乏層 14 少数担体 15,17 電源 16 レーザパルス DESCRIPTION OF SYMBOLS 1 Microwave generation part 2 Circulator 3 Silicon substrate 4 Reflection microwave detection part 5 Amplification part 6 Laser diode 7 Pulse generation part 8 Oscilloscope 9 Vacuum suction table 10 Rotary pump 11A, 11B Insulator 12A, 12B Electrode 13 Depletion layer 14 Minority carrier 15, 17 Power supply 16 Laser pulse
Claims (1)
パルスを照射し少数担体を発生させ、前記シリコン結晶
基板の一方の面から入射したマイクロ波の反射波の強度
の時間的変化から前記少数担体の再結合寿命を求める型
の少数担体再結合寿命測定装置であって、少なくとも、
前記シリコン結晶基板を他方の面で支持する、絶縁物で
被覆された電極と、前記シリコン結晶基板の一方の面に
接触する、透明絶縁物で被覆された透明電極と、前記シ
リコン結晶基板の一方の面および他方の面より内部に空
乏層を生じさせるための電源とを備える少数担体再結合
寿命測定装置において、 前記電源の電圧が可変であることを特徴とする少数担体
再結合寿命測定装置。1. A minority carrier is generated by irradiating a laser pulse from one surface of a silicon crystal substrate to generate a minority carrier. A minority carrier recombination lifetime measuring device of the type for determining the recombination lifetime of at least,
An electrode coated with an insulator that supports the silicon crystal substrate on the other surface, a transparent electrode coated with a transparent insulator that contacts one surface of the silicon crystal substrate, and one of the silicon crystal substrates Minority carrier recombination with a power supply to create a depletion layer inside one side and the other side
In lifetime measuring apparatus, the minority carriers, characterized in that the voltage of the power supply is variable
Recombination lifetime measurement device .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440192A JP2845014B2 (en) | 1992-03-23 | 1992-03-23 | Minority carrier recombination lifetime measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440192A JP2845014B2 (en) | 1992-03-23 | 1992-03-23 | Minority carrier recombination lifetime measurement device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05264473A JPH05264473A (en) | 1993-10-12 |
| JP2845014B2 true JP2845014B2 (en) | 1999-01-13 |
Family
ID=13257263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6440192A Expired - Fee Related JP2845014B2 (en) | 1992-03-23 | 1992-03-23 | Minority carrier recombination lifetime measurement device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2845014B2 (en) |
-
1992
- 1992-03-23 JP JP6440192A patent/JP2845014B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05264473A (en) | 1993-10-12 |
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